Bouncing core forming die with buffer structure

Abstract

The utility model relates to the technical field of bouncing cores, in particular to a bouncing core forming die with a buffer structure, which comprises an upper die frame, buffer damping mechanisms are arranged on the surfaces of the upper die frame and a lower die frame, and positioning guide mechanisms are arranged on the surfaces of two sides of the upper die and the lower die. And the surfaces of the lower mold frame and the lower mold are provided with demolding facilitating mechanisms. According to the utility model, when the forming die is used, the upper die and the lower die can be positioned and guided, so that the forming die is more accurate when forming and casting the bouncing core, and when the forming die is used, the upper die frame and the lower die frame as well as the upper die and the lower die can be buffered and damped; the forming mold is more durable in use, the casting forming effect on the bouncing core is better, the formed bouncing core can be conveniently ejected out from the interior of the lower mold when the forming mold is used, and the forming mold is more convenient and smoother in use.

Description

Technical Field

[0001] The utility model relates to the technical field of bounce cores, in particular to a bounce core forming die with a buffer structure. Background Technique

[0002] Common drain stoppers are generally equipped with bounce cores as control switches. In the prior art, the inner cores of bounce cores are all made of copper. The precision stroke control position processing technology of copper inner cores is complex, the dimensions are unstable, the stroke is difficult to control, and overall sealing defects are likely to occur. A bounce core forming die is required during the casting of bounce cores.

[0003] The existing forming dies are not efficient enough when casting and forming bounce cores. In addition, the existing forming dies have some disadvantages to a certain extent. When the forming die is in use, positioning and guiding are required between the upper die and the lower die. The existing forming die cannot perform positioning and guiding between the upper die and the lower die when in use, which makes the forming die inaccurate when casting and forming bounce cores; when the forming die is in use, impact vibration will occur between the upper die holder and the lower die holder. Therefore, when the forming die is in use, buffering and shock absorption are required between the upper die holder and the lower die holder. The buffering and shock absorption effect of the existing forming die between the upper die holder and the lower die holder when in use is not good enough, which makes the forming die not durable enough when in use and reduces the casting and forming effect of bounce cores; when the forming die is in use, ejecting and discharging materials are required. The existing forming die is not convenient enough when ejecting materials, which makes it inconvenient to eject the formed bounce core from the inside of the lower die when the forming die is in use, making the forming die not convenient and smooth enough when in use. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a bounce core forming die with a buffer structure to solve the problems in the above background technique that the forming die cannot perform positioning and guiding between the upper die and the lower die when in use, the buffering and shock absorption effect between the upper die holder and the lower die holder is not good enough, and it is not convenient enough when ejecting materials.

[0005] To achieve the above object, the present utility model provides the following technical solutions: A forming die for a bouncing core with a buffer structure, comprising an upper die holder, a lower die holder is arranged below the upper die holder, control buttons are installed on the surface of the upper die holder, an upper die is installed on the inner wall of the upper die holder, a lower die is installed on the inner wall of the lower die holder, the lower die cooperates with the upper die, buffer and shock absorption mechanisms are arranged on the surfaces of the upper die holder and the lower die holder, the inside of the buffer and shock absorption mechanism includes a fixed column, a buffer plate and a buffer and shock absorption part, positioning and guiding mechanisms are arranged on the surfaces of both sides of the upper die and the lower die, the inside of the positioning and guiding mechanism includes a guiding groove, a positioning card, a positioning card, a positioning card slot, a guiding block and a second fixing frame, and demolding facilitating mechanisms are arranged on the surfaces of the lower die holder and the lower die, the inside of the demolding facilitating mechanism includes a demolding plate, an electric push rod and a demolding facilitating group.

[0006] Preferably, the buffer and shock absorption part is on the surfaces of the upper die holder and the lower die holder, the buffer and shock absorption part is composed of a shock absorption spring, a fixed groove and a buffer frame, and buffer frames are installed on the surfaces of both sides of the upper die holder.

[0007] Preferably, a buffer plate is arranged inside the buffer frame, fixed grooves are formed on the inner walls of the buffer frame, and the surfaces of the fixed grooves and the buffer plate are slidably matched with each other.

