Semiconductor chip belt automatic laser marking press

Abstract

The utility model relates to an automatic laser marking press for a semiconductor chip belt. The automatic laser marking press comprises a laser device, an unwinding device and a winding device, wherein the unwinding device and the winding device are arranged on two sides of the laser device; the laser device comprises a laser rack as well as a rail mechanism, a jacking mechanism and a laser mechanism which are mounted on the laser rack; the track mechanism is used for conveying a semiconductor chip belt, and a hollow area is arranged in the middle of the track mechanism. The jacking mechanism is arranged below the rail mechanism and located in the hollowed-out area. The laser mechanism comprises a support, a laser head, a protective cover and a dust collection part, the support is fixedly connected with the laser rack, the laser head is arranged above the rail mechanism, corresponds to the jacking mechanism in position and is fixedly connected to the support, the protective cover covers the laser head and is connected with the support, and the dust collection part is arranged on the protective cover and / or below the protective cover. The chip laser etching equipment solves the problem that the existing chip laser etching equipment is not provided with a smoke and dust treatment structure, so that diseases can be induced after workers inhale excessive smoke and dust.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, and particularly relates to a semiconductor chip automatic laser engraving machine. Background Art

[0002] A semiconductor chip is a way to miniaturize a circuit in electronics and is usually manufactured on the surface of a semiconductor wafer. After the semiconductor chip is processed by an SMT machine, information processing needs to be carried out on the surface of the semiconductor chip. Generally, some basic information such as the model number is laser engraved on the semiconductor chip. Traditional laser processing is generally manual feeding, and then the worker manually controls the laser machine to engrave each workpiece one by one. In this way, not only is the workload large, but the efficiency is extremely low.

[0003] To solve the problems existing in the traditional technology, the utility model patent with the publication number of CN216912518U provides a chip board laser engraving machine. Through the cooperation of a conveying mechanism and a laser engraving machine assembly, automatic conveying and automatic laser engraving of the chip are realized, and the working efficiency is greatly improved. However, when the laser processes the workpiece, a large amount of smoke and dust will be generated, and the chip board laser engraving machine does not set any treatment structure. When the worker inhales excessive smoke and dust, various diseases may be induced, seriously endangering physical health.

[0004] Therefore, it is necessary to provide a technical solution to solve the above problems. Content of the Utility Model

[0005] The utility model aims to solve the problem that in the existing chip laser engraving equipment, there is no smoke and dust treatment structure. When the worker inhales excessive smoke and dust, various diseases may be induced, seriously endangering physical health, and there are great potential safety hazards.

[0006] To achieve the above object, the utility model provides a semiconductor chip automatic laser engraving machine, which includes a laser device and a unwinding device and a winding device arranged on both sides of the laser device; the laser device includes a laser machine frame and a track mechanism, a lifting mechanism and a laser mechanism installed on the laser machine frame, wherein:

[0007] The track mechanism is used for conveying the semiconductor chip tape, and a hollow area is arranged in the middle thereof;

[0008] The lifting mechanism is arranged below the track mechanism and is located at the hollow area;

[0009] The laser mechanism includes a bracket, a laser head, a shield, and a dust suction member. The bracket is fixedly connected to the laser machine frame. The laser head is disposed above the track mechanism and corresponds to the position of the lifting mechanism, and is fixedly connected to the bracket. The shield covers the outside of the laser head and is connected to the bracket. The dust suction member is disposed on and / or below the shield.

[0010] More specifically, the laser device further includes a vision detection mechanism. The vision detection mechanism is located above the track mechanism and includes a first detector and a second detector. The first detector is disposed outside the laser head and is located inside the shield. The second detector is disposed on one side of the shield close to the winding device.

[0011] More specifically, a second telescopic driver is disposed on the bracket. The shield is slidably connected to the bracket. The second telescopic driver is used to drive the lifting movement of the shield.

[0012] More specifically, the lifting mechanism includes a first telescopic driver, a light source, and a vacuum suction member. The first telescopic driver is fixedly connected to the laser machine frame and is used to drive the lifting movement of the light source. The vacuum suction member is installed above the light source and is made of a light-transmitting material.

