Semiconductor refrigerator with embedded and wound heat pipes for conduction heat exchange

Abstract

According to the embedded winding type heat pipe conduction heat exchange semiconductor refrigerator, a splicing and welding liquid box of a gravity heat pipe refrigerator is changed into calandria pipe embedding; multiple welding of the pipeline is changed into winding of one pipe; the horizontal operation of the horizontal row pipes is changed into the vertical conduction of the vertical row pipes; cold end fin air cooling is changed into working medium phase change refrigeration; the steam heat exchange of the gravity heat pipe is changed into the steam-liquid two-phase circulation of the pulsating heat pipe, and the like, so that a liquid-box-free, liquid-core-free and welded junction-free circulating pipeline which can be embedded and wound in a plurality of densely arranged and vertically communicated circulating pipelines is provided, and the capillary force of a pipe cavity and the surface tension of a working medium are utilized; the embedded winding type refrigerator is high in performance, low in cost and diversified in form, and synchronous operation of liquid sensible heat and steam latent heat and anti-gravity circulation are achieved. The heat exchange area is expanded, the conduction heat resistance is reduced, the heat cycle efficiency is enhanced, and the conversion efficiency and refrigerating capacity of a refrigerator are improved. The semiconductor refrigeration device can be widely applied to various semiconductor refrigeration products, and can also be used for heat dissipation and cooling of heating equipment such as automobiles, cabinets and computers and high-power devices such as CPUs and LEDs.

Description

Technical Field:

[0001] The utility model relates to the conduction heat transfer mode and product application field of a semiconductor refrigerator, in particular to a semiconductor refrigerator and related products adopting an embedded and wound heat pipe for conduction heat transfer. Background Art:

[0002] In recent years, semiconductor refrigeration chips (referred to as refrigeration chips for short) have been widely used in products such as small and medium-sized refrigerators, wine cabinets, air conditioners, and water dispensers due to their advantages of small volume, light weight, simple configuration, low cost, no vibration, no noise, no pollution during operation, and rapid cold and heat conversion. However, limited by its refrigeration principle and traditional configuration, the conversion efficiency and refrigeration capacity are relatively low, and the application effect is not satisfactory.

[0003] From the cold-end heat balance formula of the refrigeration chip Qc = apnTcI - 0.5I2R - K(Tn - Tc), it can be seen that 50% of the input electrical energy will be converted into heat, and only 50% of the electrical energy can be converted into cold energy under ideal conditions, and the COP value is only 0.5; in addition, due to the small volume of the refrigeration chip, the arrangement of the thermocouple walls is dense, and the distance between the hot and cold ends is only 2 - 3 mm; in the working state with a large temperature difference and extremely high heat flux density, if the heat at both ends cannot be conducted quickly, it will cause heat exchange or even thermal short circuit between the hot and cold ends. This will increase the value of the K(Tn - Tc) term in the heat balance formula Qc = apnTcI - 0.5I2R - K(Tn - Tc), further offsetting the refrigeration capacity and reducing the COP value. Practice has proved that the conversion efficiency of the refrigeration chip with the defect of self-thermal short circuit in product applications also depends on the heat transfer efficiency of its conduction heat transfer device. Therefore, researching and developing a conduction heat transfer device with low thermal resistance and high efficiency is of great significance for improving its working conditions, enhancing refrigeration performance, and expanding a wider application field, and it is also an urgent issue to be solved in the semiconductor refrigeration industry.

[0004] In the prior art, semiconductor refrigerators generally use a forced air cooling structure (referred to as a fin and fan cooler) with finned radiators (referred to as radiators for short) and fans arranged at both ends of the refrigeration chip, and there are many defects in the application:

[0005] 1. The radiators and fans at both ends of the refrigeration chip have symmetrical structures and axial coincidence, and the arrangement order and air supply direction are confronted on the same axis, and it is impossible to reasonably set the air flow channel according to the natural law of the cold and heat cycle;

[0006] 2. The assembly screws pass through the fan, radiator, cross the refrigeration chip and the conduction block, and are fastened to the radiator substrate at the other end, connecting the whole cooler while connecting the hot and cold ends into one body, forming a structural thermal short circuit;

[0007] 3. The heat sinks at both ends of the thermoelectric cooler are installed in a "back-to-back" manner with a small spacing between them and a thin insulation layer (usually only 40 - 50 mm). Under the long-term counter-flow action of the hot and cold end fans, heat penetration will occur.

[0008] 4. The overall heat sink has no gaps and is not permeable, and cannot conduct rapid heat exchange with the air flow of the fan. Especially in a high-temperature environment, when the temperature of the hot end is too high, the cold end will lose its normal working conditions and refrigeration capacity.

[0009] 5. The heat sink made of aluminum profiles usually has a small heat exchange area and a high thermal resistance of the material. Generally, the thermal conductivity is only 155 - 237 W / mK, which far cannot meet the heat dissipation requirements of the hot and cold ends, especially the high heat flux density at the hot end.

[0010] 6. The heat sink and the fan installed vertically at both ends form a heat transfer path in the horizontal direction, which is inconsistent with the natural heat transfer direction of "hot air rises and cold air sinks", increasing the thermal resistance in the direction of heat conduction. The heat at both ends must break away from the constraint of the horizontal path and be conducted in the vertical direction without a path, reducing the heat transfer efficiency at both ends.

[0011] 7. The only advantage of thermoelectric refrigeration compared with compression refrigeration is no vibration and no noise. However, the finned fan cooler not only increases the material cost and fan failures, but also generates vibration and noise. Especially when frosting or ice blockage occurs at the cold end, the whistling sound generated by the fan makes it impossible to be used in an environment that requires silence.

[0012] 8. The air supply direction of the fan is opposite to the heat transfer direction of the hot and cold ends, and under the guiding action of the fins of the heat sink, the air flow of the fan is weakened into a dispersed and disordered eddy current, and a strong and clear circulating air flow cannot be formed, etc.

[0013] In order to improve the performance of thermoelectric refrigeration, in 1998, the applicant improved the finned fan cooler to: the cold end uses a blown plate heat pipe evaporator to absorb heat and refrigerate; the hot end uses a wire tube heat pipe condenser to conduct heat dissipation, forming the second-generation gravity heat pipe conduction heat exchange refrigerator (referred to as the gravity heat pipe refrigerator for short). By canceling the hot and cold end fans and only using natural convection for heat exchange, the production originally limited to 30-liter refrigeration products was expanded to 70-liter production, and in 1999, a number of patents such as "ZL 98101096.2 Thermoelectric Refrigerator Using Heat Pipe Conduction Heat Exchange" were obtained. However, in subsequent applications, it was found that the gravity heat pipe refrigerator still has certain deficiencies:

[0014] 1. Limited by the gravity heat pipe heat exchange method, the heat at the hot end can only release latent heat through the circulation of saturated steam, and the sensible heat of the working fluid in the liquid box cannot enter the pipeline circulation and always remains in the liquid box, continuously affecting the temperature of the hot end.

