Adsorption test disc structure for testing performance of chip-type multi-terminal component

Abstract

The utility model provides an adsorption test disc structure for testing the performance of a chip-type multi-terminal component. The adsorption test disc structure comprises a test disc, a chassis, a rotating assembly and a test assembly, the test disc and the chassis are arranged on the rotating assembly and rotate along with the rotating assembly; a plurality of sheet accommodating grooves are formed in the test disc; a first vacuum groove and a second vacuum groove which are communicated with the sheet accommodating groove are formed in the back surface of the test disc; a testing hole is formed in the position, corresponding to the sheet material containing groove, of the base plate, air is sucked from the first adsorption hole and the second adsorption hole through an external vacuum device, so that negative pressure is generated in the first vacuum groove, the second vacuum groove and the sheet material containing groove, and components are adsorbed and fixed; the probe extends upwards from the test hole to the terminal of the component to test the component. According to the adsorption test disc structure for testing the performance of the chip-type multi-terminal component, provided by the utility model, the test precision, the stability and the efficiency are improved, the operation process is simplified, and the maintenance cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of component testing equipment, and particularly relates to an adsorption test disk structure for testing the performance of chip multi-terminal components. Background Art

[0002] In the field of performance testing of chip multi-terminal components, traditional testing methods usually involve using fixed fixtures to fix the components to be tested and conducting electrical performance tests through various means; although these methods can complete basic testing tasks, there are some deficiencies in practical applications.

[0003] Deficiencies of the Existing Technology

[0004] 1. Insufficient positioning accuracy: When fixing components with traditional testing devices, the components may be displaced during the testing process due to low positioning accuracy, thus affecting the accuracy of the test results.

[0005] 2. Poor fixing stability: The fixture fixing method is difficult to ensure the stability and repeatability of the components during the testing process.

[0006] Therefore, the existing technology has deficiencies and needs further improvement. Summary of the Utility Model

[0007] Aiming at the problems existing in the existing technology, the utility model provides an adsorption test disk structure for testing the performance of chip multi-terminal components.

[0008] To achieve the above purpose, the specific scheme of the utility model is as follows:

[0009] The utility model provides an adsorption test disk structure for testing the performance of chip multi-terminal components, including:

[0010] A test disk, a chassis, a rotating assembly, and a testing assembly;

[0011] The test disk is stacked on the chassis;

[0012] The test disk and the chassis are arranged on the rotating assembly and rotate together with the rotating assembly;

[0013] The testing assembly is arranged below the chassis and is used for testing the performance of the chip multi-terminal components to be tested;

[0014] A number of sheet material accommodating grooves are annularly distributed on the test disk;

[0015] A first vacuum groove and a second vacuum groove communicating with the sheet material accommodating grooves are arranged on the back of the test disk;

[0016] A test hole is provided at a position on the chassis corresponding to the sheet material accommodating groove, and a first adsorption hole and a second adsorption hole are respectively provided at positions corresponding to the first vacuum groove and the second vacuum groove;

[0017] When the chip multi-terminal component passes over the surface of the test tray, negative pressure is generated in the first vacuum groove, the second vacuum groove and the sheet material accommodating groove by sucking air from the first adsorption hole and the second adsorption hole through an external vacuum device, so as to adsorb and fix the component;

[0018] The test assembly includes a probe, and the probe extends upward from the test hole to the terminals of the component to test the component.

[0019] Furthermore, a first mounting hole is provided at the center position of the test tray, and a second mounting hole and a third mounting hole are respectively provided on both sides of the first mounting hole;

[0020] Fourth mounting holes, fifth mounting holes and sixth mounting holes are respectively provided at positions on the chassis corresponding to the first mounting hole, the second mounting hole and the third mounting hole.

