Daughter board and circuit board
By designing an aligned groove structure in the daughter board of the R-FPCB board, the residual glue problem after the cover is lifted is solved, and a more efficient production process and reduced labor costs are achieved.
Patent Information
- Application Number
- CN202422253223.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-13
AI Technical Summary
Existing R-FPCB boards are prone to residual glue problems after uncovering the cover, resulting in low production efficiency and high labor costs.
A daughter board is designed, and the conductive layer and the substrate layer are provided with corresponding grooves in the cover uncover area to ensure that the centers of at least two second grooves are aligned with the center of the first groove, thereby effectively controlling the breakage of the substrate layer when forming and controlling the cover to reduce the residual glue.
Through this design, even if the conductive layer and the substrate layer are offset between the layers during the pressing process, it is still possible to ensure that the substrate layer is broken smoothly, effectively control the residual glue amount, improve production efficiency and reduce labor costs.
Smart Images
Figure CN223024653U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to a daughter board and a circuit board. Background Art
[0002] The R-FPCB (Rigid Flexible Printed Circuit Board) cover-lifting process is a very common process, which has the problem of residual glue after the cover is lifted. Utility Model Content
[0003] In order to solve the problems existing in the prior art, one of the purposes of the utility model is to provide a daughter board.
[0004] The utility model provides the following technical solutions:
[0005] A sub-board includes a conductive layer and a substrate layer connected to each other;
[0006] The conductive layer has a first uncovering area, and first grooves are respectively arranged on both sides of the conductive layer at the first uncovering area, and the first grooves penetrate the conductive layer along the thickness direction of the conductive layer;
[0007] The substrate layer has a second uncovering area corresponding to the first uncovering area, and at least two second grooves are respectively arranged on both sides of the second uncovering area on the substrate layer, and the second grooves are arranged on the side of the substrate layer away from the conductive layer, and the centers of the at least two second grooves are respectively aligned with the center of the first groove.
[0008] As a further optional solution for the sub-plate, the width of the second groove is greater than the width of the groove bottom.
[0009] As a further optional solution for the sub-plate, the cross section of the second groove is triangular.
[0010] As a further optional solution for the sub-plate, the depth of the second groove is D, the thickness of the substrate layer is H, and 1 / 3H≤D≤1 / 2H.
[0011] As a further optional solution for the sub-plate, the depth of the second groove is 1 / 3 of the thickness of the substrate layer; or
[0012] The depth of the second groove is 1 / 2 of the thickness of the substrate layer.
[0013] As a further optional solution for the sub-plate, the notch width of the second groove is W, 25 μm≤W≤35 μm.
[0014] As a further optional solution for the daughter board, the notch width of the second groove is 30 μm.
[0015] As a further optional solution for the daughter board, three second grooves are respectively arranged on both sides of the second cover-lifting area on the base material layer, and the centers of the second grooves in the middle are aligned with the centers of the first grooves respectively.
[0016] The purpose of the present utility model is to provide a circuit board.
[0017] The present utility model provides the following technical solutions:
[0018] A circuit board includes the above-mentioned daughter board.
[0019] As a further optional solution for the circuit board, the circuit board further includes a core board and connecting pieces. Connecting pieces and the daughter board are respectively arranged on both sides of the core board, and the core board is connected to the base material layer of the daughter board through the connecting pieces.
[0020] The embodiments of the present utility model have the following beneficial effects:
[0021] In the existing daughter board, the conductive layer and the base material layer may be offset between layers during the previous lamination process, resulting in residual glue after cover-lifting. In this regard, at least two second grooves are respectively arranged on both sides of the second cover-lifting area of the base material layer in the above-mentioned daughter board, and the centers of at least two second grooves are aligned with the centers of the first grooves on the conductive layer. On this basis, even if the conductive layer and the base material layer are offset between layers during the previous lamination process, causing the centers of at least two second grooves to deviate from the centers of the first grooves, the center of the first groove can still be aligned with one of the second grooves. When performing the forming and depth-controlled cover-lifting, cutting along the center of the first groove, the base material layer can still be smoothly broken along this second groove, thereby effectively controlling the amount of residual glue during cover-lifting and improving the problem of residual glue after cover-lifting.
[0022] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following specifically enumerates preferred embodiments and, in conjunction with the accompanying drawings, makes the following detailed description. Description of the Drawings
[0023] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.
