PCB structure combining multi-layer soft board and multi-layer hard board
By setting up an upper hard board structure, a hard board dielectric layer and a lower hard board structure in the PCB structure, and through intersecting connection between the connecting block and the connecting slot, the problems of insufficient connection and poor contact of the existing PCB structure are solved, and higher stability and signal transmission reliability are achieved.
Patent Information
- Application Number
- CN202422066801.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-26
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-26
AI Technical Summary
The existing PCB structure that combines multi-layer soft boards with multi-layer hard boards is not firm enough, and the contact area between multi-layer soft boards and multi-layer hard boards is small, which is prone to poor contact, affecting the use of PCBs.
A PCB structure combining multi-layer soft boards and multi-layer hard boards is adopted. By setting up an upper hard board structure, several hard board dielectric layers and lower hard board structure, the hard board dielectric layer and soft board structure are distributed in a dislocation, and the connection between the hard board dielectric layer and the upper hard board structure and the lower hard board structure is strengthened through the interspersed connection between the connecting block and the connecting groove.
It effectively reinforces the connection between the multi-layer soft board and the multi-layer hard board, improves the stability of the PCB and the reliability of signal transmission, avoids the problem of poor contact, and extends the service life of electronic equipment.
Smart Images
Figure CN223040234U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of high-speed PCB design, and particularly relates to a PCB structure combining a multi-layer flexible board and a multi-layer rigid board. Background Art
[0002] With the development of FPC (flexible printed circuit board) and PCB (printed circuit board), rigid-flex boards have emerged. Rigid-flex boards are formed by combining flexible printed circuit boards and rigid printed circuit boards through processes such as lamination. They have the characteristics of both FPC and PCB, with both flexible flexible board areas and rigid rigid board areas, and can be locally bent and folded. Rigid-flex boards are widely used in computer host devices, mobile phones and other devices. During the use of the existing PCB structure combining a multi-layer flexible board and a multi-layer rigid board, there are at least the following drawbacks: 1. The connection of the existing PCB structure combining a multi-layer flexible board and a multi-layer rigid board is not firm enough; 2. The contact area between the multi-layer flexible board and the multi-layer rigid board in the existing PCB structure combining a multi-layer flexible board and a multi-layer rigid board is small, and poor contact is likely to occur, thus affecting the use of the PCB. Therefore, we have developed a new PCB structure combining a multi-layer flexible board and a multi-layer rigid board. Summary of the Utility Model
[0003] The main purpose of the utility model is to provide a PCB structure combining a multi-layer flexible board and a multi-layer rigid board, which can effectively solve the problems in the background art.
[0004] To achieve the above purpose, the technical solution adopted by the utility model is as follows:
[0005] A PCB structure combining a multi-layer flexible board and a multi-layer rigid board, including an upper rigid board structure, a flexible board structure and a rigid board dielectric layer. There are several flexible board structures and rigid board dielectric layers. The several rigid board dielectric layers and the several flexible board structures are arranged in a staggered distribution. The lower end of the lowermost rigid board dielectric layer is fixedly connected to a lower rigid board structure. The several rigid board dielectric layers are all located between the upper rigid board structure and the lower rigid board structure. The upper rigid board structure is respectively sleeved with the uppermost rigid board dielectric layer, and the lower rigid board structure is sleeved with the lowermost rigid board dielectric layer;
[0006] The upper rigid board structure includes a first board body. A first card slot is opened at the lower end of the first board body. A first rigid board copper foil layer is installed on the inner wall of the first card slot. Connecting slots are opened at the left and right parts of the lower end of the first board body. The first card slot is sleeved with the flexible board structure.
[0007] Preferably, the flexible board structure includes a second board body. Flexible board copper foil layers are fixedly connected to the middle parts of the upper and lower ends of the second board body. Connecting ends are fixedly connected to the front and rear ends of the second board body. The second board body is inserted and connected with the upper rigid board structure.
[0008] By adopting the above technical solution: the upper flexible board copper foil layer is in contact with the lower second card slot, and the lower flexible board copper foil layer is in contact with the lower second card slot.
