Isolating piece, antenna sub-array and antenna

Abstract

The utility model relates to the technical field of communication devices, and provides a spacer, an antenna sub-array and an antenna. Wherein the isolation piece comprises an adsorption plate, two isolation plates and two mounting plates; the two opposite side edges of the adsorption plate are connected with the two isolation plates correspondingly, the two isolation plates are oppositely arranged and extend in the direction away from the adsorption plate so that the two isolation plates can be arranged on the same side of the adsorption plate, and the two isolation plates can weaken interference of radiation signals on the two sides of the isolation plates; the two mounting plates are connected to the ends, away from the adsorption plate, of the two isolation plates correspondingly. The adsorption plate is used for being connected with a suction nozzle of a chip mounter, and the two mounting plates are used for being connected with a circuit board. The adsorption plate is arranged at one end of the isolation plate, and the mounting plate is arranged at the other end of the isolation plate, so that the isolation plate can be grabbed by the suction nozzle of the chip mounter to be transferred to the circuit board and then mounted on the circuit board through the mounting plate, the isolation piece is suitable for automatic mounting of the chip mounter, and the mounting efficiency of the isolation piece is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of communication devices, and particularly to a spacer, an antenna sub-array, and an antenna. Background Art

[0002] Modern mobile communication systems usually include a multiple-input multiple-output array antenna composed of multiple antenna sub-arrays. Signal interference is likely to occur between multiple sub-arrays. Therefore, a spacer is provided between adjacent sub-arrays. The spacer includes two parallel spacer plates and a connecting plate. The connecting plate is connected between the two spacer plates, making the spacer in a U-shaped structure. The connecting plate is installed on the circuit board where the base station antenna is located, so that the two spacer plates are arranged between two adjacent base station antennas to isolate the signals transmitted by the adjacent base station antennas. However, when the U-shaped spacer is installed on the circuit board of the base station antenna, it is necessary to manually attach the connecting plate of the U-shaped spacer to the circuit board for welding operation. The operation of installing the spacer on the circuit board is cumbersome and inefficient. Summary of the Utility Model

[0003] In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a spacer, an antenna sub-array, and an antenna.

[0004] The first aspect of the present disclosure provides a spacer, including an adsorption plate, two spacer plates, and two mounting plates;

[0005] The two opposite side edges of the adsorption plate are respectively connected to the two spacer plates. The two spacer plates are arranged oppositely and both extend in a direction away from the adsorption plate, so that the two spacer plates are arranged on the same side of the adsorption plate. The two mounting plates are respectively connected to the ends of the two spacer plates away from the adsorption plate;

[0006] The adsorption plate is used to connect with the suction nozzle of the pick-and-place machine, and the two mounting plates are used to connect with the circuit board.

[0007] Optionally, the two mounting plates extend in a direction towards each other, and the two mounting plates are spaced apart in the direction towards each other to form a gap between the two mounting plates.

[0008] Optionally, the adsorption plate, the two spacer plates, and the two mounting plates are of an integrated structure.

[0009] Optionally, the adsorption plate and the mounting plate are arranged at both ends of the spacer plate along the height direction of the spacer plate;

[0010] The height dimension of the spacer plate is greater than the distance dimension between the two spacer plates.

[0011] The second aspect of the present disclosure provides an antenna sub-array, including a circuit board, a plurality of radiation units, and a plurality of the isolation sheets as described in any one of the above;

[0012] The plurality of radiation units are arranged at intervals on the circuit board along a first direction, and a plurality of the isolation sheets arranged along the first direction are respectively connected to opposite two side edges of the circuit board along a second direction;

[0013] The two mounting plates of the isolation sheet are welded to the circuit board, so that the two isolation plates and the radiation units are arranged on the same side of the circuit board;

[0014] The first direction is perpendicular to the second direction.

[0015] Optionally, a plurality of the isolation sheets arranged along the second direction are respectively provided on opposite two side edges of the circuit board along the first direction, and at least one of the isolation sheets is provided between every two adjacent radiation units along the first direction.

