Silicon wafer end face detection device and silicon wafer detection system

Abstract

The utility model provides a silicon wafer end face detection device, which comprises a silicon wafer conveying line, a front end edge detection part and a rear end edge detection part, and is characterized in that the silicon wafer conveying line synchronously conveys a first silicon wafer and a second silicon wafer, and a front end edge detection station and a rear end edge detection station are arranged on a conveying path of the silicon wafer conveying line; the front-end edge detection part is used for detecting the front-end edges, the first front-end chamfers and the second front-end chamfers of the first silicon wafer and the second silicon wafer located at the front-end edge detection station; the rear end edge detection part detects the rear end edges, the first rear end chamfers and the second rear end chamfers of the first silicon wafer and the second silicon wafer located at the rear end edge detection station. According to the silicon wafer end face detection device provided by the invention, the front end edges and the rear end edges of the two silicon wafers can be detected at the same time. Compared with an existing silicon wafer end face detection device, the silicon wafer end face detection device improves the silicon wafer end face detection efficiency.

Description

Technical Field

[0001] This application relates to the field of photovoltaic cell production, and more specifically to a silicon wafer end face detection device and a silicon wafer detection system. Background Art

[0002] In the production process of solar silicon wafers, the silicon rods need to be first cut into silicon wafers, and then the silicon wafers are cleaned. After cleaning, the silicon wafers need to be detected. One of the silicon wafer detections is to detect the relative front and rear edge (two edges perpendicular to the conveying direction of the silicon wafer) of the silicon wafer to determine whether there are defects such as chipping and holes on the front and rear edge of the silicon wafer.

[0003] In the existing silicon wafer side detection device, its silicon wafer conveying line can only carry and convey one silicon wafer, and the silicon wafer conveying line conveys the silicon wafers one by one to the end face detection station for detection. The existing silicon wafer side detection device has a low detection efficiency. Summary of the Utility Model

[0004] In order to solve the above technical problems, this application provides a silicon wafer end face detection device and a silicon wafer detection system, which adopt the following technical solutions:

[0005] A silicon wafer end face detection device includes a silicon wafer conveying line, a front edge detection part and a rear edge detection part, wherein:

[0006] The silicon wafer conveying line is configured to synchronously convey a first silicon wafer and a second silicon wafer along a first direction, wherein the first silicon wafer and the second silicon wafer are placed side by side along a second direction, and the second direction is perpendicular to the first direction;

[0007] A front edge detection station and a rear edge detection station are sequentially arranged on the conveying path of the silicon wafer conveying line;

[0008] The front edge detection part is arranged at the front edge detection station and is configured to detect the front edge, the first front chamfer and the second front chamfer of the first silicon wafer and the second silicon wafer located at the front edge detection station, wherein the first front chamfer is the chamfer at the front end of the silicon wafer facing the first side of the silicon wafer conveying line, and the second front chamfer is the chamfer at the front end of the silicon wafer facing the second side of the silicon wafer conveying line;

[0009] The rear edge detection part is arranged at the rear edge detection station and is configured to detect the rear edge, the first rear chamfer and the second rear chamfer of the first silicon wafer and the second silicon wafer located at the rear edge detection station, wherein the first rear chamfer is the chamfer at the rear end of the silicon wafer facing the first side of the silicon wafer conveying line, and the second rear chamfer is the chamfer at the rear end of the silicon wafer facing the second side of the silicon wafer conveying line.

[0010] The silicon wafer end face detection device provided by this application can synchronously convey two silicon wafers. On the conveying path of the silicon wafer conveying line, a front edge detection station and a rear edge detection station are sequentially arranged. The two synchronously conveyed silicon wafers pass through the front edge detection station and the rear edge detection station successively. The front edge detection part arranged at the front edge detection station and the rear edge detection part arranged at the rear edge detection station can simultaneously detect the two silicon wafers. Compared with the existing silicon wafer end face detection device, the silicon wafer end face detection device of this application improves the detection efficiency of the silicon wafer end face.

[0011] In some embodiments, the silicon wafer conveying line includes two groups of parallel conveyor belts, and the two groups of conveyor belts are respectively used to convey the first silicon wafer and the second silicon wafer.

[0012] By setting the silicon wafer conveying line as two groups of parallel conveyor belts, the silicon wafer conveying line can synchronously convey the first silicon wafer and the second silicon wafer. In addition, the mutually adjacent sides of the first silicon wafer and the second silicon wafer can extend into the gap between the two groups of conveyor belts, thereby providing sufficient detection space for the mutually adjacent sides of the first silicon wafer and the second silicon wafer.

