Efficient cold conduction and forced air cooling case

Abstract

The utility model discloses a high-efficiency cold conduction and forced air cooling case, which comprises a case shell, a daughter card module is slidably mounted in an inner cavity of the case shell through a guide rail, radiating side plates are mounted on two sides of the case shell, a plurality of first copper strips are mounted at the top and the bottom of the daughter card module, and a plurality of second copper strips are mounted at the bottom of the daughter card module. A first copper strip piece is installed on the lower edge of the guide rail and right faces a high-heat-consumption device in the daughter card module, the lower edge of the guide rail extends inwards to form an extension strip attached to the daughter card module, a second copper strip piece and a cooling fin are installed on a side panel of the case shell, and the second copper strip piece is installed on the side panel of the case shell in an attached mode and right faces the cooling fin. Compared with a common forced air cooling case in the prior art, the forced air cooling case is better in heat dissipation effect, simple in structure and convenient to use, and the applicability of the air cooling case is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field, and particularly relates to an efficient heat conduction and forced air cooling chassis. Background Art

[0002] In the prior art, common forced air cooling chassis are as Figure 1 shown, including a chassis shell, a daughter card module, side heat dissipation plates and other structural components. The daughter card module is slidably installed in the inner cavity of the chassis shell, and both the daughter card module and the chassis shell are processed from aluminum alloy materials; the heat conduction direction of its heat dissipation is: the heat consumption of the internal devices of the daughter card module is conducted to the guide rails on both sides of the daughter card module → the guide rail grooves on the left and right edges of the chassis → the left and right side plates of the chassis, and finally the heat is blown out from both sides of the chassis.

[0003] Although the forced air cooling chassis in the above prior art has a certain heat dissipation effect, for some daughter card modules with high heat consumption components, the above forced air cooling chassis is difficult to meet the heat dissipation problem of high heat consumption devices. To solve this problem, the present utility model proposes an efficient heat conduction and forced air cooling chassis. Content of the Utility Model

[0004] The present utility model aims at the problems in the prior art and proposes the following technical solutions:

[0005] An efficient heat conduction and forced air cooling chassis, including a chassis shell, a daughter card module is slidably installed in the inner cavity of the chassis shell through a guide rail, heat dissipation side plates are installed on both sides of the chassis shell, a plurality of first copper strips are installed on the top and bottom of the daughter card module, and the first copper strips are opposite to the high heat consumption devices in the daughter card module. The lower edge of the guide rail extends inwards to form an extension strip that fits the daughter card module. A second copper strip and heat dissipation fins are installed on the side panel of the chassis shell, and the second copper strip is fitted and installed on the side panel of the chassis shell and is opposite to the heat dissipation fins.

[0006] As a preference of the above technical solution, a heat dissipation fan is installed on one side of the heat dissipation side plate close to the side panel of the chassis shell, and heat dissipation holes are formed on the heat dissipation side plate and are opposite to the heat dissipation fan.

[0007] As a preference of the above technical solution, the materials of the second copper strip and the first copper strip are both copper.

[0008] As a preference of the above technical solution, locking strips are installed on both sides of the daughter card module.

[0009] As a preference of the above technical solution, a puller is installed at the front corner of the daughter card module.

[0010] The beneficial effects of the present utility model are as follows:

[0011] In this utility model, the heat dissipation of the high heat consumption device on the first copper strip is more efficient, which is conducive to its auxiliary heat dissipation. At the same time, using copper material for the first copper strip can ensure the overall lightweight requirement of the daughter card module. After the heat of the internal dissipator in the daughter card module is conducted to the outer wall of the daughter card module or the first copper strip and then to the guide rail, the extension strip formed by the inward extension of the lower edge of the guide rail can increase the contact area between the first copper strip, the outer shell of the daughter card module and the guide rail, so as to better transfer the heat and further improve the heat dissipation effect. By setting the second copper strip and the heat dissipation fins, the heat on the guide rail and the extension strip can be better conducted to the heat dissipation fins, and finally forced air cooling is carried out by the heat dissipation side plate. Description of the Drawings

[0012] Figure 1 Shows a schematic diagram of a forced air cooling chassis in the prior art;

[0013] Figure 2 Shows an exploded view of a high-efficiency heat conduction and forced air cooling chassis in this utility model;

[0014] Figure 3 Shows a three-dimensional structure schematic diagram of a daughter card module in a high-efficiency heat conduction and forced air cooling chassis in this utility model;

[0015] Figure 4 Shows a schematic diagram of the structure of the second copper strip and the heat dissipation fins in a high-efficiency heat conduction and forced air cooling chassis in this utility model.

