Large-angle LED packaging structure

Abstract

The utility model relates to a wide-angle LED packaging structure which comprises a base material, an LED support, fixing glue, an LED chip, fluorescent glue, reflection white glue, light blocking white glue and lens optical silica gel. The LED support is arranged on the base material, the LED support surrounds to form a containing groove, and the LED chip is fixedly arranged at the bottom of the containing groove through the fixing glue; the fluorescent glue is arranged on the outer side surface of the LED chip in a wrapping mode, the reflecting white glue is arranged in a gap between the side wall of the containing groove and the fluorescent glue in a filling mode, the light blocking white glue is arranged on the fluorescent glue, and the lens optical silica gel is arranged on the light blocking white glue, the reflecting white glue and the fluorescent glue in a covering mode. Through the above arrangement, the light bar using the large-angle LED packaging structure does not need to adopt a surface-mounted lens, thereby saving materials and manufacturing cost.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, and particularly relates to a large-angle LED packaging structure. Background Art

[0002] In actual applications of current mainstream light bar modules, the LED (Light-Emitting Diode) light source is required to have a certain light-emitting angle. To expand the light-emitting angle of the LED, usually after mounting a surface-mounted LED lamp bead, a lens is further mounted. However, the above solution design will increase the material cost of the LED and the manufacturing cost of component mounting. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a large-angle LED packaging structure.

[0004] The technical solution of the utility model for solving the above technical problems is as follows: A large-angle LED packaging structure includes: a base material, an LED bracket, a fixing glue, an LED chip, a fluorescent glue, a reflective white glue, a light-blocking white glue, and a lens optical silica gel; the LED bracket is arranged on the base material, and the LED bracket surrounds to form a receiving groove, and the LED chip is fixedly arranged at the bottom of the receiving groove through the fixing glue; the fluorescent glue is wrapped on the outer surface of the LED chip, the reflective white glue is filled in the gap between the side wall of the receiving groove and the fluorescent glue, the light-blocking white glue is arranged on the fluorescent glue, and the lens optical silica gel covers the light-blocking white glue, the reflective white glue, and the fluorescent glue.

[0005] In one embodiment, the side of the lens optical silica gel away from the base material is the top surface, the top surface of the lens optical silica gel is arranged parallel to the base material, and the connection between the top surface of the lens optical silica gel and the side surface of the lens optical silica gel is set to be arc-shaped.

[0006] In one embodiment, the side of the lens optical silica gel away from the base material is the top surface, the side surface of the lens optical silica gel is arranged perpendicular to the base material, and the top surface of the lens optical silica gel is gradually inclined and recessed inward from the edge to the center to form a light-emitting groove.

[0007] In one embodiment, the height of the reflective white glue is higher than the height of the LED chip.

[0008] In one embodiment, the height of the fluorescent glue is higher than the height of the reflective white glue.

[0009] In one embodiment, the reflective white glue has a convex portion, and the fluorescent glue is recessed with a groove, and the convex portion is inserted into the groove.

[0010] In one embodiment, the fixing glue is solder paste or silver glue.

[0011] In one embodiment, the thickness of the light-blocking white glue is less than 0.1 mm.

[0012] In one embodiment, the LED chip is mounted right-side up or upside down on the substrate.

[0013] In one embodiment, the material of the lens optical silica gel is epoxy resin plus phosphor powder or diffusing powder.

[0014] The beneficial effects of the present utility model are as follows: A large-angle LED packaging structure provided by the present utility model, by arranging an LED bracket on a substrate, and the LED brackets surround to form a receiving groove, and the LED chip is installed at the bottom of the receiving groove through a fixing glue. A fluorescent glue, a light-blocking white glue and a lens optical silica gel are sequentially arranged on the LED chip. The fluorescent glue is used to enhance the light-emitting effect of the LED chip, making the light emitted by the LED chip softer; the light-blocking white glue is used to block the light emitted in the middle of the LED chip, thereby avoiding too high central brightness; the shape of the lens optical silica gel can be adjusted according to the actual situation, so as to adjust the light-emitting angle of the light emitted by the LED chip. At the same time, a reflective white glue is arranged between the side wall of the receiving groove and the fluorescent glue, which can increase the reflectivity of the light, so that more light emitted by the LED chip is emitted. Through the above settings, the light strip using the large-angle LED packaging structure does not need to use a mounted lens, saving material and manufacturing costs. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a schematic cross-sectional structure diagram of a large-angle LED packaging structure according to an embodiment;

[0017] Figure 2 It is a schematic cross-sectional structure diagram of a large-angle LED packaging structure according to another embodiment.

[0018] In the drawings, 10, large-angle LED packaging structure; 100, substrate; 200, LED bracket; 210, receiving groove; 300, fixing glue; 400, LED chip; 500, fluorescent glue; 510, groove; 600, reflective white glue; 610, convex portion; 700, light-blocking white glue; 800, lens optical silica gel; 810, top surface; 811, light-emitting groove. Detailed Embodiments

[0019] It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other. The following will further describe the technical solutions of the present utility model in conjunction with the accompanying drawings of the embodiments of the present utility model. The present utility model is not limited to the following specific embodiments.

