Infrared sensor and circuit board

Abstract

The utility model discloses an infrared sensor and a circuit board, and relates to the technical field of infrared sensors, and the infrared sensor is characterized in that a base is provided with a first cavity; the shell is provided with an opening and covers the base so as to define a second cavity with the base, and the side, away from the shell, of the shell is provided with a light inlet; the light sensing assembly is arranged in the second cavity and corresponds to the position of the light inlet, and after the light sensing assembly receives an external infrared signal through the light inlet, the light sensing assembly processes the external infrared signal to generate a corresponding infrared sensing signal and outputs the infrared sensing signal; and the signal acquisition chip is arranged in the first cavity of the base and is electrically connected with the light induction assembly, and the signal acquisition chip receives the infrared induction signal and processes the infrared induction signal to generate an infrared acquisition signal. In this way, the light sensing assembly collects an external infrared signal through the light inlet, processes the external infrared signal to generate a corresponding signal, and outputs the corresponding signal to the signal collection chip arranged in the first cavity for processing, so that the integration level and reliability of the infrared sensor can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of infrared sensors, in particular to an infrared sensor and a circuit board. Background Art

[0002] Infrared sensors in the prior art usually consist of several key components: infrared sensitive elements (such as pyroelectric sensors), optical systems (lenses, etc.), signal processing circuits, etc. These sensors are widely used in various occasions, such as security monitoring, environmental monitoring, home appliance control, etc.

[0003] Traditional infrared sensors often place signal processing circuits on the surface of the base, and a large variety of supporting components are placed on the surface of the base, which greatly reduces the integration and reliability of the sensor. Utility Model Content

[0004] The main purpose of the utility model is to provide an infrared sensor and a circuit board, aiming at the traditional infrared sensor which often sets the chip on the surface of the signal processing circuit, and sets a variety of supporting components on the surface of the base, which greatly reduces the integration and reliability of the sensor.

[0005] In order to achieve the above object, the utility model proposes an infrared sensor, which includes:

[0006] A base, wherein the base is provided with a first cavity;

[0007] A shell, wherein the shell is provided with an opening and covers the base to enclose the base to form a second cavity, and a light inlet is provided on a side of the shell away from the shell;

[0008] A light sensing component is disposed in the second cavity and is disposed at a position corresponding to the light entrance. The light sensing component is used to receive an external infrared signal through the light entrance, process and generate a corresponding infrared sensing signal, and then output the signal;

[0009] The signal acquisition chip is disposed in the first cavity of the base and is electrically connected to the light sensing component. The signal acquisition chip is used to receive the infrared sensing signal and perform signal processing to generate an infrared acquisition signal.

[0010] In one embodiment, the base is provided with a plurality of mounting holes connected to the first cavity, the signal acquisition chip is provided with a plurality of pins, and one end of the plurality of pins passes through the mounting holes and protrudes from the end surface of the base.

[0011] In one embodiment, the base is further provided with at least one connection hole, a conductive part is provided in the connection hole, and the signal acquisition chip is electrically connected to the light sensing component through the conductive part.

[0012] In one embodiment, the number of the connecting holes is two, the number of the conductive parts is two, the two connecting holes are arranged at intervals, and the two conductive parts are arranged in the two connecting holes one by one to form a conductive bracket for electrically connecting to the light sensing component.

[0013] In one embodiment, the base is provided with a boss, and the edge of the boss abuts against the end surface of the shell.

[0014] In one embodiment, the infrared sensor further includes a filter, the light inlet is disposed on the end surface of the housing, and the filter is embedded in the light inlet.

[0015] In one embodiment, the shell end surface is concave inward on all sides, and the light entrance is arranged on the axis of the shell end surface.

[0016] In one embodiment, the housing is configured as a cylinder.

[0017] In one embodiment, a positioning block is further provided on the shell for positioning the shell of the cylinder during packaging.

[0018] The utility model also provides a circuit board, which includes the infrared sensor as described above.

[0019] The technical solution of the utility model adopts an infrared sensor, which includes: a base, the base is provided with a first cavity; a shell, the shell is provided with an opening, which covers the base to enclose the base to form a second cavity, and the shell is provided with a light inlet on the side away from the shell; a light sensing component is arranged in the second cavity and arranged at a position corresponding to the light inlet, the light sensing component is used to receive an external infrared signal through the light inlet, process and generate a corresponding infrared sensing signal and output it; a signal acquisition chip is arranged in the first cavity of the base and is electrically connected to the light sensing component, the signal acquisition chip is used to receive the infrared sensing signal and perform signal processing to generate an infrared acquisition signal. In this way, in this solution, the light sensing component collects the external infrared signal through the light inlet provided in the shell, processes and generates the corresponding infrared sensing signal, and outputs it to the signal acquisition chip in the first cavity provided in the base for processing, which can effectively improve the integration and reliability of the infrared sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0021] Figure 1 A cross-sectional view of an embodiment of the infrared sensor provided by the present invention;

[0022] Figure 2 A schematic structural diagram of an embodiment of the infrared sensor provided by the present invention.