[0013] More specifically, the track mechanism includes a conveying track and two sets of driving components. The conveying track is composed of two parallel guide rails. Support ribs are disposed on the opposite surfaces of the two guide rails. Stopping members are disposed at the top of the guide rails at positions corresponding to the support ribs. The two sets of driving components are disposed at both ends of the conveying track and are used to drive the semiconductor chip tape to move along the conveying track.

[0014] More specifically, a plurality of convex ribs are disposed at the top of the support ribs.

[0015] More specifically, the driving component includes a driver, a clutch, two conveying wheels, and two pressing wheels. The pressing wheels and the conveying wheels are disposed on both guide rails. The pressing wheels and the conveying wheels are distributed vertically and are both rotatably connected to the guide rails. The output shaft of the driver is connected to the conveying wheel through the clutch.

[0016] More specifically, pressing seats are disposed at both ends of the guide rails. One end of the pressing seat is hinged to the guide rail. The pressing wheel is rotatably connected to the pressing seat. A counterweight block is detachably connected to the end of the pressing seat away from the guide rail.

[0017] More specifically, an ion wind emitter is disposed above the track mechanism. The ion wind emitter is installed on the laser machine frame.

[0018] More specifically, the unwinding device includes an unwinding frame, an unwinding wheel, and a winding wheel. The unwinding wheel and the winding wheel are vertically distributed and are both rotatably connected to the unwinding frame. A driving component for driving the unwinding wheel and the winding wheel to rotate is provided on the unwinding frame; two groups of sensing components are provided between the unwinding wheel and the winding wheel. The two groups of sensing components are vertically distributed and are installed on the unwinding frame.

[0019] The technical effect of the present utility model is as follows:

[0020] In this application, a protective cover and a dust suction component are added. When the laser head performs laser processing on the semiconductor chips on the semiconductor chip tape, the generated smoke and dust can be temporarily stored in the protective cover, and the dust suction component is connected to an external dust suction device. The smoke and dust in the protective cover are quickly extracted through the dust suction device, thereby avoiding the outward diffusion of the smoke and dust, reducing the risk of the staff inhaling the smoke and dust, preventing harm to the physical health of the staff, and eliminating potential safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic structural diagram of an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0022] Figure 2 It is a schematic structural diagram of a laser device in an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0023] Figure 3 It is a partial schematic diagram (without showing the protective cover) of an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0024] Figure 4 It is a schematic structural diagram of a laser mechanism in an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0025] Figure 5 It is a schematic structural diagram of a track mechanism in an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0026] Figure 6 is Figure 5 an enlarged schematic diagram at A in

[0027] Figure 7 is Figure 5 an enlarged schematic diagram at B in

[0028] Figure 8 It is a partial schematic diagram of a track mechanism in an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0029] Figure 9Schematic diagram of the structure of the pressure seat in an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0030] Figure 10 Schematic diagram of the structure of the pressure seat in another perspective of an automatic laser engraving machine for semiconductor chip tapes according to the present utility model;

[0031] Figure 11 Schematic diagram of the structure of the lifting mechanism in an automatic laser engraving machine for semiconductor chip tapes according to the present utility model.

[0032] Markings in the figure:

[0033] 1. Laser device; 2. Unwinding device; 3. Rewinding device;

[0034] 11. Track mechanism; 111. Guide rail; 1111. Support rib; 1112. Rib; 1113. Stopper; 112. Driving assembly; 1121. Driver; 1122. Clutch; 1123. Conveyor wheel; 1124. Pressure wheel; 1125. Pressure seat; 1126. Rotating block; 1127. Slide block; 1128. Plug rod; 1129. Counterweight; 12. Lifting mechanism; 121. First telescopic driver; 122. Light source; 123. Vacuum suction component; 13. Laser mechanism; 131. Bracket; 132. Laser head; 133. Protective cover; 134. Dust suction component; 135. Second telescopic driver; 14. Vision detection mechanism; 141. First detector; 142. Second detector; 16. Displacement detection mechanism; 161. Encoder; 162. Detection gear; 17. Laser machine frame;

[0035] 21. Unwinding machine frame; 22. Unwinding wheel; 23. Rewinding wheel; 24. Sensing component; 25. Support member. Detailed implementation manners

[0036] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element at the same time; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0038] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more, unless otherwise specifically defined.

