Device and system for testing conduction rate of mobile phone shell

Abstract

The utility model discloses a mobile phone shell conduction rate testing device and a mobile phone shell conduction rate testing system. The shell is arranged on the functional base; the test module comprises an upper module assembly and a lower module assembly, the lower module assembly is connected with the first surface of the functional base, a mobile phone shell is placed between the upper module assembly and the lower module assembly, the upper module assembly and the lower module assembly are both located in the shell, and the first conduction rate and the second conduction rate are indicated through the functional base; the lifting module is arranged in the shell and used for lifting the upper module assembly. The upper die assembly is lifted through the lifting module, the mobile phone shell is placed on the lower die assembly when the upper die assembly ascends, the conductivity of the mobile phone shell is tested when the upper die assembly descends to press the lower die assembly, the first surface and the second surface of the mobile phone shell are measured at the same time, indication is carried out through the functional base, the testing speed is high, the testing cost is low, and the testing precision is high; the method can be widely applied to the technical field of mobile phone shell testing.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone case testing, in particular to a testing device and system for the conduction rate of a mobile phone case. Background Art

[0002] After the processing of the middle frame and back shell of a mobile phone, it is necessary to test the conduction rate of its upper and lower surfaces to ensure the safety performance of the mobile phone case. In the prior art, an artificial and semi-automatic resistance tester is usually used to test the conduction rate of the mobile phone case. It is necessary to manually place the mobile phone case on the bottom mold of the tester and start the instrument for testing. This method has the disadvantages of high labor cost, low testing speed, and low testing accuracy caused by manual placement. Summary of the Utility Model

[0003] In view of this, the purpose of the embodiments of the present utility model is to provide a testing device and system for the conduction rate of a mobile phone case, which can reduce the testing cost of testing the conduction rate of the mobile phone case, has a fast testing speed, and high testing accuracy.

[0004] In a first aspect, an embodiment of the present utility model provides a testing device for the conduction rate of a mobile phone case, including:

[0005] A housing;

[0006] A functional base, on which the housing is arranged;

[0007] A testing module, including an upper mold component and a lower mold component. The lower mold component is connected to the first surface of the functional base. A mobile phone case is placed between the upper mold component and the lower mold component. The lower mold component is used to test the first conduction rate of the first surface of the mobile phone case, and the upper mold component is used to test the second conduction rate of the second surface of the mobile phone case. Both the upper mold component and the lower mold component are located inside the housing, and the first conduction rate and the second conduction rate are indicated by the functional base;

[0008] A lifting module, arranged inside the housing, for lifting the upper mold component.

[0009] Optionally, the functional base is provided with a display screen, and the display screen is used to display the test results of the upper mold component and the lower mold component, and the test results indicate the first conduction rate and the second conduction rate.

[0010] Optionally, the functional base is further provided with a plurality of function buttons.

[0011] Optionally, the lifting module includes a cylinder, a guiding column, and a fixing bracket. The cylinder is used to drive the fixing bracket to lift along the guiding column, and the fixing bracket is used to fix the upper mold component.

[0012] Optionally, the upper die assembly includes an upper die fixing plate, an upper die PCB board, upper probes, an upper die bottom plate, and a floating pre-pressing plate. The first surface of the upper die fixing plate is connected to the fixing frame. The upper die PCB board is located between the second surface of the upper die fixing plate and the first surface of the upper die bottom plate. The first surface of the floating pre-pressing plate is connected to the second surface of the upper die bottom plate. The second surface of the floating pre-pressing plate is used to press the first surface of the mobile phone case. The first end of the upper probe is connected to the upper die PCB board. The second end of the upper probe passes through the upper die bottom plate and the floating pre-pressing plate respectively and is connected to the first test point on the first surface of the mobile phone case.

[0013] Optionally, a plurality of limit blocks are provided on the upper die bottom plate, and a plurality of upper probes are provided. The plurality of upper probes are used to test the plurality of first test points.