[0023] Explanation of the reference numerals in the drawings:

[0024] 1 - Base; 2 - Housing; 3 - Light sensing component; 4 - Signal acquisition chip; 5 - Mounting hole; 6 - Pin; 7 - Connection hole; 8 - Conductive part; 9 - Conductive bracket; 10 - Boss; 11 - Filter; 12 - Light inlet; 13 - Positioning block; 14 - First cavity; 15 - Second cavity.

[0025] The realization of the purpose, functional features and advantages of the present invention will be further described with reference to the embodiments and the drawings. Detailed implementation manners

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0027] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0029] Infrared sensors in the prior art usually consist of several key components: infrared sensitive elements (such as pyroelectric sensors), optical systems (lenses, etc.), signal processing circuits, etc. These sensors are widely used in various occasions, such as security monitoring, environmental monitoring, home appliance control, etc.

[0030] The signal processing circuit (ie, signal acquisition chip) of a conventional infrared sensor is usually disposed on the surface of the base, and a large variety of supporting components are disposed on the surface of the base, which greatly reduces the integration and reliability of the sensor.

[0031] This utility model proposes an infrared sensor, please refer to Figure 1 and Figure 2 , the infrared sensor comprises:

[0032] A base 1, wherein the base 1 is provided with a first cavity 14;

[0033] A housing 2, wherein the housing 2 is provided with an opening and covers the base 1 to enclose the base 1 to form a second cavity 15, and a light entrance 12 is provided on a side of the housing 2 away from the housing 2;

[0034] The light sensing component 3 is disposed in the second cavity 15 and is disposed at a position corresponding to the light entrance 12. The light sensing component 3 is used to receive an external infrared signal through the light entrance 12, process and generate a corresponding infrared sensing signal, and then output the signal;

[0035] The signal acquisition chip 4 is disposed in the first cavity 14 of the base 1 and is electrically connected to the light sensing component 3. The signal acquisition chip 4 is used to receive the infrared sensing signal and perform signal processing to generate an infrared acquisition signal.

[0036] In this embodiment, the shell 2 can be set according to the installation requirements of the light sensing component 3 and the signal acquisition chip 4. An opening is provided at one end of the shell 2 facing the base 1, and the shell 2 is covered on the base 1 through the opening. In this way, the shell 2 and the base 1 are enclosed to form a second cavity 15. A light inlet 12 is provided on the side of the shell 2 facing away from the shell 2, so that infrared light emitted from the outside can be irradiated into the surface of the base 1 through the light inlet 12.

[0037] The light sensing component 3 can be implemented by a ceramic sensing chip. The ceramic sensing chip 2 is arranged in the second cavity 15 of the shell 2 and is arranged toward the light entrance 12, so that the infrared light of the external environment can be irradiated to the ceramic sensing chip 2 through the light entrance 12. The ceramic sensing chip is electrically connected to the signal acquisition chip 43. When the ceramic sensing chip 2 senses the infrared signal of the infrared light, it generates an infrared sensing signal and outputs it to the signal acquisition chip 43. In this way, the infrared sensing signal can be processed quickly and accurately, reducing signal delay and distortion.

[0038] The signal acquisition chip 4 can be a TSOP packaged or SOP packaged chip set in the first cavity 14 of the base 11, which can effectively reduce the volume of the base 1 and make the infrared sensor more integrated. The signal acquisition chip 4 can be connected to the light sensing component 3 by a metal body or a cable, so that the signal acquisition chip 4 can receive infrared sensing signals and perform signal processing to generate infrared acquisition signals, thereby realizing the function of collecting infrared rays and transmitting them to the outside world for processing the infrared acquisition signals.

[0039] The entire operation process of the infrared sensor in the above embodiment is as follows: infrared light enters through the light inlet 12 of the shell 2 and is received by the light sensing component 3, and the infrared sensing signal subsequently generated is processed by the signal acquisition chip 4 and converted into an electrical signal output. Since the signal acquisition chip 4 is arranged in the first cavity 14 of the base 1, the integration and reliability of the sensor are effectively improved.

[0040] In one embodiment, the base 1 is provided with a plurality of mounting holes 5 connected to the first cavity 14 , and the signal acquisition chip 4 is provided with a plurality of pins 6 , one end of each of the plurality of pins 6 passes through the mounting holes 5 and protrudes from the end surface of the base 1 .

