Chip module, electronic equipment and vehicle

Abstract

The embodiment of the utility model provides a chip module, electronic equipment and a vehicle. The chip module comprises a circuit board, and the circuit board is provided with a chip; the metal shielding cover comprises a side plate and a top plate, the side plate surrounds the chip, and the top plate comprises an opening; the metal heat dissipation piece penetrates through the opening and is arranged above the chip, and the metal heat dissipation piece is used for conducting heat dissipation on the chip; the metal heat dissipation piece is electrically connected with the metal shielding cover so as to shield electromagnetic waves generated by the chip; according to the chip module provided by the embodiment of the utility model and the chip module in the electronic equipment in the vehicle, the heat dissipation requirement and the electromagnetic shielding requirement of the chip can be met at the same time, and the chip module can be applied to a vehicle-mounted remote communication box.

Description

Technical Field

[0001] The present application relates to the field of vehicles, and more specifically, to a chip module, an electronic device, and a vehicle. Background Art

[0002] With the rapid development of the automotive industry, various in-vehicle electronic module devices have become an indispensable part of vehicles. The functions of in-vehicle electronic modules are increasing, and the integration degree of chips is getting higher. At the same time, the heat dissipation requirements and electromagnetic shielding requirements of chips are also increasing; when using heat-conducting materials to dissipate heat from chips, the heat-conducting materials need to support reflow soldering, which limits the selectability of heat-conducting materials. Therefore, a solution that can both meet the electromagnetic shielding effect of in-vehicle electronic modules and dissipate heat efficiently is needed. Summary of the Utility Model

[0003] The present application provides a chip module, an electronic device, and a vehicle. The chip module in the vehicle's electronic device can simultaneously meet the heat dissipation requirements and electromagnetic shielding requirements of the chip, and the chip module can be applied to an in-vehicle remote communication box.

[0004] In a first aspect, a chip module is provided, including: a circuit board provided with a chip; a metal shielding cover including side plates and a top plate, the side plates surrounding the chip, and the top plate including an opening; a metal heat dissipation member passing through the opening and disposed above the chip, the metal heat dissipation member being configured to dissipate heat from the chip; and the metal heat dissipation member being electrically connected to the metal shielding cover to shield electromagnetic waves generated by the chip.

[0005] Based on the above technical solution, the metal heat dissipation member in the chip module can dissipate heat from the chip, and the electromagnetic shielding structure formed by the electrical connection between the metal heat dissipation member and the metal shielding cover can meet the electromagnetic shielding requirements of the chip, so that the chip module can simultaneously meet the heat dissipation and electromagnetic shielding requirements of the chip.

[0006] In combination with the first aspect, in some implementation manners of the first aspect, the metal heat dissipation member is electrically connected to the top plate.

[0007] Based on the above technical solution, the metal heat dissipation member is electrically connected to the metal shielding cover through the top plate of the metal shielding cover to form an electromagnetic shielding structure, achieving the electromagnetic shielding effect on the chip.

[0008] In combination with the first aspect, in some implementation manners of the first aspect, the top plate further includes a metal elastic member disposed at the opening, and the metal heat dissipation member passes through the opening and abuts against the metal elastic member.

[0009] Based on the above technical solution, the metal heat sink is abutted by the metal elastic member at the opening of the top plate, which improves the stability of the physical contact between the metal heat sink and the top plate, ensures the stability of the electrical connection between the metal heat sink and the metal shielding cover, and thus ensures the stability of the electromagnetic shielding effect.

[0010] Combined with the first aspect, in some implementation manners of the first aspect, the metal elastic member includes a metal elastic sheet extending from the edge of the opening towards the center of the opening.

[0011] Based on the above technical solution, the metal elastic member includes a metal elastic sheet extending from the edge of the opening towards the center. Through the elastic deformation of the metal elastic sheet, the stability of the physical contact between the metal heat sink and the top plate is improved, the stability of the electrical connection between the metal heat sink and the metal shielding cover is ensured, and thus the stability of the electromagnetic shielding effect is ensured.