[0013] In some embodiments, the front edge detection part includes a front edge detection light source, a first front chamfer detection light source, a second front chamfer detection light source, a first front edge detection camera, a second front edge detection camera and a front reflector, wherein: the first front chamfer detection light source is located on the first side of the silicon wafer conveying line, the second front chamfer detection light source is located on the second side of the silicon wafer conveying line, the front edge detection light source is located above the silicon wafer conveying line, the first front edge detection camera and the second front edge detection camera are located above the silicon wafer conveying line, and the first front edge detection camera is close to the first side of the silicon wafer conveying line, and the second front edge detection camera is close to the second side of the silicon wafer conveying line; the first front chamfer detection light source is configured to irradiate the first front chamfers of the first silicon wafer and the second silicon wafer located at the front edge detection station, the second front chamfer detection light source is configured to irradiate the second front chamfers of the first silicon wafer and the second silicon wafer located at the front edge detection station, and the front edge detection light source is configured to irradiate the front edges of the first silicon wafer and the second silicon wafer located at the front edge detection station; the first silicon wafer reflects the received light to the first front edge detection camera through the front reflector, so as to use the first front edge detection camera to detect the first front chamfer, the second front chamfer and the front edge of the first silicon wafer; the second silicon wafer reflects the received light to the second front edge detection camera through the front reflector, so as to use the second front edge detection camera to detect the first front chamfer, the second front chamfer and the front edge of the second silicon wafer.

[0014] By setting up a front-end edge detection light source, a first front chamfer detection light source, a second front chamfer detection light source, a first front-end edge detection camera, a second front-end edge detection camera, and a front mirror, and arranging the positions of each component, the first front-end edge detection camera can receive the light reflected from the first front chamfer, the second front chamfer, and the front edge of the first silicon wafer, so as to complete the detection of the front edge and the two front chamfers of the first silicon wafer, and the second front-end edge detection camera can receive the light reflected from the first front chamfer, the second front chamfer, and the front edge of the second silicon wafer, so as to complete the detection of the front edge and the two front chamfers of the second silicon wafer.

[0015] In some embodiments, the first front chamfer detection light source includes a first front point light source and a second front point light source. Among them, the first front point light source is used to irradiate the first front chamfer of the first silicon wafer, and the second front point light source is used to irradiate the first front chamfer of the second silicon wafer; the second front chamfer detection light source includes a third front point light source and a fourth front point light source. Among them, the third front point light source is used to irradiate the second front chamfer of the first silicon wafer, and the fourth front point light source is used to irradiate the second front chamfer of the second silicon wafer.

[0016] By setting the first front chamfer detection light source to include a first front point light source and a second front point light source with different emission angles, the first front chamfer detection light source can accurately irradiate the first front chamfer of the first silicon wafer and the first front chamfer of the second silicon wafer, and finally improve the detection accuracy of the first front-end edge detection camera and the second front-end edge detection camera for the first front chamfer of the first silicon wafer and the first front chamfer of the second silicon wafer. Similarly, by setting the second front chamfer detection light source to include a third front point light source and a fourth front point light source with different emission angles, the second front chamfer detection light source can accurately irradiate the second front chamfer of the first silicon wafer and the second front chamfer of the second silicon wafer, and finally improve the detection accuracy of the first front-end edge detection camera and the second front-end edge detection camera for the second front chamfer of the first silicon wafer and the second front chamfer of the second silicon wafer.

[0017] In some embodiments, the first front point light source and the second front point light source are respectively installed on two first universal brackets located on the first side of the silicon wafer conveying line; the third front point light source and the fourth front point light source are respectively installed on two second universal brackets located on the second side of the silicon wafer conveying line.

[0018] The two first universal brackets are arranged on the first side of the silicon wafer conveying line, and the two second universal brackets are arranged on the second side of the silicon wafer conveying line, which will not occupy the space inside the silicon wafer conveying line, making the structure of the silicon wafer conveying line relatively compact.

[0019] In some embodiments, the front-end edge detection light source is a strip light source extending along the second direction.

[0020] Ensure that the front edge of the first silicon wafer and the front edge of the second silicon wafer are both irradiated by the front edge detection light source, so as to ensure the detection effect of the first front edge detection camera and the second front edge detection camera on the front edge of the first silicon wafer and the front edge of the second silicon wafer.