[0016] Optionally, a plurality of soldering areas are provided on the circuit board, the plurality of soldering areas are arranged in one-to-one correspondence with the plurality of isolation sheets, solder paste is provided on the soldering areas, and the mounting plate is welded to the soldering areas through the solder paste.

[0017] Optionally, rubber strips are provided on opposite two side edges of the soldering area, and opposite two side edges of the mounting plate perpendicular to the relative direction of the two isolation plates are respectively connected to the two rubber strips.

[0018] Optionally, the circuit board includes a ground layer, a substrate layer, and a circuit layer;

[0019] The ground layer is connected to one side of the substrate layer, the circuit layer is connected to the other side of the substrate layer, and the radiation units and the isolation sheets are all arranged on the circuit layer.

[0020] The third aspect of the present disclosure provides an antenna, including a plurality of the antenna sub-arrays as described in the above item;

[0021] A plurality of circuit boards are arranged in sequence and connected to each other along the second direction.

[0022] The technical solution provided by the present disclosure has the following advantages compared with the prior art:

[0023] The isolation sheet, antenna sub-array and antenna provided by the present disclosure are configured such that the isolation sheet includes an adsorption plate, two isolation plates and two mounting plates; the two opposite side edges of the adsorption plate are respectively connected to the two isolation plates, the two isolation plates are arranged opposite to each other and both extend away from the adsorption plate, so that the two isolation plates are disposed on the same side of the adsorption plate, and the two isolation plates can reduce the interference of the radiation signals on both sides of the isolation sheet. The two mounting plates are respectively connected to one ends of the two isolation plates away from the adsorption plate; the adsorption plate is used to connect with the nozzle of the mounter, enabling the mounter to grasp the adsorption plate through the nozzle, so that the bonding sheet can move the isolation sheet to install the isolation sheet on the circuit board. The two mounting plates are used to connect with the circuit board. When the nozzle is connected to the adsorption plate, the two mounting plates are located on the side of the adsorption plate facing away from the nozzle, facilitating the two mounting plates to be attached to the circuit board for soldering operations when the nozzle drives the isolation sheet to move towards the circuit board. By providing an adsorption plate at one end of the isolation plate and mounting plates at the other end, the isolation plate can be grasped by the nozzle of the mounter and transferred to the circuit board, and then installed on the circuit board through the mounting plates, making the isolation sheet suitable for automatic installation by the mounter and improving the installation efficiency of the isolation sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are incorporated herein and constitute a part of this specification, showing embodiments consistent with the present disclosure and, together with the specification, are used to explain the principles of the present disclosure.

[0025] To more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a schematic structural diagram of the isolation sheet according to the embodiment of the present disclosure;

[0027] Figure 2 It is a perspective structural schematic diagram of the antenna sub-array according to the embodiment of the present disclosure;

[0028] Figure 3 It is an enlarged partial structural view of the antenna sub-array according to the embodiment of the present disclosure;

[0029] Figure 4 It is a top view of the antenna according to the embodiment of the present disclosure.

[0030] Among them, 11, isolation plate; 12, adsorption plate; 13, mounting plate; 21, circuit board; 22, radiation unit; 23, welding area; 231, rubber strip. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] To more clearly understand the above objects, features, and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other.

[0032] In the following description, many specific details are set forth to facilitate a thorough understanding of the present disclosure, but the present disclosure may be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all the embodiments.

[0033] Referring to Figures 1 to 4 As shown, in the first aspect of the embodiments of the present disclosure, an isolation sheet is provided, which includes an adsorption plate 12, two isolation plates 11, and two mounting plates 13; two opposite side edges of the adsorption plate 12 are respectively connected to the two isolation plates 11, the two isolation plates 11 are oppositely arranged and both extend in a direction away from the adsorption plate 12, so that the two isolation plates 11 are arranged on the same side of the adsorption plate 12, and the two mounting plates 13 are respectively connected to one ends of the two isolation plates 11 away from the adsorption plate 12; the adsorption plate 12 is used to connect with the suction nozzle of a placement machine, and the two mounting plates 13 are used to connect with a circuit board 21.