[0012] Combined with the first aspect, in some implementation manners of the first aspect, the metal elastic members are spaced apart at opposite edges of the opening.

[0013] In some possible implementation manners, the number of the metal elastic members is multiple.

[0014] Based on the above technical solution, the metal elastic members are spaced apart at opposite edges of the opening, so that the metal elastic members can be more firmly installed at the opening, further improving the stability of the physical contact between the metal heat sink and the top plate, ensuring the stability of the electrical connection between the metal heat sink and the metal shielding cover, and thus ensuring the stability of the electromagnetic shielding effect.

[0015] Combined with the first aspect, in some implementation manners of the first aspect, the opening includes any one of a rectangular opening, a circular opening or an oval opening.

[0016] Combined with the first aspect, in some implementation manners of the first aspect, the shape of the metal elastic member includes a rectangle or a ring.

[0017] Combined with the first aspect, in some implementation manners of the first aspect, a cavity is provided between the metal heat sink and the chip. The cavity is used to accommodate a heat-conducting material. The first surface of the heat-conducting material is in contact with the metal heat sink, and the second surface of the heat-conducting material is in contact with the chip. The heat-conducting material is used to dissipate heat from the chip.

[0018] Based on the above technical solution, a cavity for accommodating a heat-conducting material is provided between the metal heat sink and the chip. The heat-conducting material does not need to be pre-installed in the chip module. Users can select and install the heat-conducting material according to actual needs, improving the flexibility of using the chip module.

[0019] In combination with the first aspect, in some implementations of the first aspect, a thermal conductive material is provided between the metal heat sink and the chip. The first surface of the thermal conductive material is in contact with the metal heat sink, and the second surface of the thermal conductive material is in contact with the chip. The thermal conductive material is used to dissipate heat from the chip.

[0020] In a second aspect, an electronic device is provided. The electronic device includes a chip module as in the first aspect and any of its implementations.

[0021] In combination with the second aspect, in some implementations of the second aspect, the electronic device includes a vehicle-mounted electronic module.

[0022] In some possible implementations, the vehicle-mounted electronic module includes a vehicle-mounted remote communication box.

[0023] In a third aspect, a vehicle is provided. The vehicle includes an electronic device as in the second aspect and any of its implementations. Description of the Drawings

[0024] Figure 1 It is a schematic diagram of a vehicle-mounted electronic module provided by an embodiment of the present application.

[0025] Figure 2 It is a schematic diagram of a chip module provided by an embodiment of the present application.

[0026] Figure 3 It is a schematic diagram of another chip module provided by an embodiment of the present application.

[0027] Figure 4 It is Figure 3 A side view of the chip module shown.

[0028] Figure 5 It is a schematic diagram of another chip module provided by an embodiment of the present application.

[0029] Figure 6 It is Figure 5 A side view of the chip module shown.

[0030] Figure 7 It is a schematic diagram of another chip module provided by an embodiment of the present application.

[0031] Figure 8 It is Figure 7 A side view of the chip module shown.

[0032] Figure 9 It is a schematic diagram of another chip module provided by an embodiment of the present application.

[0033] Figure 10 It is Figure 9 A side view of the chip module shown.

[0034] Figure 11 It is a schematic diagram of another chip module provided by an embodiment of the present application. Detailed implementation manners

[0035] The technical solutions in the present application will be described below with reference to the accompanying drawings.

[0036] With the rapid development of the automotive industry, various in-vehicle electronic module devices have become an indispensable part of automobiles. Automobiles have high requirements for the stability of in-vehicle products thereon. The in-vehicle electronic modules are mainly installed in the cockpit of the automobile, and the working environment temperature is -40°C to 85°C, and there may be a complex electromagnetic environment in the cockpit. With the progress of the electronic chip industry, the integration of chips is getting higher and higher, which brings two problems at the same time: the power of the chips increases, the temperature rises faster, and the temperature of the chips is relatively high during operation. If heat dissipation is not carried out in time, too high temperature will cause abnormal operation of the chips, and in severe cases, there will be crashes or spontaneous combustion, which may cause significant property losses; on the other hand, some chips are very sensitive to external electromagnetic interference, or these chips will also emit electromagnetic waves during operation, interfering with electronic devices in the external environment. The internal environment of existing in-vehicle electronic modules cannot meet the requirements of some key chips.

