Silicon wafer double-channel automatic laser processing equipment

Abstract

The utility model relates to a silicon wafer double-channel automatic laser processing device which comprises a main machine assembly, the main machine assembly comprises a main machine frame, and a galvanometer processing assembly and a motion platform assembly are arranged in the main machine frame. A wafer feeding and discharging assembly is arranged on the side, in the positive direction of the X axis, of the main machine assembly, and a square wafer feeding and discharging assembly is arranged on the side, in the negative direction of the X axis, of the main machine assembly. Due to the arrangement of the double-channel structure, machining of square pieces and round pieces can be compatible, the square pieces and the round pieces are fed and discharged on the two sides respectively, the utilization rate of equipment is improved, and the investment cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer dual-channel automatic laser processing device. Background Art

[0002] With the development of semiconductor technology, the demand for high-performance and high-integration semiconductor chips is increasing, and the manufacturing difficulty of chips is also increasing. Semiconductor chips are usually fabricated by depositing integrated circuit element structures on a whole substrate wafer, then performing wafer dicing, and finally packaging each die obtained after dicing.

[0003] After a large amount of retrieval, it is found that the existing Chinese patent publication number is CN215393222U, which discloses a wafer laser cutting device based on the linkage of a galvanometer and a platform, including a laser, a beam expander, a polarization element, a first mirror, a second mirror, a third mirror, a fourth mirror, a beam shaper, a two-dimensional scanning galvanometer, a telecentric field lens, an X-axis moving platform, a Z-direction moving mechanism, a wafer stage, a Y-axis moving platform, a wafer pre-alignment and transfer system, a camera system and a computer. The laser, the polarization element, the beam shaper, the two-dimensional scanning galvanometer, the X-axis moving platform, the Y-axis moving platform, the Z-direction moving mechanism, the wafer stage and the wafer transfer and pre-alignment system are controlled by a computer. The utility model can adjust the laser polarization state and the beam energy distribution form incident on the wafer surface according to different wafer cutting processes, improving the adaptability and cutting quality of wafer cutting.

[0004] In summary, the problems existing in the prior art are as follows:

[0005] The existing wafer cutting devices generally have a single-channel structure, cannot be compatible with the processing of square wafers and round wafers, are dedicated to special machines, and the processing methods are single.

[0006] In view of the above defects, the designer actively conducts research and innovation in order to create a silicon wafer dual-channel automatic laser processing device, making it more valuable in industry. Summary of the Utility Model

[0007] To solve any one of the above technical problems, the purpose of the utility model is to provide a silicon wafer dual-channel automatic laser processing device.

[0008] To achieve the above purpose, the utility model adopts the following technical solutions:

[0009] The silicon wafer dual-channel automatic laser processing device includes a main machine assembly, and the main machine assembly includes a main machine frame. A galvanometer processing assembly and a motion platform assembly are arranged inside the main machine frame;

[0010] On one side of the host component along the positive X-axis direction, a wafer loading and unloading component is provided, and on one side of the host component along the negative X-axis direction, a square wafer loading and unloading component is provided;

[0011] The motion platform component includes a marble base, a Y-axis motion module, an X-axis motion module, a Z-axis motion module, and a marble column. The marble base is installed on the host frame. The Y-axis motion module installed on the marble base drives the upper X-axis motion module to move in the Y-axis direction. The X-axis motion module drives the upper rotary jig component to move in the X-axis direction. A marble column is installed on one side of the marble base along the negative Y-axis direction. A Z-axis motion module is installed on the marble column, and the Z-axis motion module drives the galvanometer processing component to move in the Z-axis direction;

[0012] The wafer loading and unloading component includes a wafer machine frame. A wafer handling component is installed on the wafer machine frame. Wafer receiving components are installed on the wafer machine frame on both sides of the wafer handling component along the Y-axis direction;

[0013] The square wafer loading and unloading component includes a square wafer machine frame. An upper conveyor belt and a lower conveyor belt are installed on the square wafer machine frame from top to bottom in sequence. Both the upper conveyor belt and the lower conveyor belt drive the wafer basket to run in the Y-axis direction. A square wafer lifting mechanism is installed on the square wafer machine frame on one side of the upper conveyor belt or the lower conveyor belt along the positive Y-axis direction. The square wafer lifting mechanism drives the transfer conveyor belt to move in the Z-axis direction, and the transfer conveyor belt drives the wafer basket to run in the Y-axis direction. A square wafer return component is installed on the square wafer machine frame on one side of the square wafer lifting mechanism along the positive Y-axis direction. A square wafer handling component is installed on the square wafer machine frame between the square wafer lifting mechanism and the square wafer return component.

