Cooling structure for solid-state power source power amplifier and power source power amplifier system

Abstract

The utility model discloses a cooling structure for a solid-state power source power amplifier and a power source power amplifier system, and relates to the technical field of power source cooling, the cooling structure comprises a square shell; the refrigeration assembly is arranged in the shell, the refrigeration assembly is located on one side of the shell, and the refrigeration assembly penetrates through the shell and communicates with the outside; and a refrigeration guide assembly. According to the utility model, the plurality of cold conduction grooves are arranged between the first cold conduction plate and the second cold conduction plate, and the plurality of cold conduction grooves are used for guiding cooling air generated by the refrigeration assembly into the space between the first cold conduction plate and the second cold conduction plate, so that cooling and heat dissipation of the high-power working module arranged on the first cold conduction plate and the second cold conduction plate are realized; and the condition that the local temperature or the overall temperature of the whole power amplifier system is too high is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of power source cooling, in particular to a cooling structure for a solid-state power source power amplifier. Background Art

[0002] When a solid-state power source operates at high power, a large amount of heat is generated by electronic devices. If this heat cannot be effectively dissipated, it will cause the device temperature to rise, thereby affecting its performance and reliability, and even may damage the device. Therefore, it is necessary to cool the elevated temperature in time to ensure that the components will not be damaged due to the temperature rise. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a cooling structure for a solid-state power source power amplifier to cool down the solid-state power source when its temperature rises.

[0004] To achieve the above purpose, the utility model adopts the following technical scheme:

[0005] The utility model provides a cooling structure for a solid-state power source power amplifier in a first aspect, including:

[0006] A housing, the housing having a square structure;

[0007] A refrigeration component, the refrigeration component is arranged in the housing, the refrigeration component is located on one side of the housing, and the refrigeration component penetrates through the housing to communicate with the outside;

[0008] A refrigeration guiding component, the refrigeration guiding component is arranged in the housing, the refrigeration guiding component is located on one side of the refrigeration component, and the refrigeration guiding component is used to guide the refrigerated air generated by the refrigeration component to the high-power working module for cooling;

[0009] Among them, the refrigeration guiding component includes:

[0010] A first cold guide plate, the first cold guide plate is arranged in the housing, the first cold guide plate is connected to the housing, the first cold guide plate is located on one side of the refrigeration component, and the first cold guide plate is used to install a high-power working module that releases heat;

[0011] A plurality of cold guide grooves, the plurality of cold guide grooves are arranged at the bottom of the first cold guide plate, the plurality of cold guide grooves are arranged in parallel on the first cold guide plate, and the plurality of cold guide grooves are communicated with the air outlet end of the refrigeration component;

[0012] A second cold guide plate, the second cold guide plate is arranged at the bottom of the plurality of cold guide grooves, the second cold guide plate is symmetrically arranged with the first cold guide plate on the plurality of cold guide grooves, and the first cold guide plate is used to install a high-power working module that releases heat.

[0013] In a feasible solution, the refrigeration assembly includes:

[0014] A mounting rack, which is arranged on one side inside the housing, and a plurality of mounting grooves are provided on the mounting rack;

[0015] A plurality of fans, which are respectively arranged in the mounting grooves. The air inlets of the fans penetrate through the housing and communicate with the outside, and the air outlets of the fans are communicated with a plurality of cold guide grooves.

[0016] In a feasible solution, the refrigeration assembly further includes:

[0017] A guiding rack, one end of which is arranged on the mounting rack, and the other end of which is communicated with a plurality of cold guide grooves. The guiding rack is in a shape with a gradually narrowing opening from the side close to the mounting rack to the cold guide grooves.

[0018] In a feasible solution, the guiding rack is in a horn shape.

[0019] In a feasible solution, a plurality of ventilation holes are provided around the housing.

[0020] In a feasible solution, a handle is further arranged outside the housing.

[0021] The second aspect of the present utility model provides a solid-state power source amplifier system, which adopts a cooling structure for a solid-state power source amplifier as described in any one of the first aspect.