[0021] In some embodiments, the rear edge detection unit includes a rear edge detection light source, a first rear chamfer detection light source, a second rear chamfer detection light source, a first rear edge detection camera, a second rear edge detection camera, and a rear reflector, wherein: the first rear chamfer detection light source is located on the first side of the silicon wafer conveying line, the second rear chamfer detection light source is located on the second side of the silicon wafer conveying line, the rear edge detection light source is located above the silicon wafer conveying line, the first rear edge detection camera and the second rear edge detection camera are located above the silicon wafer conveying line, and the first rear edge detection camera is close to the first side of the silicon wafer conveying line, and the second rear edge detection camera is close to the second side of the silicon wafer conveying line; the first rear chamfer detection light source is configured to irradiate the first rear chamfer of the first silicon wafer and the second silicon wafer located at the rear edge detection station, the second rear chamfer detection light source is configured to irradiate the second rear chamfer of the first silicon wafer and the second silicon wafer located at the rear edge detection station, and the rear edge detection light source is configured to irradiate the rear edge of the first silicon wafer and the second silicon wafer located at the rear edge detection station; the first silicon wafer reflects the received light to the first rear edge detection camera through the rear reflector, so as to use the first rear edge detection camera to detect the first rear chamfer, the second rear chamfer, and the rear edge of the first silicon wafer; the second silicon wafer reflects the received light to the second rear edge detection camera through the rear reflector, so as to use the second rear edge detection camera to detect the first rear chamfer, the second rear chamfer, and the rear edge of the second silicon wafer.

[0022] By setting the rear edge detection light source, the first rear chamfer detection light source, the second rear chamfer detection light source, the first rear edge detection camera, the second rear edge detection camera, and the rear reflector, and arranging the positions of each component, the first rear edge detection camera can receive the light reflected by the first rear chamfer, the second rear chamfer, and the rear edge of the first silicon wafer, so as to complete the detection of the rear edge and the two rear chamfers of the first silicon wafer, and the second rear edge detection camera can receive the light reflected by the first rear chamfer, the second rear chamfer, and the rear edge of the second silicon wafer, so as to complete the detection of the rear edge and the two rear chamfers of the second silicon wafer.

[0023] In some embodiments, the first back-end chamfer detection light source includes a first back-end point light source and a second back-end point light source. The first back-end point light source is configured to irradiate the first back-end chamfer of the first silicon wafer, and the second back-end point light source is configured to irradiate the first back-end chamfer of the second silicon wafer. The second back-end chamfer detection light source includes a third back-end point light source and a fourth back-end point light source. The third back-end point light source is configured to irradiate the second back-end chamfer of the first silicon wafer, and the fourth back-end point light source is configured to irradiate the second back-end chamfer of the second silicon wafer.

[0024] By setting the first back-end chamfer detection light source to include the first back-end point light source and the second back-end point light source with different emission angles, the first back-end chamfer detection light source can accurately irradiate the first back-end chamfer of the first silicon wafer and the first back-end chamfer of the second silicon wafer, ultimately improving the detection accuracy of the first back-end edge detection camera and the second back-end edge detection camera for the first back-end chamfer of the first silicon wafer and the first back-end chamfer of the second silicon wafer. Similarly, by setting the second back-end chamfer detection light source to include the third back-end point light source and the fourth back-end point light source with different emission angles, the second back-end chamfer detection light source can accurately irradiate the second back-end chamfer of the first silicon wafer and the second back-end chamfer of the second silicon wafer, ultimately improving the detection accuracy of the first back-end edge detection camera and the second back-end edge detection camera for the second back-end chamfer of the first silicon wafer and the second back-end chamfer of the second silicon wafer.

[0025] In some embodiments, the first back-end point light source and the second back-end point light source are respectively installed on two third universal brackets located on the first side of the silicon wafer conveying line; the third back-end point light source and the fourth back-end point light source are respectively installed on two fourth universal brackets located on the second side of the silicon wafer conveying line.

[0026] The two third universal brackets are arranged on the first side of the silicon wafer conveying line, and the two fourth universal brackets are arranged on the second side of the silicon wafer conveying line, without occupying the space inside the silicon wafer conveying line, making the structure of the silicon wafer conveying line relatively compact.

[0027] Optionally, the back-end edge detection light source is a strip light source extending in the second direction.

[0028] Ensure that the back-end edges of the first silicon wafer and the second silicon wafer are both irradiated by the back-end edge detection light source, thereby ensuring the detection effect of the first back-end edge detection camera and the second back-end edge detection camera on the back-end edges of the first silicon wafer and the second silicon wafer.

[0029] This application also provides a silicon wafer detection system, which includes the above-mentioned silicon wafer end face detection device.

[0030] By setting the silicon wafer end face detection device, the silicon wafer detection system realizes the synchronous detection of the front edges and back edges of two silicon wafers, thereby improving the detection efficiency. Brief Description of the Drawings

[0031] Figure 1 is a schematic structural diagram of the silicon wafer end face detection device in the embodiment of the present application;

[0032] Figure 2 is a schematic diagram of the detection optical path of the silicon wafer end face detection device in the embodiment of the present application.