[0034] Specifically, the two isolation plates 11 can be selected to be parallel and oppositely arranged. It can be selected that on the length direction of the adsorption plate 12, two opposite side edges of the adsorption plate 12 are respectively connected to one isolation plate 11, the two isolation plates 11 are both perpendicular to the adsorption plate 12, and the two isolation plates 11 are both connected to the same side of the adsorption plate 12. Of course, it can also be selected that on the width direction of the adsorption plate 12, two opposite side edges of the adsorption plate 12 are respectively connected to one isolation plate 11.

[0035] The two mounting plates 13 are respectively arranged at one ends of the two isolation plates 11 away from the adsorption plate 12. It can be selected that the mounting plates 13 are parallel to the adsorption plate 12, and the two mounting plates 13 can extend in a direction approaching each other. Of course, it can also be selected that the two mounting plates 13 extend in a direction away from each other.

[0036] When the above-mentioned spacer is installed, the mounting plate 13 is connected to the circuit board, and the adsorption plate 12 is on the side of the mounting plate 13 facing away from the circuit board; the mounter has a movable robotic arm, and a suction nozzle can be selectively arranged on the robotic arm. The suction nozzle is attached to the side of the adsorption plate 12 facing away from the mounting plate 13, and the suction nozzle is adsorbed and connected to the adsorption plate 12, so that the robotic arm can drive the spacer to move. Moreover, the suction nozzle is connected to the side of the adsorption plate 12 facing away from the mounting plate 13. When the robotic arm drives the spacer to move to a position opposite to the circuit board, the mounting plate 13 can be arranged facing the circuit board, so that the robotic arm drives the spacer plate to move towards the circuit board, and then the mounting plate 13 can be attached to the circuit board for welding operation, enabling the spacer plate to be grabbed by the suction nozzle of the mounter and installed on the circuit board, realizing the automatic installation operation of the spacer and improving the installation efficiency of the spacer.

[0037] When the spacer provided by the embodiment of the present disclosure is specifically used, the spacer is placed in the area to be grabbed, the circuit board is placed on the mounter, the robotic arm of the mounter moves to the side of the adsorption plate 12 facing away from the mounting plate 13, and the suction nozzle of the robotic arm is attached to the adsorption plate 12 and adsorbed and connected to the adsorption plate 12; the robotic arm drives the adsorption plate 12 to move to a position opposite to the circuit board, makes the mounting plate 13 face the circuit board, and the robotic arm drives the spacer plate to move towards the circuit board, then the mounting plate 13 can be attached to the circuit board, and the mounter welds and connects the mounting plate and the circuit board; after the spacer plate is installed, the suction nozzle is disconnected from the adsorption plate 12, and the robotic arm grabs the next spacer and repeats the above steps for installation operation.

[0038] The spacer provided by the embodiment of the present disclosure includes an adsorption plate 12, two spacer plates 11 and two mounting plates 13; two spacer plates 11 are respectively connected to the opposite side edges of the adsorption plate 12, and the two spacer plates 11 are arranged oppositely and both extend in a direction away from the adsorption plate 12, so that the two spacer plates 11 are arranged on the same side of the adsorption plate 12. The two spacer plates 11 can weaken the interference of the radiation signals on both sides of the spacer. The two mounting plates 13 are respectively connected to the ends of the two spacer plates 11 away from the adsorption plate 12; the adsorption plate 12 is used to connect with the suction nozzle of the mounter, so that the mounter can grab the adsorption plate 12 through the suction nozzle, so that the bonding sheet can move the spacer to install the spacer on the circuit board. The two mounting plates 13 are used to connect with the circuit board 21. When the suction nozzle is connected to the adsorption plate 12, the two mounting plates 13 are located on the side of the adsorption plate 12 facing away from the suction nozzle, which is convenient for the two mounting plates 13 to be attached to the circuit board for welding operation when the suction nozzle drives the spacer towards the circuit board. By arranging the adsorption plate 12 at one end of the spacer plate 11 and the mounting plate 13 at the other end, the spacer plate 11 can be grabbed by the suction nozzle of the mounter and transferred to the circuit board, and then installed on the circuit board through the mounting plate, making the spacer suitable for automatic installation by the mounter and improving the installation efficiency of the spacer.