[0008] Preferably, shock absorption springs are installed inside the buffer frames, one end of each shock absorption spring is fixed to the surface of the buffer plate, fixed columns are installed on the surfaces of both sides of the lower die holder, and one end of each fixed column extends into the buffer frame and contacts the surface at the bottom position of the buffer plate.

[0009] Preferably, first fixing frames are installed on the surfaces of both sides of the upper die, second fixing frames are installed on the surfaces of both sides of the lower die, guiding blocks are installed on the surfaces of the second fixing frames, guiding grooves are formed on the surfaces of the first fixing frames, and the surfaces of the guiding grooves and the guiding blocks are slidably matched with each other.

[0010] Preferably, positioning cards for positioning between the upper die and the lower die are installed on the surfaces of the guiding blocks, positioning card slots are formed on the inner walls of the first fixing frames, and the surfaces of the positioning card slots and the positioning cards are clamped and matched with each other.

[0011] Preferably, the demolding facilitating group is arranged on the surfaces of the lower die holder and the lower die, the demolding facilitating group is composed of a fixed cylinder, a moving column and a ejector rod, fixed cylinders are installed on the surfaces at the bottom position of the lower die holder, electric push rods are installed inside the fixed cylinders, the input ends of the electric push rods are electrically connected to the output ends of the control buttons, moving columns are installed at the output ends of the electric push rods, one end of each moving column extends into the lower die holder, and the moving columns are slidably matched with the inner walls of the lower die holder.

[0012] Preferably, a demolding plate is arranged inside the lower die holder. The demolding plate is slidably matched with the inner wall of the lower die holder. The surface at the bottom position of the demolding plate is fixed to the surface of the moving column. Ejector rods for ejecting materials are installed on the surface of the demolding plate, and one end of each ejector rod extends into the lower die.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: The bouncing core forming die with a buffer structure not only enables the forming die to perform positioning and guiding treatment between the upper die and the lower die during use, making the forming die more accurate when forming and casting the bouncing core, but also enables the forming die to perform buffer and shock absorption treatment between the upper die holder and the lower die holder and between the upper die and the lower die, making the forming die more durable during use and having a better casting effect on the bouncing core. Moreover, it enables the formed bouncing core to be conveniently ejected from the inside of the lower die when the forming die is in use, making the forming die more convenient and smooth during use;

[0014] 1. By providing a positioning and guiding mechanism, the second fixing frame drives the guiding block to slide inside the guiding groove. Under the combined action of the guiding groove and the guiding block, the upper die and the lower die are guided. At this time, when the upper die moves to contact the surface of the lower die, the guiding block drives the positioning card to be inserted into the positioning card slot. Under the clamping action of the positioning card and the positioning card slot, the lower die and the upper die are positioned. Under the combined action of the first fixing frame and the second fixing frame, positioning and guiding treatment is performed between the upper die and the lower die, realizing the function of positioning and guiding the upper die and the lower die by the forming die. Thus, the forming die can perform positioning and guiding treatment between the upper die and the lower die during use, making the forming die more accurate when forming and casting the bouncing core;

[0015] 2. By providing a buffer and shock absorption mechanism, one end of the fixing column moves into the buffer frame. The fixing column pushes the buffer plate inside the buffer frame, causing the buffer plate to slide inside the fixing groove. Under the action of the fixing groove, the buffer plate is guided. At this time, under the elastic force of the shock absorption spring, the buffer plate is driven to move. Under the elastic force of the shock absorption spring inside the buffer frame, buffer and shock absorption treatment is performed between the upper die holder and the lower die holder and between the upper die and the lower die, reducing the impact force generated when the upper die holder and the upper die move downward, realizing the function of buffer and shock absorption between the upper die holder and the lower die holder by the forming die. Thus, the forming die can perform buffer and shock absorption treatment between the upper die holder and the lower die holder and between the upper die and the lower die during use, making the forming die more durable during use and having a better casting effect on the bouncing core;

