Backboard film pasting device

Abstract

The utility model discloses a backboard film pasting device. The backboard film pasting device comprises a carrying mechanism and two film pasting mechanisms. Wherein one film pasting mechanism carries out inter-sheet film pasting on the back plate, the other film pasting mechanism carries out inter-string film pasting on the back plate, and the carrying mechanism carries the back plate to the sheet gap film pasting station for inter-sheet film pasting and carries the back plate from the sheet gap film pasting station to the string gap film pasting station for inter-string film pasting after the inter-sheet film pasting is finished; the film pasting mechanism comprises a film laying table, a film laying assembly and a heating assembly; the film paving table bears the film strip and the back plate; the film laying assembly is arranged above the film laying table, and film strips are laid on the film laying table; the heating assembly is arranged below the film laying table, and the film strip laid on the film laying table is heated from the lower portion so that the film strip can be bonded with the back plate laid on the film strip; according to the invention, the film strip can be heated from the lower part of the back plate so as to be pasted on the back plate, the back plate does not need to be reversed in the subsequent assembly glass combination process, the overall manufacturing process of the photovoltaic cell assembly is simplified, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of photovoltaic cell module manufacturing, and particularly to a backplane film sticking device in a photovoltaic cell. Background Art

[0002] Photovoltaic modules are usually encapsulated by a backplane, a lower layer of glue film, a battery string group, an upper layer of glue film, and a glass plate. Among them, there are gaps between adjacent two solar cells in the battery string group and between adjacent two battery strings. It is very difficult to directly absorb or utilize the light energy irradiated into these gaps. In order to improve the light energy utilization rate, the industry adopts sticking reflective film strips at positions corresponding to the inter-cell positions and the inter-string positions on the backplane. The light energy irradiated to the above gap positions is reflected to the glass plate through the reflective film strips, and then reflected to the solar cells through the glass plate, so as to make full use of the light energy at the gap positions.

[0003] Refer to Figure 1 As shown, several reflective film strips extending along the first horizontal direction (such as the Y direction in Figure 1 ) are the inter-cell gap film strips 6 corresponding to the inter-cell positions, and several reflective film strips extending along the second horizontal direction (such as the X direction in Figure 1 ) are the inter-string gap film strips 7 corresponding to the inter-string positions. In the prior art, the film sticking method of the backplane film sticking device is usually: transporting the backplane 3 to a designated position, and the film sticking head pastes the inter-cell gap film strips 6 and the inter-string gap film strips 7 on the upper surface of the backplane 3. Since the reflective film strips are located on the upper surface of the backplane 3, the backplane 3 needs to be flipped before the module is combined with the glass, so that the reflective film strips face down. Flipping the backplane 3 increases the process complexity and requires a separate backplane flipping mechanism, which also increases the manufacturing cost of the module. Utility Model Content

[0004] In order to solve the problems of the prior art, this application provides a backplane film sticking device.

[0005] Specifically, this application provides a backplane film sticking device, including: a handling mechanism and two film sticking mechanisms; one of the film sticking mechanisms is used for implementing inter-cell film sticking on the backplane, and the other film sticking mechanism is used for implementing inter-string film sticking on the backplane. The handling mechanism is used for transporting the backplane to the inter-cell film sticking station for inter-cell film sticking, and after the inter-cell film sticking is completed, transporting the backplane from the inter-cell film sticking station to the inter-string film sticking station for inter-string film sticking;

[0006] The film sticking mechanism includes a film laying table, a film laying component, and a heating component; the film laying table is used for carrying the film strips and the backplane; the film laying component is arranged above the film laying table and is used for laying the film strips on the film laying table; the heating component is arranged below the film laying table and is used for heating the film strips laid on the film laying table from below so that the film strips are adhered to the backplane laid thereon.