[0039] Refer toFigure 1 As shown, in some embodiments, the two mounting plates 13 extend towards each other, and the two mounting plates 13 are spaced apart in the direction of approaching each other to form a gap between the two mounting plates 13. With this arrangement, the two mounting plates 13 extend towards each other, so that the two mounting plates 13 are located between the two partition plates 11, reducing the occupied space of the separator sheet and facilitating the layout of the separator sheet on the circuit board; when the mounting plate 13 is attached to the solder paste, the gap between the two mounting plates 13 can be used to observe the filling degree of the solder paste on the surface of the mounting plate 13, ensuring the welding strength between the subsequent mounting plate 13 and the circuit board.

[0040] Specifically, it can be selected that the two mounting plates 13 extend towards each other in a direction parallel to the adsorption plate 12, and a gap is formed between the two mounting plates 13. When the mounting plate 13 is welded to the circuit board, solder paste is usually applied to the position on the circuit board where the separator sheet needs to be installed. The two mounting plates 13 are first attached to the solder paste, and through the gap between the two mounting plates 13, it can be observed whether the solder paste can fill the side of the mounting plate 13 facing the circuit board, so as to ensure that the subsequent mounting plate 13 is fully welded to the circuit board through the solder paste.

[0041] Refer to Figure 1 As shown, in some embodiments, the adsorption plate 12, the two partition plates 11 and the two mounting plates 13 are of an integrated structure. With this arrangement, the separator sheet is formed by an integrated structure manufacturing, simplifying the manufacturing difficulty of the separator sheet and facilitating the mass production of the separator sheet.

[0042] Specifically, it can be selected that the adsorption plate 12, the two partition plates 11 and the two mounting plates 13 are formed by bending a metal plate through multiple bends, so that the adsorption plate 12, the two partition plates 11 and the two mounting plates 13 are of an integrated structure; of course, it can also be selected that the adsorption plate 12, the two partition plates 11 and the two mounting plates 13 are formed by casting in a mold, so that the adsorption plate 12, the two partition plates 11 and the two mounting plates 13 are of an integrated structure.

[0043] Refer to Figure 1 As shown, in some embodiments, the adsorption plate 12 and the mounting plate 13 are arranged at both ends of the partition plate 11 along the height direction of the partition plate 11; the height dimension of the partition plate 11 is greater than the distance dimension between the two partition plates 11. With this arrangement, the distance between the two partition plates 11 is smaller, thus reducing the area size required for installing the separator sheet on the circuit board and facilitating the layout of the separator sheet on the circuit board.

[0044] Specifically, when the isolation plate is installed on the circuit board, the direction perpendicular to the circuit board is the height direction of the isolation plate 11. When the height dimension of the isolation plate 11 is greater than the distance dimension between the two isolation plates 11, the isolation plate forms a rectangular structural member on the circuit board, and the rectangular structural member formed by the isolation plate extends in a direction perpendicular to the circuit board.

[0045] The above-mentioned isolation plate 11 can be selected as a square plate body, the length dimension of the isolation plate 11 is equal to the height dimension of the isolation plate 11 and is 8 mm, and the distance between the two isolation plates 11 is equal to half of the height of the isolation plate 11, that is, the distance between the two isolation plates 11 is 4 mm.