[0024] Figure 1 Shows an enlarged schematic diagram of the groove surface when there is no interlayer offset in the daughter board in the related art;
[0025] Figure 2 It shows an enlarged schematic diagram of the groove surface when the interlayer deviation of the neutron plate occurs in the related art;
[0026] Figure 3 A schematic diagram of the overall structure of a sub-board provided by an embodiment of the utility model is shown;
[0027] Figure 4 It shows an enlarged schematic diagram of a groove surface when a sub-board provided by an embodiment of the utility model is misaligned between layers;
[0028] Figure 5 A schematic cross-sectional view of a circuit board provided by an embodiment of the utility model is shown.
[0029] Description of main component symbols:
[0030] 100 - sub-board; 110 - conductive layer; 111 - first cover area; 112 - first groove; 120 - base material layer; 121 - second cover area; 122 - second groove; 200 - core board; 210 - dielectric layer; 220 - copper foil; 300 - connecting piece. DETAILED DESCRIPTION
[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0033] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the template herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0036] See also Figure 1 In the related art, when using the cover-lifting process to process the R-FPCB board, the grooves are made in advance when the daughter board 100 is made. Specifically, the grooves are made on the substrate layer 120 of the daughter board 100, and the grooves are located on both sides of the cover-lifting area. The center line of the groove is the auxiliary alignment line for blind gong cover-lifting. Ideally, the center line is aligned with the lower cutter position of the blind gong cover-lifting. In this way, during the cover-lifting process, the substrate layer 120 can be broken along the center line of the groove, and the substrate layer 120 located in the cover-lifting area is removed together with the conductive layer 110.
[0037] See also Figure 2 , the conductive layer 110 and the base layer 120 may be offset during the early lamination process, resulting in the lower cutter not being aligned with the center line of the groove when the molding depth is controlled and the cover is opened, which in turn causes the base layer 120 to fail to break smoothly. After the cover is opened, there will be a lot of residual glue on the inner soft board surface. Removal of the residual glue will cause trouble to the subsequent production process, greatly increase labor costs, and reduce production efficiency.
[0038] Example 1
[0039] See also Figure 3 This embodiment provides a sub-board 100, which includes a conductive layer 110 and a substrate layer 120. The conductive layer 110 and the substrate layer 120 are stacked along the thickness direction, which is shown in the X direction in the figure, and the conductive layer 110 and the substrate layer 120 are connected to each other.
[0040] The conductive layer 110 has a first uncovering region 111 . First grooves 112 are respectively disposed on both sides of the conductive layer 110 at the first uncovering region 111 . The first grooves 112 penetrate the conductive layer 110 along the thickness direction of the conductive layer 110 .
[0041] Correspondingly, the substrate layer 120 has a second lid-lifting area 121 corresponding to the first lid-lifting area 111. At least two second grooves 122 are respectively disposed on both sides of the second lid-lifting area 121 on the substrate layer 120, and the second grooves 122 are disposed on the side of the substrate layer 120 away from the conductive layer 110. In addition, the centers of the at least two second grooves 122 are respectively aligned with the center of the first groove 112.
[0042] In the substrate layer 120 of the above-mentioned daughter board 100, at least two second grooves 122 are respectively disposed on both sides of the second lid-lifting area 121, and the centers of the at least two second grooves 122 are aligned with the center of the first groove 112 on the conductive layer 110. On this basis, even if there is an interlayer offset between the conductive layer 110 and the substrate layer 120 during the previous lamination process, causing the centers of the at least two second grooves 122 to deviate from the center of the first groove 112, the center of the first groove 112 can still be aligned with one of the second grooves 122. When forming and controlling the depth of lid-lifting, cutting along the center of the first groove 112, the substrate layer 120 can still be smoothly broken along this second groove 122, thereby effectively controlling the amount of residual glue during lid-lifting, improving the problem of residual glue after lid-lifting, further reducing labor costs, and increasing production efficiency.
[0043] Embodiment 2
[0044] Please refer to Figure 3 , this embodiment provides a daughter board 100, which is composed of a conductive layer 110 and a substrate layer 120. The conductive layer 110 and the substrate layer 120 are stacked in the thickness direction, indicated by the X direction in the figure, and the conductive layer 110 and the substrate layer 120 are connected to each other.