[0041] In this embodiment, the base 1 is further provided with a plurality of mounting holes 5 communicating with the first cavity 14. The signal acquisition chip 4 is provided with a plurality of pins 6 capable of receiving power and transmitting infrared acquisition signals to the outside. One ends of the plurality of pins 6 all penetrate through the mounting holes 5 and protrude from the end face of the base 1. Thus, a certain height difference is formed between the end face of the base 1 and the pins 6. When the infrared sensor is integrated on the circuit board, the height difference can prevent the circuit board from directly contacting the infrared sensor, conduct the temperature on the circuit board to the infrared sensor, avoid the signal acquisition chip 4 from being heated for a long time, and avoid the influence of the infrared sensor directly contacting the circuit board and being heated on the performance of the signal acquisition chip 4 when collecting infrared signals, ensure that the signal acquisition chip 4 can normally sense infrared signals, improve the accuracy of collecting infrared signals, and extend the service life of the signal acquisition chip 4.

[0042] In one embodiment, the base 1 is further provided with at least one connection hole 7, and a conductive part 8 is arranged in the connection hole 7. The signal acquisition chip 4 is electrically connected to the light sensing component 3 through the conductive part 8.

[0043] In this embodiment, the base 1 is provided with at least one connection hole 7, the conductive part 8 is arranged in the connection hole 7, one end of the conductive part 8 protruding from the connection hole 7 and facing the housing 2 is connected to the ceramic induction chip, and the other end of the conductive part 8 protruding from the connection hole 7 and arranged in the first cavity 14 is connected to the signal acquisition chip 4. Thus, the signal acquisition chip 4 can receive the infrared induction signal of the ceramic induction chip.

[0044] In one embodiment, the number of the connection holes 7 is two, the number of the conductive parts 8 is two, the two connection holes 7 are arranged at intervals, and the two conductive parts 8 are respectively arranged in the two connection holes 7 to form a conductive bracket 9 for electrically connecting with the light sensing component 3.

[0045] In this embodiment, the base 1 is provided with two connection holes 7, the number of the conductive parts 8 is set to two, the two connection holes 7 are arranged at intervals, and the two conductive parts 8 are respectively arranged in the two connection holes 7 to form a conductive bracket 9 for electrically connecting with the ceramic induction chip. Thus, the other end of the conductive bracket 9 protruding from the connection hole 7 and arranged in the first cavity 14 is connected to the signal acquisition chip 4, and one end of the conductive bracket 9 protruding from the connection hole 7 and facing the housing 2 is connected to the ceramic induction chip. Among them, the ceramic induction chip can be connected to the end face of one end, or can be embedded into the protruding part of the conductive bracket 9 protruding from the connection hole 7 and facing the housing 2. However, when the ceramic induction chip is connected to the end face of one end, the contact surface between the conductive bracket 9 and the ceramic induction chip is the largest contact surface, and the infrared induction signal can be more stably and effectively transmitted into the signal acquisition chip 4.

[0046] In one embodiment, the base 1 is convexly provided with a boss 10, and the edge of the boss 10 abuts against the end face of the housing 2.

[0047] In this embodiment, one end of the base 1 facing the housing 2 is convexly provided with a boss 10, and the edge of the boss 10 abuts against the end face of the housing 2, so that the housing 2 can be covered on the boss 10 through the opening, so that the base 1 can stably connect the housing 2, and when encapsulating between the base 1 and the housing 2, they can be simply encapsulated together through the clamping step.

[0048] In one embodiment, the infrared sensor further includes a filter 11, the light inlet 12 is arranged on the end face of the housing 2, and the filter 11 is embedded in the light inlet 12.

[0049] In this embodiment, the light inlet 12 of the housing 2 is arranged on the end face of the housing 2, and the light inlet 12 faces the base 1, so that the infrared signal can directly irradiate into the ceramic induction chip arranged on the base 1 through the light inlet 12. By embedding the filter 11 in the light inlet 12, when the filter 11 is set as an infrared filter 11, it can effectively filter out the light other than infrared light, so that the infrared sensor can generate an infrared acquisition signal more accurately. And when the filter 11 is embedded from the inner wall of the housing 2 to the end face of the housing 2 and has a certain gap with the end face of the housing 2, it can effectively reduce the surface of the infrared filter 11 from being scratched or polluted during transportation or encapsulation.

[0050] In one embodiment, the periphery of the end face of the housing 2 is recessed inward, and the light inlet 12 is arranged on the axis of the end face of the housing 2.

[0051] In this embodiment, the periphery of the end face of the housing 2 is recessed inward, and the light inlet 12 is arranged on the axis of the end face of the housing 2, so that the light inlet 12 can focus and collect light from different directions. When the infrared filter 11 is arranged at the light inlet 12, it can effectively avoid scratching the infrared filter 11 when clamping and encapsulating and when the clamping tool comes into clamping contact with the infrared filter 11, so as to effectively maintain the optical performance of the infrared filter 11.

[0052] In one embodiment, the housing 2 is provided as a cylinder.