[0007] The backplane film pasting device provided by the present application enables two film pasting mechanisms to perform inter - sheet film pasting and inter - string film pasting on the backplane successively. The film laying component in each film pasting mechanism can lay film strips on the film laying table. After the film strips are laid, the handling mechanism places the backplane on the film strips. The heating component is arranged below the film laying table and can heat the film strips from below the backplane to make the film strips adhere to the backplane. After the film strips are pasted, they are located on the lower surface of the backplane. In the subsequent component glass - combining process, it is no longer necessary to reverse the backplane, simplifying the overall manufacturing process of photovoltaic cell components and improving production efficiency.

[0008] In some embodiments, the film laying table for inter - sheet film pasting includes: a frame, a first lifting drive assembly, and a first film strip adsorption table arranged inside the frame;

[0009] The frame is configured to support the backplane at the top;

[0010] The first film strip adsorption table is configured to adsorb and fix the inter - sheet gap film strips laid by the corresponding film laying component;

[0011] The first lifting drive assembly is drivingly connected to the first film strip adsorption table and is used to drive the first film strip adsorption table to lift and lower.

[0012] By adsorbing and fixing the film strips with the first film strip adsorption table, the thin and light film strips can be stably fixed, ensuring the film pasting accuracy of the film strips. By drivingly connecting the first film strip adsorption table with the first lifting drive assembly, when the handling mechanism places the backplane on the top of the frame, the first film strip adsorption table and the adsorbed film strips can be first controlled to descend to the avoidance low position. After the position of the backplane is adjusted, the first film strip adsorption table and the adsorbed film strips are then controlled to rise, so that the film strips contact the lower surface of the backplane, thus avoiding affecting the surface quality of the film strips.

[0013] In some embodiments, there are at least two first film strip adsorption tables, and each first film strip adsorption table is used to adsorb and fix at least one inter - sheet gap film strip; at least one support member for carrying the backplane is arranged on the top surface of the frame, and an avoidance gap for avoiding the support member during lifting is arranged between two adjacent first film strip adsorption tables.

[0014] A specific structural setting of the first film strip adsorption table and the frame is provided. When the first film strip adsorption table descends below the support member under the drive of the first lifting drive assembly, the film strips adsorbed and fixed by it can be separated from the backplane carried by the support member, facilitating the position movement of the backplane without rubbing the film strips.

[0015] In some embodiments, the film pasting mechanism for inter - sheet film pasting further includes a rectifying component, and the rectifying component is configured to clamp the backplane carried to the film laying table at the inter - sheet gap film pasting station and rectify the position of the backplane.

[0016] By arranging a rectifying component at the film laying table at the film pasting station between chips, it is possible to rectify the position of the backplane by using the rectifying component before pasting the film on the backplane, avoiding misalignment of the film strip pasting and ensuring the film pasting accuracy.

[0017] In some embodiments, the rectifying component includes an X-direction guide rail, a Y-direction guide rail, and a pair of rectifying members. At least one rectifying member is arranged on each side of the film laying table for inter-chip film pasting. The X-direction guide rail and the Y-direction guide rail are both horizontally arranged and perpendicular to each other;

[0018] The rectifying member is configured to slide along the X-direction guide rail or the Y-direction guide rail to approach or move away from the backplane laid on the film laying table.

[0019] By arranging at least one rectifying member on each side of the backplane, the backplane can be rectified quickly and accurately.

[0020] In some embodiments, the film pasting mechanism for inter-chip film pasting further includes a punching component;

[0021] The punching component is arranged below the film laying table at the film pasting station between chips. An avoidance channel is arranged on the film laying table at the film pasting station between chips corresponding to the position of the inter-chip film strip in the middle of the backplane. The punching component is configured to pass through the avoidance channel to punch through holes corresponding to the positions of the lead holes on the backplane on the inter-chip film strip in the middle of the backplane.

