Optical module assembly and optical fiber connector

Abstract

An optical module assembly comprises a printed circuit board, a substrate installed on the printed circuit board, a transmitting chip installed on the substrate, a silicon optical chip installed on the substrate, and an optical fiber connected with the silicon optical chip to transmit optical signals. The daughter board is mounted on the printed circuit board; and the electric chip is mounted on the daughter board. And the optical fiber and the printed circuit board are spaced at a certain distance so as not to interfere with each other. The utility model also discloses an optical fiber connector comprising the optical module assembly. Compared with the prior art, the optical module assembly and the optical fiber connector provided by the utility model are provided with the substrate, the transmitting chip and the silicon optical chip are both arranged on the substrate, and the optical fiber and the printed circuit board are spaced by a certain distance through the heightening effect of the substrate so as not to interfere with each other.

Description

Background Art

[0002] Optical fiber connectors in the related art include a housing and an optical module assembly at least partially located in the housing. The optical module assembly includes a printed circuit board, a transmitting chip, a silicon photonics chip, etc.

[0003] The optical module assembly in the related art is generally applicable to multi-channel single wavelength. The transmitting chip is used to transmit an optical signal, which is transmitted into a receiving optical chip and finally converted into an electrical signal through an electrical chip. The receiving optical chip can be a silicon photonics chip, which includes a splitter and a plurality of optical modulators. The splitter divides the optical signal into corresponding paths; the optical signal and the electrical signal are jointly input into the optical modulator and converted into an output signal.

[0004] Please refer to Figure 1 and Figure 2 As shown, structurally, the optical module assembly in the related art generally includes a metal base 1', a PCB board 2' (printed circuit board) mounted on the metal base 1', and an electrical chip 3' mounted on the PCB board 2'. The PCB board 2' is provided with a hollowed-out portion 21' to accommodate a transmitting chip 4', a silicon photonics chip 5', and an optical module 6'. The optical module 6' includes an optical isolator 61' and lenses 62' respectively located on both sides of the optical isolator 61'.

[0005] Those skilled in the art can understand that, preferably, the transmitting chip 4' and the silicon photonics chip 5' are at the same height in order to minimize signal loss. However, installing the transmitting chip 4' and the silicon photonics chip 5' by providing the hollowed-out portion 21' on the PCB board 2' will reduce the available area of the PCB board 2', which is not conducive to improving and expanding the functions of the PCB board 2' and does not adapt to the development trend of the increasing complexity of the optical module assembly.

[0006] Please refer to Figure 1 As shown, the transmitting chip 4' is used to transmit an optical signal, which passes through the optical module 6' and is input into the silicon photonics chip 5' through a waveguide 7'. Please refer to Figure 2 As shown, the silicon photonics chip 5' is connected to an optical fiber 9' through an optical fiber array 8' (Fiber Array, FA). At this time, the arrangement of the optical fiber 9' will be a problem because the optical fiber 9' is prone to interference with the surface of the PCB board 2'.

[0007] It should be noted that Figure 1 and Figure 2 the related art in

[0008] Therefore, it is necessary to improve the optical module components and fiber optic connectors in the related art. Summary of the Invention

[0009] The purpose of the present utility model is to provide an optical module component and a fiber optic connector with easy fiber arrangement.

[0010] To achieve the above purpose, the present utility model adopts the following technical solutions: An optical module component, which includes:

[0011] A printed circuit board;

[0012] A substrate, the substrate is mounted on the printed circuit board;

[0013] A transmitting chip, the transmitting chip is mounted on the substrate;

[0014] A silicon photonics chip, the silicon photonics chip is mounted on the substrate;

[0015] An optical fiber, the optical fiber is connected to the silicon photonics chip to transmit optical signals;

[0016] A daughter board, the daughter board is mounted on the printed circuit board; and

[0017] An electrical chip, the electrical chip is mounted on the daughter board;

[0018] Wherein, the optical fiber is spaced apart from the printed circuit board by a certain distance without interference.

[0019] As a further improved technical solution of the present utility model, the transmitting chip and the silicon photonics chip are at the same height.

[0020] As a further improved technical solution of the present utility model, the optical module component further includes an optical module located between the transmitting chip and the silicon photonics chip.