[0021] Furthermore, the rotating assembly includes a rotating motor and a first mounting plate;

[0022] The first mounting plate is mounted on the rotating shaft of the rotating motor, and a first fixing column and a second fixing column are provided on the first mounting plate;

[0023] The test tray and the chassis are mounted on the first mounting plate, the first fixing column is mounted in the second mounting hole of the test tray and the fifth mounting hole of the chassis, and the second fixing column is mounted in the third mounting hole of the test tray and the sixth mounting hole of the chassis;

[0024] The rotating shaft of the rotating motor passes through the first mounting hole of the test tray and the fourth mounting hole of the chassis, and a first cover plate is further provided on the rotating shaft for fixing the test tray and the chassis on the first mounting plate.

[0025] Furthermore, the test assembly includes a probe, a first mounting plate, a first air cylinder, a first slide rail and a mounting back plate;

[0026] The probe is mounted on the first mounting plate, the first mounting plate is slidably mounted on the first slide rail, and the first slide rail is mounted on the mounting back plate;

[0027] The first mounting plate is mounted on the telescopic rod of the first air cylinder;

[0028] The telescopic rod of the first air cylinder pushes and pulls the first mounting plate to move up and down on the first slide rail, thereby driving the probe to move up and down;

[0029] The probe moves up to the terminals of the component to be tested for testing, and then descends after the test is completed.

[0030] Furthermore, there are two circles of sheet material accommodating grooves on the test plate, and correspondingly, there are also two circles of test holes on the chassis.

[0031] Furthermore, at one corner of the sheet material accommodating groove, there is also a semi-circular notch for taking out chip components.

[0032] Furthermore, the first vacuum groove and the second vacuum groove are respectively arranged on two adjacent sides of the sheet material accommodating groove.

[0033] Adopting the technical solution of the present utility model has the following beneficial effects:

[0034] 1. Improve positioning accuracy:

[0035] By providing the first vacuum groove and the second vacuum groove, when an external vacuum device sucks air from the first adsorption hole and the second adsorption hole, a stable negative pressure can be generated in the sheet material accommodating groove, thereby more stably adsorbing and fixing components and improving the positioning accuracy.

[0036] 2. Enhance fixing stability:

[0037] The design of the double vacuum grooves enhances the adsorption effect of the components, and can keep the components stable even under the conditions of high-speed rotation or vibration, avoiding test errors caused by the movement of the components.

[0038] 3. Improve test efficiency:

[0039] There are two circles of sheet material accommodating grooves on the test plate, and correspondingly, there are also two circles of test holes on the chassis, which means that more components can be tested simultaneously, significantly improving the test efficiency.

[0040] 4. High degree of automation:

[0041] The introduction of the rotating assembly, especially the application of the rotating motor, makes the whole test process more automated, reduces the need for manual operation, and reduces the possibility of human errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 is a perspective view of the present utility model;

[0043] Figure 2 is a perspective view of the test plate, chassis and rotating mechanism of the present utility model;

[0044] Figure 3 is a bottom perspective view of the test plate, chassis and rotating mechanism of the present utility model;

[0045] Figure 4 is a top view of the test plate of the present utility model;

[0046] Figure 5 is Figure 4 the enlarged view of part A of

[0047] Figure 6 the bottom view of the test plate of the present utility model;

[0048] Figure 7 is Figure 6 the enlarged view of part B of

[0049] Figure 8 the bottom view of the chassis of the present utility model;

[0050] Figure 9 is Figure 8 the enlarged view of part C of

[0051] Figure 10 the exploded view of the rotating assembly of the present utility model;

[0052] Figure 11 the exploded view of the test assembly of the present utility model.