[0015] 2. Restricted by the gravity heat pipe circulation mode, the spaces used for the evaporator and the condenser interfere with each other. They can only be separated vertically, with each occupying half. The upper space of the evaporator and the lower space of the condenser cannot be fully utilized.

[0016] 3. To maintain the evaporation space in the liquid box of the condenser, the liquid level of the working fluid is restricted to 75% of the height of the refrigeration chip, resulting in a dry state without working fluid absorption and evaporation in the upper 25% cavity of the liquid pool with the highest heat flux density.

[0017] 4. The vertical pipeline has the highest circulation efficiency, but has many welds, high costs, and frequent welding blockages. Although the horizontal pipeline has fewer welds, the pipeline bends repeatedly on both sides, increasing the pressure head loss of the steam circulation and the liquid film reflux resistance.

[0018] 5. The liquid boxes attached to the refrigeration chips are mostly made of relatively thick (3 - 8 mm) aluminum profiles or drawn plates, and there are slight deformations under repeated high and low temperature impacts, resulting in gaps on the attachment surface, increasing the contact thermal resistance and the shielding thermal resistance.

[0019] 6. The heat pipe evaporator made of aluminum expansion plates has low overall strength and poor pressure-bearing capacity. When filling with working fluids with relatively high saturation pressures, it is extremely prone to warping and deformation in high-temperature environments, making it not suitable for assembly and affecting the product appearance.

[0020] In summary, the deficiencies in the conduction mode, pipeline settings, and product applications of finned fan coolers and gravity heat pipe coolers restrict the popularization, application, and rapid development of semiconductor refrigeration. They are also the crux of the unsatisfactory performance of semiconductor refrigeration and its long-term limitation to the micro-refrigeration field, and urgent improvement and update are needed. Utility Model Content:

[0021] The purpose of the semiconductor cooler with embedded winding heat pipe heat transfer (abbreviated as embedded winding cooler) described in this utility model is to overcome various deficiencies existing in existing coolers. By changing the welded liquid box of the gravity heat pipe cooler to a pipe embedded arrangement; changing the multiple pipeline welds to a single pipe wound; changing the horizontal operation of the horizontal pipes to the vertical conduction of vertical pipes; changing the air cooling of the cold end fins to working fluid phase change refrigeration; changing the gravity heat pipe steam heat transfer to a pulsating heat pipe vapor-liquid two-phase cycle, etc., to provide an embedded winding cooler with no liquid box, no liquid core, no welds, capable of embedding a single pipe with multiple densely arranged and vertically interconnected circulation pipelines, and utilizing the capillary force of the pipe cavity and the surface tension of the working fluid to achieve the synchronous operation of liquid sensible heat and steam latent heat and anti-gravity circulation, with high efficiency, low cost, and various forms. To expand the heat transfer area, reduce the conduction thermal resistance, strengthen the heat cycle efficiency, improve the conversion efficiency and refrigeration capacity of the cooler, and can be widely applied to various semiconductor refrigeration products. Its basic structure and configuration can also be used for heat dissipation of heating devices such as automobiles, cabinets, computers, and high-power devices such as CPUs and LEDs.

[0022] To meet the assembly requirements of various semiconductor refrigeration products, the embedded winding cooler adopts different combinations, such as "single-layer pipeline" and "double-layer pipeline", or is used alone, forming technical solutions for various forms of coolers and heat exchangers to meet the different assembly requirements of various refrigeration products.

[0023] The embedded winding cooler described in the present utility model is divided into two typical structures, namely, the embedded winding single-layer pipeline cooler and the embedded winding double-layer pipeline cooler, in terms of assembly structure and pipeline arrangement. Its main features are as follows:

[0024] The embedded winding single-layer pipeline cooler consists of one or more refrigeration chips; a single-layer embedded winding plate with a "middle" - shaped cross-section and assembled on the cold end of the refrigeration chip through two-wing mounting holes, with an assembly convex surface on one side and a row of pipe-inserting grooves provided at the lower ends on both sides of the convex surface and the convex surface; a closed pipeline formed by bending a single pipe (or multiple pipes when the refrigeration chips or pipelines are too long) into a sine wave shape with both ends bent and parallel rows of pipes between the two ends, and the head and tail are connected by a sealing pipe or a one-way valve, and the pipe distance is reduced (or maintained) at both ends of the single-layer embedded winding plate to form parallel rows of pipes, and it is riveted to the pipe-inserting grooves at the lower ends on both sides of the convex surface and the convex surface by flattening the top of the pipe groove wall, forming a circulating pipeline arranged vertically at the lower end or both the upper and lower ends and with a heat exchange plate or pipe wire or fin or bare pipe on the outer diameter; forming a lower-end or upper-and-lower-end tube-plate type or wire-tube type or bare-tube type or fin-tube type single-layer evaporator and a single-layer embedded winding plate with a "middle" - shaped cross-section and assembled on the hot end of the refrigeration chip through two-wing mounting holes, with an assembly convex surface on one side and a row of pipe-inserting grooves provided at the lower ends on both sides of the convex surface and the convex surface; a closed pipeline formed by bending a single pipe (or multiple pipes when the refrigeration chips or pipelines are too long) into a sine wave shape with both ends bent and parallel rows of pipes between the two ends, and the head and tail are connected by a sealing pipe or a one-way valve, and the pipe distance is reduced at both ends of the single-layer embedded winding plate to form parallel rows of pipes, and it is riveted to the pipe-inserting grooves at the lower ends on both sides of the convex surface and the convex surface by flattening the top of the pipe groove wall, forming a circulating pipeline arranged vertically at the upper end or both the upper and lower ends and with a heat exchange plate or pipe wire or fin or bare pipe on the outer diameter; forming an upper-end or upper-and-lower-end wire-tube type or fin-tube type or tube-plate type or bare-tube type single-layer condenser and an installation screw passing through the installation hole of the evaporator single-layer embedded winding plate and fastening to the heat-insulating part; an installation screw with an elastic part passing through the installation hole of the condenser single-layer embedded winding plate and also fastening to the heat-insulating part, and then fastening the refrigeration chip between the convex surfaces of the evaporator and condenser single-layer embedded winding plates, forming an upper-end or lower-end or upper-and-lower-end wire-tube type or tube-plate type or fin-tube type or bare-tube type embedded winding single-layer pipeline cooler;

