Packaging structure of fluxgate current sensor
By installing thermal interface materials and heat sinks inside the cover of the flux gate current sensor and designing a fast packaging structure, the problems of sensor heat dissipation difficulties and cumbersome packaging process are solved, and more efficient heat dissipation and simple packaging process are achieved.
Patent Information
- Application Number
- CN202422316574.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-23
AI Technical Summary
During the operation of the existing flux gate current sensor, the temperature increases due to the Joule heat generated by the current through the conductor and the heat generated by the flux gate effect, which makes the packaging structure not convenient for heat dissipation, affects the sensor performance and shortens the life. At the same time, the packaging process requires tools, wasting time and energy.
A packaging structure of a flux gate current sensor is designed, using thermal interface material and heat sink inside the cover to conduct heat to the surface of the heat sink plate and heat sink fin for heat dissipation, and the design of soft plastic bends and snap blocks is achieved without the need for tools.
It effectively improves the heat dissipation ability of the sensor, extends the life of the sensor, reduces energy consumption, and simplifies the packaging process, saving people's time and energy.
Smart Images
Figure CN223038009U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of current sensors, and particularly relates to a packaging structure of a fluxgate current sensor. Background Technique
[0002] There are various types of current sensors, such as Hall sensors, electronic current transformers, fluxgate current sensors, etc. At present, most current sensors are based on the basic working principle of electromagnetic coupling, while the fluxgate current sensor is based on the fluxgate technology and the application of closed-loop control in electronic circuits.
[0003] The fluxgate sensor measures weak magnetic fields by using the non-linear relationship between the magnetic induction intensity and the magnetic field intensity of a high-permeability magnetic core in an alternating magnetic field under saturated excitation in the measured magnetic field. This physical phenomenon is like a "gate" for the measured environmental magnetic field. Through this "gate", the corresponding magnetic flux is modulated and an induced electromotive force is generated. By using this phenomenon to measure the magnetic field generated by the current, the purpose of measuring the current is indirectly achieved.
[0004] In the working process of the existing fluxgate current sensor, due to the Joule heat generated by the current passing through the conductor and the heat generated by the fluxgate effect, the temperature inside the sensor will increase. Moreover, the existing packaging structure of the fluxgate current sensor is not convenient for heat dissipation inside the sensor. Prolonged use is likely to affect the performance of the sensor, shorten the service life of the sensor, and thus increase the energy consumption of the sensor. At the same time, the existing sensor packaging structure is generally fixed by screws, and the sensor cannot be packaged without tools, which wastes a lot of time and energy of personnel, thereby reducing the packaging effect of the device and the usability of the device. Content of the Utility Model
[0005] The purpose of the utility model is to provide a packaging structure of a fluxgate current sensor, which has the advantages of facilitating heat dissipation inside the sensor and facilitating the packaging of the sensor.
[0006] The above technical object of the utility model is achieved by the following technical solutions: A packaging structure of a fluxgate current sensor, including a mounting base, an installation plate is welded on the top of the mounting base, a body is fixedly installed on the surface of the installation plate, a cover is clamped on the surface of the body, a first thermal interface material is fixedly installed inside the cover, a heat sink is fixedly installed on the left side of the first thermal interface material, a second thermal interface material is fixedly installed on the left side of the cover, a heat dissipation plate is fixedly installed on the left side of the second thermal interface material, heat dissipation fins are fixedly installed on the left side of the heat dissipation plate, fixing blocks are welded around the surface of the cover, soft plastic bending parts are welded on the right side of the fixing blocks, fixing plates are fixedly installed around the surface of the body, buckle groove blocks are fixedly installed on the right side of the fixing plates, buckle plates are fixedly installed on the right side of the soft plastic bending parts, buckle grooves are opened inside the buckle plates, and buckle blocks are clamped at the bottom of the buckle groove blocks.
[0007] By adopting the above technical solutions: The first thermal interface material and the heat sink are installed inside the cover to collect the internal heat and conduct it to the second thermal interface material on the surface of the cover, and the second thermal interface material conducts the heat to the surface of the heat dissipation plate and the heat dissipation fins for heat dissipation and discharge, which is convenient for dissipating the heat inside the sensor, improving the performance of the sensor and reducing the energy consumption during the use of the sensor. When packaging the sensor, after manually aligning the cover with the body itself, rotate the soft plastic bending part to place the buckle plate on the surface of the fixing plate for fixation, and then place the buckle block at the bottom of the buckle groove block for snap fixation, so that the sensor packaging structure does not require tools for packaging, avoiding wasting the time and energy of personnel and improving the use of the device.
[0008] The utility model is further provided that mounting holes are opened inside the mounting base and the installation plate.
[0009] By adopting the above technical solutions: It is convenient to install the sensor.