[0046] Reference Figures 2 to 4 As shown, the second aspect of the embodiment of the present disclosure provides an antenna subarray, including a circuit board 21, a plurality of radiating units 22 and a plurality of isolation plates as described above; the plurality of radiating units 22 are arranged on the circuit board 21 at intervals along a first direction, and a plurality of isolation plates arranged along the first direction are respectively arranged on the two side edges opposite to each other along the second direction of the circuit board 21; the two mounting plates 13 of the isolation plates are welded and connected to the circuit board 21 so that the two isolation plates 11 and the radiating units 22 are arranged on the same side of the circuit board 21; the first direction is perpendicular to the second direction.

[0047] In order to reduce the signal infection of the radiation unit on the circuit board, the traditional antenna subarray needs to set a long isolation strip at the edge of the circuit board to isolate the external signal interference through the isolation strip. However, the circuit board usually needs to leave an avoidance area for subsequent processing and installation. The avoidance area will interfere with the isolation strip. Therefore, the length of the isolation strip needs to be adjusted, so that the size of the isolation strip used in one antenna subarray is difficult to apply to another antenna subarray. In the antenna subarray provided by the present application, multiple isolation sheets arranged along a straight line are set at the edge of the circuit board 21 to form a structure similar to the isolation strip. When the avoidance area left by the circuit board 21 for processing and installation is used, it is only necessary to remove the isolation sheet at the corresponding position without changing the size of the isolation sheet itself. By flexibly adjusting the installation positions of multiple isolation sheets on the circuit board 21, the isolation sheet can not only reduce the interference of the radiation unit 22, but also avoid the avoidance area of ​​the circuit board 21, and the isolation sheet has a wide range of application. So that the isolation sheet can be used on antenna subarrays of different types, sizes and designs.

[0048] Specifically, Figure 2 , Figure 3 and Figure 4The direction indicated by the arrow is the first direction a and the second direction b; the circuit board 21 can be selected as a rectangular plate body extending along the first direction a, and the radiation units 22 are parts for emitting signals. A plurality of radiation units 22 are arranged at intervals along the first direction a on the circuit board 21, so that the circuit board 21 can control the plurality of radiation units 22 to emit signals; the frequencies of the signals emitted by the plurality of radiation units 22 can be the same, and of course, the frequencies of the signals emitted by the plurality of radiation units 22 can also be different.

[0049] On the two opposite side edges of the above-mentioned circuit board 21 along the second direction b, a plurality of isolation sheets are respectively connected, so that there are isolation sheets on both sides of the plurality of radiation units 22 along the second direction b, thereby enabling the isolation sheets to weaken the mutual interference between the signals of the radiation units 22 and the outside of the circuit board 21.

[0050] The above-mentioned plurality of isolation sheets can be selected to be arranged at equal intervals along the first direction a, so that the plurality of isolation sheets can form a strip-like structure to weaken the signal interference received by the radiation units 22; of course, it can also be selected that the distances between some of the isolation sheets along the first direction a are relatively close to form isolation sheet groups, and the plurality of isolation sheet groups are arranged and spaced along the first direction a, so that the plurality of isolation sheet groups can avoid the avoidance areas on the circuit board 21.

[0051] By arranging a plurality of isolation sheets on the two opposite side edges of the circuit board 21 along the second direction, the plurality of isolation sheets form an approximate strip-like structure on the edge of the circuit board 21. When there are avoidance areas left for the processing and installation of the circuit board 21, only the isolation sheets at the corresponding positions need to be removed, and there is no need to change the size of the isolation sheets themselves; by flexibly adjusting the installation positions of the plurality of isolation sheets on the circuit board 21, the isolation sheets can not only weaken the interference received by the radiation units 22, but also avoid the avoidance areas of the circuit board 21, and the isolation sheets have a wide range of applications. Thus, the isolation sheets can be applied to antenna sub-arrays of different types, sizes and designs.

[0052] Refer to Figures 2 to 4 As shown, in some embodiments, a plurality of isolation sheets arranged along the second direction are respectively provided on the two opposite side edges of the circuit board 21 along the first direction, and at least one isolation sheet is provided between every two adjacent radiation units 22 along the first direction. With such an arrangement, the plurality of isolation sheets are arranged around the plurality of radiation units 22 on the edge of the circuit board 21, and the periphery of each radiation unit 22 is surrounded by the plurality of isolation sheets, which improves the effect of the plurality of isolation sheets in weakening the signal interference received by the radiation units 22.

