Heat dissipation plate and jig thereof
By setting a split plate on the cover of the heat dissipation plate and setting bumps on the substrate, welding technology is used to enhance the connection strength between the cover plate and the substrate, the welding problem caused by substrate deformation in the prior art is solved, and the refrigeration medium leakage is avoided.
Patent Information
- Application Number
- CN202422063471.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-23
AI Technical Summary
After the refrigeration medium is heat-expanded by heat in the groove of the existing heat dissipation plate, it is easy to cause welding breakage between the substrate and the cover plate, causing leakage of the refrigeration medium.
By setting multiple shunt plates at intervals on the cover plate and setting multiple bumps on the substrate, the cover plate and the substrate are fixedly connected by welding technology, and at the same time, the bumps are set in the liquid inlet and liquid outlet areas to enhance the connection strength.
The connection strength between the cover plate and the substrate is effectively improved, and the desoldering phenomenon caused by substrate deformation is reduced, thereby avoiding leakage of the refrigeration medium.
Smart Images

Figure CN223024834U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a heat dissipation plate and a jig therefor. Background Art
[0002] A heat dissipation plate generally includes a base plate and a cover plate, and a flow channel for a refrigeration medium to flow through is provided between the cover plate and the base plate. In the prior art, the peripheries of the base plate and the cover plate are usually welded to complete the assembly of the cover plate and the base plate. However, since the refrigeration medium through groove expands when heated, the base plate and the cover plate are prone to weld breakage, resulting in leakage of the refrigeration medium. Summary of the Utility Model
[0003] In order to improve the connection strength between the cover plate and the base plate and to avoid as much as possible the problem of leakage of the refrigeration medium, the present application provides a heat dissipation plate and a jig therefor.
[0004] A heat dissipation plate provided by the present application adopts the following technical solutions:
[0005] A heat dissipation plate includes a base plate and a cover plate fixedly connected thereto. A plurality of flow dividing plates are spaced apart on the cover plate, and the flow dividing plates are located between the cover plate and the base plate, and a flow channel is formed between adjacent flow dividing plates; a plurality of bumps are further provided on one side of the base plate close to the cover plate, and the plurality of bumps are used for fixedly connecting with the cover plate.
[0006] By adopting the above technical solutions, the four peripheries of the cover plate are fixedly connected to the base plate by welding, and at the same time, the connection strength between the cover plate and the base plate is further improved by welding a plurality of bumps, and the phenomenon of weld breakage caused by deformation of the base plate is avoided as much as possible.
[0007] Preferably, the cover plate and the base plate are divided into a liquid inlet area and a liquid outlet area by a plurality of flow dividing plates, and a plurality of bumps are arranged in the liquid inlet area and the liquid outlet area; a liquid inlet hole is provided on the cover plate corresponding to the liquid inlet area, and a liquid outlet is provided on the cover plate corresponding to the liquid outlet area.
[0008] By adopting the above technical solutions, the refrigeration medium in the plurality of flow channels can also flow into the liquid outlet area and be discharged through the liquid outlet hole under the pressure of the refrigeration medium injected through the liquid inlet hole, thereby completing heat dissipation.
[0009] Preferably, the plurality of flow dividing plates are spaced apart along the diagonal of the base plate, and the liquid inlet area and the liquid outlet area are respectively arranged at the other two diagonals of the base plate.
[0010] By adopting the above technical solutions, the refrigeration medium injected through the liquid inlet hole can fully and evenly enter the plurality of flow channels through the liquid inlet area.
[0011] Preferably, the protrusion is fixedly connected to the cover plate by ultrasonic welding.
[0012] By adopting the above technical solution, ultrasonic welding can produce a tiny contact surface and form a local tight connection, thereby improving the connection strength between the base plate and the cover plate.
[0013] The present application provides a fixture that adopts the following technical solution:
[0014] A fixture comprises a limiting plate, on which a substrate can be limitedly arranged.
[0015] By adopting the above technical solution, the limiting plate can be used to ensure the processing quality of the substrate during the stamping process to the greatest extent, and to avoid deformation of the substrate during the processing to affect subsequent welding.