[0009] Preferably, the rigid board dielectric layer includes a third body. Second card slots are respectively formed in the middle of the upper end and the middle of the lower end of the third body. Second rigid board copper foil layers are fixedly connected to the inner walls of the two second card slots. Connecting blocks are fixedly connected to the left part of the upper end, the right part of the upper end, the left part of the lower end, and the right part of the lower end of the third body. The two second card slots are respectively sleeved with adjacent flexible board structures.
[0010] By adopting the above technical solution: the two connecting blocks are respectively inserted and connected with the two horizontal connecting slots, which can strengthen the connection between the uppermost rigid board dielectric layer and the upper rigid board structure. In the same way, the lowermost rigid board dielectric layer can be connected to the lower rigid board structure.
[0011] Preferably, the upper rigid board structure and the lower rigid board structure have the same structure and are symmetrically distributed. The uppermost flexible board copper foil layer is in contact with the first rigid board copper foil layer, the lowermost flexible board copper foil layer is in contact with the lower first rigid board copper foil layer, the upper flexible board copper foil layer is in contact with the lower second rigid board copper foil layer, and the lower flexible board copper foil layer is in contact with the upper second rigid board copper foil layer.
[0012] Preferably, the two horizontal connecting slots are respectively sleeved with the two horizontal connecting blocks.
[0013] Compared with the prior art, the utility model has the following beneficial effects:
[0014] 1. By arranging the upper rigid board structure and the lower rigid board structure, the connection and reinforcement process between several rigid board dielectric layers and several flexible board structures can be facilitated. The two horizontal connecting slots are respectively sleeved with the two connecting blocks, which can strengthen the connection between the upper rigid board structure and the rigid board dielectric layer and improve the stability.
[0015] 2. By arranging several rigid board dielectric layers, two second card slots are arranged on each rigid board dielectric layer, and second rigid board copper foil layers are arranged in the several second card slots. The lower second rigid board copper foil layer on each rigid board dielectric layer is in contact with the upper flexible board copper foil layer on each flexible board structure, and the upper second rigid board copper foil layer on each rigid board dielectric layer is in contact with the lower flexible board copper foil layer on each flexible board structure, which can facilitate the contact and use of the PCB. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the overall structure of a PCB structure combining a multi-layer flexible board and a multi-layer rigid board of the utility model;
[0017] Figure 2 This is the overall structural schematic diagram of the upper rigid board structure of a PCB structure combining a multi-layer flexible board and a multi-layer rigid board of the present utility model;
[0018] Figure 3 This is the overall structural schematic diagram of the flexible board structure of a PCB structure combining a multi-layer flexible board and a multi-layer rigid board of the present utility model;
[0019] Figure 4 This is the overall structural schematic diagram of the rigid board dielectric layer of a PCB structure combining a multi-layer flexible board and a multi-layer rigid board of the present utility model.
[0020] In the figure: 1. Upper rigid board structure; 2. Flexible board structure; 3. Lower rigid board structure; 4. Rigid board dielectric layer; 11. First board body; 12. First card slot; 13. First rigid board copper foil layer; 14. Connection slot; 21. Second board body; 22. Flexible board copper foil layer; 23. Connection end; 41. Third body; 42. Second card slot; 43. Connection block; 44. Second rigid board copper foil layer. Detailed implementation manners
[0021] To make the technical means, creative features, achieved purposes and functions of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific implementation manners.
[0022] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0023] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0024] Please refer to Figures 1-4 , the present utility model provides a technical solution:
[0025] A PCB structure combining a multi-layer flexible board and a multi-layer rigid board, including an upper rigid board structure 1, a flexible board structure 2, and a rigid board dielectric layer 4. There are several flexible board structures 2 and rigid board dielectric layers 4, and several rigid board dielectric layers 4 and several flexible board structures 2 are arranged in a staggered distribution. The lower end of the lowermost rigid board dielectric layer 4 is fixedly connected to a lower rigid board structure 3. Several rigid board dielectric layers 4 are all located between the upper rigid board structure 1 and the lower rigid board structure 3. The upper rigid board structure 1 is respectively sleeved with the uppermost rigid board dielectric layer 4, and the lower rigid board structure 3 is sleeved with the lowermost rigid board dielectric layer 4;
[0026] In this embodiment, the upper rigid board structure 1 includes a first board body 11. A first card slot 12 is opened at the lower end of the first board body 11. A first rigid board copper foil layer 13 is installed on the inner wall of the first card slot 12. Connecting slots 14 are opened at the left and right parts of the lower end of the first board body 11. The first card slot 12 is sleeved with the flexible board structure 2; The two horizontal connecting slots 14 are respectively sleeved with the two horizontal connecting blocks 43; The upper rigid board structure 1 and the lower rigid board structure 3 have the same structure, and the upper rigid board structure 1 and the lower rigid board structure 3 are symmetrically distributed. The uppermost flexible board copper foil layer 22 is in contact with the first rigid board copper foil layer 13, the lowermost flexible board copper foil layer 22 is in contact with the lower first rigid board copper foil layer 13, the upper flexible board copper foil layer 22 is in contact with the upper second rigid board copper foil layer 44, and the lower flexible board copper foil layer 22 is in contact with the lower second rigid board copper foil layer 44.
