Uniform heat energy storage plate structure and air cooling case

Abstract

The utility model discloses a soaking energy storage plate structure and air cooling chassis, which comprises an upper top plate, a right side plate, a left side plate, a lower bottom plate and a daughter card module, the lower bottom plate is arranged on an inner layer and an outer layer, the outer layer of the lower bottom plate comprises a structural cover plate, the inner layer of the lower bottom plate comprises a temperature equalizing layer and an energy storage layer which are attached to the structural cover plate and are mutually coupled and welded, and the daughter card module is arranged on the lower bottom plate. A capillary core is formed at the welding part of the uniform temperature layer and the energy storage layer; the daughter card module is installed on the lower bottom plate in an attached mode and is close to one side of the uniform temperature layer. According to the utility model, not only is the overall structural strength high, but also the overall sealing performance is better, the device is suitable for a smaller installation space, and additional cold source equipment input is not needed; and the welding part of the uniform temperature layer and the energy storage layer forms a capillary core, so that the heat conduction resistance in the lower bottom plate is reduced, and the heat conduction effect is better.

Description

Technical Field

[0001] The utility model belongs to the technical field of chassis, and in particular relates to a chassis with a heat-saturating energy storage plate structure and air cooling. Background Art

[0002] Common chassis now include air-cooled chassis and liquid-cooled chassis. Liquid-cooled chassis are more likely to have an external liquid cooling source that inputs coolant into the chassis, and eventually takes the module heat out of the chassis. Figure 1 The following is a common liquid-cooled and air-cooled chassis frame. Figure 2 As shown, the chassis bottom plate contains a flow channel, and the bottom of the module fits the liquid cooling surface of the chassis to conduct heat away.

[0003] Although the above-mentioned liquid-cooled and air-cooled chassis can have a good cooling effect, it is difficult to ensure normal cooling of the chassis when the installation position of some modules is small or it is difficult to provide liquid cooling source equipment input. To solve the above problems, the present invention proposes a heat-spreading energy storage plate structure and air-cooled chassis. Utility Model Content

[0004] The utility model aims at solving the problems in the prior art and proposes the following technical solutions:

[0005] A heat-equalizing energy storage plate structure and air-cooled chassis, comprising an upper top plate, a right side plate, a left side plate, a lower bottom plate and a daughter card module, wherein the lower bottom plate is arranged as an inner and outer layer, the outer layer of the lower bottom plate comprises a structural cover plate, the inner layer of the lower bottom plate comprises a temperature-equalizing layer and an energy storage layer which are bonded to the structural cover plate and welded to each other, and the welding portion of the temperature-equalizing layer and the energy storage layer forms a capillary core; the daughter card module is bonded and installed on the lower bottom plate and close to the side of the temperature-equalizing layer.

[0006] As a preferred embodiment of the above technical solution, a heat dissipation fin and a fan are installed on a side of the lower base plate away from the daughter card module.

[0007] As a preferred embodiment of the above technical solution, a puller is installed on the daughter card module.

[0008] As a preferred embodiment of the above technical solution, locking strips are provided on both sides of the daughter card module.

[0009] As a preferred embodiment of the above technical solution, the temperature-averaging layer adopts an aluminum-based temperature-averaging plate.

[0010] The beneficial effects of the utility model are:

[0011] The lower base plate is arranged in inner and outer layers. The outer layer of the lower base plate includes a structural cover plate, and the inner layer of the lower base plate includes a temperature equalizing layer and an energy storage layer that are attached to the structural cover plate and coupled and welded to each other. In this embodiment, both the temperature equalizing layer and the energy storage layer are horizontally welded, and in this embodiment, the temperature equalizing layer is above the energy storage layer; the capillary wick of this utility model is of an integral design, and the temperature equalizing layer serves as the heat source installation surface to achieve rapid heat dissipation of local heat sources; the energy storage layer and the temperature equalizing layer are designed vertically and horizontally, and the energy storage layer can quickly store the heat dissipated by the temperature equalizing layer. On the side of the lower base plate away from the daughter card module, heat dissipation fins and a fan are installed, and the heat stored in the energy storage layer is dissipated through the heat dissipation fins and the fan; the lower base plate is designed as a coupled structure as a whole, which not only has high overall structural strength but also better overall sealing performance, is suitable for a smaller installation space, and does not require additional cold source equipment input; the welded part of the temperature equalizing layer and the energy storage layer forms a capillary wick, reducing the thermal conduction resistance inside the lower base plate, thereby making the heat conduction effect better. Description of the Drawings

[0012] Figure 1 Shows a conventional liquid-cooled and air-cooled chassis frame in the prior art;

[0013] Figure 2 Shows a schematic diagram of the internal structure of a conventional chassis base plate in the prior art;

[0014] Figure 3 Shows an exploded view of a chassis of a heat equalizing and energy storage plate structure and air-cooled chassis of the present utility model;

[0015] Figure 4 Shows a sectional view of the inside of the lower base plate of a heat equalizing and energy storage plate structure and air-cooled chassis of the present utility model;

[0016] Figure 5 Shows a front and rear three-dimensional structural schematic diagram of the lower base plate of a heat equalizing and energy storage plate structure and air-cooled chassis of the present utility model;

[0017] Figure 6 Shows a three-dimensional structural schematic diagram of a heat equalizing and energy storage plate structure and air-cooled chassis of the present utility model in a state of installing a daughter card module.