[0016] Preferably, a plurality of limiting strips are provided on a side of the base plate away from the cover plate, a plurality of limiting grooves are provided on the limiting plate corresponding to the limiting strips, and the limiting grooves are plug-fitted with the limiting strips.
[0017] By adopting the above technical solution, the limit bars and limit grooves that are plugged in can play a limiting role and reduce the movement of the substrate during the processing.
[0018] Preferably, a retaining groove is further provided on the limiting plate, and the retaining groove is connected to the same side ends of the plurality of limiting grooves.
[0019] By adopting the above technical solution and providing the retaining groove, the limiting strip can be prevented from slipping off when subjected to external force as much as possible, thereby enhancing the fixing effect between the base plate and the limiting plate.
[0020] Preferably, a limiting member is detachably mounted on a side of the limiting plate away from the retaining groove, and when the limiting strip is located in the limiting groove, one end of the limiting strip away from the retaining groove abuts against the limiting member.
[0021] By adopting the above technical solution, the fixing effect of the substrate on the limiting plate is enhanced by using the limiting member, the displacement or shaking of the substrate during the processing is prevented, and the stability and reliability of the operation are improved.
[0022] In summary, the present application includes at least one of the following beneficial technical effects:
[0023] 1. The four sides of the cover plate are fixedly connected to the substrate, and in order to further enhance the connection strength between the cover plate and the substrate, multiple convex points are welded to reinforce them, so as to avoid desoldering caused by deformation of the substrate as much as possible.
[0024] 2. By setting the limit plate, the quality of the substrate during processing can be guaranteed. Moreover, through the structures of the inserted and matched limit strips, limit grooves, retaining grooves, and limit parts, the displacement of the substrate during processing can be maximally avoided, thereby improving the processing quality of the substrate, and further improving the fixed connection quality between the substrate and the cover plate. Brief Description of the Drawings
[0025] Figure 1 is a schematic diagram of the overall structure of the heat dissipation plate;
[0026] Figure 2 is an exploded schematic diagram of the heat dissipation plate;
[0027] Figure 3 is a schematic diagram of the heat dissipation plate disposed on the fixture;
[0028] Figure 4 is an exploded schematic diagram of the heat dissipation plate disposed on the fixture;
[0029] Figure 5 is a schematic diagram mainly used to show the limit strip in the embodiment of the present application.
[0030] Reference Signs: 1, substrate; 11, mounting frame; 12, flow dividing plate; 13, bump; 14, limit strip; 2, cover plate; 21, liquid inlet hole; 22, liquid outlet hole; 31, flow channel; 32, liquid inlet area; 33, liquid outlet area; 4, limit plate; 41, limit groove; 411, guiding surface; 42, retaining groove; 43, limit part. Detailed Description of the Embodiment
[0031] The following further elaborates on the present application in conjunction with the attached Figures 1-5 for a more detailed description.
[0032] Embodiment 1 of the present application discloses a heat dissipation plate.
[0033] Refer to Figure 1 and Figure 2A heat sink includes a substrate 1 and a cover plate 2 that are fixedly connected. A mounting frame 11 and a plurality of diverter plates 12 are integrally formed on the side of the substrate 1 close to the cover plate 2, and the plurality of diverter plates 12 are located between the substrate 1 and the cover plate 2. The mounting frame 11 is arranged near the four sides of the substrate 1 for fixed connection with the cover plate 2. The plurality of diverter plates 12 are arranged in the mounting frame 11, and the plurality of diverter plates 12 are arranged at intervals on the substrate 1, and flow channels 31 are formed between adjacent diverter plates 12. The mounting frame 11 is also divided into a liquid inlet area 32 and a liquid outlet area 33 by the plurality of diverter plates 12, and the liquid inlet area 32 is connected to the liquid outlet area 33 through the plurality of flow channels 31. The substrate 1 is also provided with a plurality of protrusions 13, and the plurality of protrusions 13 are respectively located in the liquid inlet area 32 and the liquid outlet area 33, and the cover plate 2 is also welded to the substrate 1 through the plurality of protrusions 13, so that the connection strength between the substrate 1 and the cover plate 2 can be improved, and the problem of desoldering can be avoided as much as possible.