[0014] As a further improvement of the present utility model, a boundary camera component is installed on the marble column on one side of the galvanometer processing component along the negative Y-axis direction. The boundary camera component includes a guide shaft, an image adjustment block, a first connecting pipe, a second connecting pipe, a third connecting pipe, a boundary camera mounting frame, and a boundary camera. The bottom of the guide shaft is installed on the marble column through a shaft base. One side of the image adjustment block is connected to the guide shaft, and the other side of the image adjustment block is connected to the top of the first connecting pipe. The bottom of the first connecting pipe is connected to the first side of the third connecting pipe through a second clamping fixing frame. The first side of the second connecting pipe is fixed to the second side of the third connecting pipe through a first pillar fixing clip. The second side of the second connecting pipe is connected to the lower boundary camera through a boundary camera mounting frame.

[0015] As a further improvement of the present utility model, a laser power supply is installed on the marble column on one side of the galvanometer processing component along the negative Y-axis direction, and a gas circuit component is installed on the host frame below the marble base.

[0016] As a further improvement of the present utility model, the galvanometer processing assembly includes a scanning galvanometer, a light box assembly, and a manual camera assembly. The light box assembly is installed on the driving end of the Z-axis motion module. A scanning galvanometer is installed on one side of the light box assembly, and the manual camera assembly is installed on the scanning galvanometer through a camera bracket fixing plate.

[0017] As a further improvement of the present utility model, a dust collection cover is installed at the bottom of the scanning galvanometer.

[0018] As a further improvement of the present utility model, the rotary fixture assembly includes a rotary fixture bottom plate and fixture first side plates, fixture second side plates, fixture third side plates, and fixture fourth side plates around the periphery of the rotary fixture bottom plate. A torque motor is installed in the middle of the rotary fixture bottom plate, and the torque motor drives the upper rotary adsorption platform to rotate.

[0019] As a further improvement of the present utility model, a filter plate is provided on the fixture first side plate, an induction sheet is installed on the rotary adsorption platform, and a rotary adsorption platform sensor adapted to the above induction sheet is installed on the rotary fixture bottom plate below the induction sheet.

[0020] As a further improvement of the present utility model, regularizing assemblies are installed on the rotary fixture bottom plates on a diagonal line of the rotary adsorption platform. The regularizing assembly includes a regularizing cylinder, a regularizing plate, and regularizing columns. The regularizing cylinder installed on the rotary fixture bottom plate drives the regularizing plate to move inward, and several regularizing columns are installed on the regularizing plate.

[0021] As a further improvement of the present utility model, the wafer receiving assembly includes a wafer receiving table, a wafer receiving lifting mechanism, and a wafer receiving lifting frame. The wafer receiving table is installed on the wafer machine frame. The wafer receiving lifting mechanism located at the bottom of the wafer receiving table drives the upper wafer receiving lifting frame to move along the Z-axis direction above the wafer receiving table, and several wafer receiving limit columns are installed on the wafer receiving table outside the wafer receiving lifting frame.

[0022] As a further improvement of the present utility model, several wafer receiving sensors are installed at the edge of the wafer receiving table.

[0023] By means of the above solutions, the present utility model has at least the following advantages:

[0024] With the dual-channel structure setting of the present utility model, it can be compatible with the processing of square wafers and round wafers. The square wafers and round wafers are loaded and unloaded on both sides respectively, improving the utilization rate of the equipment and reducing the investment cost.

[0025] The present utility model has automated processing, greatly reducing the manual misoperation and improving the yield rate.