[0016] 3. By setting up a convenient demolding mechanism, the ejector rod is far from the inside of the lower mold under normal conditions. After the bouncing core inside the upper mold and the lower mold is cast and formed, the user operates the control button, which controls the electric push rod inside the fixed cylinder to work. Under the action of the electric push rod, the moving column slides inside the lower mold base. At this time, the demolding plate slides inside the lower mold base. At this time, the demolding plate drives the ejector rod to move upward into the inside of the lower mold. Under the combined action of the ejector rod and the demolding plate, the bouncing core formed inside the lower mold is ejected, which is convenient for the user to take the mold of the bouncing core, realizing the function of convenient ejecting of the molding die. Thus, when the molding die is used, it is convenient to eject the formed bouncing core from the inside of the lower mold, making the molding die more convenient and smooth to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional structure schematic diagram of the present utility model;

[0018] Figure 2 is a three-dimensional exploded state structure schematic diagram of the present utility model;

[0019] Figure 3 is a front view sectional structure schematic diagram of the present utility model;

[0020] Figure 4 is of the present utility model Figure 2 amplified structure schematic diagram of the buffer and shock absorption mechanism therein;

[0021] Figure 5 is of the present utility model Figure 2 amplified structure schematic diagram of the positioning and guiding mechanism therein;

[0022] Figure 6 is an amplified structure schematic diagram of the convenient demolding mechanism of the present utility model.

[0023] In the figure: 1. Upper mold base; 101. Lower mold base; 102. Control button; 103. Upper mold; 104. Lower mold; 2. Buffer and shock absorption mechanism; 201. Fixed column; 202. Buffer plate; 203. Buffer and shock absorption part; 2031. Shock absorption spring; 2032. Fixed groove; 2033. Buffer frame; 3. Positioning and guiding mechanism; 301. Guide groove; 302. First fixing frame; 303. Positioning card; 304. Positioning card slot; 305. Guide block; 306. Second fixing frame; 4. Convenient demolding mechanism; 401. Demolding plate; 402. Electric push rod; 403. Convenient demolding group; 4031. Fixed cylinder; 4032. Moving column; 4033. Ejector rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present utility model, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0025] The structure of a bouncing core forming mold with a buffer structure provided by the present utility model is as Figure 1 and Figure 2 shown, including an upper die holder 1. A lower die holder 101 is arranged below the upper die holder 1. A control button 102 is installed on the surface of the upper die holder 1. The model of the control button 102 can be selected from the LA series. An upper die 103 is installed on the inner wall of the upper die holder 1. A lower die 104 is installed on the inner wall of the lower die holder 101. The lower die 104 and the upper die 103 cooperate with each other.

[0026] Furthermore, as Figure 3 and Figure 4 shown, buffer and shock absorption mechanisms 2 are provided on the surfaces of both the upper die holder 1 and the lower die holder 101. The buffer and shock absorption mechanism 2 includes a fixed column 201, a buffer plate 202, and a buffer and shock absorption part 203. The buffer and shock absorption part 203 is on the surfaces of the upper die holder 1 and the lower die holder 101. The buffer and shock absorption part 203 is composed of a shock absorption spring 2031, a fixed groove 2032, and a buffer frame 2033. Buffer frames 2033 are installed on the surfaces of both sides of the upper die holder 1. A buffer plate 202 is arranged inside the buffer frame 2033. Fixed grooves 2032 are formed on the inner walls of the buffer frames 2033. The fixed grooves 2032 and the surface of the buffer plate 202 are slidably matched with each other. Shock absorption springs 2031 are installed inside the buffer frames 2033. One end of the shock absorption spring 2031 is fixed to the surface of the buffer plate 202. Fixed columns 201 are installed on the surfaces of both sides of the lower die holder 101. One end of the fixed column 201 extends into the buffer frame 2033 and contacts the surface at the bottom position of the buffer plate 202.

