SFP optical module
By setting the wave absorbing heat dissipation block and conductive shielding strip at specific locations of the SFP optical module, the problem of poor EMC performance of existing SFP optical modules is solved, especially the optical port noise and electrical port noise of RE, which significantly improves the EMC performance.
Patent Information
- Application Number
- CN202421546724.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-02
AI Technical Summary
The RE optical and electrical port noise test results of existing SFP optical modules are poor, resulting in poor EMC performance.
A wave absorbing heat dissipation block is provided at the upper cover of the SFP optical module near the optical port end, the upper cover near the electrical port end, and the base near the electrical port end, and the wave absorbing heat dissipation block is closely attached to the adapter, close to the electronic components on the PCBA board, and close to the main chip at the boss of the base. Meanwhile, a conductive shield strip is used to wind the press block and extends to the side of the base and to the surface facing away from the upper cover.
Through the above measures, the optical port noise and electrical port noise of RE in the EMC performance of the optical module are effectively improved, and the overall EMC performance is improved.
Smart Images
Figure CN223038217U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communication, and particularly relates to an SFP optical module. Background Art
[0002] With the advent of the digital age and the rapid development of the Internet industry, the development of the network communication equipment industry has also been gradually accelerating. As an important part of network equipment, optical modules are also constantly innovating and developing. The EMC performance of optical modules is an important indicator for judging the performance of optical modules. It is an indicator that measures the ability of optical modules to work normally in an electromagnetic environment and not cause unacceptable electromagnetic interference to other things in this environment. In many application scenarios of optical modules, EMC performance is within the scope of consideration. The measures to optimize the EMC performance of optical modules mainly include grounding, filtering, shielding, etc. The EMC test items of optical modules involve: RE (Radiated Emission), RS (Radiated Susceptibility), ESD (Electrostatic Discharge), CS (Conducted Susceptibility), surge, and EFT (Electrical Fast Transient).
[0003] The test results of the RE optical port noise and electrical port noise of existing SFP optical modules are not good, and the EMC performance of SFP optical modules is not good. Content of the Utility Model
[0004] The purpose of the utility model is to provide an SFP optical module, which can at least solve some defects in the prior art.
[0005] To achieve the above purpose, the embodiment of the utility model provides the following technical solution: an SFP optical module, including a housing, the housing has a base and an upper cover arranged on the base, the housing has an optical port end and an electrical port end, a PCBA board is arranged inside the housing, and wave-absorbing heat dissipation blocks are arranged at the position where the upper cover is close to the optical port end, at the position where the upper cover is close to the electrical port end, and at the position where the base is close to the electrical port end.
[0006] Further, it also includes an adapter, the adapter is arranged at the optical port end, and the wave-absorbing heat dissipation block at the position where the upper cover is close to the optical port end is tightly attached to the adapter.
[0007] Further, the wave-absorbing heat dissipation block at the position where the upper cover is close to the electrical port end is tightly attached to the electronic components on the PCBA board.
[0008] Furthermore, the thickness of the wave-absorbing and heat-dissipating block at the upper cover near the optical port end is consistent with the thickness of the wave-absorbing and heat-dissipating block at the upper cover near the electrical port end.
[0009] Furthermore, the wave-absorbing and heat-dissipating block at the base close to the electrical port end is in close contact with the electronic components on the PCBA board.
[0010] Furthermore, a tailstock is provided on the base near the electrical port end, and the gold fingers of the PCBA board extend into the tailstock.
[0011] Furthermore, a wave absorbing block is provided on the tailstock, and the wave absorbing block is located below the gold finger.
[0012] Furthermore, it also includes a pressing block for pressing the adapter, and the pressing block is installed on the base.
[0013] Furthermore, it also includes a conductive shielding strip, which is wound around the pressing block and extends from the pressing block to the side surface of the base and the surface away from the upper cover.
[0014] Furthermore, the conductive shielding strip is conductive rubber.