[0027] Through the above solution: By setting the upper rigid board structure 1 and the lower rigid board structure 3, the connection and reinforcement process between several rigid board dielectric layers 4 and several flexible board structures 2 can be facilitated through the upper rigid board structure 1 and the lower rigid board structure 3.
[0028] In this embodiment, the flexible board structure 2 includes a second board body 21. Flexible board copper foil layers 22 are fixedly connected to the middle parts of the upper and lower ends of the second board body 21. Connection ends 23 are fixedly connected to the front and rear ends of the second board body 21. The second board body 21 is inserted and connected with the upper rigid board structure 1; The rigid board dielectric layer 4 includes a third body 41. Second card slots 42 are opened at the middle parts of the upper and lower ends of the third body 41. Second rigid board copper foil layers 44 are fixedly connected to the inner walls of the two second card slots 42. Connection blocks 43 are fixedly connected to the left and right parts of the upper end and the left and right parts of the lower end of the third body 41. The two second card slots 42 are respectively sleeved with the adjacent two flexible board structures 2.
[0029] Through the above solution: The lower second rigid-board copper foil layer 44 on each rigid-board dielectric layer 4 is in contact with the upper flexible-board copper foil layer 22 on each flexible-board structure 2, and the upper second rigid-board copper foil layer 44 on each rigid-board dielectric layer 4 is in contact with the lower flexible-board copper foil layer 22 on each flexible-board structure 2, which can facilitate the contact and use of the PCB. The two connecting blocks 43 are respectively inserted and connected with the two transverse connecting grooves 14, which can strengthen the connection between the uppermost rigid-board dielectric layer 4 and the upper rigid-board structure 1. In the same way, the lowermost rigid-board dielectric layer 4 can be connected to the lower rigid-board structure 3 to improve stability.
[0030] It should be noted that the present utility model is a PCB structure combining multiple flexible boards and multiple rigid boards. During use, the PCB structure is composed of an upper rigid-board structure 1, several rigid-board dielectric layers 4, several flexible-board structures 2, and a lower rigid-board structure 3. The upper rigid-board structure 1 and the lower rigid-board structure 3 serve as the support frameworks of the entire PCB, providing not only mechanical strength but also strengthening the connection with the rigid-board dielectric layers 4 through specific connection methods (such as the insertion connection between the connecting blocks 43 and the connecting grooves 14). This reinforcement design ensures that the PCB will not become loose or deformed due to factors such as vibration, impact, or temperature changes during use. Copper foil layers (second rigid-board copper foil layers 44) are covered on the upper and lower surfaces of each rigid-board dielectric layer 4, and copper foil layers (flexible-board copper foil layers 22) are also respectively covered on the upper and lower surfaces of the flexible-board structures 2. During the assembly of the PCB, these copper foil layers are designed to be in contact with each other to ensure that electrical signals can be smoothly transmitted between different layers. Specifically, the lower copper foil layer on each rigid-board dielectric layer 4 is in contact with the upper copper foil layer on the adjacent flexible-board structure 2, and at the same time, the upper copper foil layer is in contact with the lower copper foil layer of the next flexible-board structure 2. This design avoids the problem of poor contact and improves the reliability and stability of signal transmission. When electronic components are installed on the PCB, they are connected to the copper foil layers through pins or pads. The copper foil layers serve as conductive channels to transmit signals between the electronic components. Due to the good contact between the copper foil layers and the stability of the PCB structure, signals can be efficiently and accurately transmitted inside the PCB, thus enabling the normal operation of the electronic device. By strengthening the connection between the uppermost rigid-board dielectric layer 4 and the upper rigid-board structure 1 and between the lowermost rigid-board dielectric layer 4 and the lower rigid-board structure 3 (using the insertion connection between the connecting blocks 43 and the connecting grooves 14), the stability of the entire PCB board is significantly improved. This design enables the PCB to better resist deformation and damage when subjected to external forces, thereby extending the service life of the electronic device. In addition to the structural stability, the PCB structure also improves the reliability of electrical connection by optimizing the layout and connection method of the copper foil layers. The good contact between the copper foil layers and the overall stability of the PCB structure jointly ensure the accuracy and stability of electrical signals during transmission, thereby improving the overall reliability of the electronic device.