[0027] During implementation, one end of the fixed column 201 moves into the interior of the buffer frame 2033. The fixed column 201 pushes the buffer plate 202 inside the buffer frame 2033, causing the buffer plate 202 to slide inside the fixed slot 2032. Under the action of the fixed slot 2032, the buffer plate 202 is guided. At this time, under the elastic force of the shock-absorbing spring 2031, the buffer plate 202 is driven to move. Under the elastic force of the shock-absorbing spring 2031 inside the buffer frame 2033, buffer shock absorption treatment is carried out between the upper die holder 1 and the lower die holder 101, and between the upper die 103 and the lower die 104, reducing the impact force generated when the upper die holder 1 and the upper die 103 move downward, so as to realize the function of buffer shock absorption between the upper die holder 1 and the lower die holder 101 of the forming die.

[0028] Further, as Figure 3 and Figure 5 shown, positioning and guiding mechanisms 3 are provided on the surfaces of both sides of the upper die 103 and the lower die 104. The interior of the positioning and guiding mechanism 3 includes a guiding groove 301, positioning clamping members 303, positioning clamping members 303, positioning clamping grooves 304, guiding blocks 305 and a second fixing frame 306. First fixing frames 302 are installed on the surfaces of both sides of the upper die 103, and second fixing frames 306 are installed on the surfaces of both sides of the lower die 104. Guiding blocks 305 are installed on the surfaces of the second fixing frames 306. Guiding grooves 301 are provided on the surfaces of the first fixing frames 302. The surfaces of the guiding groove 301 and the guiding block 305 are slidably matched with each other. Positioning clamping members 303 for positioning between the upper die 103 and the lower die 104 are installed on the surfaces of the guiding blocks 305. Positioning clamping grooves 304 are provided on the inner walls of the first fixing frames 302. The surfaces of the positioning clamping grooves 304 and the positioning clamping members 303 are clamped and matched with each other.

[0029] During implementation, the second fixing frame 306 drives the guiding block 305 to slide inside the guiding groove 301. Under the combined action of the guiding groove 301 and the guiding block 305, the upper die 103 and the lower die 104 are guided. At this time, when the upper die 103 moves to contact the surface of the lower die 104, the guiding block 305 drives the positioning clamping member 303 to be clamped into the interior of the positioning clamping groove 304. Under the clamping action of the positioning clamping member 303 and the positioning clamping groove 304, the lower die 104 and the upper die 103 are positioned. Under the combined action of the first fixing frame 302 and the second fixing frame 306, positioning and guiding treatment is carried out between the upper die 103 and the lower die 104, so as to realize the function of positioning and guiding between the upper die 103 and the lower die 104 of the forming die.

[0030] Further, as Figure 3 and Figure 6As shown in the figure, a demolding mechanism 4 is provided on the surfaces of the lower die holder 101 and the lower die 104. The inside of the demolding mechanism 4 includes a demolding plate 401, an electric push rod 402, and a demolding group 403. The demolding group 403 is arranged on the surfaces of the lower die holder 101 and the lower die 104. The demolding group 403 is composed of a fixed cylinder 4031, a moving column 4032, and a knockout rod 4033. Fixed cylinders 4031 are installed on the surfaces at the bottom positions of the lower die holder 101. An electric push rod 402 is installed inside the fixed cylinder 4031. The model of this electric push rod 402 can be selected from the DG series. The input end of the electric push rod 402 is electrically connected to the output end of the control button 102. A moving column 4032 is installed at the output end of the electric push rod 402. One end of the moving column 4032 extends into the inside of the lower die holder 101. The moving column 4032 is slidably engaged with the inner wall of the lower die holder 101. A demolding plate 401 is arranged inside the lower die holder 101. The demolding plate 401 is slidably engaged with the inner wall of the lower die holder 101. The surface at the bottom position of the demolding plate 401 is fixed to the surface of the moving column 4032. Knockout rods 4033 for ejecting the material are installed on the surface of the demolding plate 401. One end of the knockout rod 4033 extends into the inside of the lower die 104.