[0053] Specifically, a plurality of isolation sheets are provided on the two opposite side edges of the circuit board 21 along the first direction a, that is, a plurality of isolation sheets are provided on the two opposite side edges of the circuit board 21 along both the first direction a and the second direction b, and the plurality of isolation sheets are arranged around the plurality of radiation units 22 on the edge of the circuit board 21.

[0054] An isolation sheet can be selectively provided between every two adjacent radiation units 22. Of course, two isolation sheets arranged along the second direction can also be selectively provided, so that each radiation unit 22 is surrounded by multiple isolation sheets, and each radiation unit 22 can be protected by the surrounding multiple isolation sheets to reduce the signal interference received by the radiation unit 22.

[0055] Refer to Figure 3 As shown, in some embodiments, a plurality of welding areas 23 are provided on the circuit board 21, and the plurality of welding areas 23 are arranged in one-to-one correspondence with the plurality of isolation sheets. Solder paste is provided on the welding areas 23, and the mounting plate 13 is welded to the welding areas 23 through the solder paste. With such an arrangement, the solder paste is applied to the welding areas 23, so that the isolation sheet can first be attached to the solder paste and adhered to the circuit board 21, and then the isolation sheet can be welded to the circuit board 21 through high temperature, which is convenient for determining the mounting position of the isolation sheet on the circuit board 21 and improving the mounting accuracy of the isolation sheet.

[0056] Specifically, the area on the circuit board 21 corresponding to the area where the isolation sheet needs to be installed serves as the welding area 23. The area of the welding area 23 is adapted to the area of the isolation sheet, and the area of the welding area 23 is adapted to the area formed by the two mounting plates 13 of the isolation sheet. After the isolation sheet is arranged opposite to the welding area 23 and the isolation sheet moves towards the circuit board 21, the two mounting plates 13 can be attached to the welding area 23.

[0057] When the above-mentioned isolation sheet is installed on the circuit board 21, surface mount technology (Surface Mount Technology, abbreviated as SMT) can be selected. The isolation sheet is grabbed by the nozzle of the SMT mounter and moved into the welding area 23 of the circuit board 21, so as to weld the isolation sheet to the welding area 23 of the circuit board 21; the solder paste in the welding area 23 can be selected as the solder paste for high-temperature SMT, and the solder paste is pre-bonded to the PCB pads to be welded through stencil printing; the solder paste has an adhesive function. The mounting plate 13 is first attached to the solder paste and adhered to the circuit board 21, and then under the action of high temperature, the solder paste fixedly connects the mounting plate 13 and the circuit board 21, thereby completing the operation of welding the isolation sheet to the welding area 23.

[0058] Refer to Figure 3 As shown, in some embodiments, rubber strips 231 are provided on both opposite side edges of the welding area 23, and both opposite side edges of the mounting plate 13 perpendicular to the relative direction of the two isolation plates 11 are respectively connected to the two rubber strips 231. With such an arrangement, the rubber strips 231 assist in fixing the position of the isolation sheet on the circuit board 21, improving the stability of the isolation sheet on the circuit board 21, and enabling the isolation sheet to maintain a stable position on the circuit board 21 when the isolation sheet follows the circuit board 21 for subsequent processing and chip mounting steps.

[0059] Specifically, the welding area 23 can be selected as a rectangular area, and rubber strips 231 are provided on two opposite side edges of the rectangular area. The rubber strips 231 can be selected as special red glue for high-temperature patch. When the mounting plate 13 is welded to the welding area 23, the rubber strips 231 are connected to the edge of the mounting plate 13, so that the rubber strips 231 bond and fix the mounting plate 13.