[0014] Optionally, a probe limit plate is provided between the upper die bottom plate and the floating pre-pressing plate. The probe limit plate is used to limit the implanting depth of the upper probe.

[0015] Optionally, the lower die assembly includes a floating carrier plate, lower probes, a lower die bottom plate, and a lower die PCB board. A test slot is provided on the first surface of the floating carrier plate. The test slot is used to place the mobile phone case. The second surface of the floating carrier plate is connected to the first surface of the lower die bottom plate. The second surface of the lower die bottom plate is connected to the lower die PCB board. The first end of the lower probe passes through the lower die bottom plate and the floating carrier plate respectively and is connected to the second test point on the second surface of the mobile phone case. The second end of the lower probe is connected to the lower die PCB board.

[0016] Optionally, a barcode scanner is connected to the lower die PCB board. A barcode scanning opening is provided in the test slot. The barcode scanner is used to scan the barcode data of the mobile phone case through the barcode scanning opening.

[0017] In a second aspect, an embodiment of the present invention provides a test system for the conduction rate of a mobile phone case, including the above-mentioned test device for the conduction rate of the mobile phone case, a resistance tester, and a host computer. The test device for the conduction rate of the mobile phone case is communicatively connected to the resistance tester, and the resistance tester is communicatively connected to the host computer.

[0018] Implementing the embodiments of the present utility model includes the following beneficial effects: The embodiments of the present utility model provide a test device for the conduction rate of a mobile phone case, comprising: a housing; a functional base, on which the housing is arranged; a test module, including an upper die assembly and a lower die assembly, the lower die assembly is connected to the first surface of the functional base, a mobile phone case is placed between the upper die assembly and the lower die assembly, the lower die assembly is used to test the first conduction rate of the first surface of the mobile phone case, the upper die assembly is used to test the second conduction rate of the second surface of the mobile phone case, both the upper die assembly and the lower die assembly are located inside the housing, and the first conduction rate and the second conduction rate are indicated by the functional base; a lifting module, arranged inside the housing, for lifting the upper die assembly. By lifting the upper die assembly through the lifting module, the mobile phone case is placed on and taken from the lower die assembly when the upper die assembly rises, and the conduction rate of the mobile phone case is tested when the upper die assembly descends and presses the lower die assembly. At the same time, the first surface and the second surface of the mobile phone case are measured and indicated by the functional base. The test speed is fast, the test cost is low, and the test accuracy is high. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of a test device for the conduction rate of a mobile phone case provided by an embodiment of the present utility model;

[0020] Figure 2 is a schematic structural diagram of the test module provided by an embodiment of the present utility model;

[0021] Figure 3 is a schematic structural diagram of the lower die test component provided by an embodiment of the present utility model.

[0022] Reference numerals: housing 10, safety grating 11;

[0023] cylinder 20, guide post 21, fixing bracket 22;

[0024] upper die assembly 30, upper die fixing plate 301, upper die PCB board 302, limit block 303, upper die bottom plate 304, floating pre-pressure plate 305, upper probe 306, fixed connection column 307, floating carrier plate 31, test slot 311, mobile phone case 312, positioning post 313, pick-up and placement opening 314, code scanning opening 315, lower die bottom plate 32, limit rod 321, lower die PCB board 322, lower probe 323, code scanning gun 324;

[0025] functional base 40, display screen 41, handle 42. Detailed Embodiments

[0026] Next, in combination with the accompanying drawings in the embodiments of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] In the embodiments of the present utility model, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present utility model should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific manner.

[0028] Hereinafter, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more.