[0026] The above description is only an overview of the technical solution of the present utility model. In order to understand the technical means of the present utility model more clearly and be able to implement it according to the content of the specification, the following will describe in detail with reference to the preferred embodiments of the present utility model and the accompanying drawings as follows. Brief Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0028] Figure 1 is a schematic structural diagram of an automated laser processing device with a dual-channel for silicon wafers of the present utility model;

[0029] Figure 2 is Figure 1 a schematic structural diagram of the main machine assembly in

[0030] Figure 3 is Figure 2 a schematic structural diagram after removing the main machine frame in

[0031] Figure 4 is Figure 3 a schematic structural diagram of the galvanometer processing assembly in

[0032] Figure 5 is Figure 3 a schematic structural diagram of the boundary camera assembly in

[0033] Figure 6 is Figure 3 a schematic structural diagram of the motion platform assembly in

[0034] Figure 7 is Figure 3 a schematic structural diagram of the rotary jig assembly in

[0035] Figure 8 is Figure 1 a schematic structural diagram of the wafer loading and unloading assembly in

[0036] Figure 9 is Figure 8 a schematic structural diagram of the wafer receiving assembly in

[0037] Figure 10 is Figure 1 a schematic structural diagram of the square wafer loading and unloading assembly.

[0038] Among them, the meanings of the reference numerals in the drawings are as follows.

[0039] Host component 1, wafer loading and unloading component 2, square wafer loading and unloading component 3, host frame 4, galvanometer processing component 5, boundary camera component 6, laser power supply 7, motion platform component 8, gas circuit component 9, rotary fixture component 10, dust hood 11, scanning galvanometer 12, light box component 13, manual camera component 14, camera bracket fixing plate 15, guide shaft 16, image adjustment block 17, first connecting pipe 18, second connecting pipe 19, third connecting pipe 20, first pillar fixing clip 21, second clamping fixing frame 22, boundary camera 23, shaft base 24, Y-axis motion module 25, X-axis motion module 26, Z-axis motion module 27, marble column 28, regularization component 29, rotary adsorption platform 30, first fixture side plate 31, filter plate 32, second fixture side plate 33, rotary adsorption platform sensor 34, torque motor 35, rotary fixture bottom plate 36, third fixture side plate 37, fourth fixture side plate 38, wafer machine frame 39, wafer handling component 40, wafer receiving component 41, wafer receiving table 42, wafer receiving lifting mechanism 43, wafer receiving lifting frame 44, wafer receiving limit post 45, wafer receiving sensor 46, square wafer machine frame 47, upper conveyor belt 48, lower conveyor belt 49, wafer basket 50, square wafer lifting mechanism 51, transfer conveyor belt 52, square wafer handling component 53, square wafer return component 54. Detailed implementation manners

[0040] The following combines the drawings and embodiments to further describe in detail the specific implementation manners of the present utility model. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0041] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the claimed present utility model, but only represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0042] As Figures 1 to 10 shown, a silicon wafer dual-channel automated laser processing device includes a host component 1. A wafer loading and unloading component 2 is provided on one side of the host component 1 along the positive X-axis direction, and a square wafer loading and unloading component 3 is provided on one side of the host component 1 along the negative X-axis direction.

[0043] I. Mainframe Component 1:

[0044] The mainframe component 1 includes a mainframe rack 4, and a galvanometer processing component 5 and a motion platform component 8 are arranged inside the mainframe rack 4.

[0045] The motion platform component 8 includes a marble base, a Y-axis motion module 25, an X-axis motion module 26, a Z-axis motion module 27, and a marble column 28. The marble base is installed on the mainframe rack 4. The Y-axis motion module 25 installed on the marble base drives the upper X-axis motion module 26 to move in the Y-axis direction. The X-axis motion module 26 drives the upper rotary jig component 10 to move in the X-axis direction. A marble column 28 is installed on one side of the marble base along the negative Y-axis direction. A Z-axis motion module 27 is installed on the marble column 28, and the Z-axis motion module 27 drives the galvanometer processing component 5 to move in the Z-axis direction.