[0022] By arranging the punching component below the film laying table at the film pasting station between chips, after the inter-chip film pasting is completed at the film pasting station between chips, the punching component can punch one inter-chip film strip in the middle of the backplane, facilitating the subsequent combination of glass. The leads in the battery string group of the photovoltaic module extend through the punched part and the lead holes on the backplane and are installed with the junction box.

[0023] In some embodiments, the punching component includes a punch longitudinally arranged for punching the inter-chip film strip in the middle of the backplane, and a second lifting drive component for driving the punch to lift and lower.

[0024] By driving the punch to punch the inter-chip film strip in the middle of the backplane through the second lifting drive component and driving the punch to descend after punching, it is possible to avoid affecting the subsequent laying and pasting of the film strip and the backplane.

[0025] In some embodiments, the film laying table for inter-string film pasting includes a second film strip adsorption table, and the second film strip adsorption table is configured to adsorb and fix the inter-string film strip laid by the corresponding film laying component and carry the backplane.

[0026] After the inter-string film strip is laid on the second film strip adsorption table, the second film strip adsorption table can directly carry the backplane without adjusting the position of the backplane, and the structure is simpler and more compact.

[0027] In some embodiments, the film laying table is further configured to adsorb each film strip, and an avoidance hole is formed in the film laying table for the heating component to pass through to heat the film strip carried and adsorbed on the film laying table; the heating component below the film laying table heats the film strip carried above the film laying table through the avoidance hole.

[0028] The heating component only moves up and down linearly, with a simple traveling path and a compact overall structure of the film laying table.

[0029] In some embodiments, a plurality of film strip bearing positions are provided on the film laying table, each film strip bearing position is configured to bear a film strip, and a heating component is correspondingly arranged below each film strip bearing position of the film laying table;

[0030] Each heating component is configured to translate along the length direction of the film strip borne by the corresponding film strip bearing position to sequentially spot-iron at least two points on the corresponding film strip above, so that the film strip is pasted on the back plate.

[0031] Using one heating component to perform sequential spot-ironing on the corresponding film strip above can reduce the number of heating components and lower the structural cost.

[0032] In some embodiments, a first translation guide rail, a first translation driving component and a third lifting driving component are arranged below each film strip bearing position;

[0033] The first translation guide rail is parallel to the film strip on the corresponding film strip bearing position, the third lifting driving component is slidably connected to the first translation guide rail and is driven to translate by the first translation driving component, and the third lifting driving component is connected to the corresponding heating component to drive the heating component to lift.

[0034] By cooperating with the first translation driving component and the third lifting driving component to drive the heating component to translate and lift, it is possible to realize sequential close-range heating of at least two points to be heated on the film strip by the heating component. Through the guiding of the first translation guide rail, it is possible to prevent the position of the heating component from shifting during the sequential spot-ironing process.

[0035] In some embodiments, a plurality of film strip bearing positions are provided on the film laying table, each film strip bearing position is configured to bear a film strip, and at least two heating components are correspondingly arranged below each film strip bearing position of the film laying table, and the at least two heating components are arranged at intervals along the length direction of the film strip on the corresponding film strip bearing position;

[0036] The at least two heating components are configured to simultaneously perform spot-ironing on the film strip on the corresponding film strip bearing position above, so that the film strip is bonded to the back plate.

[0037] Using a plurality of heating components to simultaneously perform spot-ironing on the corresponding film strip above can improve the speed of spot-ironing the film strip and enhance the production efficiency.

[0038] In some embodiments, a fourth lifting drive assembly is further provided below the film laying table;

[0039] Each heating assembly is connected to the fourth lifting drive assembly and is driven to lift simultaneously by the fourth lifting drive assembly.

[0040] All the heating assemblies lift simultaneously, enabling the spot ironing of all the film strips to be completed simultaneously, further improving the production efficiency.