[0016] 1. Chassis housing; 2. Daughter card module; 21. First copper strip; 3. Guide rail; 31. Extension strip; 4. Heat dissipation side plate; 41. Heat dissipation fan; 42. Heat dissipation hole; 5. Locking strip; 6. Extractor; 71. Second copper strip; 72. Heat dissipation fins. Detailed Embodiment

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below in conjunction with the embodiments.

[0018] Embodiment

[0019] As Figures 2 - 4As shown in the figure, an efficient heat conduction and forced air-cooled chassis includes a chassis housing 1. A daughter card module 2 is slidably installed in the inner cavity of the chassis housing 1 through a guide rail 3. Heat dissipation side plates 4 are installed on both sides of the chassis housing 1. A plurality of first copper strips 21 are installed on the top and bottom of the daughter card module 2, and the first copper strips 21 are opposite to the high heat dissipation components in the daughter card module 2. In this embodiment, the first copper strips 21 are made of copper, and the thermal conductivity of copper is 401 W / mK, which is higher than the thermal conductivity of aluminum alloy, 237 W / mK. The heat dissipation of the high heat dissipation components to the first copper strips 21 is more efficient, which is beneficial to its auxiliary heat dissipation. At the same time, using copper for the first copper strips 21 can ensure the overall lightweight requirement of the daughter card module 2. The embedding method of the first copper strips 21 can be by gluing, welding or other methods; the lower edge of the guide rail 3 extends inwards to form an extension strip 31 that fits the daughter card module 2. After the heat generated by the components in the daughter card module 2 is conducted to the outer wall of the daughter card module 2 or the first copper strips 21, it is then conducted to the guide rail 3. The extension strip 31 formed by the inward extension of the lower edge of the guide rail 3 can increase the contact area between the first copper strips 21, the outer shell of the daughter card module 2 and the guide rail 3, so as to better transfer the heat out, thereby further improving the heat dissipation effect; A second copper strip 71 and heat dissipation fins 72 are installed on the side panel of the chassis housing 1. The second copper strip 71 is fitted and installed on the side panel of the chassis housing 1 and is opposite to the heat dissipation fins 72. By setting the second copper strip 71 and the heat dissipation fins 72, the heat on the guide rail 3 and the extension strip 31 can be better conducted to the heat dissipation fins 72, and finally forced air-cooled by the heat dissipation side plates 4 and dissipated out.

[0020] A heat dissipation fan 41 is installed on one side of the heat dissipation side plate 4 close to the side panel of the chassis housing 1. Heat dissipation holes 42 are provided on the heat dissipation side plate 4 and the heat dissipation holes 42 are opposite to the heat dissipation fan 41.

[0021] Locking strips 5 are installed on both sides of the daughter card module 2, and a puller 6 is installed at the front corner of the daughter card module 2. When installing the daughter card module 2, first install the daughter card module 2 into the inner cavity of the chassis housing 1 through the puller 6, and then assist in fixing the daughter card module 2 through the locking strips 5, so that the daughter card module 2 fits the guide rail 3, and the heat dissipation effect is better.

[0022] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it.

Claims

1. A highly efficient conduction-cooling and forced-air-cooling chassis, comprising a chassis shell (1), a subcard module (2) being slidably mounted in the inner cavity of the chassis shell (1) via a guide rail (3), and heat dissipation side plates (4) being mounted on both sides of the chassis shell (1), characterized in that: A plurality of first copper strips (21) are mounted on the top and bottom of the daughter card module (2), and the first copper strips (21) are directly opposite to the high heat consumption components in the daughter card module (2); the lower edge of the guide rail (3) extends inwardly to form an extension strip (31) that fits the daughter card module (2); a second copper strip (71) and a heat dissipation fin (72) are mounted on the side panel of the chassis shell (1); the second copper strip (71) is closely mounted on the side panel of the chassis shell (1) and directly opposite to the heat dissipation fin (72).

2. The high-efficiency conduction-cooling and forced-air-cooling chassis according to claim 1, characterized in that: A heat dissipation fan (41) is installed on the side of the heat dissipation side plate (4) close to the side panel of the chassis shell (1), and a heat dissipation hole (42) is opened on the heat dissipation side plate (4), and the heat dissipation hole (42) is directly opposite to the heat dissipation fan (41).

3. The high-efficiency conduction-cooling and forced-air-cooling chassis according to claim 1, characterized in that: The second copper strip (71) and the first copper strip (21) are both made of copper.

4. The high-efficiency conduction-cooling and forced-air-cooling chassis according to claim 1, characterized in that: Locking strips (5) are installed on both sides of the sub-card module (2).

5. The high-efficiency conduction-cooling and forced-air-cooling chassis according to claim 4, characterized in that: A puller (6) is installed at the front corner of the sub-card module (2).

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