[0060] During the production process of the antenna sub-array, after the isolation sheet is installed on the circuit board 21, the circuit board 21 will pass through a high-temperature environment and be flipped multiple times in the subsequent production process for the front and back patching steps. The welding connection strength between the isolation sheet and the circuit board 21 by solder paste is likely to decrease at high temperature, resulting in relative movement between the isolation sheet and the circuit board 21; while using the rubber strips 231 to bond the mounting plate 13 can assist in fixing the isolation sheet, so that when the isolation sheet is flipped multiple times with the circuit board 21 in a high-temperature environment, the isolation sheet can be stably connected to the circuit board 21.

[0061] Referring to Figure 2 and Figure 3 As shown, in some embodiments, the circuit board 21 includes a grounding layer, a substrate layer, and a circuit layer; the grounding layer is connected to one side of the substrate layer, and the circuit layer is connected to the other side of the substrate layer. The radiation unit 22 and the isolation sheet are both disposed on the circuit layer. With such an arrangement, the substrate layer enhances the structural strength of the circuit board 21, the grounding layer and the circuit layer are respectively on both sides of the substrate layer, enabling the grounding layer to achieve abutment, and the circuit layer is used to mount the radiation unit 22, so that the radiation unit 22 can be electrically connected to the circuit on the circuit layer.

[0062] Specifically, the grounding layer, the base layer, and the circuit layer can all be selected as sheet structures. The grounding layer, the base layer, and the circuit layer overlap and are connected to each other in sequence. The radiation unit 22 and the isolation sheet are both disposed on the circuit layer, so that the circuit on the circuit layer can be electrically connected to the radiation unit 22.

[0063] The third aspect of the present disclosure provides an antenna, including a plurality of antenna sub-arrays as described above;

[0064] A plurality of circuit boards 21 are arranged in sequence along the second direction and are connected to each other. With such an arrangement, the isolation sheets on the edges of the plurality of circuit boards 21 can isolate the radiation units 22 on the adjacent circuit boards 21, so that the plurality of isolation sheets can weaken the signal interference between the radiation groups on two adjacent circuit boards 21 in the second direction b, improving the accuracy of the antenna in transmitting signals; and by disassembling and assembling some of the isolation sheets, the plurality of isolation sheets on the edge of the circuit board 21 can be avoided from the avoidance area, reducing the manufacturing cost of the antenna.

[0065] Specifically, the circuit boards 21 of multiple antenna sub-arrays are arranged along the second direction b and connected to each other, so that the multiple circuit boards 21 form a substrate of the antenna. The multiple radiation units 22 on each antenna sub-array form a radiation group. The radiation groups on the multiple circuit boards 21 are spaced apart by multiple spacers arranged along the first direction a in the second direction b, so that the multiple spacers can weaken the signal interference between the radiation groups on two adjacent circuit boards 21 in the second direction b.

[0066] When the antenna is installed and processed, an avoidance area needs to be left on the substrate formed by the multiple circuit boards 21. By disassembling and installing some of the spacers, the multiple spacers at the edge of the circuit board 21 can be made to avoid the avoidance area. And through the layout optimization of the multiple isolation strips, that is, adjusting the position of the spacers or the lengths of the isolation plate 11 and the adsorption plate 12 for tuning, the co-polarization coupling strength of the antenna can be optimized and improved to a relatively large extent.

[0067] When the spacer, antenna sub-array and antenna provided by the embodiment of the present disclosure are specifically used, the spacer is placed in the area to be grabbed, and the circuit board 21 is placed on the mounter. The robotic arm of the mounter moves to the side of the adsorption plate 12 facing away from the mounting plate 13, and the suction nozzle of the robotic arm fits and adsorbs to the adsorption plate 12 for adsorption connection; the robotic arm drives the adsorption plate 12 to move to a position opposite to the circuit board, so that the mounting plate 13 faces the circuit board. The robotic arm drives the isolation plate to move towards the circuit board, and then the mounting plate 13 can be made to fit the welding area 23 of the circuit board 21; the mounting plate 13 first adheres to the solder paste on the welding area 23 and at the same time adheres to the rubber strip 231, and the mounting plate 13 is welded to the welding area 23 of the circuit board 21 through the solder paste at high temperature; after the isolation plate is installed, the suction nozzle is disconnected from the adsorption plate 12, and the robotic arm grabs the next spacer and repeats the above steps for installation operation.