[0053] In this embodiment, the shell 2 is provided with a cylinder, which can better resist external interference. For example, in complex environments, such as industrial control or outdoor scenes, the sensor needs to be able to ignore interference from non-target signals, such as other heat sources or light changes. The cylindrical shell helps to focus on the target signal, thereby improving the anti-interference performance; and the cylindrical shell is more efficient in space utilization. The internal components of the infrared sensor can be arranged around the central axis to optimize space use and reduce internal interference. This layout also facilitates automation and standardization in the production process, which is conducive to reducing costs and improving production efficiency.

[0054] In one embodiment, the housing 2 is further provided with a positioning block 13 for positioning the cylindrical housing 2 during packaging.

[0055] In this embodiment, when the shell 2 is configured as a cylinder, the light entrance 12 may be configured in a rectangular or elliptical shape or other shape that needs to correspond to the ceramic sensing chip disposed on the base 1, and when the shell 2 is provided with a positioning block 13, the infrared sensor can accurately package the shell 2 and the base 1, and can effectively reduce the error rate of the shell 2 not being configured in a corresponding position to the base 1 during packaging.

[0056] The technical solution of the utility model adopts an infrared sensor, which includes: a base 1, wherein the base 1 is provided with a first cavity 14; a shell 2, wherein the shell 2 is provided with an opening and covers the base 1 to enclose the base 1 to form a second cavity 15, and a light inlet 12 is provided on the side of the shell 2 away from the shell 2; a light sensing component 3 is arranged in the second cavity 15 and is arranged at a position corresponding to the light inlet 12, wherein the light sensing component 3 is used to receive an external infrared signal through the light inlet 12, process and generate a corresponding infrared sensing signal and output it; a signal acquisition chip 4 is arranged in the first cavity 14 of the base 1 and is electrically connected to the light sensing component 3, wherein the signal acquisition chip 4 is used to receive the infrared sensing signal and perform signal processing to generate an infrared acquisition signal. Thus, in the present embodiment, the light sensing component 3 collects external infrared signals through the light inlet 12 provided in the shell 2, processes and generates corresponding infrared sensing signals, and then outputs the signals to the signal acquisition chip 4 in the first cavity 14 provided in the base 1 for processing, thereby effectively improving the integration and reliability of the infrared sensor.

[0057] The utility model also proposes a circuit board, which includes an infrared sensor. The specific structure of the infrared sensor refers to the above embodiment. Since the circuit board adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0058] The above are only exemplary embodiments of the present utility model, and do not thus limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields is included within the patent protection scope of the present utility model.

Claims

1. An infrared sensor, characterized in that: The infrared sensor comprises: A base, wherein the base is provided with a first cavity; A shell, wherein the shell is provided with an opening and covers the base to enclose the base to form a second cavity, and a light inlet is provided on a side of the shell away from the shell; A light sensing component is disposed in the second cavity and is disposed at a position corresponding to the light inlet. The light sensing component is used to receive an external infrared signal through the light inlet, process and generate a corresponding infrared sensing signal, and then output the signal; The signal acquisition chip is disposed in the first cavity of the base and is electrically connected to the light sensing component. The signal acquisition chip is used to receive the infrared sensing signal and perform signal processing to generate an infrared acquisition signal.

2. The infrared sensor according to claim 1, characterized in that: The base is provided with a plurality of mounting holes communicating with the first cavity, and the signal acquisition chip is provided with a plurality of pins, one end of each of the plurality of pins passes through the mounting holes and protrudes from the end surface of the base.

3. The infrared sensor according to claim 1, characterized in that: The base is also provided with at least one connection hole, a conductive part is provided in the connection hole, and the signal acquisition chip is electrically connected to the light sensing component through the conductive part.

4. The infrared sensor according to claim 3, characterized in that: The number of the connecting holes is two, the number of the conducting parts is two, the two connecting holes are arranged at intervals, and the two conducting parts are arranged in the two connecting holes in a one-to-one correspondence to form a conducting bracket for electrically connecting to the light sensing component.

5. The infrared sensor according to claim 1, characterized in that: The base is provided with a boss, and the edge of the boss abuts against the end surface of the shell.

6. The infrared sensor according to claim 1, characterized in that: The infrared sensor further comprises a filter. The light inlet is arranged on the end surface of the housing, and the filter is embedded in the light inlet.

7. The infrared sensor according to claim 6, characterized in that: The periphery of the shell end surface is concave inward, and the light entrance is arranged on the axis of the shell end surface.

8. The infrared sensor according to claim 1, characterized in that: The housing is configured as a cylinder.

9. The infrared sensor according to claim 8, characterized in that: The shell is also provided with a positioning block for positioning the shell of the cylinder during packaging.

10. A circuit board, characterized in that: The circuit board comprises the infrared sensor according to any one of claims 1 to 9.

Images