[0045] Among them, the conductive layer 110 has a first lid-lifting area 111. First grooves 112 are respectively disposed on both sides of the first lid-lifting area 111 on the conductive layer 110, and the first grooves 112 penetrate through the conductive layer 110 along the thickness direction of the conductive layer 110. That is, the first grooves 112 penetrate through the conductive layer 110 along the X direction.
[0046] Correspondingly, the substrate layer 120 has a second lid-lifting area 121 corresponding to the first lid-lifting area 111. At least two second grooves 122 are respectively disposed on both sides of the second lid-lifting area 121 on the substrate layer 120, and the second grooves 122 are disposed on the side of the substrate layer 120 away from the conductive layer 110. In addition, the centers of the at least two second grooves 122 are respectively aligned with the center of the first groove 112.
[0047] It can be understood that when the number of the second grooves 122 is odd, the center of the middle second groove 122 is the center of the at least two second grooves 122. When the number of the second grooves 122 is even, the boundary between the two middle second grooves 122 is the center of the at least two second grooves 122.
[0048] Please combine with Figure 4 Figure 4 On the above-mentioned basis, at least two second grooves 122 are respectively arranged on both sides of the second uncovering area 121 of the substrate layer 120 in the sub-board 100, and the centers of at least two second grooves 122 are aligned with the center of the first groove 112 on the conductive layer 110. On this basis, even if there is an interlayer misalignment between the conductive layer 110 and the substrate layer 120 during the previous lamination process, causing the centers of at least two second grooves 122 to deviate from the center of the first groove 112, the center of the first groove 112 can still be aligned with one of the second grooves 122. When cutting along the center of the first groove 112 during the forming and depth-controlled uncovering, the substrate layer 120 can still be smoothly broken along this second groove 122, thereby effectively controlling the amount of residual glue during uncovering, improving the problem of residual glue after uncovering, further reducing the labor cost, and increasing the production efficiency.
[0049] In some embodiments, the material of the conductive layer 110 is copper.
[0050] In some embodiments, the cross-section of the first groove 112 is triangular, and the notch of the first groove 112 is exposed on the side of the conductive layer 110 facing away from the substrate layer 120, and the bottom of the first groove 112 is located on the side of the conductive layer 110 facing the substrate layer 120.
[0051] In some embodiments, the second groove 122 is processed by laser cutting, which has the advantages of high processing accuracy (±25μm), no burr residue, small spot diameter (10 - 25μm), etc., and can meet the processing requirements of high precision, no burrs, and narrow spaces.
[0052] In some embodiments, the notch width of the second groove 122 is greater than the bottom width.
[0053] Making the notch width of the second groove 122 greater than the bottom width is conducive to the stress concentration at the bottom of the second groove 122 during the uncovering process, so that the substrate layer 120 can be broken more smoothly along the second groove 122.
[0054] Furthermore, the cross-section of the second groove 122 is triangular, which can make the stress further concentrate at the bottom of the second groove 122.
[0055] In some embodiments, the depth of the second groove 122 is D, and the thickness of the substrate layer 120 is H, satisfying 1 / 3H ≤ D ≤ 1 / 2H.
[0056] In this embodiment, the depth of the second groove 122 is 1 / 3 of the thickness of the substrate layer 120.
[0057] In another embodiment of the present application, the depth of the second groove 122 is 1 / 2 of the thickness of the substrate layer 120.
[0058] In some embodiments, the notch width of the second groove 122 is W, satisfying 25 μm ≤ W ≤ 35 μm.
[0059] Optionally, the notch width of the second groove 122 may be 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, or any value between 25 μm - 35 μm.
[0060] In this embodiment, the notch width of the second groove 122 is 30 μm.
[0061] Correspondingly, the spacing between two adjacent second grooves 122 is also 30 μm. Thus, the edges of two adjacent second grooves 122 on the same side of the second cover-lifting area 121 coincide.
[0062] Wherein, the spacing between two adjacent second grooves 122 specifically refers to the spacing between the centers of two adjacent second grooves 122.
[0063] In this embodiment, three second grooves 122 are respectively arranged on both sides of the second cover-lifting area 121 on the substrate layer 120, and the centers of the second grooves 122 in the middle are respectively aligned with the centers of the first grooves 112.