[0031] During implementation, under normal conditions, the knockout rod 4033 is far from the inside of the lower die 104. After the bounce core inside the upper die 103 and the lower die 104 is cast and formed, the user operates the control button 102 again, so that the control button 102 controls the electric push rod 402 inside the fixed cylinder 4031 to work. Under the action of the electric push rod 402, the moving column 4032 slides inside the lower die holder 101. At this time, the demolding plate 401 slides inside the lower die holder 101. At this time, the demolding plate 401 drives the knockout rod 4033 to move upward into the inside of the lower die 104. Under the combined action of the knockout rod 4033 and the demolding plate 401, the bounce core cast and formed inside the lower die 104 is ejected, which is convenient for the user to take the mold of the bounce core, so as to realize the function of convenient material ejection of the forming die.

[0032] Working principle: When in use, first place the upper die holder 1 at the designated position. The power mechanism drives the upper die holder 1 to move downward, causing the upper die holder 1 to drive the upper die 103 downward until it contacts the surface of the lower die 104. The bouncing core is cast and formed between the lower die 104 and the upper die 103. When the upper die 103 and the lower die 104 move, at this time, the second fixing frame 306 drives the guide block 305 to slide inside the guide groove 301. Under the combined action of the guide groove 301 and the guide block 305, the upper die 103 and the lower die 104 are guided. At this time, when the upper die 103 moves to contact the surface of the lower die 104, the guide block 305 drives the positioning clip 303 to snap into the positioning slot 304. Under the clamping action of the positioning clip 303 and the positioning slot 304, the lower die 104 and the upper die 103 are positioned. Under the combined action of the first fixing frame 302 and the second fixing frame 306, the upper die 103 and the lower die 104 are guided and positioned, so as to realize the function of the forming die to position and guide between the upper die 103 and the lower die 104. Thus, when the forming die is in use, it can perform positioning and guiding treatment between the upper die 103 and the lower die 104, making the forming die more accurate when casting and forming the bouncing core.

[0033] Subsequently, when the upper die holder 1 moves downward, at this time, one end of the fixed column 201 moves into the inside of the buffer frame 2033. The fixed column 201 pushes the buffer plate 202 inside the buffer frame 2033, causing the buffer plate 202 to slide inside the fixed slot 2032. Under the action of the fixed slot 2032, the buffer plate 202 is guided. At this time, under the elastic force of the shock-absorbing spring 2031, the buffer plate 202 is driven to move. Under the elastic force of the shock-absorbing spring 2031 inside the buffer frame 2033, buffer and shock-absorbing treatment is carried out between the upper die holder 1 and the lower die holder 101, and between the upper die 103 and the lower die 104, reducing the impact force generated when the upper die holder 1 and the upper die 103 move downward, so as to realize the function of the forming die to buffer and shock-absorb between the upper die holder 1 and the lower die holder 101. Thus, when the forming die is in use, it can perform buffer and shock-absorbing treatment between the upper die holder 1 and the lower die holder 101 and between the upper die 103 and the lower die 104, making the forming die more durable in use and having a better casting and forming effect on the bouncing core.

[0034] Subsequently, the ejector rod 4033 in the normal state is away from the inside of the lower mold 104. After the bounce cores inside the upper mold 103 and the lower mold 104 are cast and formed, the user operates the control button 102 again, so that the control button 102 controls the electric push rod 402 inside the fixed cylinder 4031 to work. Under the action of the electric push rod 402, the moving column 4032 is driven to slide inside the lower mold base 101. At this time, the demolding plate 401 slides inside the lower mold base 101. At this time, the demolding plate 401 drives the ejector rod 4033 to move upward into the inside of the lower mold 104. Under the combined action of the ejector rod 4033 and the demolding plate 401, the bounce core cast and formed inside the lower mold 104 is ejected, which is convenient for the user to take the mold of the bounce core, so as to realize the function of convenient ejecting of the formed mold, so that the formed mold can conveniently eject the formed bounce core from the inside of the lower mold 104 when in use, making the formed mold more convenient and smooth when in use, and finally completing the use work of the formed mold.