[0029] In a first aspect, referring to Figure 1 , the embodiments of the present utility model provide a test device for the conduction rate of a mobile phone case 312, including:

[0030] A housing 10;

[0031] A functional base 40, on which the housing 10 is disposed;

[0032] A test module, including an upper die assembly 30 and a lower die assembly. The lower die assembly is connected to the first surface of the functional base 40. A mobile phone case 312 is placed between the upper die assembly 30 and the lower die assembly. The lower die assembly is used to test the first conduction rate of the first surface of the mobile phone case 312, and the upper die assembly 30 is used to test the second conduction rate of the second surface of the mobile phone case 312. Both the upper die assembly 30 and the lower die assembly are located inside the housing 10, and the first conduction rate and the second conduction rate are indicated by the functional base 40;

[0033] A lifting module, disposed inside the housing 10, for lifting the upper die assembly 30.

[0034] Specifically, the outer shell 10 is installed on the first surface (upper surface) of the functional base 40 to protect the test module. The first surface of the functional base 40 is fixed to the second surface of the upper die assembly 30. A mobile phone case 312 is placed between the upper die assembly 30 and the lower die assembly. The first conduction rate of the first surface of the mobile phone case 312 is tested through the lower die assembly, and at the same time, the second conduction rate of the second surface of the mobile phone case 312 is tested through the upper die assembly 30, with high test efficiency. Both the upper die assembly 30 and the lower die assembly are located inside the outer shell 10. The upper die assembly 30 sends the tested first conduction rate to the host computer, and the lower die assembly sends the tested second conduction rate to the host computer. The host computer sends the corresponding test result information to the functional base 40 for display, thereby indicating the first conduction rate and the second conduction rate. The lifting module is arranged inside the outer shell 10. The upper die assembly 30 is lifted and lowered through the lifting module. When the upper die assembly 30 is lifted by the lifting module, the mobile phone case 312 can be placed and taken on the lower die assembly. When the upper die assembly 30 is lowered by the lifting module to press the lower die assembly, the conduction rate of the mobile phone case 312 is tested, and at the same time, the first surface and the second surface of the mobile phone case 312 are measured through the upper die assembly 30 and the lower die assembly, with high test efficiency. The lifting of the upper die assembly 30 and the lower die assembly is accurate, ensuring the measurement accuracy.

[0035] In some alternative embodiments, the functional base 40 is provided with a display screen 41 for displaying the test results of the upper die assembly 30 and the lower die assembly, and the test results indicate the first conduction rate and the second conduction rate.

[0036] Specifically, the specific test results are displayed through the display screen 41 of the functional base 40, thereby indicating the first conduction rate and the second conduction rate according to the test results. When the specific test result is passed, it indicates that the first conduction rate and the second conduction rate are qualified. When the test result is failed, it indicates that the first conduction rate and / or the second conduction rate is unqualified. The specific display data is not limited here. The functional base 40 is also provided with a handle 42 to facilitate the movement of the functional base 40.

[0037] In some alternative embodiments, the functional base 40 is further provided with a plurality of function buttons.

[0038] Specifically, the function buttons on the functional base 40 include a power button, a start test button, an end test button, a set test parameter button, etc., which are not specifically limited here and can be set according to requirements.

[0039] In some alternative embodiments, a safety grating 11 is provided on the outer shell to play a safety protection role during the installation of single-machine testing.

[0040] In some alternative embodiments, the lifting module includes a cylinder 20, a guide post 21, and a fixing bracket 22. The cylinder 20 is configured to drive the fixing bracket 22 to move up and down along the guide post 21, and the fixing bracket 22 is used to fix the upper die assembly 30.

[0041] Specifically, referring to Figure 1 , the cylinder 20 pushes the fixing bracket 22 to move up and down along the guide post 21, thereby lifting and lowering the upper die assembly 30. The upper surface of the fixing bracket 22 is fixedly connected to the cylinder 20, and the lower surface of the fixing bracket 22 is fixed to the upper die assembly 30. Specifically, the upper die assembly 30 can be clamped, fixedly connected, or detachably connected to the fixing bracket 22. The corners of the fixing bracket 22 are provided with movable openings, and are movably connected to the guide post 21 through the movable openings.