[0015] Compared with the prior art, the beneficial effects of the utility model are: an SFP optical module, by arranging absorbing and heat dissipating blocks at the upper cover near the optical port end, the upper cover near the electrical port end, and the base near the electrical port end, can effectively improve the optical port noise and electrical port noise of RE in the EMC performance of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 An exploded schematic diagram of an SFP optical module provided by an embodiment of the utility model (the PCBA board is not shown);
[0017] Figure 2 A schematic diagram of an SFP optical module provided in an embodiment of the present invention, wherein an absorbing and heat dissipating block is arranged near the optical port end of the upper cover;
[0018] Figure 3 A schematic diagram of an SFP optical module provided in an embodiment of the present invention, wherein an absorbing and heat dissipating block is arranged near the electrical port end of the upper cover;
[0019] Figure 4 A schematic diagram of a wave absorbing and heat dissipating block provided on a base boss of an SFP optical module provided by an embodiment of the utility model;
[0020] Figure 5 A schematic diagram of an SFP optical module with an absorber block disposed on the tail seat provided by an embodiment of the utility model;
[0021] Figure 6Schematic diagram of a conductive shielding strip provided on the base of an SFP optical module according to an embodiment of the present utility model;
[0022] In the attached drawings: 1 - First wave-absorbing heat sink; 2 - Second wave-absorbing heat sink; 3 - Third wave-absorbing heat sink; 4 - Upper cover; 5 - Base; 6 - Tail seat; 7 - Wave-absorbing block; 8 - Conductive shielding strip; 9 - Bracket; 10 - Pressing block; 11 - Elastic sheet; 12 - Pressing strip; A - Optical port end; B - Electrical port end. Detailed implementation manners
[0023] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0024] Please refer to Figures 1 to 5 , an SFP optical module provided by an embodiment of the present utility model includes a housing. The housing has a base 5 and an upper cover 4 provided on the base 5. The housing has an optical port end A and an electrical port end B. A PCBA board is provided inside the housing. Wave-absorbing heat sinks are provided at the position where the upper cover 4 is close to the optical port end A, at the position where the upper cover 4 is close to the electrical port end B, and at the position where the base 5 is close to the electrical port end B. In this embodiment, by providing wave-absorbing heat sinks at the position where the upper cover 4 is close to the optical port end A, at the position where the upper cover 4 is close to the electrical port end B, and at the position where the base 5 is close to the electrical port end B, the optical port noise and electrical port noise of the RE in the EMC performance of the optical module can be effectively improved. Specifically, the optical port end A is the side of the optical module where the adapter is provided. The adapter is such as TOSA (optical emission) and ROSA (optical reception) devices. The electrical port end B is the side of the PCBA board of the optical module close to the output of the gold finger. By providing wave-absorbing heat sinks at the positions where the upper cover 4 is close to the optical port end A and the electrical port end B, the noise on the side of the optical port end A and the electrical port end B close to the upper cover 4 can be improved. By providing a wave-absorbing heat sink at the position where the base 5 is close to the electrical port end B, the radiation emitted by the main chip can be reduced. The wave-absorbing heat sink uses wave-absorbing heat dissipation material. The wave-absorbing material refers to a class of functional materials that can absorb and attenuate the electromagnetic wave energy incident in space and reduce or eliminate the reflected electromagnetic wave. Electromagnetic waves induce currents in the material, and the currents are blocked during transmission inside the material and converted into internal energy. Generally, iron and barium are filled inside. On this basis, the wave-absorbing heat dissipation material has a heat dissipation function. The metal inside it can play a heat dissipation effect, can perform electromagnetic shielding and clutter absorption, has a high thermal conductivity, is soft, has its own viscosity, has conformability and can be cut. This wave-absorbing heat dissipation material is an existing material purchased on the market. For example, the material of model FHD-10G30A of Feihongda Technology is used.
[0025] As an optimized solution of the embodiment of the present utility model, please refer to Figures 1 to 5 , and it further includes an adapter. The adapter is arranged at the optical port end A, and the wave-absorbing heat dissipation block near the optical port end A on the upper cover 4 is closely attached to the adapter. In this embodiment, for the convenience of marking and description, the wave-absorbing heat dissipation block at this place is defined as the first wave-absorbing heat dissipation block 1. The first wave-absorbing heat dissipation block 1 is closely attached to the adapter, which can promote the heat dissipation of the adapter and absorb the electromagnetic waves emitted by the adapter at the same time.
[0026] As an optimized solution of the embodiment of the present utility model, please refer to Figures 1 to 5 , the wave-absorbing heat dissipation block near the electrical port end B on the upper cover 4 is closely attached to the electronic components on the PCBA board. In this embodiment, for the convenience of marking and description, the wave-absorbing heat dissipation block at this place is defined as the second wave-absorbing heat dissipation block 2. The second wave-absorbing heat dissipation block 2 is closely attached to the electronic components at the end of the PCBA board. The electronic components on the PCBA board here are electronic components such as MCU chips and MOS transistors. Covering the electronic components at this place can absorb the electromagnetic waves radiated by them during operation. Preferably, the thickness of the wave-absorbing heat dissipation block near the optical port end A on the upper cover 4 is the same as that of the wave-absorbing heat dissipation block near the electrical port end B on the upper cover 4, so as to avoid tilting of the PCBA board of the optical module.