[0037] The in-vehicle electronic module may include an in-vehicle telematics box (t-box). The t-box can also be called an in-vehicle information box or a communication box, and is mainly used to provide the interaction between the gateway and the Internet. The t-box usually consists of a housing and a main board, and chip modules for implementing various vehicle functions are arranged on the main board.

[0038] The user needs to install the chip module on the main board of the t-box. During the installation process, high-temperature welding is usually required, and the temperature may reach 200°C to 300°C during welding. If the heat-conducting material is installed in the chip module in advance, most of the heat-conducting materials may melt or expand during high-temperature welding, and the heat dissipation effect cannot be achieved. Therefore, the chip module is usually designed as an open structure, and the heat-conducting material can be installed in the chip module after the chip module is installed on the main board of the t-box, so as to avoid damaging the heat-conducting material during high-temperature welding.

[0039] In the prior art, the shielding cover of the chip module is directly opened, and then a thermal pad or thermal gel is set in the opening to dissipate heat from the chip through the thermal pad or thermal gel. However, in this solution, there will be many gaps at the opening of the shielding cover, and the shielding effect of electromagnetic waves is poor, which cannot meet the electromagnetic compatibility (EMC) requirements; in some other chip modules, the shielding cover is directly opened, and then the heat dissipation metal is connected to the shielding cover through conductive foam. Although this method can improve the electromagnetic shielding effect of the chip module, the assembly process of this chip module is relatively complicated; in some other chip modules, after the shielding cover is set with an opening, the thermal pad is glued to the structural member and buckled. This solution requires the shielding cover and the product to be packaged together for the user and assembled on the user side, and the process is complicated.

[0040] Therefore, a relatively simple solution is needed that can meet the electromagnetic shielding requirements of the chip and dissipate heat for the chip at the same time.

[0041] Figure 1 is a schematic diagram of a vehicle-mounted electronic module 1 provided in an embodiment of the application, such as Figure 1 As shown, the vehicle-mounted electronic module 1 includes a mainboard 10 and a shell 20. The mainboard 10 can be a printed circuit board (PCB). A chip module 30 for realizing various functions of the vehicle-mounted electronic module 1 is arranged on the mainboard 10. The number of chip modules 30 can be one or more. The mainboard 10 is also provided with electronic components for realizing various functions of the vehicle-mounted electronic module 1, such as resistors, capacitors, etc.; the chip module 30 and the electronic components are usually installed on the mainboard 10 by welding, and the shell 20 is arranged on the mainboard 10. The chip module 30 and various electronic components of the mainboard 10 are installed inside the shell 20 to prevent the mainboard 10 from being physically damaged by the external environment. The shell 20 is usually made of metal material, especially metal material with good heat dissipation or thermal conductivity, such as copper, aluminum, stainless steel and other metal materials or composite metal materials. The shell 20 can dissipate the heat generated by the mainboard 10 when working to the external environment.

[0042] Figure 2 is a schematic diagram of a chip module provided in an embodiment of the present application, Figure 2 The chip module 30 shown is only an example and does not constitute a limitation to the present application. The shape and size of each component of the chip module 30 can be determined according to actual application conditions.

[0043] like Figure 2As shown, the chip module 30 includes a circuit board 31 and a metal shielding cover 33. Among them, the circuit board 31 is used to mount the chip 32. The metal shielding cover 33 includes a side plate 331 and a top plate 332. The top plate 332 is provided with an opening 3321. The opening 3321 is used to accommodate the metal heat sink 34. The metal heat sink 34 is disposed above the chip 32 through the opening 3321. The metal heat sink 34 is used to dissipate heat from the chip 32. The side plate 331 surrounds the chip 32 on the circuit board 31. The opening 3321 is used to accommodate the metal heat sink 34. The metal heat sink 34 is electrically connected to the metal shielding cover 33 to shield the electromagnetic waves emitted when the chip 32 works.