[0021] As a further improved technical solution of the present utility model, the optical module includes an optical isolator and lenses respectively located on both sides of the optical isolator.

[0022] As a further improved technical solution of the present utility model, the silicon photonics chip is connected to a waveguide, and the optical signal passing through the optical module is input to the silicon photonics chip through the waveguide.

[0023] As a further improved technical solution of the present utility model, the electrical chip is electrically and mechanically connected to the daughter board through a plurality of first bonding elements.

[0024] As a further improved technical solution of the present utility model, the daughter board is fixed to the printed circuit board by means of flip chip packaging.

[0025] As a further improved technical solution of the present utility model, the daughter board is electrically and mechanically connected to the printed circuit board through a plurality of second bonding elements.

[0026] As a further improved technical solution of the present utility model, at least two silicon optical chips of the optical module assembly are applicable to multi-wavelength and dual-channel transmission.

[0027] The present utility model also discloses an optical fiber connector, which includes:

[0028] A first metal housing, and the first metal housing is provided with a first extension;

[0029] A second metal housing, and the second metal housing is provided with a second extension; and

[0030] An optical module assembly, which is the aforementioned optical module assembly, at least part of the optical module assembly is located between the first metal housing and the second metal housing, and the printed circuit board of the optical module assembly includes a tongue plate, and the tongue plate is located between the first extension and the second extension.

[0031] Compared with the prior art, the optical module assembly and the optical fiber connector of the present utility model are provided with a substrate, and both the emitting chip and the silicon optical chip are mounted on the substrate. Through the elevation effect of the substrate, the optical fiber and the printed circuit board are spaced apart by a certain distance so as not to interfere with each other. Description of the Drawings

[0032] Figure 1 is a schematic structural diagram of an optical module assembly in the related art;

[0033] Figure 2 is a schematic structural diagram of the optical module assembly in the related art from another angle;

[0034] Figure 3 is a schematic structural diagram of the optical module assembly of the present utility model in one embodiment;

[0035] Figure 4 is Figure 3 a schematic structural diagram from another angle;

[0036] Figure 5 is a working principle diagram of the multi-wavelength emitting silicon optical chip of the present utility model;

[0037] Figure 6 is a connection schematic diagram of the multi-wavelength single-channel optical fiber of the present utility model;

[0038] Figure 7 is a three-dimensional schematic diagram of the optical fiber connector of the present utility model in one embodiment;

[0039] Figure 8 is Figure 7 a perspective schematic view from another angle;

[0040] Figure 9 is Figure 7 the top view of;

[0041] Figure 10 is Figure 8 the top view of;

[0042] Figure 11 is Figure 8 the side view of;

[0043] Figure 12 is Figure 7 the front view of;

[0044] Figure 13 is Figure 8 the rear view of;

[0045] Figure 14 is the partial exploded perspective view of the fiber optic connector of the present utility model in one embodiment;

[0046] Figure 15 is Figure 14 the partial exploded perspective view from another angle;

[0047] Figure 16 is Figure 14 the partial exploded perspective view of the optical module assembly in, where the daughter board and the electrical chips are separated. Specific Embodiments

[0048] The following will describe in detail the exemplary specific embodiments of the present utility model with reference to the accompanying drawings. If there are several specific embodiments, the features in these embodiments can be combined with each other without conflict. When the description involves the accompanying drawings, unless otherwise specified, the same numbers in different drawings represent the same or similar elements. The content described in the following exemplary specific embodiments does not represent all embodiments consistent with the present utility model; on the contrary, they are only examples of devices, products, and / or methods consistent with some aspects of the present utility model as recited in the claims of the present utility model.

[0049] The terms used in the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the protection scope of the present utility model. The singular forms of "a", "the", or "said" used in the specification and claims of the present utility model are also intended to include the plural forms unless the context clearly indicates otherwise.

[0050] It should be understood that the terms used in the description and claims of the present utility model, such as "first", "second" and similar terms, do not denote any order, quantity or importance, but are only used to distinguish the named features. Similarly, terms such as "a" or "one" do not denote a quantity limitation, but indicate the existence of at least one. Unless otherwise indicated, the terms such as "front", "rear", "upper", "lower" and the like appearing in the present utility model are only for convenience of description and are not limited to a specific position or a spatial orientation. The terms such as "comprising" or "including" are open-ended expressions, meaning that the elements appearing before "comprising" or "including" cover the elements appearing after "comprising" or "including" and their equivalents, and this does not exclude that the elements appearing before "comprising" or "including" may further include other elements. If "several" appears in the present utility model, its meaning refers to two or more.