[0025] The embedded double-layer pipeline cooler consists of one or more refrigeration chips; a double-layer embedded winding plate with a "middle" - shaped cross-section, which is assembled at the cold end of the refrigeration chip through two-wing mounting holes, has an assembly convex surface on one side, and a row of embedded pipe grooves are provided at the lower ends on both sides of the convex surface and on the back of the convex surface; a closed pipeline is formed by bending or winding a single (or multiple when the refrigeration chips or pipeline is too long) pipe into a sine wave or spiral shape with both ends bent and parallel rows of pipes between the two ends, and the head and tail are connected by a sealed pipe or a one-way valve. The pipe distance is reduced at both ends of the double-layer embedded winding plate to form parallel rows of pipes. After being riveted to the embedded pipe grooves at the convex surface and the lower ends on both sides of the convex surface by flattening the top of the pipe groove wall, one end of the pipeline is vertically downward; one end of the row of pipes goes up along the top of the double-layer embedded winding plate and then turns 180 degrees, and is then riveted to the embedded pipe groove on the back of the convex surface and is also vertically downward, overlapping and juxtaposing with the other end of the pipeline, forming a double-layer circulating pipeline arranged vertically at the lower end or both the upper and lower ends of the double-layer embedded winding plate, with a U-shaped or O-shaped pipeline end face and equipped with pipe threads or sleeve pieces or bare pipes. When the refrigeration chip and the double-layer embedded winding plate are installed horizontally, the U-shaped or O-shaped pipeline can be set horizontally, or one end or both ends can be bent downward by 90 degrees or 180 degrees, constituting the lower end or both the upper and lower ends, or when the refrigeration chip is set horizontally, one end or both ends of the pipeline are bent downward by 90 degrees or 180 degrees, and the pipeline end face is a U-shaped or O-shaped wire tube type or sleeve piece type or bare tube type double-layer evaporator and a double-layer embedded winding plate with a "middle" - shaped cross-section, which is assembled at the hot end of the refrigeration chip through two-wing mounting holes, has an assembly convex surface on one side, and a row of embedded pipe grooves are provided at the lower ends on both sides of the convex surface and on the back of the convex surface; a closed pipeline is formed by bending or winding a single (or multiple when the refrigeration chips or pipeline is too long) pipe into a sine wave or spiral shape with both ends bent and parallel rows of pipes between the two ends, and the head and tail are connected by a sealed pipe or a one-way valve. The pipe distance is reduced at both ends of the double-layer embedded winding plate to form parallel rows of pipes. After being riveted to the embedded pipe grooves at the convex surface and the lower ends on both sides of the convex surface by flattening the top of the pipe groove wall, one end of the pipeline is vertically upward; one end of the row of pipes goes down along the bottom of the double-layer embedded winding plate and then turns 180 degrees, and is then riveted to the embedded pipe groove on the back of the convex surface and is also vertically upward, overlapping and juxtaposing with the other end of the pipeline, forming a double-layer circulating pipeline arranged vertically at the upper end or both the upper and lower ends of the double-layer embedded winding plate, with a U-shaped or O-shaped pipeline end face and equipped with pipe threads or sleeve pieces or bare pipes. When the refrigeration chip and the double-layer embedded winding plate are installed horizontally, the U-shaped or O-shaped pipeline can be set horizontally, or one end or both ends can be bent upward by 90 degrees or 180 degrees, constituting the upper end or both the upper and lower ends, or when the refrigeration chip is set horizontally, one end or both ends of the pipeline are bent upward by 90 degrees or 180 degrees, and the pipeline end face is a U-shaped or O-shaped wire tube type or sleeve piece type or bare tube type double-layer condenser and the installation screws pass through the installation holes of the double-layer embedded winding plate of the evaporator and are fastened to the heat insulating part;An embedded double - pipe refrigeration device, in which an installation screw with an elastic part passes through the installation holes of the double - layer embedded winding plate of the condenser and is also fastened to the heat - insulating part, and then the refrigeration sheet is fastened between the convex surface of the evaporator and the double - layer embedded winding plate. When it is arranged at the upper end or the lower end or both the upper and lower ends, or when the refrigeration sheet is horizontally arranged, one end or both ends are bent upward or downward by 90 degrees or 180 degrees, and the end face is U - shaped or O - shaped, and it is a wire - tube type or fin - type or bare - tube type embedded double - pipe refrigeration device.

[0026] For the embedded refrigeration device described in the present utility model, in the "middle" - shaped cross - section of the single - layer or double - layer embedded winding plate, the rest of the cross - section except the pipe - embedding groove is a solid structure; for material saving or processing convenience, process holes and material - saving cavities can be provided in the cross - section; a V - shaped guiding groove can be provided at the top of the pipe - groove wall; installation holes are provided on both wings of the embedded winding plate; maintaining or cutting the back of the convex surface of the double - layer embedded winding plate or the height of the pipe - embedding groove can be used as a single - layer embedded winding plate.

[0027] For the embedded refrigeration device described in the present utility model, the pipe - embedding groove of the single - layer or double - layer embedded winding plate is formed by embedding multiple pipes and then flattening the top of the pipe - groove wall to rivet them so that the pipes and the pipe - groove walls are alternately arranged, and the side of the pipe is lower than or at the same plane as the riveting plane of the pipe - embedding groove; the number of pipe - embedding grooves is determined according to the specifications of the refrigeration sheet and the diameter of the pipe; the shape of the pipe - embedding groove depends on the shape of the pipe.

[0028] For the embedded refrigeration device described in the present utility model, when it is used for winding the pipelines of multiple refrigeration sheets, it can be a composite embedded winding plate composed of multiple single - layer or double - layer embedded winding plates through horizontal arrangement, longitudinal extension or integral forming; an isolation space or isolation groove and wing - type installation holes are provided between the opposing surfaces of the refrigeration sheets and between the assembled convex surfaces.

[0029] For the embedded refrigeration device described in the present utility model, the pipe wires of the sine - wave - shaped U - shaped pipeline with an outer diameter are welded and riveted on the embedded winding plate after being welded in parallel rows when the pipe is bent; the pipe wires of the spiral - shaped O - shaped pipeline are formed by welding after the pipeline is formed and riveted to the embedded winding plate to form parallel rows; the fins on the U - shaped or O - shaped pipeline are formed by alternately sleeving long - hole - type fins that can accommodate two or more pipes through different layers after the pipeline is riveted to the embedded winding plate and then being pressed and expanded.