[0044] It should be noted that the bottom end of the side plate 331 can be fixed to the circuit board 31. That the metal heat sink 34 is disposed above the chip 32 through the opening 3321 can mean that the metal heat sink 34 is in direct contact with the chip 32 above the chip 32, or it can mean that the metal heat sink 34 is in indirect contact with the chip 32 above the chip 32, and there is a space or cavity between the metal heat sink 34 and the chip 32.

[0045] The electrical connection between the metal heat sink 34 and the metal shielding cover 33 can be directly achieved through physical contact between the two, or can be indirectly achieved through other metal media. The metal heat sink 34 can be electrically connected to the side plate 331 of the metal shielding cover 33.

[0046] In some possible implementation manners, the electrical connection between the metal heat sink 34 and the metal shielding cover 33 can include the electrical connection between the metal heat sink 34 and the top plate 332 of the metal shielding cover 33. For example, the metal heat sink 34 is in electrical connection by abutting against the edge of the opening 3321 of the top plate 332.

[0047] It should be noted that the shape of the metal heat sink 34 is arranged to match the shape of the opening 3321, especially the shape of the side of the metal heat sink 34 facing the opening 3321. For example, when the metal heat sink 34 is a rectangular body, the shape of the opening 3321 is also rectangular. When the metal heat sink 34 is a disc, the shape of the opening 3321 can be circular, and the size of the side of the metal heat sink 34 facing the opening 3321 is the same as the size of the opening 3321. In this way, the metal heat sink 34 can enter the metal shielding cover 33 through the opening 3321.

[0048] Multiple chips 32 can be provided on the circuit board 31. One opening 3321 can be provided to dissipate heat from the chips 32 on the circuit board 31 simultaneously, or multiple openings 3321 can be provided to dissipate heat from the multiple chips 32 on the circuit board 31 separately.

[0049] The metal heat sink 34 can be a metal with a relatively high thermal conductivity. The metal heat sink 34 can be in direct contact with the chip 32 to transfer the heat generated by the chip 32 to the external environment. The metal heat sink 34 can also be referred to as a heat-dissipating metal or a heat-dissipating structural component.

[0050] Figure 2 The assembly process of each component of the chip module 30 shown can be as follows: Fix the metal shield 33 on the circuit board 31 so that the metal shield 33 surrounds the chip 32. Press the metal heat sink 34 against the chip 32 through the opening 3321 of the top plate 332, so that the metal heat sink 34 is in contact with the chip 32, and the heat generated when the chip 32 is in the working state can be conducted to the external environment through the metal heat sink 34, thereby realizing the heat dissipation of the chip 32. At the same time, since the metal heat sink 34 is in contact with the edge at the opening 3321 of the top plate 332, an electrical connection is formed between the metal heat sink 34 and the metal shield 33. It can also be understood that the metal heat sink 34 and the metal shield 33 overlap to form an electromagnetic shielding structure, so as to be able to shield the electromagnetic waves generated by the chip 32 in the metal shield 33 and meet the electromagnetic shielding requirements of the chip 32.

[0051] The chip module 30 provided by the embodiment of the present application includes a metal shield 33 and a metal heat sink 34. Among them, an electrical connection is formed after the metal shield 33 is in contact with the metal heat sink 34, and the chip 32 is jointly covered, so as to meet the electromagnetic shielding requirements of the chip 32. At the same time, the metal heat sink 34 is in contact with the chip 32, so that the heat generated when the chip 32 works can be conducted to the external environment through the metal heat sink 34, meeting the heat dissipation requirements of the chip 32. Based on this, the chip module provided by the embodiment of the present application can meet the heat dissipation requirements while meeting the electromagnetic shielding requirements of the chip.

