Cleaning and drying device for multiple groups of silicon wafers

Abstract

The utility model discloses a cleaning and drying device for multiple groups of silicon wafers, which belongs to the technical field of silicon wafer cleaning and comprises a device body, a limiting unit, a drying unit, a cleaning unit and a waste liquid recovery unit are arranged in the device body, and the waste liquid recovery unit comprises a waste liquid tank and a recovery tank. A waste liquid treatment tank and a liquid storage tank are arranged in the recovery tank, the cleaning unit comprises a cleaning tank and a cleaning assembly, and the cleaning assembly comprises a liquid conveying pipe and a plurality of groups of vertical cleaning pipes which are uniformly distributed; the limiting unit comprises a silicon wafer fixing plate, a plurality of silicon wafer adsorption seats are arranged on the silicon wafer fixing plate, silicon wafers are arranged on the silicon wafer adsorption seats, and the silicon wafer adsorption seats and the vertical cleaning pipes are arranged in a staggered mode. According to the silicon wafer cleaning device, the cleaning pipes and the silicon wafers are arranged in the staggered mode, the driving device is used for driving the silicon wafers to go deep into the positions among the cleaning pipes, then the nozzles are used for cleaning the two faces of the silicon wafers at the same time, and the cleaning quality can be guaranteed while the cleaning efficiency is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of waste liquid cleaning, in particular to a cleaning and drying device for multiple groups of silicon wafers. Background Art

[0002] Elemental silicon is a gray, brittle, tetravalent non-metallic chemical element. A silicon wafer, also known as a wafer, is processed from a silicon ingot. Through specialized processes, millions of transistors can be etched on the silicon wafer, which is widely used in the manufacture of integrated circuits. In semiconductor device production, silicon wafers must be strictly cleaned, and even trace amounts of contamination can cause device failure. Monocrystalline silicon wafers are used as the substrate material for chips. Particles and metals on the surface of the silicon wafers have a great impact on the yield of the chips. Therefore, a large amount of pure water is required to clean the particles and metals on the surface of the silicon wafers during the silicon wafer processing.

[0003] However, the existing silicon wafer cleaning equipment has insufficient and incomplete cleaning effects, cannot clean in large quantities, and has low cleaning efficiency; moreover, most of the cleaning waste liquid is directly discharged, resulting in waste of resources.

[0004] Based on the above problems, a cleaning and drying device for multiple groups of silicon wafers is proposed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a cleaning and drying device for multiple groups of silicon wafers. By arranging multiple cleaning tubes and silicon wafers in an alternating manner, and using a driving device to drive the silicon wafers to penetrate between multiple cleaning tubes, and then using spray heads to clean both sides of multiple silicon wafers simultaneously, the cleaning efficiency can be guaranteed while also ensuring the cleaning quality.

[0006] To achieve the above purpose, the utility model provides a cleaning and drying device for multiple groups of silicon wafers, including a device body. Inside the device body, there are provided a limiting unit for placing silicon wafers, a drying unit, a cleaning unit, and a waste liquid recovery unit. The waste liquid recovery unit includes a waste liquid tank arranged at the bottom of the device body and a recovery tank arranged on one side of the waste liquid tank. Inside the recovery tank, there are provided a waste liquid treatment tank and a liquid storage tank. The cleaning unit includes a cleaning tank and a cleaning component. The cleaning component includes an infusion pipe and multiple groups of vertically arranged cleaning tubes evenly distributed. Multiple spray heads are arranged on the vertically arranged cleaning tubes;

[0007] The limiting unit includes a silicon wafer fixing plate. Multiple silicon wafer adsorption seats are arranged on the silicon wafer fixing plate. The silicon wafers are arranged on the silicon wafer adsorption seats. The silicon wafer adsorption seats are arranged in a staggered manner with the vertically arranged cleaning tubes.