[0033] Figures 1 to 2 includes:

[0034] The silicon wafer conveyor line 1, the first group of conveyor belts 11, the second group of conveyor belts 12, the front edge detection part 51, the rear edge detection part 54, the front edge detection light source 511, the first front chamfer detection light source 512, the second front chamfer detection light source 513, the first front edge detection camera 514, the second front edge detection camera 515, the front emission mirror 516, the rear edge detection light source 541, the first rear chamfer detection light source 542, the second rear chamfer detection light source 543, the first rear edge detection camera 544, the second rear edge detection camera 545, the rear reflection mirror 546, the first front point light source 5121, the second front point light source 5122, the third front point light source 5131, the fourth front point light source 5132, the first rear point light source 5421, the second rear point light source 5422, the third rear point light source 5431, and the fourth rear point light source 5432. Detailed Description of the Embodiment

[0035] In order to make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0036] As Figures 1 to 2 shown, the silicon wafer end face detection device in the embodiment of the present application includes a silicon wafer conveyor line 1, a front edge detection part 51, and a rear edge detection part 54, wherein:

[0037] The silicon wafer conveyor line 1 is configured to synchronously convey the first silicon wafer 100 and the second silicon wafer 200 in the first direction (the X-axis direction in the figure), wherein the first silicon wafer 100 and the second silicon wafer 200 are placed side by side in the second direction (the Y-axis direction in the figure), and the second direction is perpendicular to the first direction.

[0038] The front edge detection station and the rear edge detection station are sequentially arranged on the conveying path of the silicon wafer conveyor line 1.

[0039] The front-end edge detection unit 51 is disposed at the front-end edge detection station and is configured to detect the front-end edges, the first front chamfer, and the second front chamfer of the first wafer 100 and the second wafer 200 located at the front-end edge detection station. Among them, the first front chamfer is the chamfer on the first side (such as Figure 2 the A side shown in Figure 2 ) facing the wafer conveying line at the front end of the wafer, and the second front chamfer is the chamfer on the second side (such as

[0040] ) facing the wafer conveying line at the front end of the wafer.

[0041] The wafer end face detection device provided by the embodiment of the present application can synchronously convey two wafers through the wafer conveying line 1. The front-end edge detection station and the rear-end edge detection station are sequentially arranged on the conveying path of the wafer conveying line. The two synchronously conveyed wafers pass through the front-end edge detection station and the rear-end edge detection station in sequence. The front-end edge detection unit 51 disposed at the front-end edge detection station and the rear-end edge detection unit 54 disposed at the rear-end edge detection station can simultaneously detect the two wafers. Compared with the existing wafer end face detection device, the wafer end face detection device of the present application improves the detection efficiency of the wafer end face.

[0042] Optionally, the wafer conveying line 1 includes two groups of parallel conveyor belts. Among them, the first group of conveyor belts 11 is used to convey the first wafer 100, and the second group of conveyor belts 12 is used to convey the second wafer 200.

[0043] By setting the wafer conveying line 1 into two groups of parallel conveyor belts, the wafer conveying line 1 can realize the synchronous conveying of the first wafer 100 and the second wafer 200. In addition, the mutually adjacent sides of the first wafer 100 and the second wafer 200 can extend into the gap between the two groups of conveyor belts, so that the mutually adjacent sides of the first wafer 100 and the second wafer 200 are fully exposed from the wafer conveying line 1, thereby providing a sufficient detection space for the mutually adjacent sides of the first wafer 100 and the second wafer 200.

[0044] Optionally, the front-end edge detection unit 51 includes a front-end edge detection light source 511, a first front chamfer detection light source 512, a second front chamfer detection light source 513, a first front-end edge detection camera 514, a second front-end edge detection camera 515, and a front reflector 516, where:

[0045] The first front chamfer detection light source 512 is located on the first side of the silicon wafer conveying line 1, the second front chamfer detection light source 513 is located on the second side of the silicon wafer conveying line 1, the front edge detection light source 511 is located above the silicon wafer conveying line 1, the first front edge detection camera 514 and the second front edge detection camera 515 are located above the silicon wafer conveying line, and the first front edge detection camera 514 is close to the first side of the silicon wafer conveying line 1, and the second front edge detection camera 515 is close to the second side of the silicon wafer conveying line 1.

