Forming mold for injection molding of electronic product
By using the mutual cooperation between the forming punch and the guide column in the forming mold, the problems of low molding accuracy and high defect rate in the prior art are solved, and higher molding accuracy and stability are achieved.
Patent Information
- Application Number
- CN202422099265.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-28
AI Technical Summary
The molding molds in the prior art do not use the mutual cooperation between the molding punch and the guide column, resulting in low molding accuracy, position deviation and high defect rate.
By using the mutual cooperation between the forming punch and the guide column in the forming mold, the guide column plays a guiding role in the forming process, preventing the position of the forming punch from falling, and stably discharging the material through the discharge plate to improve the stability of the mold.
It improves the molding accuracy, reduces the molding defect rate, and enhances the stability of the mold during the molding process.
Smart Images
Figure CN223030252U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of devices for electronic products, in particular to a molding die for injection molding of electronic products. Background Art
[0002] During the injection molding process of electronic products, a molding die is required for molding; the existing molding die does not use the mutual cooperation of a molding punch and a guide pillar to achieve the molding of electronic products, which is not convenient for preventing the position deviation of the molding punch when it descends, resulting in low molding accuracy and a high defective rate of molding; therefore, in view of this current situation, there is an urgent need to develop a molding die for injection molding of electronic products to meet the actual use requirements. Summary of the Utility Model
[0003] In view of this, in view of the deficiencies existing in the prior art, the main purpose of the present utility model is to provide a molding die for injection molding of electronic products, which realizes the molding of electronic products through the mutual cooperation of a molding punch and a guide pillar. During the molding process, the guide pillar plays a guiding role, preventing the position deviation of the molding punch when it descends, improving the molding accuracy, and reducing the defective rate of molding.
[0004] To achieve the above purpose, the present utility model adopts the following technical solutions:
[0005] A molding die for injection molding of electronic products includes an upper molding component and a lower molding component. The upper molding component is located above the lower molding component in a liftable and movable manner; the upper molding component includes a connecting plate, a mounting plate, a molding punch, and a guide pillar for guiding. The connecting plate is arranged on the upper surface of the mounting plate, the molding punch is arranged on the lower surface of the mounting plate, and the guide pillar is installed below the mounting plate; the lower molding component has a feeding plate for placing electronic products, the upper molding component can be lowered and pressed on the feeding plate, and the molding punch can be lowered corresponding to the electronic products.
[0006] As a preferred solution: a molding cavity matching the molding punch is arranged on the feeding plate, and the molding punch can be lowered to press the electronic product into the molding cavity; both the molding punch and the molding cavity are two, and the two molding punches are symmetrically distributed on the mounting plate, and the two molding cavities are symmetrically distributed on the feeding plate.
[0007] As a preferred solution: a guide sleeve matching the guide pillar is arranged on the feeding plate, and the guide pillar can be lowered and located in the guide sleeve.
[0008] As a preferred solution: both the guide pillar and the guide sleeve are four. The four guide pillars are distributed at the four corner positions of the mounting plate, the four guide sleeves are distributed at the four corner positions of the feeding plate, and the four guide pillars and the four guide sleeves correspond one by one.
[0009] As a preferred solution: the lower forming assembly further includes a support plate and a bottom plate. The support plate is located between the bottom plate and the material feeding plate. The support plate is detachably arranged above the bottom plate through bolts, and the material feeding plate is detachably arranged above the support plate.
[0010] As a preferred solution: a strip-shaped groove for facilitating handling is formed by the inward depression of the side wall of the mounting plate. There are two strip-shaped grooves, and the two strip-shaped grooves are symmetrically distributed on the opposite side walls of the mounting plate.
[0011] As a preferred solution: a driving device for driving the upper forming assembly to lift is arranged on the upper surface of the connecting plate, and the connecting plate is located at the output end of the driving device.