[0035] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims in the present utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A bouncing core forming mold with a buffer structure, comprising an upper mold frame (1), characterized in that: A lower mold frame (101) is arranged below the upper mold frame (1), a control button (102) is installed on the surface of the upper mold frame (1), an upper mold (103) is installed on the inner wall of the upper mold frame (1), a lower mold (104) is installed on the inner wall of the lower mold frame (101), the lower mold (104) and the upper mold (103) cooperate with each other, and a buffer shock absorbing mechanism (2) is arranged on the surface of both the upper mold frame (1) and the lower mold frame (101), and the interior of the buffer shock absorbing mechanism (2) includes a fixing column (201), a buffer plate (202) and a buffer shock absorbing mechanism (2). Part (203), the surfaces of both sides of the upper mold (103) and the lower mold (104) are provided with positioning guide mechanisms (3), the interior of the positioning guide mechanisms (3) includes guide grooves (301), positioning clamps (303), positioning clamping grooves (304), guide blocks (305) and a second fixed frame (306), the surfaces of the lower mold frame (101) and the lower mold (104) are provided with demolding mechanisms (4), the interior of the demolding mechanisms (4) includes demolding plates (401), electric push rods (402) and demolding groups (403).

2. The bouncing core forming mold with a buffer structure according to claim 1, characterized in that: The buffer and shock absorbing part (203) is on the surface of the upper mold frame (1) and the lower mold frame (101), and the buffer and shock absorbing part (203) is composed of a shock absorbing spring (2031), a fixing groove (2032) and a buffer frame (2033). The surfaces of both sides of the upper mold frame (1) are both installed with buffer frames (2033).

3. The bouncing core forming mold with a buffer structure according to claim 2, characterized in that: A buffer plate (202) is arranged inside the buffer frame (2033), and a fixing groove (2032) is provided on the inner wall of the buffer frame (2033), and the fixing groove (2032) and the surface of the buffer plate (202) are slidably matched with each other.

4. The bouncing core forming mold with a buffer structure according to claim 3, characterized in that: A shock absorbing spring (2031) is installed inside the buffer frame (2033), one end of the shock absorbing spring (2031) is fixed to the surface of the buffer plate (202), and fixed columns (201) are installed on the surfaces of both sides of the lower mold frame (101), one end of the fixed column (201) extends to the inside of the buffer frame (2033) and contacts the surface at the bottom of the buffer plate (202).

5. The bouncing core forming mold with a buffer structure according to claim 1, characterized in that: The surfaces of both sides of the upper mold (103) are installed with first fixing frames (302), the surfaces of both sides of the lower mold (104) are installed with second fixing frames (306), the surfaces of the second fixing frames (306) are installed with guide blocks (305), the surfaces of the first fixing frames (302) are provided with guide grooves (301), and the guide grooves (301) and the surfaces of the guide blocks (305) are slidably matched with each other.

6. The bouncing core forming mold with a buffer structure according to claim 5, characterized in that: A positioning clamp (303) for positioning the upper mold (103) and the lower mold (104) is installed on the surface of the guide block (305), and a positioning groove (304) is provided on the inner wall of the first fixing frame (302), and the positioning groove (304) and the surface of the positioning clamp (303) are mutually engaged.

7. The bouncing core forming mold with a buffer structure according to claim 1, characterized in that: The demolding group (403) is arranged on the surface of the lower mold frame (101) and the lower mold (104), and the demolding group (403) is composed of a fixed cylinder (4031), a movable column (4032) and a push rod (4033). The surface at the bottom position of the lower mold frame (101) is installed with a fixed cylinder (4031), and an electric push rod (402) is installed inside the fixed cylinder (4031). The input end of the electric push rod (402) is electrically connected to the output end of the control button (102), and the output end of the electric push rod (402) is installed with a movable column (4032), one end of the movable column (4032) extends to the interior of the lower mold frame (101), and the movable column (4032) and the inner wall of the lower mold frame (101) are slidably matched with each other.

8. The bouncing core forming mold with a buffer structure according to claim 1, characterized in that: A demolding plate (401) is arranged inside the lower mold frame (101), and the demolding plate (401) and the inner wall of the lower mold frame (101) are slidably matched with each other. The surface at the bottom position of the demolding plate (401) is fixed to the surface of the movable column (4032), and the surface of the demolding plate (401) is installed with a ejecting rod (4033) for ejecting material, and one end of the ejecting rod (4033) extends to the inside of the lower mold (104).

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