[0046] The first front chamfer detection light source 512 is configured to irradiate the first front chamfers of the first silicon wafer 100 and the second silicon wafer 200 located at the front edge detection station, the second front chamfer detection light source 513 is configured to irradiate the second front chamfers of the first silicon wafer 100 and the second silicon wafer 200 located at the front edge detection station, and the front edge detection light source 511 is configured to irradiate the front edges of the first silicon wafer 100 and the second silicon wafer 200 located at the front edge detection station.

[0047] The first silicon wafer 100 reflects the received light through the front mirror 516 into the first front edge detection camera 514, so as to use the first front edge detection camera 514 to detect the first front chamfer, the second front chamfer and the front edge of the first silicon wafer 100;

[0048] The second silicon wafer 200 reflects the received light through the front mirror 516 into the second front edge detection camera 515, so as to use the second front edge detection camera 515 to detect the first front chamfer, the second front chamfer and the front edge of the second silicon wafer 200.

[0049] It can be seen that by setting the front edge detection light source 511, the first front chamfer detection light source 512, the second front chamfer detection light source 513, the first front edge detection camera 514, the second front edge detection camera 515 and the front mirror 516, and arranging the positions of the above components, the first front edge detection camera 514 can receive the light reflected by the first front chamfer, the second front chamfer and the front edge of the first silicon wafer 100, so as to complete the detection of the front edge and the two front chamfers of the first silicon wafer, and the second front edge detection camera 515 can synchronously receive the light reflected by the first front chamfer, the second front chamfer and the front edge of the second silicon wafer 200, so as to complete the detection of the front edge and the two front chamfers of the second silicon wafer 200.

[0050] Such as Figure 2As shown, optionally, the first front chamfer detection light source 512 includes a first front point light source 5121 and a second front point light source 5122. Among them, the first front point light source 5121 is used to irradiate the first front chamfer of the first silicon wafer 100, and the second front point light source 5122 is used to irradiate the first front chamfer of the second silicon wafer 200.

[0051] By setting the first front chamfer detection light source 512 to include the first front point light source 5121 and the second front point light source 5122 with different emission angles, the first front chamfer detection light source can accurately irradiate the first front chamfer of the first silicon wafer 100 and the first front chamfer of the second silicon wafer 200, and finally improve the detection accuracy of the first front edge detection camera 514 and the second front edge detection camera 515 for the first front chamfer of the first silicon wafer 100 and the first front chamfer of the second silicon wafer 200.

[0052] The second front chamfer detection light source 513 includes a third front point light source 5131 and a fourth front point light source 5132. Among them, the third front point light source 5131 is used to irradiate the second front chamfer of the first silicon wafer 100, and the fourth front point light source 5132 is used to irradiate the second front chamfer of the second silicon wafer 200.

[0053] By setting the second front chamfer detection light source 513 to include the third front point light source 5131 and the fourth front point light source 5132 with different emission angles, the second front chamfer detection light source 513 can accurately irradiate the second front chamfer of the first silicon wafer 100 and the second front chamfer of the second silicon wafer 200, and finally improve the detection accuracy of the first front edge detection camera 514 and the second front edge detection camera 515 for the second front chamfer of the first silicon wafer 100 and the second front chamfer of the second silicon wafer 200.

[0054] The first front point light source 5121 and the second front point light source 5122 are respectively installed on two first universal brackets located on the first side of the silicon wafer conveying line 1; the third front point light source 5131 and the fourth front point light source 5132 are respectively installed on two second universal brackets located on the second side of the silicon wafer conveying line 1.

[0055] The irradiation angles of the first front point light source 5121 and the second front point light source 5122 can be conveniently adjusted through the two first universal brackets; the irradiation angles of the third front point light source 5131 and the fourth front point light source 5132 can be conveniently adjusted through the two second universal brackets. No universal bracket is installed between the first group of conveyor belts 11 and the second group of conveyor belts 12 in the silicon wafer conveying line 1 to ensure the compact structure of the entire silicon wafer conveying line 1.

[0056] Optionally, the front-end edge detection light source 511 is a strip light source extending in the second direction. In this way, it can be ensured that the front-end edges of the first silicon wafer 100 and the second silicon wafer 200 are both irradiated by the front-end edge detection light source 511, so as to ensure the detection effect of the first front-end edge detection camera 514 and the second front-end edge detection camera 515 on the front-end edges of the first silicon wafer 100 and the second silicon wafer 200. Optionally, the rear-end edge detection unit 54 includes a rear-end edge detection light source 541, a first rear-end chamfer detection light source 542, a second rear-end chamfer detection light source 543, a first rear-end edge detection camera 544, a second rear-end edge detection camera 545, and a rear-end reflector 546, where: the first rear-end chamfer detection light source 542 is located on the first side of the silicon wafer conveying line 1, the second rear-end chamfer detection light source 543 is located on the second side of the silicon wafer conveying line 1, the rear-end edge detection light source 541 is located above the silicon wafer conveying line 1, the first rear-end edge detection camera 544 and the second rear-end edge detection camera 545 are located above the silicon wafer conveying line 1, and the first rear-end edge detection camera 544 is close to the first side of the silicon wafer conveying line 1, and the second rear-end edge detection camera 545 is close to the second side of the silicon wafer conveying line 1.