[0027] As an optimized solution of the embodiment of the present utility model, please refer to Figures 1 to 5 , the wave-absorbing heat dissipation block near the electrical port end B on the base 5 is closely attached to the electronic components on the PCBA board. In this embodiment, for the convenience of marking and description, the wave-absorbing heat dissipation block at this place is defined as the third wave-absorbing heat dissipation block 3. The third wave-absorbing heat dissipation block 3 is attached to the boss of the base 5 and can be closely attached to the main chip on the PCBA board. The size of the third wave-absorbing heat dissipation block 3 is the same as that of the main chip. The third wave-absorbing heat dissipation block 3 can absorb the electromagnetic waves emitted by the main chip and significantly improve the RE structure of the module.
[0028] As an optimized solution of the embodiment of the present utility model, please refer to Figure 5 , a tail seat 6 is provided near the electrical port end B on the base 5, and the gold fingers of the PCBA board extend into the tail seat 6. In this embodiment, the tail seat 6 is designed to facilitate the placement of the gold fingers of the PCBA board. Preferably, an absorbing block 7 is provided on the tail seat 6, and the absorbing block 7 is located below the gold fingers. The absorbing block 7 has an adhesive and can be pasted on the tail seat 6. It is flush with the gold fingers but not closely attached, and can absorb the electromagnetic waves emitted from the gold fingers of the optical module to improve the electrical port noise.
[0029] As an optimized solution of the embodiment of the present utility model, please refer to Figure 6, this SFP optical module further includes a pressing block 10 for pressing the adapter, and the pressing block 10 is installed on the base 5. In this embodiment, the pressing block 10 is used to fix the adapter so that the adapter can be stably arranged on the base 5. Preferably, this optical module further includes a conductive shielding strip 8, the conductive shielding strip 8 is wound around the pressing block 10, and the conductive shielding strip 8 extends from the pressing block 10 to the side surface of the base 5 and the surface of the base 5 facing away from the upper cover 4. In this embodiment, the conductive shielding strip 8 is arranged in a loop around the pressing block 10 and the base 5 of the optical module. There is one conductive shielding strip 8, and the two end points of the conductive shielding strip 8 are respectively arranged on the two pressing strips 12 of the pressing block 10, that is, the conductive shielding strip 8 starts from one pressing block 10 and winds around, first passes through the side surface of the base 5, then passes through the bottom surface of the base 5 (i.e., the surface of the base 5 facing away from the upper cover 4), then passes through the other side surface of the base 5, and finally winds back to the other pressing strip 12. The conductive shielding strip 8 can block the gaps between the base 5 and the elastic sheet, and between the pressing block 10 and the upper cover 4, achieving the effect of shielding electromagnetic waves and significantly improving the optical port noise of the optical module. Preferably, the conductive shielding strip 8 is made of conductive rubber.
[0030] As an optimized solution of the embodiment of the present utility model, please refer to Figure 1 , this optical module further includes a pressing block 10 arranged at the light port end A of the upper cover 4 close to the light port, and an elastic sheet 11 arranged on the side of the base 5 facing away from the upper cover 4, and the elastic sheet is also arranged at the light port end A. This optical module further includes a bracket 9, and the bracket 9 is arranged on the base 5 for supporting the upper cover 4.
[0031] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model, and the scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. An SFP optical module, comprising a housing, the housing having a base and an upper cover arranged on the base, the housing having an optical port and an electrical port, a PCBA board arranged in the housing, characterized in that: Wave absorbing and heat dissipating blocks are arranged at the upper cover near the optical port end, at the upper cover near the electrical port end, and at the base near the electrical port end.
2. The SFP optical module according to claim 1, wherein: It also includes an adapter, which is arranged at the optical port end, and the upper cover is arranged close to the absorbing and heat dissipating block at the optical port end and close to the adapter.
3. The SFP optical module according to claim 1, wherein: The wave-absorbing and heat-dissipating block at the upper cover near the electrical port end is in close contact with the electronic components on the PCBA board.
4. The SFP optical module according to claim 1, wherein: The thickness of the wave-absorbing and heat-dissipating block at the upper cover near the optical port end is consistent with that of the wave-absorbing and heat-dissipating block at the upper cover near the electrical port end.
5. The SFP optical module according to claim 1, wherein: The wave absorbing and heat dissipating block at the base close to the electrical port end is in close contact with the electronic components on the PCBA board.
6. The SFP optical module according to claim 1, wherein: The base is provided with a tailstock near the electrical port end, and the gold fingers of the PCBA board extend into the tailstock.
7. The SFP optical module according to claim 6, characterized in that: The tailstock is provided with a wave absorbing block, and the wave absorbing block is located below the gold finger.
8. The SFP optical module according to claim 1, wherein: The utility model also comprises a pressing block for pressing the adapter, wherein the pressing block is installed on the base.
9. The SFP optical module according to claim 8, characterized in that: It also includes a conductive shielding strip, which is wound around the pressing block and extends from the pressing block to the side surface of the base and the surface away from the upper cover.
10. The SFP optical module according to claim 9, characterized in that: The conductive shielding strip is conductive rubber.