[0022] The beneficial effects of the present utility model are as follows:

[0023] By arranging a plurality of cold guide grooves between the first cold guide plate and the second cold guide plate, the present utility model guides the cooling air generated by the refrigeration assembly into the space between the first cold guide plate and the second cold guide plate, so as to cool and dissipate heat from the high-power working modules mounted on the first cold guide plate and the second cold guide plate, ensuring that the entire amplifier system will not have the situation of local overheating or overall overheating. Description of the Drawings

[0024] Figure 1 It is a schematic structural diagram (three-dimensional view) of a cooling structure for a solid-state power source amplifier provided in an embodiment of the present utility model;

[0025] Figure 2 It is a schematic plan view of a cooling structure for a solid-state power source amplifier provided in an embodiment of the present utility model;

[0026] Figure 3 It is an exploded view of a cooling structure for a solid-state power source amplifier provided in an embodiment of the present utility model;

[0027] Figure 4 This is a schematic diagram of the refrigeration component structure in a cooling structure for a solid-state power source power amplifier provided in an embodiment of the present invention.

[0028] The markings in the figure are as follows:

[0029] 1. Housing; 11. Handle;

[0030] 2. Refrigeration component; 21. Cooling fan; 22. Mounting frame; 23. Guide frame;

[0031] 3. First heat conduction plate; 31. Heat conduction groove; 32. Second heat conduction plate. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0033] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0034] In the present invention, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or is unachievable, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0036] Embodiment

[0037] Refer to Figures 1 to 4, in order to cool down the solid - state power source when it gets heated up in this embodiment, a cooling structure for the power amplifier of the solid - state power source is proposed. The cooling structure includes: a housing 1, a refrigeration component 2, and a refrigeration guiding component. The housing 1 has a square structure and is used to carry and install the entire cooling structure and the high - power working module. The refrigeration component 2 is arranged inside the housing 1, located on one side of the housing 1, and the refrigeration component 2 penetrates through the housing 1 and communicates with the outside to achieve a ventilation refrigeration cycle. The refrigeration guiding component is arranged inside the housing 1, located on one side of the refrigeration component 2, and the refrigeration guiding component is used to guide the refrigerating air generated by the refrigeration component 2 to the high - power working module for cooling, that is, the refrigeration guiding component is also used to install and carry the high - power working module. Specifically, the refrigeration guiding component includes: a first cold - conducting plate 3, a plurality of cold - conducting grooves 31, and a second cold - conducting plate 32. The first cold - conducting plate 3 is arranged inside the housing 1, connected to the housing 1, located on one side of the refrigeration component 2, and the first cold - conducting plate 3 is used to install the high - power working module that releases heat. A plurality of the cold - conducting grooves 31 are arranged at the bottom of the first cold - conducting plate 3, and the plurality of cold - conducting grooves 31 are arranged in parallel on the first cold - conducting plate 3. The plurality of cold - conducting grooves 31 are connected to the air - outlet end of the refrigeration component 2 to enable the refrigeration component 2 to cool down the high - power working module by passing the cooling air through the cold - conducting grooves 31. The second cold - conducting plate 32 is arranged at the bottom of the plurality of cold - conducting grooves 31, and the second cold - conducting plate 32 is symmetrically arranged with the first cold - conducting plate 3 on the plurality of cold - conducting grooves 31. The first cold - conducting plate 3 is also used to install the high - power working module that releases heat. That is, by arranging a plurality of cold - conducting grooves 31 between the first cold - conducting plate 3 and the second cold - conducting plate 32, the cooling air generated by the refrigeration component 2 is introduced between the first cold - conducting plate 3 and the second cold - conducting plate 32 to cool down the high - power working module installed on the first cold - conducting plate 3 and the second cold - conducting plate 32, ensuring that the entire power amplifier system will not have the situation of local over - temperature or overall over - temperature.

[0038] The refrigeration component 2 includes: a plurality of fans and a mounting frame 22. The mounting frame 22 is arranged on one side inside the housing 1. A number of mounting grooves (not shown in the figure) are provided on the mounting frame 22, and the mounting grooves are used for mounting the fans. The plurality of fans are respectively arranged in the mounting grooves. The air inlets of the fans penetrate through the housing 1 and communicate with the outside, and the air outlets of the fans are communicated with a number of the cold guide grooves 31 to complete the cooling ventilation cycle. In this embodiment, in order to ensure that the cooling air of the fans is quickly introduced into the cold guide grooves 31, the refrigeration component 2 further includes: a guide frame 23. One end of the guide frame 23 is arranged on the mounting frame 22, and the other end of the guide frame 23 is communicated with a number of the cold guide grooves 31. The guide frame 23 is in a shape with an opening gradually narrowing from the side close to the mounting frame 22 to the cold guide grooves 31, so as to quickly introduce the refrigerating air generated by the fans into the cold guide grooves 31 and cool and dissipate heat from the high-power working modules mounted on the first cold guide plate 3 and the second cold guide plate 32. Preferably, the guide frame 23 is in a horn shape. The large opening of the guide frame 23 is communicated with the air outlet of the fan, and the small opening of the guide frame 23 is communicated with the cold guide grooves 31.