[0064] It can be understood that, ideally, there is no interlayer misalignment between the conductive layer 110 and the substrate layer 120, and the centers of the second grooves 122 in the middle are aligned with the centers of the first grooves 112. When interlayer misalignment occurs during the previous lamination process of the conductive layer 110 and the substrate layer 120, and the misalignment distance is limited, the center of the first groove 112 can still be aligned with one of the second grooves 122.
[0065] In summary, at least two second grooves 122 are respectively arranged on both sides of the second cover-lifting area 121 of the substrate layer 120 in the above-mentioned daughter board 100, and the centers of at least two second grooves 122 are aligned with the centers of the first grooves 112 on the conductive layer 110. On this basis, even if misalignment occurs during the previous lamination process of the conductive layer 110 and the substrate layer 120, causing the centers of at least two second grooves 122 to deviate from the centers of the first grooves 112, the center of the first groove 112 can still be aligned with one of the second grooves 122. When cutting along the center of the first groove 112 during the forming and depth-controlled cover-lifting, the substrate layer 120 can still be smoothly broken along this second groove 122, so that the amount of residual glue can be effectively controlled during cover-lifting, the problem of residual glue after cover-lifting can be improved, and thus the labor cost can be reduced and the production efficiency can be increased.
[0066] Please refer to Figure 5, this embodiment also provides a circuit board, specifically a rigid-flex board, which includes the above-mentioned daughter board 100.
[0067] In some embodiments, the above-mentioned circuit board further includes a core board 200 and a connecting piece 300.
[0068] Among them, a connecting piece 300 and a daughter board 100 are respectively arranged on both sides of the core board 200, and the core board 200 is connected to the base material layer 120 of the daughter board 100 through the connecting piece 300.
[0069] Specifically, the core board 200 is composed of a dielectric layer 210 and two copper foils 220, and the two copper foils 220 are respectively located on both sides of the dielectric layer 210 along the thickness direction. One side of the copper foil 220 along the thickness direction is fixedly connected to the dielectric layer 210, and the other side of the copper foil 220 along the thickness direction is connected to the base material layer 120 through the connecting piece 300.
[0070] Optionally, the material of the connecting piece 300 is NF-PP (No Flow Polypropylene).
[0071] In all the examples shown and described here, any specific value should be construed as merely exemplary, not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.
[0072] It should be noted that: similar reference numerals and letters denote similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0073] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation to the scope of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention.
Claims
1. A sub-board, characterized in that: comprising a conductive layer and a substrate layer connected to each other; The conductive layer has a first uncovering area, and first grooves are respectively arranged on both sides of the conductive layer at the first uncovering area, and the first grooves penetrate the conductive layer along the thickness direction of the conductive layer; The substrate layer has a second uncovering area corresponding to the first uncovering area, and at least two second grooves are respectively arranged on both sides of the second uncovering area on the substrate layer, and the second grooves are arranged on the side of the substrate layer away from the conductive layer, and the centers of the at least two second grooves are respectively aligned with the center of the first groove.
2. The daughterboard according to claim 1, characterized in that: The width of the second groove is greater than the width of the groove bottom.
3. The daughterboard according to claim 2, characterized in that: The cross section of the second groove is triangular.
4. The daughterboard according to claim 1, characterized in that: The depth of the second groove is D, the thickness of the substrate layer is H, and 1 / 3H≤D≤1 / 2H.
5. The daughterboard according to claim 4, characterized in that: The depth of the second groove is 1 / 3 of the thickness of the substrate layer; or The depth of the second groove is 1 / 2 of the thickness of the substrate layer.
6. The daughterboard according to claim 1, characterized in that: The notch width of the second groove is W, 25 μm≤W≤35 μm.
7. The daughterboard according to claim 6, characterized in that: The second groove has a notch width of 30 μm.
8. The daughterboard according to any one of claims 1 to 7, characterized in that: Three second grooves are respectively arranged on both sides of the second cover-lifting area on the substrate layer, and the centers of the second grooves located in the middle are respectively aligned with the centers of the first grooves.
9. A circuit board, characterized in that: The invention comprises the daughterboard according to any one of claims 1 to 8.
10. The circuit board according to claim 9, characterized in that: The circuit board further comprises a core board and a connecting piece. The connecting piece and the sub-board are respectively arranged on two sides of the core board. The core board is connected to the base material layer of the sub-board through the connecting piece.