[0030] For the embedded refrigeration device described in the present utility model, the cold end uses a tube - plate type or wire - tube type or fin - type or bare - tube type heat - pipe evaporator for heat conduction and heat transfer. The circulating pipeline is the evaporation section, and the embedded pipeline is the condensation section, so as to utilize the low - temperature liquefied saturated vapor at the cold end, and through liquid reflux and re - absorption of heat and evaporation, continuous phase - change refrigeration is achieved.

[0031] The embedded winding cooler described in the present utility model, when used in the configuration of cabinet air conditioners and other products, adopts the circulating heat exchange of the temperatures inside and outside the cabinet: that is, the cold-end fan sucks in the outside air, passes it through the evaporator and sends it into the cabinet; then the hot-end fan sucks out the heat in the cabinet, passes it through the condenser and discharges it into the atmosphere; and there is a cold quantity shunt channel between the cold-end evaporator and the hot-end fan to use the cold air sucked in by the hot-end fan to cool the condenser; when used in the configuration of mobile air conditioners, the hot-end heat is discharged at the top of the air conditioner to reduce the thermal impact on the surrounding environment and the human body.

[0032] For the embedded winding cooler described in the present utility model, the installation direction of the pipe embedding grooves of the evaporator or the condenser can be set to be commutated by 90 degrees according to the working mode of the cooler; when the pipe embedding grooves are vertically installed, a vertically arranged circulating pipeline is formed; when horizontally assembled, an inclined pipeline arranged horizontally is formed; it is also possible to adopt the configuration mode of horizontally assembling the pipe embedding grooves of the evaporator and vertically assembling the pipe embedding grooves of the condenser.

[0033] The semiconductor refrigeration device with embedded winding heat pipe conduction heat exchange described in the present utility model has the following beneficial effects:

[0034] 1. The tube plates of the embedded winding cooler are embedded in a standard way, the pipeline winding is dense, the configuration is concise, the structure is compact, the heat transfer efficiency is high, and the refrigeration effect is good. When used in products such as refrigerators and wine cabinets, accessories such as fans can be omitted, enabling it to work without vibration, noise, and pollution, which helps to improve the industrialization and commercialization levels of products.

[0035] 2. The embedded winding evaporator and condenser are more suitable for the pulsating heat pipe operation mode, realizing the synchronous circulation of liquid plugs and gas plugs, the synchronous heat exchange of the sensible heat of the working medium and the latent heat of the steam, and the thermal conductivity coefficient can be as high as 8000 - 32000 W / mK, which is dozens of orders of magnitude higher than that of metal radiators such as copper and aluminum, and can significantly improve the heat exchange efficiency of the cooler.

[0036] 3. Utilize the capillary force of small-diameter tubes and the surface tension of the working medium to realize the anti-gravity circulation of the two-phase flow of the working medium and steam, so as to make full use of the heat exchange space and expand the heat exchange area of the evaporator and the condenser.

[0037] 4. The embedded winding evaporator and condenser are easy to form vertically dense circulating pipelines. The saturated vapor can reach the condensation section directly under the dual action of the natural upward force and the pressure difference in the pipe cavity; the liquid film can avoid the reflux resistance of the multi-bend pipeline and directly fall to the evaporation section, absorb heat and evaporate to reduce the hot-end temperature, forming a heat dissipation and cooling state where the temperature of the evaporation section is lower than that of the condensation section. This can reduce the circulation resistance and head loss of the two-phase flow and accelerate the evaporation and reflux speed;

[0038] 5. The embedded winding evaporator and condenser are easy to arrange dense and vertically interconnected circulating pipelines in a narrow space, and are particularly suitable for cooling the refrigeration chips and high-power devices with a small heating area and a high heat flux density;

[0039] 6. The cold-end evaporator has the condensation section on top, attached to the cold end of the Peltier element; the evaporation section is at the bottom, where the working fluid absorbs heat and evaporates, and liquefies at the cold end, forming continuous phase change refrigeration to enhance the refrigeration capacity of the semiconductor.

[0040] 7. The pipes of the embedded winding evaporator and condenser can be made by winding a single pipe. Each pipe is connected to adjacent pipes in a sine wave or spiral path. There is no need for additional horizontal connections between the pipes. Through the continuous evaporation and reflux of the working fluid, the liquid distribution of each pipe and the vapor-liquid synchronous cycle of the pulsating heat pipe can be achieved.

[0041] 8. The liquid supply and reflux of the embedded winding evaporator and condenser have a self-regulating mechanism. When the temperature is high and the evaporation rate increases, the expansion and rupture speed of the bubbles accelerate, prompting the liquid film to reflux in a timely manner, thus avoiding dry burning.

[0042] 9. The tube-sheet evaporator for refrigerator products uses a tube-sheet composite structure, effectively isolating the pressure and shape changes of the evaporation tubes, expanding the heat exchange area, and improving the overall strength and appearance level of the evaporator.

[0043] 10. By appropriately lowering the inclination angle of the evaporation end of the embedded winding evaporator and appropriately raising the inclination angle of the condensation end of the condenser, the refrigerator or the refrigeration product equipped can operate in the horizontal direction.

[0044] 11. The embedded winding refrigerator has no liquid box, no liquid core, and no welded joints. With one kind of embedded winding plate and one pipe, it can form evaporation or condensation pipelines with dense arrangements and vertical interconnections for various structures and uses. It has a simple structure, low cost, and fast processing speed, can greatly reduce the manufacturing cost, and is suitable for industrial mass production.

[0045] 12. The embedded winding evaporator and condenser can form various pipeline arrangements through two kinds of embedded winding structures. In practical applications, they can be flexibly selected, arbitrarily combined, or used alone according to the specific requirements of product configuration. BRIEF DESCRIPTION OF THE DRAWINGS:

[0046] The attached drawings of the embedded winding heat pipe conduction heat transfer semiconductor refrigerator described in the present utility model are explained as follows:

[0047] Figure 1 It is a schematic diagram of a solid structure with a "middle" - shaped cross-section or a double-layer embedded winding plate with process holes;

[0048] Figure 2 It is a schematic diagram of the shape change of each row of embedded pipe grooves of the double-layer embedded winding plate before and after the pipe embedding and riveting;

[0049] Figure 3 It is a schematic diagram of a composite embedded winding plate with multiple embedded winding plates arranged horizontally, extended longitudinally, or integrally formed;

[0050] Figure 4Schematic diagram of U-shaped pipelines at both ends of the winding board, upper U-shaped pipeline, and lower O-shaped pipeline;

[0051] Figure 5 It is a winding single-layer pipeline refrigerator composed of a lower tube sheet evaporator and an upper wire tube condenser;

[0052] Figure 6 A winding single-layer pipeline refrigerator composed of tube sheet evaporators at both ends and wire tube condensers at both ends;