[0039] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0040] To more clearly illustrate the technical solution of the present utility model, a preferred embodiment is provided below. Specifically, refer to Figures 1 to 11 , an automatic laser engraving machine for semiconductor chip tapes, including a laser device 1, and a unwind device 2 and a rewind device 3 arranged on both sides of the laser device 1; the laser device 1 includes a laser frame 17, and a track mechanism 11, a lifting mechanism 12 and a laser mechanism 13 installed on the laser frame 17, wherein:

[0041] The track mechanism 11 is used to convey the semiconductor chip tape, and a hollow area is provided in the middle thereof;

[0042] The lifting mechanism 12 is arranged below the track mechanism 11 and is located at the hollow area;

[0043] The laser mechanism 13 includes a bracket 131, a laser head 132, a shield 133 and a dust suction member 134. The bracket 131 is fixedly connected to the laser frame 17. The laser head 132 is arranged above the track mechanism 11 and corresponds to the position of the lifting mechanism 12, and is fixedly connected to the bracket 131. The shield 133 covers the outside of the laser head 132 and is connected to the bracket 131. The dust suction member 134 is arranged on and / or below the shield 133.

[0044] Compared with the prior art, a semiconductor chip tape automatic laser engraving machine according to the present utility model is different in that a shield 133 and a dust suction member 134 are added in this application to extract the smoke and dust generated during laser engraving. During actual application, the unwinding device 2 outputs a semiconductor chip tape, which passes through the track mechanism 11 and is wound onto the winding device 3. The lifting mechanism 12 is used to support and fix the semiconductor chip tape on the track mechanism 11, and the laser mechanism 13 engraves and processes the semiconductor chip tape fixed by the lifting mechanism 12. During the engraving and processing, the generated smoke and dust can be temporarily stored in the shield 133, and the dust suction member 134 is connected to an external dust suction device to quickly extract the smoke and dust in the shield 133 through the dust suction device, thereby preventing the smoke and dust from spreading outwards, reducing the risk of staff inhaling the smoke and dust, avoiding harm to the health of the staff, and eliminating potential safety hazards.

[0045] In this embodiment, the laser device 1 further includes a vision detection mechanism 14. The vision detection mechanism 14 is located above the track mechanism 11 and includes a first detector 141 and a second detector 142. The first detector 141 is arranged outside the laser head 132 and is located inside the shield 133, and the second detector 142 is arranged on one side of the shield 133 close to the winding device 3. Both the first detector 141 and the second detector 142 are selected as CCD cameras. During actual application, the first detector 141 is used to detect the position of the semiconductor chip tape on the track mechanism 11 so that the laser head 132 can accurately engrave and process the semiconductor chips on the semiconductor chip tape, and the second detector 142 is used to detect the engraving and processing quality. For example, whether the engraved text is clear and whether the engraving position is accurate.

[0046] Preferably, light supplement components are arranged on both the first detector 141 and the second detector 142 to supplement light to the semiconductor chip tape, thereby improving the detection accuracy.

[0047] In this embodiment, a second telescopic driver 135 is arranged on the bracket 131. The shield 133 is slidably connected to the bracket 131, and the second telescopic driver 135 is used to drive the shield 133 to move up and down. With the above design, the shield 133 can be retracted upwards, so that it is convenient for the staff to perform corresponding processing on the semiconductor chip tape on the track mechanism 11.

[0048] In this embodiment, the lifting mechanism 12 includes a first telescopic driver 121, a light source 122, and a vacuum suction attachment 123. The first telescopic driver 121 is fixedly connected to the laser frame 17 and is used to drive the light source 122 to move up and down. The vacuum suction attachment 123 is installed above the light source 122 and is made of a light-transmitting material. In practical applications, the first telescopic driver 121 can drive the light source 122 to move upward, and the vacuum suction attachment 123 will move into the hollow area and adsorb and fix the semiconductor chip tape. Through the irradiation of the light source 122, the detection results of the first detector 141 and the second detector 142 can be made more accurate. Preferably, the vacuum suction attachment 123 is a hollow box body. The top of the box body is provided with an air suction hole, and its side end is provided with an air extraction hole. The box body is made of acrylic material.