[0053] In the figure:

[0054] 1. Test plate;

[0055] 101. Sheet material accommodating groove; 102. Notch; 103. First vacuum groove; 104. Second vacuum groove;

[0056] 105. First mounting hole; 106. Second mounting hole; 107. Third mounting hole;

[0057] 2. Chassis;

[0058] 201. Test hole; 202. First adsorption hole; 203. Second adsorption hole; 204. Fourth mounting hole; 205. Fifth mounting hole; 206. Sixth mounting hole;

[0059] 3. Rotating assembly;

[0060] 301. Rotating motor; 302. First mounting plate; 303. First fixing column; 304. Second fixing column; 305. First cover plate;

[0061] 4. Test assembly;

[0062] 401. Probe; 402. First mounting plate; 403. First cylinder; 404. First slide rail; 405. Mounting back plate;

[0063] 5. Components. Detailed implementation manners

[0064] The present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the sake of convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0065] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0066] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above the top", and "on the top" of the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is at a higher horizontal height than the second feature. The first feature being "below", "below the bottom", and "under the bottom" of the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is at a lower horizontal height than the second feature.

[0067] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "front", "rear", "left", and "right" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0068] Combined Figures 1 - 11 As shown, the present utility model provides an adsorption test disk structure for testing the performance of chip multi-terminal components, including:

[0069] A test disk 1, a chassis 2, a rotating assembly 3, and a testing assembly 4;

[0070] The test disk 1 is stacked on the chassis 2;

[0071] The test disk 1 and the chassis 2 are arranged on the rotating assembly 3 and rotate together with the rotating assembly 3;

[0072] The test component 4 is arranged below the chassis 2 and is used to perform performance tests on the chip multi-terminal component 5 to be tested;

[0073] A plurality of sheet material accommodating grooves 101 are annularly distributed on the test plate 1;

[0074] A first vacuum groove 103 and a second vacuum groove 104 communicating with the sheet material accommodating groove 101 are arranged on the back surface of the test plate 1;

[0075] Test holes 201 are arranged on the chassis 2 at positions corresponding to the sheet material accommodating grooves 101, and a first adsorption hole 202 and a second adsorption hole 203 are respectively arranged at positions corresponding to the first vacuum groove 103 and the second vacuum groove 104;

[0076] When the chip multi-terminal component 5 passes through the surface of the test plate 1, the first vacuum groove 103, the second vacuum groove 104 and the sheet material accommodating groove 101 generate negative pressure by sucking air from the first adsorption hole 202 and the second adsorption hole 203 through an external vacuum device, so as to adsorb and fix the component 5;

[0077] The test component 4 includes a probe 401, and the probe 401 extends upward from the test hole 201 to the terminals of the component 5 to test the component 5.

[0078] A first mounting hole 105 is arranged at the center position of the test plate 1, and a second mounting hole 106 and a third mounting hole 107 are respectively arranged on both sides of the first mounting hole 105;

[0079] Fourth mounting holes 204, fifth mounting holes 205 and sixth mounting holes 206 are respectively arranged on the chassis 2 at positions corresponding to the first mounting hole 105, the second mounting hole 106 and the third mounting hole 107;

[0080] The rotation assembly 3 includes a rotation motor 301 and a first mounting plate 302;

[0081] The first mounting plate 302 is mounted on the rotating shaft of the rotation motor 301, and a first fixing column 303 and a second fixing column 304 are arranged on the first mounting plate 302;

[0082] The test plate 1 and the chassis 2 are mounted on the first mounting plate 302. The first fixing column 303 is mounted in the second mounting hole 106 of the test plate 1 and the fifth mounting hole 205 of the chassis 2, and the second fixing column 304 is mounted in the third mounting hole 107 of the test plate 1 and the sixth mounting hole 206 of the chassis 2;

[0083] The rotating shaft of the rotating electrical machine 301 is passed through the first mounting hole 105 of the test disk 1 and the fourth mounting hole 204 of the chassis 2. A first cover plate 305 is further provided on the rotating shaft for fixing the test disk 1 and the chassis 2 on the first mounting disk 302.