[0057] The first rear-end chamfer detection light source 542 is configured to irradiate the first rear-end chamfers of the first silicon wafer 100 and the second silicon wafer 200 located at the rear-end edge detection station, the second rear-end chamfer detection light source 543 is configured to irradiate the second rear-end chamfers of the first silicon wafer 100 and the second silicon wafer 200 located at the rear-end edge detection station, and the rear-end edge detection light source 541 is configured to irradiate the rear-end edges of the first silicon wafer 100 and the second silicon wafer 200 located at the rear-end edge detection station.

[0058] The first silicon wafer 100 reflects the received light to the first rear-end edge detection camera 544 through the rear-end reflector 546, so as to use the first rear-end edge detection camera 544 to detect the first rear-end chamfer, the second rear-end chamfer, and the rear-end edge of the first silicon wafer 100; the second silicon wafer 200 reflects the received light to the second rear-end edge detection camera 545 through the rear-end reflector 546, so as to use the second rear-end edge detection camera 545 to detect the first rear-end chamfer, the second rear-end chamfer, and the rear-end edge of the second silicon wafer 200.

[0059] It can be seen that by setting the rear-end edge detection light source 541, the first rear-end chamfer detection light source 542, the second rear-end chamfer detection light source 543, the first rear-end edge detection camera 544, the second rear-end edge detection camera 545 and the rear-end reflector 546, and arranging the positions of the above components, the first rear-end edge detection camera 544 can receive the light reflected by the first rear-end chamfer, the second rear-end chamfer and the rear-end edge of the first silicon wafer 100, so as to complete the detection of the rear-end edge and the two rear-end chamfers of the first silicon wafer 100, and the second rear-end edge detection camera 545 can receive the light reflected by the first rear-end chamfer, the second rear-end chamfer and the rear-end edge of the second silicon wafer 200, so as to complete the detection of the rear-end edge and the two rear-end chamfers of the second silicon wafer 200.

[0060] As Figure 2 shown, optionally, the first rear-end chamfer detection light source 542 includes a first rear-end point light source 5421 and a second rear-end point light source 5422. The first rear-end point light source 5421 is configured to irradiate the first rear-end chamfer of the first silicon wafer 100, and the second rear-end point light source 5422 is configured to irradiate the first rear-end chamfer of the second silicon wafer 200.

[0061] By setting the first rear-end chamfer detection light source 542 to include the first rear-end point light source 5421 and the second rear-end point light source 5422 with different emission angles, the first rear-end chamfer detection light source 542 can accurately irradiate the first rear-end chamfer of the first silicon wafer 100 and the first rear-end chamfer of the second silicon wafer 200, and finally improve the detection accuracy of the first rear-end edge detection camera 544 and the second rear-end edge detection camera 545 for the first rear-end chamfer of the first silicon wafer 100 and the first rear-end chamfer of the second silicon wafer 200.

[0062] The second rear-end chamfer detection light source 543 includes a third rear-end point light source 5431 and a fourth rear-end point light source 5432. The third rear-end point light source 5431 is configured to irradiate the second rear-end chamfer of the first silicon wafer 100, and the fourth rear-end point light source 5432 is configured to irradiate the second rear-end chamfer of the second silicon wafer 200.

[0063] By setting the second rear-end chamfer detection light source 543 to include the third rear-end point light source 5431 and the fourth rear-end point light source 5432 with different emission angles, the second rear-end chamfer detection light source 543 can accurately irradiate the second rear-end chamfer of the first silicon wafer 100 and the second rear-end chamfer of the second silicon wafer 200, and finally improve the detection accuracy of the first rear-end edge detection camera 544 and the second rear-end edge detection camera 545 for the second rear-end chamfer of the first silicon wafer 100 and the second rear-end chamfer of the second silicon wafer 200.

[0064] The first rear endpoint light source 5421 and the second rear endpoint light source 5422 are respectively installed on two third universal brackets located on the first side of the silicon wafer conveying line 1; the third rear endpoint light source 5431 and the fourth rear endpoint light source 5432 are respectively installed on two fourth universal brackets located on the second side of the silicon wafer conveying line 1.