[0049] In this embodiment, the track mechanism 11 includes a conveying track and two sets of driving components 112; the conveying track is composed of two parallel guide rails 111. Support ribs 1111 are provided on the opposite surfaces of the two guide rails 111, and a stopper 1113 is provided at the top of the guide rail 111 at the position corresponding to the support rib 1111; two sets of driving components 112 are arranged at both ends of the conveying track and are used to drive the semiconductor chip tape to move along the conveying track. The distance between the two guide rails 111 is adjustable to meet the conveying requirements of semiconductor chip tapes of different specifications. In practical applications, the semiconductor chip tape is arranged between the two guide rails 111, and its two sides are respectively placed on the corresponding support ribs 1111. The stopper 1113 plays a limiting role on the semiconductor chip tape; with the above design, the contact area between the semiconductor chip tape and the conveying track can be reduced, the risk of wear of the semiconductor chip tape can be reduced, and the conveying stability of the semiconductor chip tape can be improved.

[0050] Preferably, a plurality of convex ribs 1112 are provided on the top of the support rib 1111. With the above design, the contact area between the semiconductor chip tape and the conveying track can be further reduced, and the moving smoothness of the semiconductor chip tape can be improved.

[0051] In this embodiment, the driving assembly 112 includes a driver 1121, a clutch 1122, two conveying wheels 1123 and two pressing wheels 1124. The two guide rails 111 are both provided with the pressing wheels 1124 and the conveying wheels 1123. The pressing wheels 1124 and the conveying wheels 1123 are distributed vertically, and are both rotatably connected to the guide rail 111. The output shaft of the driver 1121 is connected to the conveying wheel 1123 through the clutch 1122. When the equipment is running normally, the semiconductor chip tape is driven to be conveyed forward by the driving assembly 112 at the rear end. When the second detector 142 detects that the semiconductor chips on the semiconductor chip tape are not clearly engraved or are missing an engraving, the clutch 1122 at the rear end will control the separation of the driver 1121 and the conveying wheel 1123, and the clutch 1122 at the front end will control the connection of the driver 1121 and the conveying wheel 1123. At this time, the driving assembly 112 at the front end will drive the semiconductor chip tape to move backward, so that the semiconductor chips with unclear engraving or missing engraving are reset to the laser head 132 for re-engraving processing. This structural design is ingenious, which can not only reduce the risk of missing engraving, but also improve the quality of engraving.

[0052] In this embodiment, pressing seats 1125 are provided at both ends of the guide rail 111. One end of the pressing seat 1125 is hinged to the guide rail 111. The pressing wheel 1124 is rotatably connected to the pressing seat 1125. A counterweight 1129 is detachably connected to the end of the pressing seat 1125 away from the guide rail 111. In practical applications, the semiconductor chip tape is located above the conveying wheel 1123, and the pressing seat 1125 is located above the semiconductor chip tape. Under the action of the gravity of the pressing seat 1125, the pressing wheel 1124 will press against the top surface of the semiconductor chip tape, so that the semiconductor chip tape is kept in close contact with the conveying wheel 1123, ensuring that the conveying wheel 1123 can continuously convey the semiconductor chip tape and improving the movement stability of the semiconductor chip tape. In addition, according to different semiconductor chip tapes, different counterweights 1129 can be replaced to change the pressure exerted by the pressing wheel 1124 on the semiconductor chip tape to meet the use requirements of different semiconductor chip tapes.