[0052] It can be understood that due to possible errors in the production and preparation process, there is a deviation between the size of the side of the metal heat sink 34 facing the opening 3321 and the size of the opening 3321. If the size of the side of the metal heat sink 34 facing the opening 3321 is larger than the size of the opening 3321, then the metal heat sink 34 cannot enter the metal shield 33 through the opening 3321. If the size of the side of the metal heat sink 34 facing the opening 3321 is smaller than the size of the opening 3321, then after the metal heat sink 34 enters the metal shield 33 from the opening, it may not be able to completely contact the edge of the opening 3321, resulting in the inability to form an electrical connection between the metal shield 33 and the metal heat sink 34, weakening the electromagnetic shielding effect of the metal shield 33 and not being able to meet the electromagnetic shielding requirements of the chip 32.

[0053] Figure 3 is a schematic diagram of another chip module provided by the embodiment of the present application, as Figure 3As shown, in order to ensure that after the metal heat sink 34 enters the metal shielding case 33 through the opening 3321, it can have a good contact effect with the metal shielding case 33 to guarantee the electrical connection effect between the metal shielding case 33 and the metal heat sink 34, a metal elastic member 3322 can be provided at the opening 3321 of the metal shielding case 33. When the metal heat sink 34 passes through the opening 3321, it abuts against the metal elastic member 3322, which can cause the metal elastic member 3322 to undergo elastic deformation. Through the metal elastic member 3322, the metal heat sink 34 and the metal shielding case 33 can form a stable physical contact to achieve electrical connection, thereby ensuring the stability of the electromagnetic shielding effect of the metal shielding case 33.

[0054] In some possible implementation manners, the metal elastic member 3322 can include a metal spring piece, and the metal spring piece extends from the edge of the opening 3321 towards the center of the plane where the opening 3321 is located. As Figure 3 shown, when the metal heat sink 34 is installed into the metal shielding case 33 through the opening 3321 of the top plate 332, the metal heat sink 34 will squeeze the metal spring piece. After being stressed, the metal spring piece will undergo elastic deformation and bend towards the chip 32 side. After the metal heat sink 34 presses the metal spring piece to bend, under the action of force, the metal spring piece maintains elastic deformation, and there is always a tight abutment between the metal heat sink 34 and the metal spring piece, having a good physical contact, so that a stable electrical connection is formed between the metal shielding case 33 and the metal heat sink 34, and the stability of the electromagnetic shielding effect is guaranteed.

[0055] In some possible implementation manners, the number of the metal elastic members 3322 can be one or multiple. When multiple metal elastic members 3322 are provided, the metal elastic members 3322 can be arranged at intervals at the opposite edges of the opening 3321. Taking a rectangular opening as an example, the rectangular opening has four sides, and one or more metal elastic members 3322 are respectively arranged at intervals at each side and its opposite side. If the opening 3321 is circular or elliptical, the metal elastic members 3322 can be arranged at intervals around the opening 3321. The embodiments of the present application do not limit the number of the metal elastic members 3322 and the distance of the interval setting.

[0056] In some possible implementation manners, the metal elastic member 3322 can be a metal spring piece extending from the plane where the opening 3321 is located of the top plate 332, and the metal spring piece can be integrally formed with the top plate 332, reducing the number of workpieces in the chip module 30.

[0057] In some possible implementation manners, the metal elastic member 3322 can be installed at the opening 3321 of the top plate during subsequent processing. For example, the metal elastic member 3322 can be fixed at the edge of the opening 3321 of the top plate by welding.

[0058] In the above solution, the metal heat sink 34 is in direct contact with the chip 32. In other embodiments provided by the present application, the metal heat sink 34 and the chip 32 may also be in indirect contact. A cavity may be provided between the metal heat sink 34 and the chip 32, and the cavity can be used to accommodate a heat-conducting material. After the cavity is provided with the heat-conducting material, the heat generated when the chip 32 works is transferred to the metal heat sink 34 through the heat-conducting material, and then the metal heat sink 34 transfers the heat to the external environment.