[0068] After the multiple spacers are welded to the circuit board 21, the mounter performs subsequent front and back surface chip mounting processing on the circuit board 21, installs the radiation units 22 on the circuit board 21, and completes the production of the antenna.

[0069] When the antenna needs to have an avoidance area that interferes with the spacers on the circuit board 21 due to design changes or actual situations, the spacers at the corresponding positions on the circuit board 21 are disassembled.

[0070] It should be noted that in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0071] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A spacer, characterized in that: It comprises an adsorption plate (12), two isolation plates (11) and two mounting plates (13); The two opposite side edges of the adsorption plate (12) are respectively connected to the two isolation plates (11); the two isolation plates (11) are arranged opposite to each other and both extend in a direction away from the adsorption plate (12), so that the two isolation plates (11) are arranged on the same side of the adsorption plate (12); and the two mounting plates (13) are respectively connected to one end of the two isolation plates (11) away from the adsorption plate (12); The adsorption plate (12) is used to be connected to the suction nozzle of a chip placement machine, and the two mounting plates (13) are used to be connected to the circuit board (21).

2. The isolation sheet according to claim 1, characterized in that: The two mounting plates (13) extend in a direction approaching each other, and the two mounting plates (13) are spaced apart in the direction approaching each other, so as to form a gap between the two mounting plates (13).

3. The isolation sheet according to claim 1, characterized in that: The adsorption plate (12), the two isolation plates (11) and the two mounting plates (13) are an integrated structure.

4. The isolation sheet according to claim 1, characterized in that: The adsorption plate (12) and the mounting plate (13) are arranged at two ends of the isolation plate (11) along the height direction of the isolation plate (11); The height dimension of the isolation plate (11) is greater than the distance dimension between two isolation plates (11).

5. An antenna subarray, characterized in that: It comprises a circuit board (21), a plurality of radiation units (22) and a plurality of isolation sheets according to any one of claims 1 to 4; A plurality of the radiation units (22) are arranged on the circuit board (21) at intervals along a first direction, and two side edges of the circuit board (21) opposite to each other along a second direction are respectively connected to a plurality of the isolation sheets arranged along the first direction; The two mounting plates (13) of the isolation plate are welded to the circuit board (21), so that the two isolation plates (11) and the radiation unit (22) are arranged on the same side of the circuit board (21); The first direction is perpendicular to the second direction.

6. The antenna subarray according to claim 5, characterized in that: A plurality of isolation sheets arranged along the second direction are respectively arranged on two opposite side edges of the circuit board (21) along the first direction, and at least one isolation sheet is arranged between every two adjacent radiation units (22) along the first direction.

7. The antenna subarray according to claim 5, characterized in that: The circuit board (21) is provided with a plurality of welding areas (23), the plurality of welding areas (23) are arranged in one-to-one correspondence with the plurality of isolation sheets, the welding areas (23) are provided with solder paste, and the mounting plate (13) is connected to the welding areas (23) by soldering via the solder paste.

8. The antenna subarray according to claim 7, characterized in that: The two opposite edges of the welding area (23) are provided with rubber strips (231), and the two opposite edges of the mounting plate (13) perpendicular to the relative directions of the two isolation plates (11) are respectively connected to the two rubber strips (231).

9. The antenna subarray according to claim 5, characterized in that: The circuit board (21) comprises a ground layer, a substrate layer and a circuit layer; The grounding layer is connected to one side of the substrate layer, the circuit layer is connected to the other side of the substrate layer, and the radiation unit (22) and the isolation plate are both arranged on the circuit layer.

10. An antenna, characterized in that: comprising a plurality of antenna subarrays as claimed in any one of claims 5 to 9; A plurality of circuit boards (21) are arranged in sequence along the second direction and are connected to each other.

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