[0046] A boundary camera component 6 is installed on the marble column 28 on the side of the galvanometer processing component 5 along the negative Y-axis direction. The boundary camera component 6 includes a guide shaft 16, an image adjustment block 17, a first connecting pipe 18, a second connecting pipe 19, a third connecting pipe 20, a boundary camera mounting bracket, and a boundary camera 23. The bottom of the guide shaft 16 is installed on the marble column 28 through a shaft base 24. One side of the image adjustment block 17 is connected to the guide shaft 16, and the other side of the image adjustment block 17 is connected to the top of the first connecting pipe 18. The bottom of the first connecting pipe 18 is connected to the first side of the third connecting pipe 20 through a second clamping fixture 22. The first side of the second connecting pipe 19 is connected to the second side of the third connecting pipe 20 through a first pillar fixing clip 21. The second side of the second connecting pipe 19 is connected to the lower boundary camera 23 through a boundary camera mounting bracket.

[0047] A laser power supply 7 is installed on the marble column 28 on the side of the galvanometer processing component 5 along the negative Y-axis direction, and a gas circuit component 9 is installed on the mainframe rack 4 below the marble base.

[0048] The galvanometer processing component 5 includes a scanning galvanometer 12, a light box component 13, and a manual camera component 14. The light box component 13 is installed on the driving end of the Z-axis motion module 27. A scanning galvanometer 12 is installed on one side of the light box component 13. The manual camera component 14 is installed on the scanning galvanometer 12 through a camera bracket fixing plate 15. A dust collection cover 11 is installed at the bottom of the scanning galvanometer 12.

[0049] The rotary fixture assembly 10 includes a rotary fixture bottom plate 36, and fixture first side plates 31, fixture second side plates 33, fixture third side plates 37, and fixture fourth side plates 38 around the periphery on the rotary fixture bottom plate 36. A torque motor 35 is installed in the middle of the rotary fixture bottom plate 36, and the torque motor 35 drives the upper rotary adsorption platform 30 to rotate. A filter plate 32 is provided on the fixture first side plate 31. An induction sheet is installed on the rotary adsorption platform 30, and a rotary adsorption platform sensor 34 adapted to the above-mentioned induction sheet is installed on the rotary fixture bottom plate 36 below the induction sheet.

[0050] Regularization assemblies 29 are installed on the rotary fixture bottom plate 36 on a diagonal line of the rotary adsorption platform 30. The regularization assembly 29 includes a regularization cylinder, a regularization plate, and regularization columns. The regularization cylinder installed on the rotary fixture bottom plate 36 drives the regularization plate to move inward, and several regularization columns are installed on the regularization plate.

[0051] There are two groups of regularization assemblies 29, which can be telescoped on the diagonal line of the fixture bottom plate 36 to regularize the silicon wafers.

[0052] II. Wafer loading and unloading assembly 2:

[0053] The wafer loading and unloading assembly 2 includes a wafer machine frame 39. A wafer handling assembly 40 is installed on the wafer machine frame 39, and wafer receiving assemblies 41 are installed on the wafer machine frame 39 on both sides along the Y-axis direction of the wafer handling assembly 40.

[0054] The wafer receiving assembly 41 includes a wafer receiving table 42, a wafer receiving lifting mechanism 43, and a wafer receiving lifting frame 44. The wafer receiving table 42 is installed on the wafer machine frame 39. The wafer receiving lifting mechanism 43 at the bottom of the wafer receiving table 42 drives the upper wafer receiving lifting frame 44 to move along the Z-axis direction above the wafer receiving table 42. Several wafer receiving limit columns 45 are installed on the wafer receiving table 42 outside the wafer receiving lifting frame 44. Several wafer receiving sensors 46 are installed at the edge of the wafer receiving table 42.

[0055] The wafer handling assembly 40 transports the wafers on one side of the wafer receiving assembly 41 to the main machine assembly 1 for processing, and then transports them to the wafer receiving assembly 41 on the other side through the wafer handling assembly 40 after processing.