[0059] Figure 3 The assembly process of the various components of the chip module 30 shown can be as follows: Fix the metal shielding cover 33 on the circuit board 31 so that the metal shielding cover 33 surrounds the chip 32, and press the metal heat sink 34 against the chip 32 through the opening 3321 of the top plate 332. During the installation of the metal heat sink 34, the metal heat sink 34 will bend the metal elastic piece at the opening 3321, so that the side of the metal elastic piece facing the chip 32 bends, and the metal elastic piece maintains an elastically deformed state. The metal heat sink 34 is in contact with the chip 32, so that the heat generated when the chip 32 is in the working state can be conducted to the external environment through the metal heat sink 34, thereby realizing heat dissipation of the chip 32; at the same time, since the metal heat sink 34 is in contact with the metal elastic piece at the opening 3321 of the top plate 332, an electrical connection is formed between the metal heat sink 34 and the metal shielding cover 33. It can also be understood that the metal heat sink 34 and the metal shielding cover 33 are electrically connected to form an electromagnetic shielding structure, so as to be able to shield the electromagnetic waves generated by the chip 32 in the metal shielding cover 33 and meet the electromagnetic shielding requirements of the chip 32.

[0060] Figure 4 is Figure 3 a side view of the chip module 30 shown. As Figure 4 shown in the figure, after the metal heat sink 34 is installed on the metal shielding cover 33 through the opening 3321, the side of the metal elastic piece facing the chip 32 bends. At the same time, a heat-conducting material 35 is provided in the cavity between the metal heat sink 34 and the chip 32. The first surface of the heat-conducting material 35 is in contact with the metal heat sink 34, and the second surface of the heat-conducting material 35 is in contact with the chip 32. The heat generated during the operation of the chip 32 can be conducted to the metal heat sink 34 through the heat-conducting material 35, thereby realizing heat dissipation of the chip 32.

[0061] Figure 5 is a schematic diagram of another chip module provided by an embodiment of the present application. And Figure 3The difference between the chip modules 30 shown is that at the opening 3321 of the top plate 332 in the chip module 30, a rectangular metal elastic member 3322 is provided on each side of the rectangular opening. The long side of the rectangle can be equal to the side length of the rectangle corresponding to the opening, or slightly shorter than the side length of the rectangle corresponding to the opening. That is to say, only one rectangular metal elastic member 3322 is provided on each side of the rectangular opening. Such a setting can reduce the difficulty of forming the metal shield 33. And since the size of the metal elastic piece is large, it is not easily damaged by external forces, thus improving the reliability of the metal shield 33.

[0062] Figure 6 is Figure 5 a side view of the chip module 30 shown, as Figure 6 shown in. After the metal heat sink 34 is installed into the metal shield 33 through the opening 3321, the metal elastic piece bends towards the side of the chip 32. At the same time, a heat-conducting material 35 is provided in the cavity between the metal heat sink 34 and the chip 32. The first surface of the heat-conducting material 35 contacts the metal heat sink 34, and the second surface of the heat-conducting material 35 contacts the chip 32. The heat generated by the chip 32 during operation can be conducted to the metal heat sink 34 through the heat-conducting material 35, thereby realizing the heat dissipation of the chip 32.

[0063] Figure 7 is a schematic diagram of another chip module provided by an embodiment of the present application. The difference from the Figure 3 chip module 30 shown is that the shape of the opening 3321 provided on the top plate 332 is circular, and the metal elastic member 3322 extending from the top plate 332 in the plane of the opening 3321 is an annular metal elastic piece. When the metal heat sink 34 is a rectangular body, the four corners of the metal heat sink 34 can press the annular metal elastic piece to bend towards the chip 32. Under the action of force, the metal heat sink 34 contacts the metal shield 33 through the bent annular metal elastic piece and forms an electrical connection.