[0053] Figure 7 A thermal upper double-layer refrigerator composed of tube sheet evaporators at both ends and an upper U-shaped pipeline condenser;

[0054] Figure 8 It is a thermal double-layer refrigerator at both ends composed of tube sheet evaporators at both ends and U-shaped wire tube condensers at both ends;

[0055] Figure 9 It is a thermal full-width double-layer refrigerator composed of tube sheet evaporators at both ends and a full-width U-shaped cold wire tube condenser;

[0056] Figure 10 It is a full-width double-layer composite refrigerator composed of a lower tube sheet evaporator and U-shaped wire tube condensers at both ends;

[0057] Figure 11 It is a portable box single-layer refrigerator formed by using the machine shell to form tube sheet evaporators and condensers at both ends;

[0058] Figure 12 It is a top-mounted refrigerator composed of a 90-degree downward-bent tube sheet evaporator and U-shaped wire tube condensers at both ends;

[0059] Figure 13 It is an air-conditioning composite refrigerator composed of a lower O-shaped finned evaporator and an upper U-shaped finned condenser;

[0060] Figure 14 It is an air-conditioning composite refrigerator composed of a lower O-shaped wire tube evaporator and an upper U-shaped wire tube condenser;

[0061] Figure 15 It is an air-conditioning refrigerator composed of a horizontally arranged refrigeration sheet and evaporator condensers with 90-degree bends at the upper and lower ends;

[0062] Figure 16 It is a mobile air-conditioning refrigerator with a 90-degree downward-bent evaporator and a 90-degree or 180-degree upward-bent condenser;

[0063] Figure 17 It is a finned tube air-conditioning refrigerator with an inclined angle, side-mounted and top-mounted on cabinets and pet rooms;

[0064] Figure 18The ice cream machine and cold drink machine coolers are formed by bending the evaporator horizontally and the condenser vertically by 180 degrees.

[0065] Figure 19 The cold drink machine cooler is composed of a downward-bent 90-degree bare tube evaporator and an upward-bent 90-degree wire tube condenser.

[0066] Figure 20 The hot and cold bed cushion cooler is composed of U-shaped bare tube evaporators at both ends and U-shaped wire tube condensers at both ends.

[0067] Figure 21 The condenser for high-power devices with fins is formed by bending a U-shaped or O-shaped pipeline upward or downward by 90 degrees or 180 degrees.

[0068] Figure 22 The condenser for large-area heating equipment is a finned or bare tube type formed by bending a U-shaped or O-shaped pipeline upward by 90 degrees. In the figure: 1 - double-layer winding plate; 2 - raised surface; 3 - lower ends on both sides of the raised surface; 4 - back of the raised surface;

[0069] 5 - single-layer pipe embedding groove; 6 - encapsulated pipe; 7 - one-way valve; 8 - closed pipeline; 9 - heat exchange plate;

[0070] 10 - heat insulation part; 11 - refrigeration chip; 12 - fan. Specific implementation method:

[0071] The semiconductor cooler with heat conduction and heat exchange by winding type of the present utility model generally consists of a refrigeration chip, a single-layer or double-layer winding plate, a closed pipeline, an encapsulated pipe or a one-way valve, a fan and a heat insulation part, etc.

[0072] Among them, the winding plate plays roles such as attaching the refrigeration chip, riveting the pipe, structural connection and efficient heat transfer in the cooler, and should have corresponding strength and good heat transfer performance. Therefore, the cross-section of the winding plate should adopt a solid structure except for the pipe embedding groove. For material saving or processing convenience, process holes can also be set in the cross-section (such as Figure 1 shown). One side of the double-layer winding plate 1 has an assembly raised surface 2, and a row of pipe embedding grooves is provided on the raised surface, the lower ends on both sides of the raised surface 3 and the back of the raised surface 4 respectively. The pipeline is embedded and riveted to each row of pipe embedding grooves by flattening the top of the pipe groove wall, so that the winding plate and the pipeline are integrated (such as Figure 2 shown). When winding the pipelines of multiple refrigeration chips, multiple winding plates can be arranged horizontally, extended longitudinally or integrally formed into a composite winding plate (such as Figure 3 shown). Cutting or maintaining the height of the back of the raised surface or the pipe embedding groove of the double-layer winding plate can be used as single-layer winding;

[0073] The winding type cooler described in the utility model also provides a typical single-layer and double-layer circulating pipeline "formed by winding a single pipe". Among them, the single-layer pipeline evaporator or condenser is formed by repeatedly bending a single pipe into a sine wave shape with both ends bent and parallel arrangement between the two ends (as shown by a and b in Figure 4 ), and the closed pipeline 8 is formed by connecting the head and tail with a packaging pipe 6 or a one-way valve 7; at both ends of the single-layer winding plate 5, the pipe pitch is reduced to form parallel rows of pipes, and the pipe is fixed in the pipe embedding grooves on the convex surface 2 and the lower ends on both sides of the convex surface 3 by flattening the guide grooves at the top of the pipe groove wall, constituting a single-layer evaporator or condenser arranged vertically at the upper end or the lower end or both the upper and lower ends of the single-layer winding plate 5, and having pipe threads or finned tubes or bare pipes or heat exchange plates 9 installed on the outside, and the installation screws pass through the winding plate 5 and are fastened to the structural member or the heat insulation member 10; the installation screws with elastic members pass through the condenser winding plate 5 and are fastened to the structural member or the heat insulation member 10, and the refrigeration sheet 11 is fastened between the convex surfaces 2 of the single-layer winding plates of the evaporator and the condenser, forming a winding type single-layer pipeline cooler (as shown in Figure 5 , Figure 6 and Figure 11 ).