[0034] Reference Figure 1 and Figure 2 The substrate 1 and the cover plate 2 are rectangular plates as a whole, and in this embodiment, the substrate 1 is set as a copper plate, which can play a better heat dissipation role. The mounting frame 11 is in the shape of a rectangular frame, and the four sides of the mounting frame 11 are arranged close to the four sides of the substrate 1. The cover plate 2 is embedded in the mounting frame 11, and the cover plate 2 is fixedly connected to the mounting frame 11 by welding. A liquid inlet hole 21 is opened on the cover plate 2 corresponding to the liquid inlet area 32, and a liquid outlet hole 22 is opened on the cover plate 2 corresponding to the liquid outlet area 33.
[0035] The diverter plate 12 is in the shape of a rectangular plate as a whole, and the plate surface of the diverter plate 12 is parallel to the plate surface of the substrate 1, and the length direction of the diverter plate 12 is perpendicular to the length direction of the substrate 1. Multiple diverter plates 12 are arranged in sequence at equal intervals along the diagonal direction of the substrate 1, so that the liquid inlet area 32 and the liquid outlet area 33 can be respectively arranged at the other two diagonals of the substrate 1, and the liquid inlet area 32 and the liquid outlet area 33 are in the shape of a conical column. The liquid inlet hole 21 and the liquid outlet hole 22 on the cover plate 2 are arranged at the diagonals of the cover plate 2, and the liquid inlet hole 21 and the liquid outlet hole 22 are away from the diagonal line where the diverter plate 12 is located, so that the refrigerant injected from the liquid inlet hole 21 can enter the multiple flow channels 31 through the liquid inlet area 32 in a full and uniform manner. The refrigerant in the multiple flow channels 31 can also flow into the liquid outlet area 33 and be discharged through the liquid outlet 22 under the pressure of the refrigerant injected into the liquid inlet hole 21, thereby completing the heat dissipation.
[0036] The protrusions 13 can be set as dot-shaped protrusions 13, rectangular protrusions 13 or oblong protrusions 13, etc. In this embodiment, oblong protrusions 13 are used, and the length direction of the protrusions 13 is parallel to the length direction of the substrate 1. On the one hand, the impact of the protrusions 13 on the normal flow of the refrigerant in the liquid inlet area 32 and the liquid outlet area 33 can be reduced, and on the other hand, the contact area between the protrusions 13 and the cover plate 2 can be increased. Preferably, the plurality of protrusions 13 are fixedly connected to the cover plate 2 by ultrasonic welding, so that the connection strength between the substrate 1 and the cover plate 2 can be further improved.
[0037] The implementation principle of Example 1 of the present application is: the four sides of the cover plate 2 are fixedly connected to the substrate 1 by welding, and at the same time, the connection strength between the cover plate 2 and the substrate 1 is further improved by welding multiple protrusions 13, so as to avoid desoldering caused by deformation of the substrate 1 as much as possible.
[0038] Embodiment 2 of the present application discloses a fixture.
[0039] A jig includes a limiting plate 4, on which a substrate 1 is limited. The substrate 1 is usually integrally formed by a stamping process, and the substrate 1 is mounted on the limiting plate 4 during the stamping process, which can ensure the overall flatness of the substrate 1 to the greatest extent, so as to ensure the subsequent welding quality of the substrate 1 and the cover plate 2.
[0040] refer to Figure 4 and Figure 5 , multiple limiting strips 14 are arranged near one of the lengthwise sides of the substrate 1 below, and the limiting strips 14 are in the shape of a rectangular rod as a whole, and the lengthwise direction of the limiting strips 14 is perpendicular to the lengthwise direction of the substrate 1, and multiple limiting strips 14 are arranged at equal intervals. The limiting plate 4 is in the shape of a rectangular plate as a whole, and a limiting groove 41 is provided on the limiting plate 4 near one of the lengthwise sides above the substrate 1, corresponding to the limiting strip 14, and the limiting strip 14 and the limiting groove 41 are plugged in. A retaining groove 42 is also arranged on the limiting plate 4, and the lengthwise direction of the retaining groove 42 is perpendicular to the lengthwise direction of the retaining groove 41, and the retaining groove 42 is arranged at one end of the retaining groove 41 near the inside of the substrate 1, and the retaining groove 42 and multiple limiting grooves 41 are connected. When the substrate 1 is installed on the limiting plate 4 through the plugged limiting strips 14 and the limiting grooves 41, the limiting strips 14 will abut against the groove wall of the retaining groove 42 away from the limiting groove 41, thereby limiting the position of the substrate 1 on the limiting plate 4. In addition, a guide surface 411 is provided at one end of the wall of the limiting groove 41 close to the edge of the limiting plate 4 , so that the limiting strip 14 can smoothly enter the limiting groove 41 .