[0064] In some possible implementation manners, in the Figure 7 chip module 30 shown, the metal heat sink 34 can be disc-shaped. The diameter of the disc is smaller than the diameter of the circular opening 3321 and larger than the inner diameter of the annular metal elastic piece. When the disc-shaped metal heat sink 34 is installed into the metal shield 33 through the opening 3321, the metal heat sink 34 can uniformly press down the annular metal elastic piece, so that the metal elastic member 3322 remains in contact with the annular metal elastic piece and forms an electrical connection.

[0065] Figure 8 is Figure 7 a side view of the chip module 30 shown, as Figure 8As shown, after the metal heat sink 34 is installed on the metal shield 33 through the opening 3321, the metal spring piece bends toward the side of the chip 32. At the same time, a heat-conducting material 35 is arranged in the cavity between the metal heat sink 34 and the chip 32. The first surface of the heat-conducting material 35 contacts the metal heat sink 34, and the second surface of the heat-conducting material 35 contacts the chip 32. The heat generated by the chip 32 during operation can be conducted to the metal heat sink 34 through the heat-conducting material 35, thereby realizing heat dissipation of the chip 32.

[0066] Figure 9 is a schematic diagram of another chip module provided by an embodiment of the present application. Different from Figure 3 the chip module 30 shown, the difference lies in that the shape of the opening 3321 provided on the top plate 332 is circular, and the metal elastic member 3322 extended by the top plate 332 in the plane where the opening 3321 is located is a metal spring piece. The metal spring piece can extend from different positions at the edge of the circular opening. The metal heat sink 34 is disc-shaped. The four corners of the disc-shaped metal heat sink 34 can press the metal spring piece to bend toward the chip 32. Under the action of force, the metal heat sink 34 contacts the metal shield 33 through the bent metal spring piece and forms an electrical connection.

[0067] Figure 10 is Figure 9 a side view of the chip module 30 shown. As Figure 10 shown, after the metal heat sink 34 is installed on the metal shield 33 through the opening 3321, the metal spring piece bends toward the side of the chip 32. At the same time, a heat-conducting material 35 is arranged in the cavity between the metal heat sink 34 and the chip 32. The first surface of the heat-conducting material 35 contacts the metal heat sink 34, and the second surface of the heat-conducting material 35 contacts the chip 32. The heat generated by the chip 32 during operation can be conducted to the metal heat sink 34 through the heat-conducting material 35, thereby realizing heat dissipation of the chip 32.

[0068] Figure 11 is a schematic diagram of another chip module provided by an embodiment of the present application. As Figure 11 shown in (a) of Figure 11Among them, (b) is a three-dimensional schematic diagram of the chip module 30. As shown in the figure, after the metal heat sink 34 is installed in the metal shield 33, it can be observed that the metal elastic sheet is in an elastic deformation state. The metal elastic sheet extends from the edge of the opening 3321 towards the center of the opening 3321. Metal elastic sheets are provided on each side of the opening 3321. Therefore, there is a good contact effect between the metal heat sink 34 and the metal elastic sheet. The metal heat sink 34 is electrically connected to the metal shield 33 through the metal elastic sheet to achieve the electromagnetic shielding effect. Figure 11 Among them, (c) is a side view of the chip module 30. It can be observed that the metal elastic sheet is in an elastic deformation state, and there is a cavity between the metal heat sink 34 and the chip 32. A heat-conducting material 35 is provided in the cavity. The first surface of the heat-conducting material 35 is in contact with the metal heat sink 34, and the second surface of the heat-conducting material 35 is in contact with the chip 32.

[0069] Based on the above technical solution, the metal heat sink 34 is in contact with the chip 32 through the heat-conducting material 35, which can reduce the structural tolerance between the metal heat sink 34 and the chip 32, achieve a tight combination between the metal heat sink 34 and the chip 32, and the heat generated by the chip 32 can be conducted to the metal heat sink 34 through the heat-conducting material 35.

[0070] The heat-conducting material 35 may include, but is not limited to, graphene, heat-conducting silica gel sheet, heat-dissipating graphite film, etc.