[0074] The double-layer pipeline evaporator or condenser can also be formed by bending or winding a single pipe (multiple pipes are used when there are multiple refrigeration sheets or the pipeline is too long) into a sine wave shape or a spiral shape with both ends bent and parallel arrangement between the two ends (as shown by c in Figure 4 ), and the closed pipeline 8 is formed by connecting the head and tail with a packaging pipe 6 or a one-way valve 7. After reducing (or maintaining) the pipe pitch at both ends of the double-layer winding plate 1 to form parallel rows of pipes and fixing the pipe in the pipe embedding grooves on the convex surface 2 and the lower ends on both sides of the convex surface 3 by flattening the guide grooves at the top of the pipe groove wall, one end of the pipeline is vertically downward or upward; one end of the row of pipes goes up or down along the top or bottom of the winding plate 1 and then turns 180 degrees, and then is fixed in the pipe embedding groove on the back of the convex surface 4 and is also vertically downward or upward, and coincides with the other end of the pipeline in parallel, forming a double-layer circulating pipeline arranged vertically at the lower end or the upper end or both the upper and lower ends of the winding plate 1, with a U-shaped or O-shaped end face and having pipe threads or finned tubes or bare pipes; the horizontally arranged refrigeration sheet 11 and the U-shaped or O-shaped pipeline of the winding plate 1 can be horizontally arranged, or one end or both ends can be bent downward or upward by 90 degrees or 180 degrees, constituting a wire tube type or finned tube type or bare tube type double-layer evaporator or condenser arranged at the lower end or the upper end or both the upper and lower ends or when the refrigeration sheet 11 is horizontally arranged, with one end or both ends bent downward or upward by 90 degrees or 180 degrees and a U-shaped or O-shaped end face, and the installation screws pass through the evaporator winding plate and are fastened to the structural member or the heat insulation member 10, the installation screws with elastic members pass through the condenser winding plate and are fastened to the structural member or the heat insulation member 10, and the refrigeration sheet 11 is fastened between the convex surfaces of the evaporator and condenser winding plates, forming a winding type double-layer pipeline cooler with a U-shaped or O-shaped end face, a wire tube type or finned tube type or bare tube type, arranged at the lower end or the upper end or both the upper and lower ends or when the refrigeration sheet 11 is horizontally arranged, with one end or both ends bent downward or upward by 90 degrees or 180 degrees (as shown inFigures 7 - 10 , Figures 12 - 22 as shown).

[0075] The specific implementation of the thermoelectric cooler with embedded winding heat pipe conduction heat transfer described in the present utility model is as follows: By combining two typical evaporators and condensers, namely "single-layer pipeline" and "double-layer pipeline", in different ways, a variety of embedded winding coolers for thermoelectric cooling products can be formed; it can also be used alone for heat dissipation of heating equipment or high-power devices. Due to space limitations, some embodiments are listed below for specific illustration:

[0076] Figure of the double-layer embedded pressing plate with a "middle" - shaped cross-section solid structure in Embodiment 1, which features high strength and good heat transfer performance; Figures of the double-layer embedded pressing plates with process holes or material-saving cavities at the upper left and right corners, which feature low cost (as Figure 1 shown).

[0077] Figure of the changes in each row of pipes and the top of the groove wall before and after the rows of pipes are riveted to the double-layer embedded pressing plate in Embodiment 2 (as Figure 2 shown).

[0078] Figure of the composite embedded winding plate with multiple embedded winding plates arranged horizontally, extended longitudinally, or integrally formed in Embodiment 3 (as Figure 3 shown).

[0079] Figures of the U-shaped pipeline at both ends of the embedded winding plate, the upper U-shaped pipeline, and the lower O-shaped pipeline in Embodiment 4 (as Figure 4 shown).

[0080] Figure of the embedded winding single-layer pipeline cooler for refrigerators, wine cabinets, and refrigerated cabinets composed of a tube-plate evaporator with the thermoelectric cooler vertically arranged at the lower end of the single-layer embedded winding plate and a wire-tube condenser at the upper end of the single-layer embedded winding plate (as Figure 5 shown).

[0081] Figure of the embedded winding single-layer pipeline cooler for refrigerators, wine cabinets, and refrigerated cabinets composed of a tube-plate evaporator with the thermoelectric cooler vertically arranged at both ends of the single-layer embedded winding plate and a wire-tube condenser at both ends of the single-layer embedded pressing plate (as Figure 6 shown).

[0082] Figure of the embedded winding hot-end double-layer pipeline cooler for refrigerators, wine cabinets, and refrigerated cabinets composed of a tube-plate evaporator at both ends of the single-layer embedded winding plate and a U-shaped pipeline wire-tube condenser at the upper end of the double-layer embedded pressing plate (as Figure 7 shown).

[0083] Figure of the embedded winding hot-end double-layer pipeline cooler for refrigerators, wine cabinets, and refrigerated cabinets composed of a tube-plate evaporator at both ends of the single-layer embedded winding plate and a U-shaped pipeline wire-tube condenser at both ends of the double-layer embedded winding plate (as Figure 8 shown).

[0084] Example 9 is an embedded winding type hot-end double-layer full-width refrigerator for refrigerators, wine cabinets, and refrigerators composed of a tube-sheet evaporator at both ends of a single-layer embedded winding plate and a U-shaped tube wire-sheet condenser between both ends of a double-layer embedded pressing plate (as Figure 9 shown).

[0085] Example 10 is a composite hot-end double-layer full-width refrigerator composed of a tube-sheet evaporator at both ends of a single-layer embedded winding plate, a U-shaped tube wire-sheet condenser between both ends of a double-layer embedded pressing plate, and two horizontally arranged double-layer embedded winding plates (as Figure 10 shown).

[0086] Example 11 is an embedded winding type top-mounted single-layer refrigerator for a mobile express refrigerator composed of a Peltier element arranged horizontally and a tube-sheet evaporator formed by using the inner lining of the box and a tube-sheet condenser formed by using the outer shell of the box (as Figure 11 shown).

[0087] Example 12 is an embedded winding type top-mounted double-layer refrigerator for large wine cabinets and refrigerators composed of a Peltier element arranged horizontally, a tube-sheet evaporator with a 90-degree downward bend in the pipeline, and a U-shaped tube wire-sheet condenser between both ends of a double-layer embedded winding plate (as Figure 12 shown).

[0088] Example 13 is an embedded winding type double-layer pipeline composite refrigerator for a small air conditioner composed of an O-shaped pipeline finned evaporator placed at the lower end of a double-layer embedded winding plate and a U-shaped pipeline finned condenser placed at the upper end of the double-layer embedded winding plate (as Figure 13 shown).

[0089] Example 14 is a double-layer composite refrigerator for a cabinet air conditioner with an inclined angle, which can be installed on the side or on the top, composed of an O-shaped pipeline wire-sheet evaporator placed at the lower end of a double-layer embedded winding plate and a U-shaped pipeline wire-sheet condenser placed at the upper end of the double-layer embedded winding plate (as Figure 14 shown).

[0090] Example 15 is a double-layer composite refrigerator for a cabinet air conditioner composed of a Peltier element arranged horizontally, an O-shaped finned evaporator with a 90-degree downward bend at both ends of a double-layer embedded winding plate, and a U-shaped finned condenser with a 90-degree upward bend at both ends of the double-layer embedded winding plate (as Figure 15 shown).

[0091] Example 16 is a double-layer composite refrigerator for a mobile air conditioner composed of a Peltier element arranged horizontally, an O-shaped finned evaporator with a 90-degree downward bend in the pipeline at both ends of a double-layer embedded pressing plate, and a U-shaped or O-shaped finned condenser with a 90-degree upward bend or a 180-degree upward bend at one end or a 180-degree upward bend at both ends in the pipeline at both ends of the double-layer embedded winding plate in Figure (a) (as Figure 16 shown).