[0084] The test assembly 4 includes a probe 401, a first mounting plate 402, a first cylinder 403, a first slide rail 404, and a mounting back plate 405;

[0085] The probe 401 is mounted on the first mounting plate 402. The first mounting plate 402 is slidably mounted on the first slide rail 404, and the first slide rail 404 is mounted on the mounting back plate 405;

[0086] The first mounting plate 402 is mounted on the telescopic rod of the first cylinder 403;

[0087] The telescopic rod of the first cylinder 403 pushes and pulls the first mounting plate 402 to move up and down on the first slide rail 404, thereby driving the probe 401 to move up and down;

[0088] The probe 401 moves up to the terminal of the component 5 to be tested for testing and then descends after the test is completed.

[0089] There are two circles of chip accommodating grooves 101 on the test disk 1, and correspondingly, there are also two circles of test holes 201 on the chassis 2.

[0090] At one corner of the chip accommodating groove 101, a semi-circular notch 102 is further provided for taking out the chip component 5.

[0091] The first vacuum groove 103 and the second vacuum groove 104 are respectively arranged on two adjacent sides of the chip accommodating groove 101.

[0092] The principle of the present utility model is as follows:

[0093] 1. Adsorption and fixation of the component 5

[0094] Vacuum adsorption system: The first vacuum groove 103 and the second vacuum groove 104 are provided on the back surface of the test disk 1, and these vacuum grooves are communicated with the chip accommodating groove 101 on the surface of the test disk 1. When the chip multi-terminal component 5 is placed in the chip accommodating groove 101 of the test disk 1, air is sucked through the first adsorption hole 202 and the second adsorption hole 203 on the chassis 2 by an external vacuum device, so that negative pressure is generated in the first vacuum groove 103 and the second vacuum groove 104, thereby adsorbing and fixing the component 5.

[0095] 2. Rotation of the test disk 1 and the chassis 2

[0096] Rotating Assembly 3: The rotating assembly 3 consists of a rotating motor 301 and a first mounting plate 302. The first mounting plate 302 is mounted on the rotating shaft of the rotating motor 301 and is provided with a first fixing post 303 and a second fixing post 304. The test plate 1 and the chassis 2 are matched with the corresponding mounting holes on the chassis 2 through the first mounting hole 105, the second mounting hole 106, and the third mounting hole 107, and are fixed on the first mounting plate 302 through the fixing posts. The rotating motor 301 drives the rotating shaft to rotate, thereby driving the test plate 1 and the chassis 2 to rotate together.

[0097] 3. Actions of the Testing Assembly 4

[0098] Testing Assembly 4: The testing assembly 4 mainly includes a probe 401, a first mounting plate 402, a first cylinder 403, a first slide rail 404, and a mounting backplate 405. The probe 401 is mounted on the first mounting plate 402, and the first mounting plate 402 can move up and down along the first slide rail 404 through the telescopic rod of the first cylinder 403. When the test plate 1 rotates to the correct position, the first cylinder 403 drives the first mounting plate 402 to rise, so that the probe 401 contacts the terminals of the component 5. After the performance test is completed, the probe 401 descends back to the initial position.

[0099] 4. Special Design of the Test Plate 1

[0100] Test Holes 201: There are two circles of sheet material accommodating grooves 101 on the test plate 1, and there are also two circles of test holes 201 on the corresponding chassis 2. In this way, more components 5 can be tested simultaneously, improving the test efficiency.

[0101] Design for Easy Removal: A semi-circular notch 102 is provided at one corner of the sheet material accommodating groove 101, which is convenient for removing the component 5 from the test plate 1 after the test is completed.

[0102] Dual Vacuum Groove Design: The first vacuum groove 103 and the second vacuum groove 104 are respectively arranged on two adjacent sides of the sheet material accommodating groove 101. This design can more effectively adsorb and fix the component 5.

[0103] In summary, through the unique adsorption test plate structure, combining the rotating assembly 3 and the testing assembly 4, the utility model realizes the efficient and stable testing of the chip multi-terminal component 5. The rotating assembly 3 drives the test plate 1 and the chassis 2 to rotate, so that the component 5 reaches the correct test position; the performance test is completed through the testing assembly 4; and the double-layer vacuum adsorption system ensures that the component 5 is firmly fixed during the whole testing process.