[0053] Further, a rotating block 1126 is rotatably connected to the middle of the pressing seat 1125, and a slider 1127 is slidably connected to one side thereof. A slot is provided on the side of the rotating block 1126 close to the slider 1127. A plug rod 1128 is rotatably connected to the slider 1127, and the end of the plug rod 1128 is placed in the slot. A position adjusting member for adjusting the position of the slider 1127 is provided on the pressing seat 1125; the pressing wheel 1124 is rotatably connected to the side of the rotating block 1126 away from the slider 1127. In practical applications, the position adjusting member can control the rotation of the rotating block 1126 by adjusting the position of the slider 1127, thereby changing the inclination angle of the pressing wheel 1124. When the semiconductor chip tape moves forward, the position adjusting member will adjust the position of the slider 1127 so that the corresponding pressing wheels 1124 on the two guide rails 111 are distributed in an outward V shape. At this time, the semiconductor chip tape will be subjected to an outward pushing tension applied by the pressing wheels 1124 during the movement, so that the semiconductor chip tape on the track mechanism 11 is kept in a tensioned state, thereby improving the processing quality during subsequent engraving. When the semiconductor chip tape needs to move backward, the position adjusting member will adjust the position of the slider 1127 again so that the corresponding pressing wheels 1124 on the two guide rails 111 are distributed in an inward V shape, so that when the semiconductor chip tape moves backward, it will still be subjected to an outward pushing tension, ensuring that the semiconductor chip tape on the track mechanism 11 is always kept in a tensioned state.

[0054] In this embodiment, an ion wind emitter is provided above the track mechanism 11, and the ion wind emitter is installed on the laser frame 17. In practical applications, ion wind is blown onto the semiconductor chip tape through the ion wind emitter. The ion wind can blow away the dust on the semiconductor chip tape and remove the static electricity attached to the semiconductor chip tape, so that the semiconductor chip is kept clean. In this way, it is beneficial to improve the engraving quality.

[0055] In this embodiment, a displacement detection mechanism 16 is provided on the conveying rail. The displacement detection mechanism 16 includes an encoder 161 and a detection gear 162. The encoder 161 is installed on the conveying rail, and the detection gear 162 is installed on the output end of the encoder 161. It should be noted that there are arrayed holes beside the semiconductor chip tape, and the teeth of the detection gear 162 are placed in the holes. In actual application, when the semiconductor chip tape moves, it will drive the detection gear 162 to rotate. By analyzing the rotation angle of the detection gear 162, the encoder 161 can detect the displacement of the semiconductor chip tape, and then determine whether the next chip moves accurately into place. For example, assume that when the semiconductor chip tape moves normally once, the rotation angle of the detection gear 162 is a°. If the encoder 161 detects that the rotation angle of the detection gear 162 is greater than or less than a°, it means that the movement amount of the semiconductor chip tape does not meet the standard and the chip does not move into place. At this time, the position of the semiconductor chip tape needs to be readjusted to align the chip with the laser head 132 again. With the above design, the accurate alignment between the chip and the laser head 132 can be ensured, and the processing quality is improved.

[0056] In this embodiment, the unwinding device 2 includes an unwinding frame 21, an unwinding wheel 22, and a winding wheel 23. The unwinding wheel 22 and the winding wheel 23 are arranged vertically and are both rotatably connected to the unwinding frame 21. A driving component for driving the unwinding wheel 22 and the winding wheel 23 to rotate is provided on the unwinding frame 21. Two groups of sensing components 24 are arranged between the unwinding wheel 22 and the winding wheel 23. The two groups of sensing components 24 are arranged vertically and are installed on the unwinding frame 21. In actual application, the unwinding wheel 22 unwinds the material roll, and the semiconductor chip tape in the material roll is conveyed to the track mechanism, while the release film roll in the material roll is wound onto the winding wheel 23. It should be understood that there is a buffer section of the semiconductor chip tape with a natural droop between the unwinding wheel 22 and the track mechanism. The provision of this buffer section of the semiconductor chip tape is mainly used to achieve soft transmission, so that during the movement of the semiconductor chip tape, neither the semiconductor chip tape on the unwinding wheel 22 nor the track mechanism 11 is subjected to rigid tension, thereby improving the smoothness and stability of the movement of the semiconductor chip tape on the track mechanism 11, and at the same time avoiding the breakage of the semiconductor chip tape. The buffer section of the semiconductor chip tape should not be too long or too short. The positions detected by the two groups of sensing components 24 are the thresholds that the lowest point of the buffer section of the semiconductor chip tape can reach. When the sensing component 24 detects an abnormality, it means that the buffer section of the semiconductor chip tape is too long or too short. At this time, the sensing component 24 will feedback information to make the device alarm.