[0041] On this basis, a plurality of limiting members 43 are further arranged on the side of the limiting plate 4 close to and away from the length direction side of the blocking groove 42. The limiting members 43 are integrally in the shape of a rectangular block, and the length direction of the limiting members 43 is parallel to the length direction of the substrate 1. The limiting members 43 are threadedly connected to the limiting plate 4, and the limiting members 43 can block the opening end of the limiting groove 41 away from the blocking groove 42. After the substrate 1 is placed on the limiting plate 4, installing a plurality of limiting members 43 can avoid the displacement of the substrate 1 during the processing to the greatest extent and ensure the processing quality of the substrate 1 as much as possible.
[0042] The implementation principle of the fixture in Embodiment 2 of the present application is as follows: By arranging the limiting groove 41, the blocking groove 42 and the limiting members 43 on the limiting plate 4, it can be ensured that the substrate 1 does not generate displacement as much as possible when the substrate 1 is installed on the fixture, thereby improving the processing quality of the substrate 1.
[0043] The above are all the preferred embodiments of the present application. The protection scope of the present application is not limited by this. Therefore, all equivalent changes made according to the structure, shape and principle of the present application should be covered within the protection scope of the present application.
Claims
1. A heat sink, characterized in that: The invention comprises a base plate (1) and a cover plate (2) which are fixedly connected, wherein a plurality of flow dividers (12) are arranged at intervals on the cover plate (2), and the flow dividers (12) are located between the cover plate (2) and the base plate (1), and flow channels (31) are formed between adjacent flow dividers (12); and a plurality of protrusions (13) are also arranged on a side of the base plate (1) close to the cover plate (2), and the plurality of protrusions (13) are used for being fixedly connected to the cover plate (2).
2. A heat sink according to claim 1, characterized in that: The cover plate (2) and the base plate (1) are divided into a liquid inlet area (32) and a liquid outlet area (33) by a plurality of flow dividers (12), and a plurality of protrusions (13) are arranged in the liquid inlet area (32) and the liquid outlet area (33); a liquid inlet hole (21) is arranged on the cover plate (2) corresponding to the liquid inlet area (32), and a liquid outlet is arranged on the cover plate (2) corresponding to the liquid outlet area (33).
3. A heat sink according to claim 2, characterized in that: The plurality of flow dividers (12) are arranged at intervals along the diagonal line of the substrate (1), and the liquid inlet area (32) and the liquid outlet area (33) are respectively arranged at the other two diagonals of the substrate (1).
4. The heat dissipation plate according to claim 1, characterized in that: The protrusion (13) is fixedly connected to the cover plate (2) by ultrasonic welding.
5. A fixture, based on the heat sink according to any one of claims 1 to 4, characterized in that: It comprises a limiting plate (4), and the base plate (1) can be limitedly arranged on the limiting plate (4).
6. A jig according to claim 5, characterized in that: A plurality of limiting strips (14) are provided on a side of the base plate (1) away from the cover plate (2), and a plurality of limiting grooves (41) are provided on the limiting plate (4) corresponding to the limiting strips (14), and the limiting grooves (41) and the limiting strips (14) are plug-fitted.
7. A fixture according to claim 6, characterized in that: A retaining groove (42) is also provided on the limiting plate (4), and the retaining groove (42) is connected to the same side ends of the plurality of limiting grooves (41).
8. A fixture according to claim 7, characterized in that: A limiting member (43) is detachably mounted on a side of the limiting plate (4) away from the retaining groove (42); when the limiting strip (14) is located in the limiting groove (41), an end of the limiting strip (14) away from the retaining groove (42) abuts against the limiting member (43).