[0031] The foregoing has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above-mentioned embodiments, and what is described in the above-mentioned embodiments and the specification is only to illustrate the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will also have various changes and improvements, and these changes and improvements fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.
Claims
1. A PCB structure combining a multi-layer soft board and a multi-layer hard board, comprising an upper hard board structure (1), a soft board structure (2) and a hard board dielectric layer (4), characterized in that: A plurality of the soft board structures (2) and the hard board dielectric layers (4) are provided, the plurality of the hard board dielectric layers (4) and the plurality of the soft board structures (2) are staggeredly distributed, the lower end of the lowest hard board dielectric layer (4) is fixedly connected to the lower hard board structure (3), the plurality of the hard board dielectric layers (4) are located between the upper hard board structure (1) and the lower hard board structure (3), the upper hard board structure (1) is respectively sleeved with the uppermost hard board dielectric layer (4), and the lower hard board structure (3) is sleeved with the lowest hard board dielectric layer (4); The upper hard board structure (1) comprises a No. 1 board body (11), a No. 1 card slot (12) is formed at the lower end of the No. 1 board body (11), a No. 1 hard board copper foil layer (13) is installed on the inner groove wall of the No. 1 card slot (12), a connection groove (14) is formed at the left and right parts of the lower end of the No. 1 board body (11), and the No. 1 card slot (12) is sleeved with the soft board structure (2).
2. The PCB structure of a multi-layer flexible board and a multi-layer rigid board according to claim 1, characterized in that: The soft board structure (2) comprises a second board body (21), the middle of the upper end and the middle of the lower end of the second board body (21) are both fixedly connected with a soft board copper foil layer (22), the front and rear ends of the second board body (21) are both fixedly connected with connection ends (23), and the second board body (21) is interlacedly connected with the upper hard board structure (1).
3. The PCB structure of a multi-layer flexible board and a multi-layer rigid board according to claim 1, characterized in that: The hard board dielectric layer (4) comprises a No. 3 body (41), the No. 3 body (41) is provided with a No. 2 card slot (42) in the middle of the upper end and the middle of the lower end, the inner groove walls of the two No. 2 card slots (42) are fixedly connected with a No. 2 hard board copper foil layer (44), the upper left and upper right parts of the No. 3 body (41) and the lower left and lower right parts of the No. 3 body (41) are fixedly connected with a connecting block (43), and the two No. 2 card slots (42) are respectively sleeved with two adjacent soft board structures (2).
4. The PCB structure of a multi-layer flexible board and a multi-layer rigid board according to claim 2, characterized in that: The upper hard board structure (1) and the lower hard board structure (3) have the same structure, and the upper hard board structure (1) and the lower hard board structure (3) are symmetrically distributed, the uppermost soft board copper foil layer (22) contacts the first hard board copper foil layer (13), the lowermost soft board copper foil layer (22) contacts the first hard board copper foil layer (13) at the bottom, the upper soft board copper foil layer (22) contacts the second hard board copper foil layer (44) at the bottom, and the lower soft board copper foil layer (22) contacts the second hard board copper foil layer (44) at the top.
5. The PCB structure of a multi-layer flexible board and a multi-layer rigid board according to claim 1, characterized in that: The two transverse connecting grooves (14) are respectively sleeved with the two transverse connecting blocks (43).