[0012] Compared with the prior art, the present utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solutions, the forming of electronic products is realized by the mutual cooperation of the forming punch and the guide post. During the forming process, the guide post plays a guiding role to prevent the position deviation of the forming punch when it descends, improving the forming accuracy and reducing the forming defective rate; by using the material feeding plate to stably feed the electronic products, it is convenient for the forming of electronic products and improves the mold stability during forming.
[0013] To more clearly illustrate the structural features and functions of the present utility model, the following will be described in detail in combination with the drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 FIG. 1 is a first perspective three-dimensional structural schematic diagram of the forming mold for electronic product injection molding of the present utility model;
[0015] Figure 2 FIG. 2 is a second perspective three-dimensional structural schematic diagram of the forming mold for electronic product injection molding of the present utility model;
[0016] Figure 3 FIG. 3 is a three-dimensional structural schematic diagram of the upper forming assembly of the present utility model;
[0017] Figure 4 FIG. 4 is a three-dimensional structural schematic diagram of the lower forming assembly of the present utility model.
[0018] Description of the reference numerals in the drawings:
[0019] In the figure: 10, upper forming assembly; 11, connecting plate; 12, mounting plate; 121, strip-shaped groove; 13, forming punch; 14, guide post; 20, lower forming assembly; 21, support plate; 22, bottom plate; 23, material feeding plate; 231, forming cavity; 24, guide sleeve. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] The present utility model is as Figures 1 to 4As shown in the figure, a molding die for injection molding of electronic products includes an upper molding component 10 and a lower molding component 20, where:
[0021] The upper molding component 10 is located above the lower molding component 20 in a liftable and movable manner; the upper molding component 10 includes a connecting plate 11, a mounting plate 12, a molding punch 13, and a guide post 14 for guiding. The connecting plate 11 is disposed on the upper surface of the mounting plate 12, the molding punch 13 is disposed on the lower surface of the mounting plate 12, and the guide post 14 is installed below the mounting plate 12; the lower molding component 20 has a loading plate 23 for placing electronic products, the upper molding component 10 can be lowered and pressed on the loading plate 23, and the molding punch 13 can be lowered corresponding to the electronic products.
[0022] The mounting plate 12 is disposed on the lower surface of the connecting plate 11, both the molding punch 13 and the guide post 14 are disposed on the lower surface of the mounting plate 12, the electronic product to be molded is located on the loading plate 23, and the molding punch 13 descends to stamp and form the electronic product on the loading plate 23; during the forming process, the guide post 14 descends along with the molding punch 13 to play a guiding role.
[0023] The forming of the electronic product is achieved by the mutual cooperation of the molding punch 13 and the guide post 14. During the forming process, the guide post 14 plays a guiding role to prevent the molding punch 13 from shifting in position when descending, improving the forming accuracy and reducing the defective rate of forming; by using the loading plate 23 to stably place the electronic product, it is convenient for the forming of the electronic product and improves the stability of the mold during forming.
[0024] On the upper surface of the connecting plate 11, there is a driving device for driving the lifting of the upper molding component 10, and the connecting plate 11 is located at the output end of the driving device.
[0025] The driving device uses a driving cylinder, and the connecting plate 11 is disposed at the shaft end of the driving cylinder.
[0026] On the loading plate 23, there is a molding cavity 231 matching the molding punch 13, and the molding punch 13 can be lowered to press the electronic product into the molding cavity 231; both the molding punch 13 and the molding cavity 231 are two, and the two molding punches 13 are symmetrically distributed on the mounting plate 12, and the two molding cavities 231 are symmetrically distributed on the loading plate 23.
[0027] The forming of the electronic product is achieved by the mutual cooperation of the molding cavity 231 and the molding punch 13. By using two molding punches 13 and molding cavities 231, the forming requirements of the electronic product are met, and the forming efficiency is improved.
[0028] On the loading plate 23, there is a guide sleeve 24 matching the guide post 14, and the guide post 14 can be lowered and located in the guide sleeve 24.
[0029] There are four guide posts 14 and four guide sleeves 24. The four guide posts 14 are distributed at the four corner positions of the mounting plate 12, the four guide sleeves 24 are distributed at the four corner positions of the blanking plate 23, and the four guide posts 14 and the four guide sleeves 24 correspond to each other one by one.