[0018] 1. Structural cover plate; 2. Temperature equalizing layer; 3. Energy storage layer; 4. Capillary wick; 11. Upper top plate; 12. Right side plate; 13. Left side plate; 14. Lower base plate; 15. Daughter card module; 16. Locking strip; 17. Extractor; 20. Heat dissipation fins. Detailed Embodiment

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below in conjunction with the embodiments.

[0020] Embodiment

[0021] As Figure 3 shown, a soaking energy storage plate structure integrated with an air-cooled chassis includes an upper top plate 11, a right side plate 12, a left side plate 13, a lower bottom plate 14, and a daughter card module 15. The upper top plate 11, the right side plate 12, the left side plate 13, and the lower bottom plate 14 are joined together to form a complete chassis frame.

[0022] As Figure 4 , Figure 5 shown, the lower bottom plate 14 is provided with an inner and outer layer. The outer layer of the lower bottom plate 14 includes a structural cover plate 1, and the inner layer of the lower bottom plate 14 includes a temperature equalizing layer 2 and an energy storage layer 3 that are attached to the structural cover plate 1 and coupled and welded to each other. In this embodiment, both the temperature equalizing layer 2 and the energy storage layer 3 are horizontally welded, and in this embodiment, the temperature equalizing layer 2 is above the energy storage layer 3; the capillary wick 4 is of an integral design. The temperature equalizing layer 2 serves as a heat source mounting surface to achieve rapid heat spreading of local heat sources; the energy storage layer 3 is designed above and below the temperature equalizing layer 2, and the energy storage layer 3 can quickly store the heat spread by the temperature equalizing layer 2. On the side of the lower bottom plate 14 away from the daughter card module 15, heat dissipation fins 20 and a fan are installed, and the heat stored in the energy storage layer 3 is dissipated through the heat dissipation fins 20 and the fan; the lower bottom plate 14 is integrally designed with a coupled structure, which not only has high overall structural strength but also better overall sealing performance, is suitable for a smaller installation space, and does not require additional cold source equipment input; the welded part of the temperature equalizing layer 2 and the energy storage layer 3 forms a capillary wick 4, reducing the thermal conduction resistance inside the lower bottom plate 14, thereby making the heat conduction effect better.

[0023] As Figure 6 shown, the daughter card module 15 is attached and installed on the lower bottom plate 14 and on the side close to the temperature equalizing layer 2, that is, the top of the lower bottom plate 14 in this embodiment. An extractor 17 is installed on the daughter card module 15. When installing the daughter card module 15, the daughter card module 15 is assembled into the chassis through the extractor 17, so that the module end connector socket is inserted and mated with the connector plug on the printed circuit board; locking strips 16 are provided on both sides of the daughter card module 15. After being inserted and mated, the locking strips 16 are adjusted so that the heat dissipation surface of the module housing is in contact with the top of the lower bottom plate 14, which is beneficial to heat conduction.

[0024] In this embodiment, the temperature equalizing layer 2 is made of an aluminum-based heat pipe. In actual applications, the temperature equalizing layer 2 can be replaced with other temperature equalizing material plates with the same function.

[0025] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it.

Claims

1. A heat-saturating energy storage plate structure and air-cooling chassis, comprising an upper top plate (11), a right side plate (12), a left side plate (13), a lower bottom plate (14) and a daughter card module (15), characterized in that: The lower base plate (14) is arranged as an inner and outer layer, the outer layer of the lower base plate (14) comprises a structural cover plate (1), the inner layer of the lower base plate (14) comprises a temperature-averaging layer (2) and an energy storage layer (3) which are bonded to the structural cover plate (1) and are coupled and welded to each other, and the welding portion of the temperature-averaging layer (2) and the energy storage layer (3) forms a capillary core (4); the subcard module (15) is bonded and mounted on the lower base plate (14) and close to one side of the temperature-averaging layer (2).

2. A heat-saturating energy storage plate structure and air-cooled chassis according to claim 1, characterized in that: A heat dissipation fin (20) and a fan are installed on a side of the lower base plate (14) away from the daughter card module (15).

3. The heat-saturating energy storage plate structure and air-cooled chassis according to claim 1, characterized in that: The sub-card module (15) is provided with an extractor (17).

4. A heat-saturating energy storage plate structure and air-cooled chassis according to claim 3, characterized in that: Locking strips (16) are provided on both sides of the sub-card module (15).

5. The heat-saturating energy storage plate structure and air-cooled chassis according to claim 1, characterized in that: The temperature-averaging layer (2) is an aluminum-based temperature-averaging plate.

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