[0042] In some alternative embodiments, the upper die assembly 30 includes an upper die fixing plate 301, an upper die PCB board 302, upper probes 306, an upper die bottom plate 304, and a floating pre-pressing plate 305. The first surface of the upper die fixing plate 301 is connected to the fixing bracket 22. The upper die PCB board 302 is located between the second surface of the upper die fixing plate 301 and the first surface of the upper die bottom plate 304. The first surface of the floating pre-pressing plate 305 is connected to the second surface of the upper die bottom plate 304. The second surface of the floating pre-pressing plate 305 is used to press the first surface of the mobile phone case 312. The first end of the upper probe 306 is connected to the upper die PCB board 302, and the second end of the upper probe 306 passes through the upper die bottom plate 304 and the floating pre-pressing plate 305 respectively and is connected to the first test point on the first surface of the mobile phone case 312.

[0043] Specifically, referring to Figure 2, the first surface (upper surface) of the upper die fixing plate 301 is connected to the lower surface of the fixing frame 22. Specifically, the fixing frame 22 is connected to the connection holes of the upper die fixing plate 301 through connecting rods. At the same time, the second surface (lower surface) of the upper die fixing plate 301 fixes the upper die PCB board 302 on the first surface of the upper die bottom plate 304. A plurality of fixed connection posts 307 are arranged on the first surface of the upper die bottom plate 304. After the fixed connection posts 307 are inserted into the connection holes of the upper die fixing plate 301, the upper die PCB board 302 is fixed. The first surface of the floating pre-pressing plate 305 is connected to the second surface of the upper die bottom plate 304. The second surface of the floating pre-pressing plate 305 is used to press the first surface of the mobile phone case 312, so as to fix the position of the mobile phone case 312. The first end of the upper probe 306 is connected to the upper die PCB board 302, and sends the data of the first surface of the tested mobile phone case 312 to the upper die PCB board 302. The upper die PCB board 302 sends the data to devices such as a resistance tester to obtain corresponding conduction rate data, and displays and processes it through a host computer. The second end of the upper probe 306 passes through the upper die bottom plate 304 and the floating pre-pressing plate 305 respectively and is connected to the first test point on the first surface of the mobile phone case 312, so as to test the conduction rate of the first surface of the mobile phone case 312.

[0044] In some alternative embodiments, a plurality of limiting blocks 303 are arranged on the upper die bottom plate 304, and a plurality of the upper probes 306 are provided. The plurality of the upper probes 306 are used to test a plurality of the first test points.

[0045] Specifically, referring to Figure 2 , the upper die bottom plate 304 positions the PCB board by restricting the position of the PCB board through a plurality of limiting blocks 303, so that the PCB board can be connected to the corresponding upper probe 306. A plurality of upper probes 306 are provided, so that a plurality of first test points on the first surface of the mobile phone case 312 can be tested, and the test efficiency is high.

[0046] In some alternative embodiments, a probe limiting plate is arranged between the upper die bottom plate 304 and the floating pre-pressing plate 305. The probe limiting plate is used to limit the implantation depth of the upper probe 306.

[0047] Specifically, the limiting holes on the probe limiting plate can limit the implantation depth of the upper probe 306, so as to prevent the upper probe 306 from being implanted too much and damaging the mobile phone case 312.

[0048] In some alternative embodiments, the lower die assembly includes a floating carrier plate 31, a lower probe 323, a lower die base plate 32, and a lower die PCB board 322. A test slot 311 is provided on the first surface of the floating carrier plate 31 for placing a mobile phone case 312. The second surface of the floating carrier plate 31 is connected to the first surface of the lower die base plate 32, and the second surface of the lower die base plate 32 is connected to the lower die PCB board 322. The first end of the lower probe 323 passes through the lower die base plate 32 and the floating carrier plate 31 respectively and is connected to a second test point on the second surface of the mobile phone case 312, and the second end of the lower probe 323 is connected to the lower die PCB board 322.