[0056] III. Square wafer loading and unloading assembly 3:

[0057] The square wafer loading and unloading assembly 3 includes a square wafer machine frame 47. An upper conveyor belt 48 and a lower conveyor belt 49 are successively installed on the square wafer machine frame 47 from top to bottom. Both the upper conveyor belt 48 and the lower conveyor belt 49 drive the wafer cassette 50 to run along the Y-axis direction. A square wafer lifting mechanism 51 is installed on the square wafer machine frame 47 on the positive Y-axis side of the upper conveyor belt 48 or the lower conveyor belt 49. The square wafer lifting mechanism 51 drives the transfer conveyor belt 52 to move in the Z-axis direction, and the transfer conveyor belt 52 drives the wafer cassette 50 to run along the Y-axis direction. A square wafer return assembly 54 is installed on the square wafer machine frame 47 on the positive Y-axis side of the square wafer lifting mechanism 51. A square wafer handling assembly 53 is installed on the square wafer machine frame 47 between the square wafer lifting mechanism 51 and the square wafer return assembly 54.

[0058] A number of wafer cassettes 50 are successively placed on the upper conveyor belt 48. The wafer cassette 50 to be processed is transferred to the transfer conveyor belt 52. During the lifting process of the square wafer lifting mechanism 51, the square wafers in the wafer cassette 50 are transferred onto the square wafer return assembly 54 through the square wafer return assembly 54, and then the square wafers located on the square wafer return assembly 54 are transported to the main machine assembly 1 for processing through the square wafer handling assembly 53. After processing, the square wafers are placed on the square wafer return assembly 54 through the square wafer handling assembly 53. The square wafer return assembly 54 drives the square wafers to move towards the wafer cassette 50 and replay them into the wafer cassette 50. Then, the wafer cassette 50 filled with the processed square wafers is docked with the lower conveyor belt 49 through the transfer conveyor belt 52, so that the wafer cassette 50 is transferred onto the lower conveyor belt 49.

[0059] The dual-channel structure setting of the present utility model can be compatible with the processing of square wafers and round wafers. The square wafers and round wafers are respectively loaded and unloaded on both sides, improving the utilization rate of the equipment and reducing the investment cost. Automated processing greatly reduces the manual misoperation and improves the yield.

[0060] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0061] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0062] The above description is only the preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A silicon wafer dual-channel automated laser processing device, comprising a host assembly (1), wherein the host assembly (1) comprises a host frame (4), wherein a galvanometer processing assembly (5) and a motion platform assembly (8) are arranged in the host frame (4); Features: A round wafer loading and unloading assembly (2) is arranged on one side of the main machine assembly (1) along the positive direction of the X-axis, and a square wafer loading and unloading assembly (3) is arranged on one side of the main machine assembly (1) along the negative direction of the X-axis; The motion platform assembly (8) comprises a marble base, a Y-axis motion module (25), an X-axis motion module (26), a Z-axis motion module (27) and a marble column (28); the marble base is mounted on a main frame (4); the Y-axis motion module (25) mounted on the marble base drives the X-axis motion module (26) above to move in the Y-axis direction; the X-axis motion module (26) drives the rotating fixture assembly (10) above to move in the X-axis direction; a marble column (28) is mounted on one side of the marble base along the negative direction of the Y-axis; a Z-axis motion module (27) is mounted on the marble column (28); and the Z-axis motion module (27) drives the galvanometer processing assembly (5) to move in the Z-axis direction; The wafer loading and unloading assembly (2) comprises a wafer rack (39), a wafer conveying assembly (40) is mounted on the wafer rack (39), and wafer receiving assemblies (41) are mounted on the wafer racks (39) on both sides of the wafer conveying assembly (40) along the Y-axis direction; The wafer loading and unloading assembly (3) comprises a wafer frame (47), on which an upper conveyor belt (48) and a lower conveyor belt (49) are sequentially installed from top to bottom, and both the upper conveyor belt (48) and the lower conveyor belt (49) drive the wafer basket (50) to move along the Y-axis direction, and a wafer lifting mechanism (51) is installed on the wafer frame (47) on one side of the upper conveyor belt (48) or the lower conveyor belt (49) along the positive direction of the Y-axis, The wafer lifting mechanism (51) drives the transfer conveyor belt (52) to move in the Z-axis direction, and the transfer conveyor belt (52) drives the wafer basket (50) to move along the Y-axis direction. A wafer return assembly (54) is installed on the wafer frame (47) on one side of the wafer lifting mechanism (51) along the positive direction of the Y-axis, and a wafer transport assembly (53) is installed on the wafer frame (47) between the wafer lifting mechanism (51) and the wafer return assembly (54).