[0008] Preferably, the silicon wafer fixing plate is arranged at the lower end of a support plate. One side of the support plate is connected to a driving device, and the other side is connected to a slider. The slider is slidably arranged on a sliding groove. The sliding groove is arranged on the right inner wall of the device body.

[0009] Preferably, the driving device includes a lead screw and a moving block arranged on the lead screw. The moving block is fixedly connected to the support plate. The bottom of the lead screw is rotatably connected to the upper end of the recovery tank through a lead screw seat. The top of the lead screw extends out of the top wall of the device body and is connected to the output shaft of the forward and reverse motor.

[0010] Preferably, a sealing plate is connected to the lower end of the side of the support plate close to the moving block. The sealing plate is slidably and sealingly connected between the front and rear side walls of the device body. An expansion plate is arranged at the bottom of the sealing plate.

[0011] Preferably, a filter plate is arranged between the waste liquid tank and the cleaning tank. The infusion tube is arranged at the upper end of the filter plate. One end of the infusion tube is connected to the liquid storage tank through a suction pump.

[0012] Preferably, the waste liquid treatment tank is connected to the liquid storage tank through a two-way valve, and the two-way valve is connected to a drain pipe.

[0013] Preferably, the drying unit includes a drying device and a ventilation pipe. The drying device is arranged outside the right side of the device body.

[0014] Therefore, the cleaning and drying device for multiple groups of silicon wafers adopting the above structure has the following beneficial effects:

[0015] (1) In this device, a plurality of silicon wafer suction seats are arranged on the silicon wafer fixing plate and are staggered with the cleaning pipes in the cleaning assembly at the lower end. One end of the silicon wafer fixing plate is arranged on the lead screw through a moving block. By driving the moving block to move up and down by a forward and reverse motor, during cleaning, the silicon wafers are extended between adjacent cleaning pipes, and double-sided cleaning of multiple silicon wafers is carried out simultaneously, ensuring the cleaning efficiency.

[0016] (2) In this device, a drying unit is arranged at the upper end of the cleaning part, and a sealing plate and an expansion plate are arranged on one side of the support plate. When drying is carried out, the bottom wall of the drying area is blocked to ensure the drying efficiency.

[0017] (3) In this device, a waste liquid tank and a waste liquid treatment tank are arranged to treat the cleaning waste liquid for secondary recycling, avoiding waste of resources.

[0018] The technical solutions of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of an embodiment of a cleaning and drying device for multiple groups of silicon wafers of the present invention;

[0020] Figure 2This is a half-sectional view of an embodiment of a cleaning and drying device for multiple groups of silicon wafers according to the present utility model;

[0021] Among them, 1. Device body; 2. Waste liquid tank; 3. Waste liquid treatment tank; 4. Liquid storage tank; 5. Filter plate; 6. Cleaning tank; 7. Liquid infusion pipe; 8. Vertical cleaning pipe; 9. Silicon wafer fixing plate; 10. Silicon wafer; 11. Support plate; 12. Lead screw; 13. Moving block; 14. Reversible motor; 15. Slide block; 16. Slide groove; 17. Sealing plate; 18. Telescopic plate; 19. Drying device; 20. Ventilation pipe. Specific implementation mode

[0022] The technical solutions of the present utility model will be further described below with reference to the drawings and embodiments.

[0023] Unless otherwise defined, the technical terms or scientific terms used in the present utility model should have the ordinary meaning understood by those of ordinary skill in the field to which the present utility model belongs. The "first", "second" and similar terms used in the present utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or objects appearing before this term cover the elements or objects listed after this term and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0024] Embodiment

[0025] As Figure 1 - Figure 2 shown, the present utility model provides a cleaning and drying device for multiple groups of silicon wafers, including a device body 1. Inside the device body 1, there are provided a limiting unit, a drying unit, a cleaning unit and a waste liquid recovery unit for placing silicon wafers, so as to clean and dry multiple groups of silicon wafers simultaneously.