[0065] The irradiation angles of the first rear endpoint light source 5421 and the second rear endpoint light source 5422 can be conveniently adjusted through the two third universal brackets; the irradiation angles of the third rear endpoint light source 5431 and the fourth rear endpoint light source 5432 can be conveniently adjusted through the two fourth universal brackets. All the universal brackets in this application are existing structures, so no detailed description is made.

[0066] Optionally, the rear edge detection light source 541 is a strip light source extending along the second direction. In this way, it can be ensured that the rear edges of the first silicon wafer 100 and the second silicon wafer 200 are both irradiated by the rear edge detection light source 541, so as to ensure the detection effects of the first rear edge detection camera 544 and the second rear edge detection camera 545 on the rear edges of the first silicon wafer 100 and the second silicon wafer 200.

[0067] To ensure the reflection effects of the front mirror 516 and the rear mirror 546, the first group of conveyor belts 11 and the second group of conveyor belts 12 in the silicon wafer conveying line 1 are both composed of multiple conveying sections butt-jointed. The front mirror 516 and the rear mirror 546 are respectively arranged at the gaps between adjacent conveying sections. The heights of the front mirror 516 and the rear mirror 546 are both lower than the conveying surface of the silicon wafer conveying line 1, which not only ensures the reflection effects of the front mirror 516 and the rear mirror 546, but also does not affect the normal conveying of the first silicon wafer 100 and the second silicon wafer 200.

[0068] The embodiment of the present application also provides a silicon wafer detection system, which includes the silicon wafer end face detection device provided in any one of the above embodiments. By setting the silicon wafer end face detection device, the silicon wafer detection system realizes the synchronous detection of the front edges and rear edges of two silicon wafers, thereby improving the detection efficiency.

[0069] The above text has described the present application in sufficient detail with a certain particularity. Those of ordinary skill in the art should understand that the descriptions in the embodiments are only exemplary. All changes made without departing from the true spirit and scope of the present application should fall within the protection scope of the present application. The scope of protection required by the present application is defined by the claims described, rather than by the above descriptions in the embodiments. And, the embodiments mentioned in the present application are not limited to being implemented individually, and some embodiments can also be implemented in combination.

Claims

1. A silicon wafer end face detection device, characterized in that: The silicon wafer end face detection device comprises a silicon wafer conveying line, a front edge detection unit and a rear edge detection unit, wherein: The silicon wafer conveying line is configured to convey a first silicon wafer and a second silicon wafer synchronously along a first direction, wherein the first silicon wafer and the second silicon wafer are placed side by side along a second direction, and the second direction is perpendicular to the first direction; A front edge detection station and a rear edge detection station are sequentially arranged on the conveying path of the silicon wafer conveying line; The front end edge detection unit is disposed at the front end edge detection station, and is configured to detect the front end edge, the first front end chamfer, and the second front end chamfer of the first silicon wafer and the second silicon wafer located at the front end edge detection station, wherein the first front end chamfer is the chamfer of the front end of the silicon wafer facing the first side of the silicon wafer conveying line, and the second front end chamfer is the chamfer of the front end of the silicon wafer facing the second side of the silicon wafer conveying line; The rear end edge detection unit is disposed at the rear end edge detection station, and is configured to detect the rear end edge, the first rear end chamfer and the second rear end chamfer of the first silicon wafer and the second silicon wafer located at the rear end edge detection station, wherein the first rear end chamfer is the chamfer of the rear end of the silicon wafer toward the first side of the silicon wafer conveying line, and the second rear end chamfer is the chamfer of the rear end of the silicon wafer toward the second side of the silicon wafer conveying line.

2. The silicon wafer end face detection device according to claim 1, characterized in that: The silicon wafer conveying line includes two sets of conveying belts arranged in parallel, and the two sets of conveying belts are used to convey the first silicon wafer and the second silicon wafer respectively.