[0051] Please refer to Figures 3 to 16 As shown, the present utility model discloses an optical module assembly 100, which includes a printed circuit board (PCB) 1, a substrate 2 mounted on the printed circuit board 1, a transmitting chip 21 mounted on the substrate 2, a silicon photonics chip 22 mounted on the substrate 2, and an optical module 23 located between the transmitting chip 21 and the silicon photonics chip 22. The optical module 23 includes an optical isolator 231 and lenses 232 respectively located on both sides of the optical isolator 231.

[0052] Preferably, the transmitting chip 21 and the silicon photonics chip 22 are at the same height to minimize signal loss as much as possible.

[0053] Those skilled in the art can understand that during the manufacturing process of the printed circuit board 1, a certain degree of deformation will inevitably occur, resulting in insufficient flatness of its surface. To solve the above problems, the present utility model provides a substrate 2 with sufficiently high flatness to facilitate the installation of the transmitting chip 21 and the silicon photonics chip 22, thereby avoiding the possible mounting problems caused by directly mounting the transmitting chip 21 and the silicon photonics chip 22 on the printed circuit board 1.

[0054] The transmitting chip 21 is used to emit an optical signal, and the optical signal passes through the optical module 23.

[0055] The silicon photonics chip 22 is connected to a waveguide 221. The optical signal passing through the optical module 23 is input to the silicon photonics chip 22 through the waveguide 221.

[0056] In the illustrated embodiment of the present utility model, the optical module assembly 100 further includes a daughter board 24 mounted on the printed circuit board 1 and an electrical chip 25 mounted on the daughter board 24. The daughter board 24 can be made of a printed circuit board.

[0057] The silicon optical chip 22 is connected to the optical fiber 223 through a fiber array 222 (Fiber Array, FA). Those skilled in the art can understand that in the illustrated embodiment of the present utility model, the printed circuit board 1 is not provided with any hollowed-out portions for accommodating the transmitting chip 21 and the silicon optical chip 22. Therefore, the printed circuit board 1 has good structural strength and a relatively large available area, which is beneficial for arranging more electronic components.

[0058] In addition, in the illustrated embodiment of the present utility model, the optical fiber 223 is higher than the printed circuit board 1 and will not interfere with the printed circuit board 1.

[0059] In an embodiment of the present utility model, the electrical chip 25 is electrically connected to the daughter board 24 through a plurality of first bonding elements 251 (for example, first solder balls). Those skilled in the art can understand that when the first solder balls are melted, the electrical chip 25 can be fixed to the daughter board 24.

[0060] In addition, in an embodiment of the present utility model, the daughter board 24 is fixed to the printed circuit board 1 by flip chip bond. For example, the daughter board 24 is electrically connected to the printed circuit board 1 through a plurality of second bonding elements 252 (for example, second solder balls). Those skilled in the art can understand that when the second solder balls are melted, the daughter board 24 can be fixed to the printed circuit board 1.

[0061] Please refer to Figure 5 As shown, in an application of the optical module assembly 100 of the present utility model, the silicon optical chip 22 of the optical module assembly 100 is applicable to multi-wavelength and dual-channel transmission. At this time, a first optical signal LS1 and a second optical signal LS2 are emitted from the transmitting chip 21, and the first optical signal LS1 and the second optical signal LS2 have different wavelengths. The silicon optical chip 22 includes a splitter 224 and a plurality of optical modulators 225. The splitter 224 divides the first optical signal LS1 and the second optical signal LS2 into corresponding paths, and then inputs the optical signal and the electrical signal ES into the optical modulators 225 together and converts them into output signals.

[0062] Please refer to Figure 6As shown, the silicon photonic chip 22 of the optical module assembly 100 of the present utility model can be several (for example, two), and different wavelength transmitting silicon photonic chips 22 and optical fiber 223 connection combination methods are used to achieve multi-wavelength single-channel transmission. For example, optical signals of different continuous waves (for example, 1270CW, 1290CW, 1310CW, and 1330CW respectively) are input into several silicon photonic chips 22, and after being processed by the silicon photonic chips 22, they are output after being operated by a multiplexer 5 (MUX).