[0030] The balance is improved by using four guide posts 14 and four guide sleeves 24.
[0031] The lower molding assembly 20 further includes a support plate 21 and a bottom plate 22. The support plate 21 is located between the bottom plate 22 and the blanking plate 23. The support plate 21 is detachably arranged above the bottom plate 22 by bolts, and the blanking plate 23 is detachably arranged above the support plate 21.
[0032] The support plate 21 and the bottom plate 22 support and bear the weight of the blanking plate 23, improving the stability of molding.
[0033] The side wall of the mounting plate 12 is recessed inward to form two strip-shaped grooves 121 for easy handling. The two strip-shaped grooves 121 are symmetrically distributed on the opposite side walls of the mounting plate 12; the two strip-shaped grooves 121 facilitate handling.
[0034] The usage method and principle of the molding die for injection molding of electronic products are as follows:
[0035] The mounting plate is arranged on the lower surface of the connecting plate. The molding punch and the guide posts are both arranged on the lower surface of the mounting plate. The electronic product to be molded is located on the blanking plate. The molding punch descends to stamp and form the electronic product on the blanking plate; during the molding process, the guide posts descend with the molding punch to play a guiding role.
[0036] The design focus of the present utility model is that the molding of the electronic product is achieved through the mutual cooperation of the molding punch and the guide posts. During the molding process, the guide posts play a guiding role to prevent the position deviation of the molding punch when it descends, improving the molding accuracy and reducing the defective rate of molding; by using the blanking plate to stably place the electronic product, it is convenient for the molding of the electronic product and improves the stability of the mold during molding.
[0037] The above are only the preferred embodiments of the present utility model, and do not impose any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.
Claims
1. A molding die for injection molding of electronic products, characterized in that: It includes an upper forming component and a lower forming component, wherein the upper forming component can be lifted and moved above the lower forming component; the upper forming component includes a connecting plate, a mounting plate, a forming punch and a guide column for guiding, the connecting plate is arranged on the upper surface of the mounting plate, the forming punch is arranged on the lower surface of the mounting plate, and the guide column is installed below the mounting plate; the lower forming component has a discharge plate for placing electronic products, the upper forming component can be lowered and pressed on the discharge plate, and the forming punch can be lowered to correspond to the electronic product.
2. The electronic product injection molding mold according to claim 1, characterized in that: The discharge plate is provided with a forming cavity matching the forming punch, and the forming punch can be lowered to press the electronic product into the forming cavity; there are two forming punches and two forming cavities, and the two forming punches are symmetrically distributed on the mounting plate, and the two forming cavities are symmetrically distributed on the discharge plate.
3. The electronic product injection molding mold according to claim 1, characterized in that: The unloading plate is provided with a guide sleeve matching the guide post, and the guide post can be lowered and positioned in the guide sleeve.
4. The electronic product injection molding mold according to claim 3, characterized in that: There are four guide posts and four guide sleeves, the four guide posts are distributed at four corner positions of the mounting plate, the four guide sleeves are distributed at four corner positions of the discharge plate, and the four guide posts and the four guide sleeves correspond one to one.
5. The electronic product injection molding mold according to claim 1, characterized in that: The lower molding assembly also includes a support plate and a bottom plate. The support plate is located between the bottom plate and the discharge plate. The support plate is detachably arranged above the bottom plate by bolts, and the discharge plate is detachably arranged above the support plate.
6. The electronic product injection molding mold according to claim 1, characterized in that: The side wall of the mounting plate is recessed inwardly to form a strip groove for easy transportation. There are two strip grooves, and the two strip grooves are symmetrically distributed on the opposite side walls of the mounting plate.
7. The electronic product injection molding mold according to claim 1, characterized in that: The upper surface of the connecting plate is provided with a driving device for driving the upper forming assembly to rise and fall, and the connecting plate is located at the output end of the driving device.