[0092] Example 17 is an installation schematic diagram of an air conditioner for cabinets and pet rooms with an inclined angle, which can be installed on the side or at the top, consisting of an O-shaped wire tube evaporator at the lower end of a double-layer wound plate and a U-shaped wire tube condenser at the upper end of the double-layer wound plate (as Figure 17 shown).

[0093] Example 18 is a double-layer composite refrigerator for ice cream machines and cold drink machines, consisting of a horizontally arranged wound plate with 180-degree horizontally bare tube evaporators at both ends and a vertically arranged double-layer wound plate with 180-degree wire tube condensers at both ends (as Figure 18 shown).

[0094] Example 19 is a wound double-layer refrigerator for cold drink machines and water dispensers, consisting of an O-shaped bare tube evaporator at the lower end of a double-layer wound plate that can be installed on the side or at the top and a wire tube condenser with a 90-degree upward bend on one side at the upper end of the double-layer wound plate (as Figure 19 shown).

[0095] Example 20 is a wound double-layer composite refrigerator for cold and hot mattresses and cushions, consisting of U-shaped or O-shaped bare tube evaporators at the upper and lower ends of a double-layer wound plate and U-shaped pipe wire tube condensers at the upper end or both the upper and lower ends of the double-layer wound plate (as Figure 20 shown).

[0096] Example 21 is a wound double-layer radiator for cooling heat-generating devices, with U-shaped or O-shaped finned tubes bent 90 or 180 degrees up and down on the pipelines at one or both ends of a double-layer wound plate, with or without refrigeration chips installed (as Figure 21 shown).

[0097] Example 22 is a wound double-layer radiator for cooling heat-generating equipment, with U-shaped or O-shaped wire tubes (Figure a) or bare tubes (Figure b) bent 90 degrees up on the pipelines at both ends of a double-layer wound plate, with or without refrigeration chips installed (as Figure 22 shown).

Claims

1. A semiconductor refrigerator with heat conduction and heat exchange by an embedded winding heat pipe. Its assembly structure and pipeline arrangement are divided into two typical structures: an embedded single-layer pipeline refrigerator and an embedded double-layer pipeline refrigerator. It is characterized in that: The embedded single-layer pipeline refrigerator consists of one or more refrigeration chips; a single-layer embedded winding plate with a "middle" - shaped cross-section, which is assembled at the cold end of the refrigeration chip through two-wing mounting holes, has an assembly convex surface on one side, and a row of pipe-embedding grooves is arranged at the lower ends on both sides of the convex surface; a closed pipeline formed by bending a pipe into a sine wave shape with both ends bent, parallel rows of pipes between the two ends, and the head and tail connected by a sealing pipe or a check valve; at both ends of the single-layer embedded winding plate, the pipe distance is reduced to form parallel rows of pipes, and it is riveted to the pipe-embedding grooves at the lower ends on both sides of the convex surface by flattening the top of the pipe groove wall, forming a circulating pipeline arranged vertically at the lower end or both the upper and lower ends of the single-layer embedded winding plate, with a heat exchange plate or pipe wire or fin or bare pipe on the outer diameter, constituting a lower-end or upper and lower-end pipe-plate type or wire-tube type or fin type or bare-tube type single-layer evaporator, and a single-layer embedded winding plate with a "middle" - shaped cross-section, which is assembled at the hot end of the refrigeration chip through two-wing mounting holes, has an assembly convex surface on one side, and a row of pipe-embedding grooves is arranged at the lower ends on both sides of the convex surface; a closed pipeline formed by bending a pipe into a sine wave shape with both ends bent, parallel rows of pipes between the two ends, and the head and tail connected by a sealing pipe or a check valve; at both ends of the single-layer embedded winding plate, the pipe distance is reduced to form parallel rows of pipes, and it is riveted to the pipe-embedding grooves at the lower ends on both sides of the convex surface by flattening the top of the pipe groove wall, forming a circulating pipeline arranged vertically at the upper end or both the upper and lower ends of the single-layer embedded winding plate, with a heat exchange plate or pipe wire or fin or bare pipe on the outer diameter, constituting an upper-end or upper and lower-end wire-tube type or fin type or pipe-plate type or bare-tube type single-layer condenser, and installation screws passing through the mounting holes of the evaporator single-layer embedded winding plate and fastening to the heat-insulating part; installation screws with elastic parts passing through the mounting holes of the condenser single-layer embedded winding plate and fastening to the heat-insulating part, and further fastening the refrigeration chip between the convex surfaces of the evaporator and condenser single-layer embedded winding plates, constituting an upper-end or lower-end or upper and lower-end wire-tube type or pipe-plate type or fin type or bare-tube type embedded single-layer pipeline refrigerator; The embedded double-layer pipeline refrigerator consists of one or more refrigeration chips; a double-layer embedded winding plate with a "middle" - shaped cross-section and assembled at the cold end of the refrigeration chip through two-wing mounting holes, with an assembly convex surface on one side and a row of embedded pipe grooves provided at the lower ends on both sides of the convex surface and on the back of the convex surface; a closed pipeline formed by bending or winding a pipe into a sine wave shape or a spiral shape with both ends bent and parallel rows of pipes between the two ends, and the head and tail are connected by a sealed pipe or a one-way valve; at both ends of the double-layer embedded winding plate, the pipe distance is reduced to form parallel rows of pipes, and after riveting it to the embedded pipe grooves at the convex surface and the lower ends on both sides of the convex surface by flattening the top of the pipe groove wall, one end of the pipeline is vertically downward; one end of the row of pipes runs upward along the top of the double-layer embedded winding plate, then turns 180 degrees, and after being riveted to the embedded pipe groove on the back of the convex surface, it is also vertically downward, and coincides with the other end of the pipeline in parallel, forming a double-layer circulating pipeline arranged vertically at the lower end or both the upper and lower ends of the double-layer embedded winding plate, with a U-shaped or O-shaped pipeline end face and equipped with pipe threads or sleeve pieces or bare pipes; when the refrigeration chip and the double-layer embedded winding plate are installed horizontally, the U-shaped or O-shaped pipeline can be arranged horizontally, or one end or both ends can be bent downward by 90 degrees or 180 degrees to form the lower end or both the upper and lower ends, or when the refrigeration chip is horizontally arranged, one end or both ends of the pipeline are bent downward by 90 degrees or 180 degrees, and the pipeline end face is a U-shaped or O-shaped wire tube type or sleeve piece type or bare tube type double-layer evaporator and a double-layer embedded winding plate with a "middle" - shaped cross-section and assembled at the hot end of the refrigeration chip through two-wing mounting holes, with an assembly convex surface on one side and a row of embedded pipe grooves provided at the lower ends on both sides of the convex surface and on the back of the convex surface; a closed pipeline formed by bending or winding a pipe into a sine wave shape or a spiral shape with both ends bent and parallel rows of pipes between the two ends, and the head and tail are connected by a sealed pipe or a one-way valve. At both ends of the double-layer embedded winding plate, the pipe distance is reduced to form parallel rows of pipes, and after riveting it to the embedded pipe grooves at the convex surface and the lower ends on both sides of the convex surface by flattening the top of the pipe groove wall, one end of the pipeline is vertically upward; one end of the row of pipes runs downward along the bottom of the double-layer embedded winding plate, then turns 180 degrees, and after being riveted to the embedded pipe groove on the back of the convex surface, it is also vertically upward, and coincides with the other end of the pipeline in parallel, forming a double-layer circulating pipeline arranged vertically at the upper end or both the upper and lower ends of the double-layer embedded winding plate, with a U-shaped or O-shaped pipeline end face and equipped with pipe threads or sleeve pieces or bare pipes; when the refrigeration chip and the double-layer embedded winding plate are installed horizontally, the U-shaped or O-shaped pipeline can be arranged horizontally, or one end or both ends can be bent upward by 90 degrees or 180 degrees to form the upper end or both the upper and lower ends, or when the refrigeration chip is horizontally arranged, one end or both ends of the pipeline are bent upward by 90 degrees or 180 degrees, and the pipeline end face is a U-shaped or O-shaped wire tube type or sleeve piece type or bare tube type double-layer condenser and the installation screws pass through the installation holes of the double-layer embedded winding plate of the evaporator and are fastened to the heat-insulating part; the installation screws with elastic parts pass through the installation holes of the double-layer embedded winding plate of the condenser and are also fastened to the heat-insulating part, and then the refrigeration chip is fastened between the convex surfaces of the double-layer embedded winding plates of the evaporator and the condenser, forming an embedded double-layer pipeline refrigerator with a U-shaped or O-shaped end face, a wire tube type or sleeve piece type or bare tube type, and when the upper end or the lower end or both the upper and lower ends or the refrigeration chip is horizontally arranged, one end or both ends are bent upward or downward by 90 degrees or 180 degrees.