[0039] In this embodiment, in order to ensure that the refrigeration mechanism dissipates heat from various power amplifier modules mounted on the housing 1 with the cooling air, a number of ventilation holes are provided around the housing 1. Preferably, a number of ventilation holes are provided at the position of the cooling fan 21 on the housing 1 to achieve air intake cooling, and a number of ventilation holes are also provided at the position of the housing 1 far from the cooling fan 21 to achieve air outlet circulation.

[0040] In this embodiment, in order to facilitate the taking and placing of the cooling structure, a handle 11 is further provided outside the housing 1. The handle 11 is used for an operator to extract and pull the whole cooling structure and the power amplifier modules mounted thereon.

[0041] In this embodiment, the present invention also provides a solid-state power source power amplifier system. The power amplifier system adopts one of the above-mentioned cooling structures for a solid-state power source power amplifier. By adopting the above-mentioned cooling structure, the cooling air generated by the cooling fan 21 in the cooling structure is introduced to the working power amplifier components through the cooling guide assembly to cool the working power amplifier components, ensuring that the whole power amplifier system will not have the situation of local overheating or overall overheating.

[0042] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present invention.

Claims

1. A cooling structure for a solid-state power source amplifier, characterized in that: include: A housing, wherein the housing has a square structure; A refrigeration component, wherein the refrigeration component is disposed in the shell, the refrigeration component is located on one side of the shell, and the refrigeration component penetrates the shell and circulates with the outside; A refrigeration guide assembly, the refrigeration guide assembly is arranged in the shell, the refrigeration guide assembly is located on one side of the refrigeration assembly, and the refrigeration guide assembly is used to guide the refrigeration wind generated by the refrigeration assembly to the high-power working module for cooling; Wherein, the refrigeration guide assembly comprises: A first cold conduction plate, the first cold conduction plate is arranged in the shell, the first cold conduction plate is connected to the shell, the first cold conduction plate is located at one side of the refrigeration assembly, and the first cold conduction plate is used to install a high-power working module that releases heat; A plurality of cold conduction grooves, wherein the plurality of cold conduction grooves are arranged at the bottom of the first cold conduction plate, the plurality of cold conduction grooves are arranged in parallel on the first cold conduction plate, and the plurality of cold conduction grooves are connected to the air outlet end of the refrigeration component; The second cooling plate is arranged at the bottom of the plurality of cooling grooves, the second cooling plate is symmetrically arranged with the first cooling plate stack on the plurality of cooling grooves, and the first cooling plate is used for installing a high-power working module that releases heat.

2. A cooling structure for a solid-state power source amplifier according to claim 1, characterized in that: The refrigeration assembly comprises: A mounting frame, the mounting frame is arranged on one side of the interior of the housing, and the mounting frame is provided with a plurality of mounting slots; A plurality of fans are respectively arranged in the installation grooves, the air inlets of the fans penetrate the shell and are connected to the outside, and the air outlets of the fans are connected to a plurality of the cooling grooves.

3. A cooling structure for a solid-state power source amplifier according to claim 2, characterized in that: The refrigeration assembly also includes: A guide frame, one end of which is arranged on the mounting frame, and the other end of which is connected to a plurality of cooling grooves, and the opening of the guide frame gradually narrows from the side close to the mounting frame to the cooling groove.

4. A cooling structure for a solid-state power source amplifier according to claim 3, characterized in that: The guide frame is in a trumpet shape.

5. The cooling structure for a solid-state power source amplifier according to claim 1, characterized in that: A plurality of ventilation holes are arranged around the shell.

6. A cooling structure for a solid-state power source amplifier according to claim 1, characterized in that: A handle is also provided on the outside of the shell.

7. A solid-state power source amplifier system, characterized in that: A cooling structure for a solid-state power source amplifier as claimed in any one of claims 1 to 6 is adopted.

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