[0041] In some embodiments, the film laying assembly for inter-chip film sticking includes a second translation guide rail, a second translation drive assembly, and a film laying head assembly; the second translation guide rail is fixed on the film laying table at the inter-chip film sticking station and is arranged along the length direction of the inter-chip film strip to be laid; the film laying head assembly is configured to be driven by the second translation drive assembly to lay the inter-chip film strip on the film laying table while translating on the second translation guide rail; the film laying head assembly includes: a moving member and a film laying head mounted on the moving member;

[0042] The moving member is slidably connected to the second translation guide rail and is driven by the second translation drive assembly. The number of film laying heads is equal to the number of inter-chip film strips required at the inter-chip film sticking station, and each film laying head is arranged on the moving member at intervals along the direction perpendicular to the second translation guide rail.

[0043] The film laying heads equal in number to the inter-chip film strips required at the inter-chip film sticking station can translate along the length direction of the inter-chip film strip under the drive of the second translation drive assembly, and complete the laying of all the inter-chip film strips at one time.

[0044] In some embodiments, the film laying assembly for inter-string film sticking includes: a third translation guide rail, a third translation drive assembly, and a set of film laying head assemblies; the third translation guide rail is fixed on the film laying table at the inter-string film sticking station and is arranged along the length direction of the inter-string film strip to be laid;

[0045] A set of film laying head assemblies is configured to be driven by the third translation drive assembly to lay two groups of inter-string film strips on the film laying table in batches while translating on the third translation guide rail;

[0046] The film laying head assembly includes: a moving member and a film laying head mounted on the moving member;

[0047] The moving member is slidably connected to the third translation guide rail and is driven by the third translation drive assembly. The number of film laying heads is equal to the number of a set of inter-string film strips required at the inter-string film sticking station, and each film laying head is arranged on the moving member at intervals along the direction perpendicular to the third translation guide rail.

[0048] A set of film laying head assemblies is driven by the third translation drive assembly to complete the laying of two groups of inter-string film strips in two times along the length direction of the inter-string film strip, reducing the number of film laying heads and simplifying the film sticking structure at the inter-string film sticking station.

[0049] In some embodiments, the film laying assembly for inter-string film sticking includes: a fourth translation guide rail, a fourth translation driving assembly, and two groups of film laying head assemblies; the fourth translation guide rail is fixed on the film laying table at the inter-string film sticking station and is arranged along the length direction of the inter-string film strip to be laid;

[0050] The two groups of film laying head assemblies are configured to be driven by the fourth translation driving assembly to respectively lay two groups of inter-string film strips on the film laying table while translating on the fourth translation guide rail;

[0051] Each group of film laying head assemblies includes: a moving member and a film laying head mounted on the moving member;

[0052] The moving member is slidably connected to the fourth translation guide rail and is driven by the fourth translation driving assembly. The number of film laying heads is equal to the number of a group of inter-string film strips required at the inter-string film sticking station, and each film laying head is arranged on the moving member at intervals in a direction perpendicular to the fourth translation guide rail.

[0053] Setting the two groups of film laying head assemblies to be driven by the fourth translation driving assembly to simultaneously lay two groups of inter-string film strips can complete the laying of two groups of inter-string film strips on the backplane at one time, improving the film sticking efficiency.

[0054] In some embodiments, the film laying head includes: a connecting plate, and a film strip guiding member, a film strip feeding member, a cutting member, and a pressing member respectively mounted on the connecting plate;

[0055] The connecting plate is mounted on the corresponding moving member, and the film strip guiding member is mounted on the top of the connecting plate for guiding and limiting the film strip;

[0056] The film strip feeding member is arranged on one side of the film strip guiding member adjacent to the film laying table for controlling the movement of the film strip;

[0057] Both the cutting member and the pressing member are located at the bottom end of the connecting plate. The pressing member is used to control the pressing and loosening of the film strip, and the cutting member is used to cut the film strip; the film strip is limited and guided by the film strip guiding member and enters the film strip feeding member, is sent out from the film strip feeding member, is pressed by the pressing member and laid on the film laying table, and is cut by the cutting member after completing one laying stroke.