[0020] It should be understood that the same or similar reference numerals in the accompanying drawings of the embodiments correspond to the same or similar components. In the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0021] In one embodiment, as Figure 1 shown, a large-angle LED packaging structure 10 includes: a substrate 100, an LED bracket 200, a fixing glue 300, an LED chip 400, a fluorescent glue 500, a reflective white glue 600, a light-blocking white glue 700, and a lens optical silica gel 800; the LED bracket 200 is disposed on the substrate 100, and the LED bracket 200 surrounds to form a receiving groove 210, and the LED chip 400 is fixedly disposed at the bottom of the receiving groove 210 through the fixing glue 300; the fluorescent glue 500 is wrapped on the outer surface of the LED chip 400, the reflective white glue 600 is filled in the gap between the side wall of the receiving groove 210 and the fluorescent glue 500, the light-blocking white glue 700 is disposed on the fluorescent glue 500, and the lens optical silica gel 800 covers the light-blocking white glue 700, the reflective white glue 600, and the fluorescent glue 500.

[0022] Specifically, by disposing the LED bracket 200 on the substrate 100, and the LED bracket 200 surrounds to form a receiving groove 210, the LED chip 400 is installed on the bottom of the receiving groove 210 through the fixing glue 300. The fluorescent glue 500, the light-blocking white glue 700, and the lens optical silica gel 800 are sequentially disposed on the LED chip 400. The fluorescent glue 500 is used to enhance the light-emitting effect of the LED chip 400, making the light emitted by the LED chip 400 softer; the light-blocking white glue 700 is used to block the light emitted from the middle of the LED chip 400, thereby avoiding too high central brightness; the shape of the lens optical silica gel 800 can be adjusted according to the actual situation, so as to adjust the light-emitting angle of the light emitted by the LED chip 400. At the same time, the reflective white glue 600 is disposed between the side wall of the receiving groove 210 and the fluorescent glue 500, which can increase the reflectivity of light, so that more light emitted by the LED chip 400 is emitted. Through the above settings, the light strip using the large-angle LED packaging structure 10 does not need to use a mounted lens, saving material and manufacturing costs.

[0023] In one embodiment, the thickness of the lens optical silica gel 800 above the LED chip 400 is greater than 0.05 mm. By setting it like this, the LED chip 400 refracts in the lens optical silica gel 800, which can make the emitted light have a larger light-emitting angle. The shape of the lens optical silica gel 800 can be adjusted according to actual needs, so as to adjust the angle of the emitted light, making the light emitted by the LED chip 400 have a suitable light-emitting angle.

[0024] In one embodiment, as Figure 1 shown, the side of the lens optical silica gel 800 away from the substrate 100 is the top surface 810. The top surface 810 of the lens optical silica gel 800 is arranged parallel to the substrate 100, and the connection between the top surface 810 of the lens optical silica gel 800 and the side surface of the lens optical silica gel 800 is set to be arc-shaped. Specifically, the outer shape of the lens optical silica gel 800 is similar to a hemispherical shape. Through the above settings, the light emitted by the LED chip 400 can be refracted in the lens optical silica gel 800, making the light emitted by the LED chip 400 have a larger light-emitting angle.

[0025] In one embodiment, as Figure 2As shown, the side of the lens optical silica gel 800 away from the substrate 100 is the top surface 810. The side surface of the lens optical silica gel 800 is perpendicular to the substrate 100, and the top surface 810 of the lens optical silica gel 800 is gradually inclined and recessed inward from the edge to the center to form a light-emitting groove 811. Specifically, the top surface 810 of the lens optical silica gel 800 is recessed to form the light-emitting groove 811. Most of the light emitted by the LED chip 400 is reflected within the lens optical silica gel 800 of the above shape, so that most of the light is emitted from the light-emitting groove 811, and most of the light can be emitted from the top surface 810 of the lens optical silica gel 800.

[0026] To ensure that the light emitted by the LED chip 400 is fully emitted within the accommodation groove 210, in one embodiment, as Figure 1 and Figure 2 shown, the height of the reflective white glue 600 is higher than the height of the LED chip 400. Specifically, through the above settings, it can be ensured that the light emitted from the side of the LED chip 400 can be reflected by the reflective white glue 600, so that the light emitted by the LED chip 400 is fully emitted within the accommodation groove 210, improving the overall brightness.

[0027] To improve the reflection effect of the reflective white glue 600, in one embodiment, the material of the reflective white glue 600 is epoxy resin glue, and aluminum oxide powder and / or silver powder are added to the epoxy resin glue. With the reflective white glue 600 configured as above, the reflectivity of light on the reflective white glue 600 can be increased.

[0028] To allow the light emitted by the LED chip 400 to enter the lens optical silica gel 800 for reflection and refraction, in one embodiment, as Figure 1 and Figure 2 shown, the height of the fluorescent glue 500 is higher than the height of the reflective white glue 600. Specifically, through the above settings, the light emitted by the LED chip 400 can be emitted from the part of the fluorescent glue 500 higher than the reflective white glue 600 and enter the lens optical silica gel 800, and be reflected and refracted in the lens optical silica gel 800, thereby adjusting the light-emitting angle.