2. The semiconductor refrigerator with heat conduction and heat exchange by an embedded heat pipe according to claim 1, characterized in that In the "middle" - shaped cross - section of a single - layer or double - layer winding plate, the rest of the cross - section except the pipe - embedding groove is a solid structure; for material saving or processing convenience, process holes or material - saving cavities can also be provided in the cross - section; mounting holes are provided on both wings of the winding plate; a V - shaped riveting opening guide groove can be provided at the top of the pipe - groove wall; by maintaining or cutting the height of the back of the raised surface or the pipe - embedding groove of the double - layer winding plate in different sizes, it can be used as different forms of single - layer winding plates.

3. The semiconductor refrigerator with heat conduction and heat exchange by means of an embedded heat pipe according to claim 1, characterized in that The pipe - embedding grooves of single - layer or double - layer winding plates are formed by embedding multiple pipes and then flattening the top of the pipe - groove wall to rivet them into a riveting plane where the pipes and the pipe - groove walls are arranged alternately, and the side of the pipe is lower than or at the same plane as the riveting plane of the pipe - groove wall; the number of pipe - embedding grooves of single - layer or double - layer winding plates is determined according to the specification of the refrigeration chip and the diameter of the pipe; the shape of the pipe - embedding groove is determined according to the end - face shape of the pipe.

4. The semiconductor refrigerator with heat conduction and heat exchange by the embedded heat pipe according to claim 1, characterized in that When used for piping winding of multiple refrigeration chips, a composite winding plate can be composed of multiple single - layer or double - layer winding plates through horizontal arrangement, longitudinal extension or integral forming; at the confrontation of the corresponding cold - making pieces, an isolation space or an isolation groove is provided between each assembly raised surface, and mounting holes are provided on both sides corresponding to the isolation space or the isolation groove.

5. The semiconductor refrigerator with heat conduction and heat exchange by an embedded heat pipe according to claim 1, characterized in that The pipe wires on the outer diameter of the sine - wave - shaped U - shaped pipe are formed by butt - welding when the pipe is bent to form parallel rows of pipes, and then riveted on the winding plate; the pipe wires on the spiral O - shaped pipe are formed by butt - welding after the pipe is formed and riveted on the winding plate to form parallel rows of pipes; the fin - sheets sleeved on the U - shaped or O - shaped pipes are formed by alternately sleeving long - hole - type fin - sheets that can accommodate two or more pipes after the pipes and the winding plate are riveted, and then through pressing and tube expansion.

6. The semiconductor refrigerator with heat conduction and heat exchange by an embedded heat pipe according to claim 1, characterized in that The cold end uses a tube - plate - type, wire - tube - type, fin - sheet - type or bare - tube - type heat - pipe evaporator for heat transfer, and realizes continuous phase - change refrigeration by using the low - temperature liquefied saturated vapor at the cold end, through liquid reflux and re - absorption of heat for evaporation.

7. The semiconductor refrigerator with heat conduction and heat exchange by means of an embedded heat pipe according to claim 1, characterized in that When used for the configuration of cabinet air - conditioning products, cyclic heat transfer of the temperatures inside and outside the cabinet is adopted; that is, the cold - end fan sucks in outside air, passes it through the evaporator and sends it into the cabinet; the hot - end fan sucks out the heat of the cabinet, passes it through the condenser and discharges it into the atmosphere; in order to control the hot - end temperature, a cold - quantity diversion channel is provided between the cold - end evaporator and the hot - end fan to use the cold air sucked in by the hot - end fan to cool the condenser; when used for the configuration of mobile air - conditioners, the hot - end heat is discharged at the top of the air - conditioner to conform to the natural conduction direction of the hot air and reduce the heat impact on its surrounding environment and the human body.

8. The semiconductor refrigerator with heat conduction and heat exchange of the embedded winding heat pipe according to claim 1, wherein the evaporator Or the installation direction of the condenser pipe - embedding groove can be set to be reversed by 90 degrees according to the working mode of the refrigerator; when the pipe - embedding groove is vertically installed, a vertically arranged circulating pipeline is formed; when horizontally assembled, a horizontally arranged inclined pipeline is formed; a configuration method can also be adopted where the evaporator pipe - embedding groove is horizontally assembled and the condenser pipe - embedding groove is vertically assembled.

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