[0058] By guiding and limiting the film strip through the film strip guiding member, controlling the movement of the film strip by the film strip feeding member, pressing the film strip on the film laying table by the pressing member, and cutting the film strip by the cutting member, the film strip can be accurately laid on the film laying table, avoiding the deviation of the film strip position during the laying process.

[0059] In some embodiments, the handling mechanism includes a first handling component and a second handling component;

[0060] The first handling component is arranged on one side of the film pasting mechanism for implementing inter-chip film pasting on the backplane, and is used to transport the backplane from the backplane feeding area to the film laying table at the inter-chip film pasting station;

[0061] The second handling component is arranged between the two film pasting mechanisms, and is used to transport the backplane from the film laying table at the inter-chip film pasting station to the film laying table at the inter-string film pasting station.

[0062] After the first handling component transports the backplane in the feeding area to the inter-chip film pasting station to complete inter-chip film pasting, the second handling component then transports the backplane to the inter-string film pasting station to complete inter-string film pasting. The two handling components can work simultaneously to realize the transfer and handling of the backplane, improving production efficiency. Description of the Drawings

[0063] Referring to the accompanying drawings, the disclosure of the present application will become easier to understand. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the protection scope of the present application. In addition, similar numbers in the drawings are used to represent similar components, where:

[0064] Figure 1 is a schematic diagram of the backplane after completing inter-chip film pasting and inter-string film pasting;

[0065] Figure 2 is Figure 1 the enlarged view of part A in

[0066] Figure 3 is a schematic structural diagram of the backplane film pasting device in one embodiment of the present application;

[0067] Figure 4 is a schematic structural diagram of the film pasting mechanism for inter-chip film pasting in the backplane film pasting device in one embodiment of the present application;

[0068] Figure 5 is a schematic diagram of the cooperation between the first film strip adsorption table and the alignment component in the inter-chip film pasting mechanism of the backplane film pasting device in one embodiment of the present application;

[0069] Figure 6 is Figure 5 the partial enlarged view of part B in

[0070] Figure 7 is a schematic side view of the film laying table in the inter-chip film pasting mechanism of the backplane film pasting device in one embodiment of the present application;

[0071] Figure 8 is a schematic diagram of the punching process of the inter-chip film strip by the punching mechanism in the inter-chip film pasting mechanism of the backplane film pasting device in one embodiment of the present application;

[0072] Figure 9It is a schematic structural diagram of the inter-string film pasting mechanism in the backplane film pasting device in one embodiment of the present application;

[0073] Figure 10 It is a schematic diagram of the cooperation between the second film strip adsorption table and the heating component in the backplane film pasting device in one embodiment of the present application;

[0074] Figure 11 is Figure 10 The enlarged view at position C in;

[0075] Figure 12 It is a schematic structural diagram of the film laying head in the backplane film pasting device in one embodiment of the present application.

[0076] Wherein: 1. Handling mechanism; 11. First handling component; 12. Second handling component; 2. Film pasting mechanism; 2A. Inter-chip film pasting mechanism; 2B. Inter-string film pasting mechanism; 21. Film laying table; 2a1. Frame; 2a11. Support member; 2a2. First lifting drive component; 2a3. First film strip adsorption table; 2a4. Avoidance gap; 2b1. Second film strip adsorption table; 2b2. Fifth lifting drive component; 22. Film laying component; 221. Second translation guide rail; 223. Film laying head component; 2231. Moving part; 2232. Film laying head; 22321. Connecting plate; 22322. Film strip guiding member; 22323. Film strip feeding member; 22324. Cutting member; 22325. Pressing member; 22a. Fourth translation guide rail; 23. Heating component; 24. Rectifying component; 241. X-direction guide rail; 242. Y-direction guide rail; 243. Rectifying member; 244. Rectifying driver; 25. Punching component; 251. Punch head; 252. Second lifting drive component; 3. Backplane; 4. Avoidance hole; 5. Fourth lifting drive component; 6. Inter-chip gap film strip; 7. Inter-string gap film strip; 8. Through hole; 10. Adsorption table main body; 13. Adsorption hole. Detailed implementation manners

[0077] The following describes some embodiments of the present application with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present application and are not intended to limit the protection scope of the present application.