[0057] In this embodiment, a receiving groove is provided on the unwinding rack 21. The receiving groove is located between the unwinding wheel 22 and the winding wheel 23, and a support member 25 is provided in the receiving groove. It should be understood that when the coil material on the unwinding device 2 is exhausted, a new coil material needs to be loaded and the new coil material is connected to the old coil material. At this time, the support member 25 can be pulled outwards to place the new coil material and the old coil material, facilitating the coil material connection operation for the staff.

[0058] In this embodiment, an ion wind emitter is also provided on the unwinding rack 21 to remove dust and static electricity from the semiconductor chip tape.

[0059] It should be noted that the structure of the winding device 3 is the same as that of the unwinding device 2, so it will not be elaborated here.

[0060] The above are only the preferred embodiments of the present utility model, and its structure is not limited to the shapes listed above. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A semiconductor chip tape automatic laser marking machine, characterized in that: The invention comprises a laser device and an unwinding device and a rewinding device arranged on both sides of the laser device; the laser device comprises a laser frame and a track mechanism, a lifting mechanism and a laser mechanism installed on the laser frame, wherein: The track mechanism is used to transport the semiconductor chip belt, and a hollow area is provided in the middle thereof; The lifting mechanism is arranged below the track mechanism and is located at the hollow area; the laser mechanism includes a bracket, a laser head, a protective cover and a dust collector, the bracket is fixedly connected to the laser frame, the laser head is arranged above the track mechanism and corresponds to the position of the lifting mechanism, and is fixedly connected to the bracket, the protective cover is arranged outside the laser head and is connected to the bracket, and the dust collector is arranged on the protective cover and / or below the protective cover.

2. The semiconductor chip tape automatic laser marking machine according to claim 1, characterized in that: The laser device also includes a visual detection mechanism, which is located above the track mechanism and includes a first detector and a second detector. The first detector is arranged on the outside of the laser head and located in the protective cover, and the second detector is arranged on a side of the protective cover close to the winding device.

3. The automatic laser marking machine for semiconductor chip tape according to claim 1, characterized in that: The bracket is provided with a second telescopic driver, the shield is slidably connected to the bracket, and the second telescopic driver is used to drive the shield to move up and down.

4. The automatic laser marking machine for semiconductor chip tape according to claim 1, characterized in that: The lifting mechanism includes a first telescopic driver, a light source and a vacuum adsorption component. The first telescopic driver is fixedly connected to the laser frame and is used to drive the light source to move up and down. The vacuum adsorption component is installed above the light source and is made of a light-transmitting material.

5. The automatic laser marking machine for semiconductor chip tape according to claim 1, characterized in that: The track mechanism includes a conveying rail and two sets of driving components; the conveying rail is composed of two parallel guide rails, and supporting ridges are arranged on the opposite surfaces of the two guide rails, and a stopper is arranged on the top of the guide rail at a position corresponding to the supporting ridges; two sets of driving components are arranged at both ends of the conveying rail, which are used to drive the semiconductor chip belt to move along the conveying rail.

6. The automatic laser marking machine for semiconductor chip tape according to claim 5, characterized in that: A plurality of convex ribs are arranged on the top of the supporting convex strip.

7. The semiconductor chip tape automatic laser marking machine according to claim 5, characterized in that: The driving assembly includes a driver, a clutch, two conveying wheels and two pressure wheels. The pressure wheels and the conveying wheels are arranged on the two guide rails. The pressure wheels and the conveying wheels are distributed up and down and are rotatably connected to the guide rails. The output shaft of the driver is connected to the conveying wheels through the clutch.

8. The automatic laser marking machine for semiconductor chip tape according to claim 7, characterized in that: Both ends of the guide rail are provided with a pressure seat, one end of the pressure seat is hinged to the guide rail, the pressure wheel is rotatably connected to the pressure seat, and one end of the pressure seat away from the guide rail is detachably connected with a counterweight block.

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