[0010] The utility model is further provided that a wrench is fixedly installed on the right side of the buckle plate.
[0011] By adopting the above technical solutions: It is convenient to open the buckle plate.
[0012] The utility model is further provided that current detection holes are opened inside the installation plate, the body and the cover.
[0013] By adopting the above technical solutions: It is convenient to detect the current.
[0014] The utility model is further provided that the soft plastic bending part is made of PVC soft plastic material.
[0015] By adopting the above technical solutions: It is convenient to rotate the buckle plate.
[0016] The present utility model is further configured such that the snap block is snap - fitted and installed inside the snap groove block for fixation, and the right side of the snap block is fixed to the snap plate.
[0017] Adopting the above - mentioned technical solution: it is convenient to carry out snap - fixation on the cover.
[0018] The present utility model is further configured such that the fixing plate, the snap plate and the wrench are all made of elastic plastic material.
[0019] Adopting the above - mentioned technical solution: it is convenient to improve the durability of the fixing plate, the snap plate and the wrench.
[0020] To sum up, the present utility model has the following beneficial effects:
[0021] 1. The present utility model installs an internal heat - dissipation structure in the cover. A thermal interface material I and a heat sink are installed inside the cover to collect internal heat and conduct it to the thermal interface material II on the surface of the cover. The thermal interface material II conducts the heat to the surface of the heat dissipation plate and the heat dissipation fins for heat dissipation and discharge. This is convenient for dissipating heat inside the sensor, improving the performance of the sensor and reducing the energy consumption during the use of the sensor.
[0022] 2. The present utility model installs a quick - encapsulation structure. When encapsulating the sensor, after manually aligning the cover with the body itself, rotate the soft plastic bend to snap the snap plate onto the surface of the fixing plate for fixation, and then snap the snap block onto the bottom of the snap groove block for snap - fixation. This enables the sensor encapsulation structure to be encapsulated without the aid of tools, avoiding wasting the time and energy of personnel and improving the use of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0024] Figure 2 is a front - view of the side structure of the present utility model;
[0025] Figure 3 is a cross - sectional view of the side structure of the present utility model;
[0026] Figure 4 is the present utility model for Figure 2 a partial enlarged view of part A in.
[0027] Reference numerals: 1, mounting base; 2, mounting plate; 3, mounting hole; 4, body; 5, cover; 6, thermal interface material I; 7, heat sink; 8, thermal interface material II; 9, heat dissipation plate; 10, heat dissipation fins; 11, fixing block; 12, soft plastic bend; 13, fixing plate; 14, snap groove block; 15, snap plate; 16, snap groove; 17, snap block; 18, wrench; 19, current detection hole. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0028] The following further describes the present utility model in detail with reference to the accompanying drawings.
[0029] Embodiment 1:
[0030] Refer to Figure 1 、 Figure 2 、 Figure 3 For a packaging structure of a fluxgate current sensor, it includes a mounting base 1. A mounting plate 2 is welded to the top of the mounting base 1. A body 4 is fixedly installed on the surface of the mounting plate 2. A cover 5 is snap-fitted on the surface of the body 4. A first thermal interface material 6 is fixedly installed inside the cover 5. A heat sink 7 is fixedly installed on the left side of the first thermal interface material 6. A second thermal interface material 8 is fixedly installed on the left side of the cover 5. A heat dissipation plate 9 is fixedly installed on the left side of the second thermal interface material 8. A heat dissipation fin 10 is fixedly installed on the left side of the heat dissipation plate 9. Installing the first thermal interface material 6 and the heat sink 7 inside the cover 5 to collect and conduct the internal heat to the second thermal interface material 6 on the surface of the cover 5, and the second thermal interface material 6 conducts the heat to the surfaces of the heat dissipation plate 7 and the heat dissipation fin 10 for heat dissipation and discharge, which is convenient for dissipating heat inside the sensor, improving the performance of the sensor, and reducing the power consumption during the use of the sensor.
[0031] Refer to Figure 1 Installation holes 3 are provided inside the mounting base 1 and the mounting plate 2. By providing the installation holes 3, it is convenient to install the sensor.
[0032] Refer to Figure 4 A wrench 18 is fixedly installed on the right side of the buckle plate 15. By providing the wrench 18, it is convenient to open the buckle plate 15.
[0033] Refer to Figure 1 Current detection holes 19 are provided inside the mounting plate 2, the body 4 and the cover 5. By providing the current detection holes 19, it is convenient to detect the current.