[0104] The above are only the preferred embodiments of the present utility model, and thus do not limit the scope of the present utility model. Any equivalent structural transformation made by using the content of the specification and drawings of the present utility model under the inventive concept of the present utility model, or direct or indirect application in other related technical fields, is included in the protection scope of the present utility model.

Claims

1. An adsorption test plate structure for performance testing of chip-type multi-terminal components, characterized in that: include: Test disc, chassis, rotating assembly, test assembly; The test tray is superimposed on the chassis; The test disc and the chassis are arranged on the rotating assembly and rotate together with the rotating assembly; The test assembly is arranged below the chassis and is used to perform performance tests on chip-type multi-terminal components to be tested; The test plate is provided with a plurality of sheet material accommodating grooves distributed in an annular shape; The back of the test disc is provided with a first vacuum groove and a second vacuum groove which are connected with the sheet material containing groove; A test hole is provided on the chassis at a position corresponding to the sheet material receiving slot, and a first adsorption hole and a second adsorption hole are provided at positions corresponding to the first vacuum slot and the second vacuum slot, respectively; When the chip-type multi-terminal components pass through the surface of the test disc, the external vacuum device sucks air from the first adsorption hole and the second adsorption hole to generate negative pressure in the first vacuum groove, the second vacuum groove and the chip material receiving groove, so as to adsorb and fix the components; The test assembly comprises a test needle, which extends upward from a test hole to a terminal of a component to test the component.

2. The adsorption test plate structure for chip-type multi-terminal component performance testing according to claim 1, characterized in that: A first mounting hole is provided at the center of the test plate, and a second mounting hole and a third mounting hole are respectively provided on both sides of the first mounting hole; A fourth mounting hole, a fifth mounting hole and a sixth mounting hole are respectively arranged at positions on the chassis corresponding to the first mounting hole, the second mounting hole and the third mounting hole.

3. The adsorption test plate structure for chip-type multi-terminal component performance testing according to claim 2, characterized in that: The rotating assembly includes a rotating motor and a first mounting plate; The first mounting plate is mounted on the rotating shaft of the rotating motor, and the first mounting plate is provided with a first fixing column and a second fixing column; The test plate and the chassis are mounted on the first mounting plate, the first fixing column is mounted in the second mounting hole of the test plate and the fifth mounting hole of the chassis, and the second fixing column is mounted in the third mounting hole of the test plate and the sixth mounting hole of the chassis; The rotating shaft of the rotating motor is inserted into the first mounting hole of the test plate and the fourth mounting hole of the chassis. A first cover plate is also provided on the rotating shaft for fixing the test plate and the chassis on the first mounting plate.

4. The adsorption test plate structure for chip-type multi-terminal component performance testing according to claim 3, characterized in that: The test assembly includes a measuring needle, a first mounting plate, a first cylinder, a first slide rail, and a mounting back plate; The measuring needle is mounted on a first mounting plate, the first mounting plate is slidably mounted on a first slide rail, and the first slide rail is mounted on a mounting back plate; The first mounting plate is mounted on the telescopic rod of the first cylinder; The telescopic rod of the first cylinder pushes and pulls the first mounting plate to move up and down on the first slide rail, thereby driving the measuring needle to move up and down; The probe moves up to the terminal of the component to be tested for testing and then moves down after the test is completed.

5. The adsorption test plate structure for chip-type multi-terminal component performance testing according to claim 1, characterized in that: The sheet material accommodating grooves on the test plate are provided with two circles, and the corresponding test holes on the bottom plate are also provided with two circles.

6. The adsorption test plate structure for chip-type multi-terminal component performance testing according to claim 1, characterized in that: A semicircular notch is also provided at one corner of the sheet material accommodating groove for taking out the sheet components.

7. The adsorption test plate structure for chip-type multi-terminal component performance testing according to claim 1, characterized in that: The first vacuum groove and the second vacuum groove are respectively arranged on two adjacent sides of the sheet accommodating groove.

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