[0071] The metal heat sink and / or the metal elastic member can be made of metals with good heat-conducting performance, such as metal materials and composite metal materials such as copper, aluminum or steel.

[0072] Based on the above technical solution, the heat generated when the chip works only needs to pass through the heat-conducting material and the metal heat sink to be transferred to the external environment. The heat dissipation path of the chip is short, which can improve the heat dissipation efficiency and optimize the heat dissipation effect.

[0073] Since there is a cavity between the metal heat sink of the chip module and the chip, when the user installs the chip module, the type of heat-conducting material provided in the cavity can be selected according to the actual heat dissipation requirements of the product, which improves the freedom of the user when installing the chip module.

[0074] Moreover, since the heat-conducting material 35 does not need to be installed in the chip module 30 in advance, when the user installs the chip module 30 on the main board of the t-box, there is no need to consider whether the heat-conducting material 35 can withstand the high temperature during welding installation. Therefore, the user can select the heat-conducting material 35 with a suitable thermal conductivity according to the actual needs.

[0075] Optionally, the metal shield 33 can be fixed on the circuit board 31 by welding.

[0076] The embodiment of the present application also provides an electronic device, including the chip module described in any of the above embodiments.

[0077] In some possible implementation manners, the electronic device includes any one of a desktop computer, a laptop computer, a smart phone, a tablet computer, a personal digital assistant (PDA), a wearable device, a smart speaker, a television, a drone, a vehicle, an in-vehicle device or an in-vehicle electronic module (such as a car head unit, an in-vehicle computer, an in-vehicle HUD, a t-box, etc.) or a robot.

[0078] In some possible implementation manners, the electronic device includes a vehicle-mounted remote communication box t-box.

[0079] The embodiment of the present application also provides a vehicle, which includes any of the above electronic devices.

[0080] As described above, the above are only specific implementation manners of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A chip module, characterized in that: include: A circuit board, wherein the circuit board is provided with a chip; A metal shielding cover, comprising a side plate and a top plate, wherein the side plate surrounds the chip, and the top plate comprises an opening; A metal heat sink, the metal heat sink is disposed above the chip through the opening, and the metal heat sink is used to dissipate heat from the chip; The metal heat sink is electrically connected to the metal shielding cover to shield the electromagnetic waves generated by the chip.

2. The chip module according to claim 1, characterized in that: The metal heat sink is electrically connected to the top plate.

3. The chip module according to claim 1, characterized in that: The top plate further includes a metal elastic member disposed at the opening, and the metal heat sink passes through the opening and abuts against the metal elastic member.

4. The chip module according to claim 3, characterized in that: The metal elastic member includes a metal spring extending from the edge of the opening toward the center of the opening.

5. The chip module according to claim 4, characterized in that: The metal elastic members are arranged at intervals at opposite edges of the opening.

6. The chip module according to any one of claims 3 to 5, characterized in that: The shape of the metal elastic member includes a rectangle or a ring.

7. The chip module according to any one of claims 1 to 5, characterized in that: The opening includes any one of a rectangular opening, a circular opening or an elliptical opening.

8. The chip module according to any one of claims 1 to 5, characterized in that: A cavity is provided between the metal heat sink and the chip, the cavity is used to accommodate a thermally conductive material, a first surface of the thermally conductive material contacts the metal heat sink, a second surface of the thermally conductive material contacts the chip, and the thermally conductive material is used to dissipate heat from the chip.

9. The chip module according to any one of claims 1 to 5, characterized in that: A heat-conducting material is arranged between the metal heat sink and the chip, a first surface of the heat-conducting material contacts the metal heat sink, and a second surface of the heat-conducting material contacts the chip, and the heat-conducting material is used to dissipate heat from the chip.

10. An electronic device, characterized in that: Comprising a chip module as described in any one of claims 1-9.

11. The electronic device according to claim 10, characterized in that: The electronic device includes an on-board electronic module.

12. A vehicle, characterized in that: Comprising the electronic device as claimed in claim 10 or 11.

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