2. The silicon wafer dual-channel automated laser processing equipment according to claim 1, characterized in that: A boundary camera assembly (6) is installed on a marble column (28) on one side of the galvanometer processing assembly (5) along the negative direction of the Y axis. The boundary camera assembly (6) comprises a guide shaft (16), an image adjustment block (17), a first connecting tube (18), a second connecting tube (19), a third connecting tube (20), a boundary camera mounting frame and a boundary camera (23). The bottom of the guide shaft (16) is installed on the marble column (28) through a shaft base (24). One side of the image adjustment block (17) is connected to the guide shaft (16). The other side of the image adjustment block (17) is connected to the top of the first connecting tube (18). The bottom of the first connecting tube (18) is connected to the first side of the third connecting tube (20) through a second clamping fixing frame (22). The first side of the second connecting tube (19) is connected to the second side of the third connecting tube (20) through a first pillar fixing clamp (21). The second side of the second connecting tube (19) is connected to the boundary camera (23) below through the boundary camera mounting frame.

3. The silicon wafer dual-channel automated laser processing equipment according to claim 1, characterized in that: A laser power supply (7) is installed on a marble column (28) on one side of the galvanometer processing component (5) along the negative direction of the Y axis, and an air path component (9) is installed on a main machine frame (4) below the marble base.

4. The silicon wafer dual-channel automated laser processing equipment according to claim 1, characterized in that: The galvanometer processing assembly (5) comprises a scanning galvanometer (12), a light box assembly (13) and a manual camera assembly (14); the light box assembly (13) is mounted on the driving end of a Z-axis motion module (27); a scanning galvanometer (12) is mounted on one side of the light box assembly (13); and the manual camera assembly (14) is mounted on the scanning galvanometer (12) via a camera bracket fixing plate (15).

5. The silicon wafer dual-channel automated laser processing equipment according to claim 4, characterized in that: A dust collecting cover (11) is installed at the bottom of the scanning galvanometer (12).

6. The silicon wafer dual-channel automated laser processing equipment according to claim 1, characterized in that: The rotating jig assembly (10) comprises a rotating jig bottom plate (36) and a jig first side plate (31), a jig second side plate (33), a jig third side plate (37) and a jig fourth side plate (38) located around the rotating jig bottom plate (36). A torque motor (35) is installed in the middle of the rotating jig bottom plate (36), and the torque motor (35) drives the rotating adsorption platform (30) above to rotate.

7. The silicon wafer dual-channel automated laser processing equipment according to claim 6, characterized in that: A filter plate (32) is provided on the first side plate (31) of the jig, a sensing sheet is installed on the rotating adsorption platform (30), and a rotating adsorption platform sensor (34) adapted to the sensing sheet is installed on the rotating jig bottom plate (36) below the sensing sheet.

8. The silicon wafer dual-channel automated laser processing equipment according to claim 6, characterized in that: A regularization component (29) is installed on a rotating jig base plate (36) on a diagonal line of the rotating adsorption platform (30). The regularization component (29) includes a regularization cylinder, a regularization plate and a regularization column. The regularization cylinder installed on the rotating jig base plate (36) drives the regularization plate to move inward, and a plurality of regularization columns are installed on the regularization plate.

9. The silicon wafer dual-channel automated laser processing equipment according to claim 1, characterized in that: The wafer receiving assembly (41) comprises a wafer receiving platform (42), a wafer receiving lifting mechanism (43) and a wafer receiving lifting frame (44); the wafer receiving platform (42) is mounted on a wafer frame (39); the wafer receiving lifting mechanism (43) located at the bottom of the wafer receiving platform (42) drives the wafer receiving lifting frame (44) above to move along the Z-axis direction above the wafer receiving platform (42); and a plurality of wafer receiving limiting columns (45) are mounted on the wafer receiving platform (42) outside the wafer receiving lifting frame (44).

10. The silicon wafer dual-channel automated laser processing equipment according to claim 9, characterized in that: A plurality of wafer receiving sensors (46) are installed at the edge of the wafer receiving platform (42).

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