[0026] The waste liquid recovery unit includes a waste liquid tank 2 provided at the bottom of the device body 1 and a recovery tank provided on one side of the waste liquid tank 2. Inside the recovery tank, there are provided a waste liquid treatment tank 3 and a liquid storage tank 4.

[0027] The waste liquid treatment tank 3 is connected to the liquid storage tank 4 through a two-way valve, and the two-way valve is connected to a drain pipe. A detection device can be provided between the waste liquid treatment tank 3 and the two-way valve. When the waste liquid meets the standards, it enters the liquid storage tank 4 through the two-way valve. If it does not meet the standards, it is discharged through the drain pipe.

[0028] The cleaning unit includes a cleaning tank 6 and a cleaning component. A filter plate 5 is arranged between the waste liquid tank 2 and the cleaning tank 6 for preliminary filtration of the waste liquid. The filter plate 5 is detachably arranged on the tank walls at both ends. An induction device is arranged below the filter plate 5. When it senses that the water flow in the waste liquid tank 2 becomes small, the filter plate 5 is replaced.

[0029] The cleaning component includes an infusion pipe 7 and multiple groups of vertically arranged cleaning pipes 8 evenly distributed. The infusion pipe 7 is arranged at the upper end of the filter plate 5. Both the infusion pipe 7 and the vertical cleaning pipes 8 are set as rigid pipes with fixed positions to ensure their fixed positions and facilitate subsequent cleaning operations. One end of the infusion pipe 7 is connected to the liquid storage tank 4 through a suction pump. Multiple nozzles are arranged on the vertical cleaning pipes 8, and the nozzles are set as shower nozzles to expand the cleaning area.

[0030] The limiting unit includes a silicon wafer fixing plate 9. Multiple silicon wafer adsorption seats are arranged on the silicon wafer fixing plate 9. The silicon wafer adsorption seats are set as vacuum suction seats, and existing devices can be selected. The silicon wafer 10 is arranged on the silicon wafer adsorption seats. The silicon wafer adsorption seats and the vertical cleaning pipes 8 are arranged in a staggered manner. This setting is to ensure that the silicon wafer 10 can penetrate between two adjacent vertical flushing pipes 8 for cleaning work. The silicon wafer fixing plate 9 is arranged at the lower end of the support plate 11. One side of the support plate 11 is connected to a driving device. The driving device includes a lead screw 12 and a moving block 13 arranged on the lead screw 12. The moving block 13 is fixedly connected to the support plate 11. The bottom of the lead screw 12 is rotationally connected to the upper end of the recovery tank through a lead screw seat. The top of the lead screw 12 extends out of the top wall of the device body 1 and is connected to the output shaft of the forward and reverse motor 14. When the position of the silicon wafer 10 needs to be adjusted, the forward and reverse motor 14 is turned on to drive the lead screw 12 to rotate, driving the moving block 13 to move up and down, thereby driving the silicon wafer on the silicon wafer fixing plate 9 at the lower end of the support plate 11 to move.

[0031] The other side of the support plate 11 is connected to a slider 15. The slider 15 is slidably arranged on a chute 16. The chute 16 is arranged on the right inner wall of the device body 1. This setting is to ensure the stability of the entire silicon wafer fixing plate 9.

[0032] A sealing plate 17 is connected to the lower end of the side of the support plate 11 close to the moving block 13. The sealing plate 17 is slidably and sealingly connected between the front and rear side walls of the device body 1. An expansion plate 18 is arranged at the bottom of the sealing plate 17. The expansion plate 18 is set as an electric expansion plate. When the drying process needs to be carried out, the forward and reverse motor 14 drives the silicon wafer 10 on the support plate 11 to move to the drying position. At this time, the electric expansion plate is controlled to extend to block the bottom of the silicon wafer 10 and improve the drying efficiency. In this setting, there is a certain small gap between the electric expansion plate and the front and rear side walls of the device body 1. One is to ensure ventilation, and the leakage of a small amount of hot air will not affect the drying effect. The other is to ensure the normal expansion and contraction of the electric expansion plate.