3. The silicon wafer end face detection device according to claim 1, characterized in that: The front edge detection unit includes a front edge detection light source, a first front chamfer detection light source, a second front chamfer detection light source, a first front edge detection camera, a second front edge detection camera and a front reflector, wherein: The first front chamfer detection light source is located at a first side of the silicon wafer conveyor line, the second front chamfer detection light source is located at a second side of the silicon wafer conveyor line, the front edge detection light source is located above the silicon wafer conveyor line, the first front edge detection camera and the second front edge detection camera are located above the silicon wafer conveyor line, and the first front edge detection camera is close to the first side of the silicon wafer conveyor line, and the second front edge detection camera is close to the second side of the silicon wafer conveyor line; The first front chamfer detection light source is configured to illuminate the first front chamfers of the first silicon wafer and the second silicon wafer located at the front edge detection station, the second front chamfer detection light source is configured to illuminate the second front chamfers of the first silicon wafer and the second silicon wafer located at the front edge detection station, and the front edge detection light source is configured to illuminate the front edges of the first silicon wafer and the second silicon wafer located at the front edge detection station; The first silicon wafer reflects the received light to the first front edge detection camera through the front reflector, so as to detect the first front chamfer, the second front chamfer and the front edge of the first silicon wafer by using the first front edge detection camera; The second silicon wafer reflects the received light to the second front end edge detection camera through the front end reflector, so as to utilize the second front end edge detection camera to detect the first front end chamfer, the second front end chamfer and the front end edge of the second silicon wafer.

4. The silicon wafer end face detection device according to claim 3, characterized in that: The first front chamfer detection light source includes a first front point light source and a second front point light source, wherein the first front point light source is configured to illuminate the first front chamfer of the first silicon wafer, and the second front point light source is configured to illuminate the first front chamfer of the second silicon wafer; The second front chamfer detection light source includes a third front point light source and a fourth front point light source, wherein the third front point light source is configured to illuminate the second front chamfer of the first silicon wafer, and the fourth front point light source is configured to illuminate the second front chamfer of the second silicon wafer.

5. The silicon wafer end face detection device according to claim 4, characterized in that: The first front point light source and the second front point light source are respectively and correspondingly mounted on two first universal brackets located on the first side of the silicon wafer conveyor line; The third front end point light source and the fourth front end point light source are respectively mounted on two second universal brackets located on the second side of the silicon wafer conveyor line.

6. The silicon wafer end face detection device according to claim 3, characterized in that: The front edge detection light source is a bar-shaped light source extending along the second direction.

7. The silicon wafer end face detection device according to claim 1, characterized in that: The rear edge detection unit includes a rear edge detection light source, a first rear chamfer detection light source, a second rear chamfer detection light source, a first rear edge detection camera, a second rear edge detection camera and a rear reflector, wherein: The first rear-end chamfer detection light source is located at a first side of the silicon wafer conveying line, the second rear-end chamfer detection light source is located at a second side of the silicon wafer conveying line, the rear-end edge detection light source is located above the silicon wafer conveying line, the first rear-end edge detection camera and the second rear-end edge detection camera are located above the silicon wafer conveying line, and the first rear-end edge detection camera is close to the first side of the silicon wafer conveying line, and the second rear-end edge detection camera is close to the second side of the silicon wafer conveying line; The first rear chamfer detection light source is configured to illuminate the first rear chamfers of the first silicon wafer and the second silicon wafer located at the rear edge detection station, the second rear chamfer detection light source is configured to illuminate the second rear chamfers of the first silicon wafer and the second silicon wafer located at the rear edge detection station, and the rear edge detection light source is configured to illuminate the rear edges of the first silicon wafer and the second silicon wafer located at the rear edge detection station; The first silicon wafer reflects the received light to the first rear edge detection camera through the rear reflector, so as to detect the first rear chamfer, the second rear chamfer and the rear edge of the first silicon wafer using the first rear edge detection camera; The second silicon wafer reflects the received light to the second rear end edge detection camera through the rear end reflector, so as to utilize the second rear end edge detection camera to detect the first rear end chamfer, the second rear end chamfer and the rear end edge of the second silicon wafer.

8. The silicon wafer end face detection device according to claim 7, characterized in that: The first rear chamfer detection light source includes a first rear end point light source and a second rear end point light source, the first rear end point light source is configured to illuminate the first rear chamfer of the first silicon wafer, and the second rear end point light source is configured to illuminate the first rear chamfer of the second silicon wafer; The second back-end chamfer detection light source includes a third back-end point light source and a fourth back-end point light source, the third back-end point light source is configured to illuminate the second back-end chamfer of the first silicon wafer, and the fourth back-end point light source is configured to illuminate the second back-end chamfer of the second silicon wafer.

9. The silicon wafer end face detection device according to claim 8, characterized in that: The first rear end point light source and the second rear end point light source are respectively and correspondingly mounted on two third universal brackets located on the first side of the silicon wafer conveyor line; The third rear end point light source and the fourth rear end point light source are respectively mounted on two fourth universal brackets located on the second side of the silicon wafer conveyor line.

10. The silicon wafer end face detection device according to claim 7, characterized in that: The rear edge detection light source is a bar-shaped light source extending along the second direction.

11. A silicon wafer inspection system, characterized in that: It comprises the silicon wafer end face detection device as described in any one of claims 1 to 10.

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