[0049] Specifically, referring to Figure 2 , a test slot 311 is provided on the first surface of the floating carrier plate 31. The test slot 311 is adapted to the mobile phone case 312. The mobile phone case 312 is placed through the test slot 311, and the mobile phone case 312 is tested within the test slot 311. The second surface of the floating carrier plate 31 is connected to the first surface of the lower die base plate 32, and the second surface of the lower die base plate 32 is connected to the lower die PCB board 322 to fix the position of the lower PCB board. The first end of the lower probe 323 passes through the lower die base plate 32 and the floating carrier plate 31 respectively and is connected to a second test point on the second surface of the mobile phone case 312, and the second end of the lower probe 323 is connected to the lower die PCB board 322. Thus, the conduction data of the second test point on the second surface of the mobile phone case 312 is tested through the lower probe 323 and transmitted to the lower die PCB board 322. The lower die PCB board 322 sends the conduction data to a corresponding resistance tester and other devices to obtain a corresponding second conduction rate, and the second conduction rate is displayed and processed through a host computer. Specifically, a plurality of lower probes 323 are provided, and multiple second test points can be tested simultaneously, with high test efficiency.

[0050] In some alternative embodiments, a barcode scanner 324 is connected to the lower die PCB board 322, and a barcode scanning opening 315 is provided in the test slot 311. The barcode scanner 324 is used to scan the barcode data of the mobile phone case 312 through the barcode scanning opening 315.

[0051] Specifically, the barcode scanner 324 scans the barcode data of the mobile phone case 312 through the barcode scanning opening 315 and sends it to the lower die PCB board 322 for processing. The barcode data includes the number or batch number information of the mobile phone case 312, and specific details are not limited. Positioning posts 313 are provided in the test slot 311 to position the mobile phone case 312. Symmetric pick-and-place openings 314 are provided on the side of the test slot 311 to facilitate the picking and placing of the mobile phone case 312. A limiting rod 321 is provided on the lower die base plate 32 to limit the position of the lower die PCB board 322.

[0052] Implementing the embodiments of the present utility model includes the following beneficial effects: The embodiments of the present utility model provide a test device for the conduction rate of a mobile phone case 312, including: a housing 10; a functional base 40, where the housing 10 is disposed on the functional base 40; a test module, including an upper die assembly 30 and a lower die assembly. The lower die assembly is connected to the first surface of the functional base 40. A mobile phone case 312 is placed between the upper die assembly 30 and the lower die assembly. The lower die assembly is used to test the first conduction rate of the first surface of the mobile phone case 312, and the upper die assembly 30 is used to test the second conduction rate of the second surface of the mobile phone case 312. Both the upper die assembly 30 and the lower die assembly are located inside the housing 10, and the first conduction rate and the second conduction rate are indicated by the functional base 40; a lifting module, disposed inside the housing 10, for lifting the upper die assembly 30. By lifting the upper die assembly 30 with the lifting module, the mobile phone case 312 is placed on and taken from the lower die assembly when the upper die assembly 30 rises, and the conduction rate of the mobile phone case 312 is tested when the upper die assembly 30 descends to press the lower die assembly. At the same time, the first surface and the second surface of the mobile phone case 312 are measured and indicated by the functional base 40. The test speed is fast, the test cost is low, and the test accuracy is high.

[0053] In a second aspect, the embodiments of the present utility model provide a test system for the conduction rate of a mobile phone case 312, including the above-mentioned test device for the conduction rate of a mobile phone case 312, a resistance tester, and a host computer. The test device for the conduction rate of a mobile phone case 312 is communicatively connected to the resistance tester, and the resistance tester is communicatively connected to the host computer.

[0054] It can be seen that the content in the above-mentioned test device embodiments is applicable to the present system embodiments. The functions specifically implemented by the present system embodiments are the same as those of the above-mentioned test device embodiments, and the beneficial effects achieved are also the same as those of the above-mentioned test device embodiments.