[0033] The drying unit includes a drying device 19 and a ventilation pipe 20 connected thereto. The drying device 19 is arranged outside the right side of the device body 1 to dry the interior.

[0034] In this device, the forward and reverse motor 4, the suction pump, the two-way valve, the drying device 19, and the electric telescopic plate are all connected to the controller by signals, and the components work through the controller control component; in this device, the connection methods such as fixed connection and rotational connection between the components all adopt conventional connection methods. For example, the fixed connection can be a bolt connection or other fixed connection methods.

[0035] Therefore, the present utility model adopts a cleaning and drying device for multiple groups of silicon wafers with the above structure. By arranging multiple cleaning tubes and silicon wafers in an alternating manner, the driving device is used to drive the silicon wafers deep between the multiple cleaning tubes, and then the nozzles are used to simultaneously clean both surfaces of the multiple silicon wafers, ensuring both the cleaning efficiency and the cleaning quality.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and are not intended to limit them. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify or equivalently replace the technical solutions of the present utility model, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present utility model.

Claims

1. A cleaning and drying device for multiple groups of silicon wafers, characterized in that: The device comprises a device body, wherein a limiting unit for placing silicon wafers, a drying unit, a cleaning unit and a waste liquid recovery unit are arranged inside the device body, wherein the waste liquid recovery unit comprises a waste liquid tank arranged at the bottom of the device body and a recovery tank arranged at one side of the waste liquid tank, wherein a waste liquid treatment tank and a liquid storage tank are arranged in the recovery tank, wherein the cleaning unit comprises a cleaning tank and a cleaning assembly, wherein the cleaning assembly comprises a liquid infusion pipe and a plurality of groups of evenly arranged vertical cleaning pipes, wherein a plurality of nozzles are arranged on the vertical cleaning pipes; The limiting unit comprises a silicon wafer fixing plate, a plurality of silicon wafer adsorption seats are arranged on the silicon wafer fixing plate, the silicon wafer is arranged on the silicon wafer adsorption seats, and the silicon wafer adsorption seats are staggered with the vertical cleaning pipe.

2. The cleaning and drying device for multiple groups of silicon wafers according to claim 1, characterized in that: The silicon wafer fixing plate is arranged at the lower end of the supporting plate, one side of the supporting plate is connected to the driving device, and the other side is connected to the sliding block, the sliding block is slidably arranged on the sliding groove, and the sliding groove is arranged on the right inner wall of the device body.

3. The cleaning and drying device for multiple groups of silicon wafers according to claim 2, characterized in that: The driving device includes a screw rod and a moving block arranged on the screw rod, the moving block is fixedly connected to the support plate, the bottom of the screw rod is rotatably connected to the upper end of the recovery groove through a screw rod seat, and the top of the screw rod extends out of the top wall of the device body and is connected to the output shaft of the forward and reverse motors.

4. The cleaning and drying device for multiple groups of silicon wafers according to claim 3, characterized in that: A sealing plate is connected to the lower end of one side of the support plate close to the moving block. The sealing plate is slidably and sealingly connected to the front and rear side walls of the device body. A telescopic plate is arranged at the bottom of the sealing plate.

5. The cleaning and drying device for multiple groups of silicon wafers according to claim 1, characterized in that: A filter plate is arranged between the waste liquid tank and the cleaning tank, the liquid infusion tube is arranged at the upper end of the filter plate, and one end of the liquid infusion tube is connected to the liquid storage tank through a pump.

6. The cleaning and drying device for multiple groups of silicon wafers according to claim 1, characterized in that: The waste liquid treatment tank is connected to the liquid storage tank via a two-way valve, and the two-way valve is connected to a drain pipe.

7. The cleaning and drying device for multiple groups of silicon wafers according to claim 1, characterized in that: The drying unit comprises a drying device and a ventilation pipe, and the drying device is arranged outside the right side of the device body.

Images