[0063] Please refer to Figures 7 to 16 As shown, the present utility model also discloses an optical fiber connector 200 including the optical module assembly 100. The optical fiber connector 200 includes a first metal housing 3, a second metal housing 4, and the optical module assembly 100 at least partially located between the first metal housing 3 and the second metal housing 4.

[0064] The optical fiber connector 200 is provided with a docking surface 201. The first metal housing 3 is provided with a first extension 31 protruding from the docking surface 201. The second metal housing 4 is provided with a second extension 41 protruding from the docking surface 201. In the illustrated embodiment of the present utility model, the second extension 41 is generally U-shaped, and includes a plate portion 411, a first side wall 412 vertically extending away from the first extension 31 from one side of the plate portion 411, and a second side wall 413 vertically extending away from the first extension 31 from the other side of the plate portion 411. The plate portion 411 is provided with a plurality of through holes 411a. The second metal housing 4 is further provided with a plurality of spaced fins 42 and grooves 43 located between adjacent fins 42. The fins 42 can be configured for heat dissipation, and the grooves 43 can be configured to allow air flow through to improve heat dissipation.

[0065] The printed circuit board 1 of the optical module assembly 100 is provided with a tongue plate 11 protruding from the docking surface 201. The tongue plate is located between the first extension 31 and the second extension 41.

[0066] Compared with the prior art, the optical module assembly 100 and the optical fiber connector 200 of the present utility model are provided with a substrate 2. The emitting chip 21 and the silicon photonic chip 22 are both mounted on the substrate 2. Through the elevation effect of the substrate 2, the optical fiber 223 is spaced from the printed circuit board 1 by a certain distance so as not to interfere with each other.

[0067] The above embodiments are only used to illustrate the present utility model and do not limit the technical solutions described by the present utility model. The understanding of the present utility model should be based on those skilled in the relevant technical field. Although this specification has described the present utility model in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the relevant technical field can still make modifications or equivalent replacements to the present utility model. All technical solutions and their improvements that do not depart from the spirit and scope of the present utility model shall be covered within the scope of the claims of the present utility model.

Claims

1. An optical module component, characterized in that, Comprising: A printed circuit board; A substrate mounted on the printed circuit board; A transmitting chip mounted on the substrate; A silicon photonics chip mounted on the substrate; An optical fiber connected to the silicon photonics chip to transmit optical signals; A daughter board mounted on the printed circuit board; And An electrical chip mounted on the daughter board; Wherein, the optical fiber is spaced apart from the printed circuit board by a certain distance so as not to interfere with each other.

2. The optical module component according to claim 1, wherein: The transmitting chip and the silicon photonics chip are at the same height.

3. The optical module component according to claim 1, characterized in that: The optical module assembly further includes an optical module located between the transmitting chip and the silicon photonics chip.

4. The optical module component according to claim 3, characterized in that: The optical module includes an optical isolator and lenses respectively located on both sides of the optical isolator.

5. The optical module component according to claim 3, characterized in that: The silicon photonics chip is connected to a waveguide, and the optical signal passing through the optical module is input into the silicon photonics chip through the waveguide.

6. The optical module component according to claim 1, wherein: The electrical chip is electrically and mechanically connected to the daughter board through a plurality of first bonding elements.

7. The optical module component according to claim 1, wherein: The daughter board is fixed to the printed circuit board by means of flip-chip packaging.

8. The optical module component according to claim 7, characterized in that: The daughter board is electrically and mechanically connected to the printed circuit board through a plurality of second bonding elements.

9. The optical module component according to claim 1, wherein: The silicon photonics chip of the optical module assembly is at least two and suitable for multi-wavelength and dual-channel transmission.

10. An optical fiber connector, characterized in that, Comprising: A first metal housing provided with a first extension portion; A second metal housing provided with a second extension portion; And A module assembly, the optical module assembly is the optical module assembly according to any one of claims 1 to 9, at least part of the optical module assembly is located between the first metal housing and the second metal housing, and the printed circuit board of the optical module assembly includes a tongue plate located between the first extension portion and the second extension portion.

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