[0034] Brief description of the usage process: Installing the first thermal interface material 6 and the heat sink 7 inside the cover 5 to collect and conduct the internal heat to the second thermal interface material 6 on the surface of the cover 5, and the second thermal interface material 6 conducts the heat to the surfaces of the heat dissipation plate 7 and the heat dissipation fin 10 for heat dissipation and discharge, which is convenient for dissipating heat inside the sensor, improving the performance of the sensor, and reducing the power consumption during the use of the sensor.
[0035] Embodiment 2:
[0036] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4, A packaging structure of a fluxgate current sensor. Fixed blocks 11 are welded around the surface of the cover 5. A soft plastic bending part 12 is welded on the right side of the fixed block 11. Fixed plates 13 are fixedly installed around the surface of the body 4. A buckle groove block 14 is fixedly installed on the right side of the fixed plate 13. A buckle plate 15 is fixedly installed on the right side of the soft plastic bending part 12. A buckle groove 16 is formed inside the buckle plate 15. A buckle block 17 is clamped at the bottom of the buckle groove block 14. When packaging the sensor, manually align the cover 5 with the body 4 itself, then rotate the soft plastic bending part 12 to place the buckle plate 15 on the surface of the fixed plate 13 for fixation, and then place the buckle block 17 at the bottom of the buckle groove block 14 for clamping and fixation, so that the sensor packaging structure does not require tools for packaging, avoiding wasting the time and energy of personnel and improving the use of the device.
[0037] Reference Figure 4 , The soft plastic bending part 12 is made of PVC soft plastic material. By setting the PVC soft plastic material, it is convenient to rotate the buckle plate 15.
[0038] Reference Figure 4 , The buckle block 17 is clamped and installed inside the buckle groove block 14 for fixation, and the right side of the buckle block 17 is fixed to the buckle plate 15. By setting the buckle block 17, it is convenient to fix the cover 5 with the buckle block 17.
[0039] Reference Figure 4 , The fixed plate 13, the buckle plate 15 and the wrench 18 are all made of elastic plastic material. By setting the plastic material, it is convenient to improve the durability of the fixed plate 13, the buckle plate 15 and the wrench 18.
[0040] Brief description of the usage process: When packaging the sensor, manually align the cover 5 with the body 4 itself, then rotate the soft plastic bending part 12 to place the buckle plate 15 on the surface of the fixed plate 13 for fixation, and then place the buckle block 17 at the bottom of the buckle groove block 14 for clamping and fixation, so that the sensor packaging structure does not require tools for packaging, avoiding wasting the time and energy of personnel and improving the use of the device.
[0041] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications without creative contributions to this embodiment according to needs after reading this specification, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.
Claims
1. A packaging structure of a fluxgate current sensor, comprising a mounting seat (1), characterized in that: A mounting plate (2) is welded to the top of the mounting seat (1), a body (4) is fixedly mounted on the surface of the mounting plate (2), a cover (5) is snapped onto the surface of the body (4), a thermal interface material 1 (6) is fixedly mounted inside the cover (5), a heat sink (7) is fixedly mounted on the left side of the thermal interface material 1 (6), a thermal interface material 2 (8) is fixedly mounted on the left side of the cover (5), a heat sink (9) is fixedly mounted on the left side of the thermal interface material 2 (8), and the heat sink (9) is fixedly mounted on the left side. A heat dissipation fin (10) is fixedly installed, a fixing block (11) is welded around the surface of the cover (5), a soft plastic bent piece (12) is welded on the right side of the fixing block (11), a fixing plate (13) is fixedly installed around the surface of the body (4), a buckle groove block (14) is fixedly installed on the right side of the fixing plate (13), a buckle plate (15) is fixedly installed on the right side of the soft plastic bent piece (12), a buckle groove (16) is opened inside the buckle plate (15), and a buckle block (17) is clamped at the bottom of the buckle groove block (14).
2. The packaging structure of a fluxgate current sensor according to claim 1, characterized in that: The mounting seat (1) and the mounting plate (2) are provided with mounting holes (3) inside.
3. The packaging structure of a fluxgate current sensor according to claim 1, characterized in that: A wrench (18) is fixedly mounted on the right side of the gusset plate (15).
4. The packaging structure of a fluxgate current sensor according to claim 1, characterized in that: Current detection holes (19) are provided inside the mounting plate (2), the machine body (4) and the cover (5).
5. The packaging structure of a fluxgate current sensor according to claim 1, characterized in that: The soft plastic bent piece (12) is made of PVC soft plastic material.
6. The packaging structure of a fluxgate current sensor according to claim 1, characterized in that: The buckle block (17) is buckled and installed inside the buckle slot block (14) for fixation, and the right side of the buckle block (17) is fixed to the buckle plate (15).
7. The packaging structure of a fluxgate current sensor according to claim 1, characterized in that: The fixing plate (13), the buckle plate (15) and the wrench (18) are all made of elastic plastic material.