[0055] In the description of this specification, the description referring to the term "in a specific embodiment" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representation of the above term does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0056] The above is a specific description of the preferred embodiments of the present utility model, but the present utility model is not limited to the above embodiments. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A device for testing the conductivity of a mobile phone case, characterized in that: include: shell; A functional base, the housing being arranged on the functional base; A test module, comprising an upper mold assembly and a lower mold assembly, wherein the lower mold assembly is connected to a first surface of the functional base, a mobile phone case is placed between the upper mold assembly and the lower mold assembly, the lower mold assembly is used to test a first conductivity of the first surface of the mobile phone case, and the upper mold assembly is used to test a second conductivity of the second surface of the mobile phone case, the upper mold assembly and the lower mold assembly are both located inside the shell, and the first conductivity and the second conductivity are indicated by the functional base; A lifting module is arranged inside the shell and is used for lifting the upper mold assembly.

2. The mobile phone case conductivity testing device according to claim 1, characterized in that: The functional base is provided with a display screen, and the display screen is used to display the test results of the upper mold assembly and the lower mold assembly, and the test results indicate the first conductivity and the second conductivity.

3. The mobile phone case conductivity testing device according to claim 2, characterized in that: The functional base is also provided with a plurality of functional buttons.

4. The mobile phone case conductivity testing device according to claim 1, characterized in that: The lifting module includes a cylinder, a guide column and a fixing frame. The cylinder is used to drive the fixing frame to move up and down along the guide column, and the fixing frame is used to fix the upper mold assembly.

5. The mobile phone case conductivity testing device according to claim 4, characterized in that: The upper mold assembly includes an upper mold fixing plate, an upper mold PCB board, an upper probe, an upper mold bottom plate and a floating pre-pressing plate. The first surface of the upper mold fixing plate is connected to the fixing frame, the upper mold PCB board is located between the second surface of the upper mold fixing plate and the first surface of the upper mold bottom plate, the first surface of the floating pre-pressing plate is connected to the second surface of the upper mold bottom plate, the second surface of the floating pre-pressing plate is used to press the first surface of the mobile phone case, the first end of the upper probe is connected to the upper mold PCB board, and the second end of the upper probe is connected to the first test point on the first surface of the mobile phone case after passing through the upper mold bottom plate and the floating pre-pressing plate respectively.

6. The mobile phone case conductivity testing device according to claim 5, characterized in that: A plurality of limit blocks are arranged on the upper mold bottom plate, and a plurality of upper probes are arranged, and the plurality of upper probes are used to test a plurality of the first test points.

7. The mobile phone case conductivity testing device according to claim 5, characterized in that: A probe limiting plate is arranged between the upper mold bottom plate and the floating pre-compression plate, and the probe limiting plate is used to limit the implantation depth of the upper probe.

8. The mobile phone case conductivity testing device according to claim 1, characterized in that: The lower mold assembly includes a floating carrier, a lower probe, a lower mold bottom plate and a lower mold PCB board. The first surface of the floating carrier is provided with a test slot, and the test slot is used to place a mobile phone case. The second surface of the floating carrier is connected to the first surface of the lower mold bottom plate, and the second surface of the lower mold bottom plate is connected to the lower mold PCB board. The first end of the lower probe passes through the lower mold bottom plate and the floating carrier respectively and is connected to the second test point on the second surface of the mobile phone case, and the second end of the lower probe is connected to the lower mold PCB board.

9. The mobile phone case conductivity testing device according to claim 8, characterized in that: The lower mold PCB board is connected to a barcode scanning gun, the test slot is provided with a barcode scanning opening, and the barcode scanning gun is used to scan the barcode data of the mobile phone case through the barcode scanning opening.

10. A mobile phone case conductivity testing system, characterized in that: It comprises a mobile phone case conductivity test device, a resistance tester and a host computer as described in any one of claims 1 to 9, wherein the mobile phone case conductivity test device is communicatively connected to the resistance tester, and the resistance tester is communicatively connected to the host computer.

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