[0029] To increase the bonding force between the fluorescent glue 500 and the reflective white glue 600, in one embodiment, as Figure 1 and Figure 2As shown, the reflective white glue 600 has a convex portion 610, the fluorescent glue 500 is recessed with a groove 510, and the convex portion 610 is inserted into the groove 510. Specifically, the reflective white glue 600 is circular ring-shaped, and the convex portion 610 is located inside the circular ring of the reflective white glue 600. The groove 510 on the fluorescent glue 500 is located on the outer side of the fluorescent glue 500. By inserting the convex portion 610 of the reflective white glue 600 into the groove 510 of the fluorescent glue 500, the bonding force between the fluorescent glue 500 and the reflective white glue 600 can be increased, so that the fluorescent glue 500 and the reflective white glue 600 can be connected more firmly.

[0030] In order to enable the LED chip 400 to be stably mounted on the substrate 100, in one embodiment, the fixing glue 300 is solder paste or silver glue. Specifically, silver glue is fully called conductive silver glue, which is a glue containing silver powder with conductive function. Solder paste is fully called solder paste, which is made by mixing solder powder, flux, and other surfactants, thixotropic agents, etc. Therefore, selecting solder paste or silver glue can fix the LED chip 400 on the substrate 100 and ensure electrical connection between the LED chip 400 and the circuit on the substrate 100.

[0031] In one embodiment, the thickness of the light-blocking white glue 700 is less than 0.1 mm. Specifically, making the thickness of the light-blocking white glue 700 less than 0.1 mm can play a role in blocking light while reducing the occupied space, so that the lens optical silica gel 800 can be made thinner.

[0032] In one embodiment, the LED chip 400 is mounted on the substrate 100 in a face-up or flip-chip manner. Specifically, the LED chip 400 can be mounted on the substrate 100 in a face-up or flip-chip manner. When the LED chip 400 is mounted on the substrate 100 in a face-up manner, bonding wires need to be bonded to conduct the circuit on the LED chip 400 and the LED bracket 200, so as to ensure electrical connection between the LED chip 400 and an external power source.

[0033] In order to enable light to be refracted and reflected in the lens optical silica gel 800, in one embodiment, the material of the lens optical silica gel 800 is epoxy resin plus phosphor or diffusing powder. Specifically, the epoxy resin in the lens optical silica gel 800 can transmit light, and by adding phosphor or diffusing powder to the epoxy resin, the refraction and reflection of light can be enhanced, so that light can better penetrate the lens optical silica gel 800.

[0034] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation manners here. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. A large-angle LED packaging structure, characterized in that: include: Substrate, LED bracket, fixing glue, LED chip, fluorescent glue, reflective white glue, light-blocking white glue, lens optical silicone; The LED bracket is arranged on the substrate, and the LED bracket surrounds to form a receiving groove, and the LED chip is fixed to the bottom of the receiving groove by the fixing glue; The fluorescent glue is wrapped on the outer surface of the LED chip, the reflective white glue is filled in the gap between the side wall of the accommodating groove and the fluorescent glue, the light-blocking white glue is on the fluorescent glue, and the lens optical silicone is covered on the light-blocking white glue, the reflective white glue and the fluorescent glue.

2. A large-angle LED packaging structure according to claim 1, characterized in that: The side of the lens optical silicone away from the substrate is the top surface, the top surface of the lens optical silicone is arranged parallel to the substrate, and the connection between the top surface of the lens optical silicone and the side surface of the lens optical silicone is arranged in an arc shape.

3. The large-angle LED packaging structure according to claim 1, characterized in that: The side of the lens optical silicone away from the substrate is the top surface, the side surface of the lens optical silicone is arranged perpendicular to the substrate, and the top surface of the lens optical silicone gradually tilts inward from the edge to the center to form a light emitting groove.

4. The large-angle LED packaging structure according to claim 1, characterized in that: The height of the reflective white glue is higher than the height of the LED chip.

5. The large-angle LED packaging structure according to claim 1, characterized in that: The height of the fluorescent glue is higher than the height of the reflective white glue.

6. The large-angle LED packaging structure according to claim 1, characterized in that: The reflective white glue has a convex portion, the fluorescent glue is concavely provided with a groove, and the convex portion is inserted into the groove.

7. The large-angle LED packaging structure according to claim 1, characterized in that: The fixing glue is solder paste or silver glue.

8. The large-angle LED packaging structure according to claim 1, characterized in that: The thickness of the light-blocking white glue is less than 0.1 mm.

9. The large-angle LED packaging structure according to claim 1, characterized in that: The LED chip is mounted face-up or flip-down on the substrate.

10. A large-angle LED packaging structure according to any one of claims 1 to 9, characterized in that: The material of the lens optical silicone is epoxy resin plus fluorescent powder or diffusion powder.

Images