[0078] As described in the background art, the film pasting method of the current backplane film pasting device is usually as follows: the backplane is conveyed to a specified position, and the film pasting head pastes the inter-chip gap film strip and the inter-string gap film strip on the upper surface of the backplane. Since the reflective film strip is located on the upper surface of the backplane, the backplane needs to be flipped before the components are combined with glass to make the reflective film strip face down. Flipping the backplane increases the process complexity and requires a separate backplane flipping mechanism, which also increases the manufacturing cost of the components. To solve the above problems, the present application creatively proposes a backplane film pasting device. The reflective film strip and the backplane are sequentially laid above the film laying table, and a heating component is arranged below the film laying table to heat the reflective film strip laid on the film laying table from below so that the reflective film strip is bonded to the backplane laid on the reflective film strip. Before the subsequent components are combined with glass, there is no need to flip the backplane to make the reflective film strip face down, reducing the process complexity and eliminating the need for a separate backplane flipping mechanism, thereby reducing the manufacturing cost of the components.

[0079] The following will specifically elaborate on the present application through specific embodiments.

[0080] An embodiment of the present application provides a backplane film pasting device, in combination with Figure 1 , referring to Figures 2 to 7 shown, including: a handling mechanism 1 and two film pasting mechanisms 2; one of the film pasting mechanisms is used to perform inter-chip film pasting on the backplane 3, denoted as the inter-chip film pasting mechanism 2A, and the other film pasting mechanism is used to perform inter-string film pasting on the backplane, denoted as the inter-string film pasting mechanism 2B. The handling mechanism 1 is used to convey the backplane 3 to the inter-chip film pasting station M for inter-chip film pasting, and after the inter-chip film pasting is completed, convey the backplane 3 from the inter-chip film pasting station M to the inter-string film pasting station N for inter-string film pasting; the inter-chip film pasting station M refers to the place where the inter-chip gap film strip 6 and the backplane 3 are laid and bonded, and the inter-string film pasting station N refers to the place where the inter-string gap film strip 7 and the backplane 3 are laid and bonded.

[0081] The film pasting mechanism 2 includes a film laying table 21, a film laying assembly 22, and a heating assembly 23; the film laying table 21 is used to carry the film strip and the backplane 3; the film laying assembly 22 is arranged above the film laying table 21 and is used to lay the film strip on the film laying table 21; the heating assembly 23 is arranged below the film laying table 21 and is used to heat the film strip laid on the film laying table 21 from below so that the film strip is bonded to the backplane 3 laid on it.

[0082] The film strips to be pasted on the backplane 3 are divided into an inter-chip gap film strip 6 and an inter-string gap film strip 7. Taking the backplane 3 shown in Figure 1 as an example, several reflective film strips extending along the first horizontal direction (i.e., the Y direction in Figure 1 ) are the inter-chip gap film strips 6 corresponding to the inter-chip positions. As shown in Figure 1 , there are 25 inter-chip gap film strips 6 in total; along the second horizontal direction (i.e., Figure 1A plurality of reflective film strips extending in the X direction (in the figure) i.e., the string gap film strips 7 corresponding to the positions between the strings. The second horizontal direction is perpendicular to the first horizontal direction. Among them, there are two groups of string gap film strips 7 arranged side by side in the second horizontal direction, and each group contains the same number of string gap film strips 7. For example, Figure 1 each group in Figure 1 contains 7 string gap film strips 7, and there are a total of 14 string gap film strips 7 on the entire backplane. The number of inter - cell gap film strips 6 and string gap film strips 7 on the backplane mainly depends on the number of cell strings in the photovoltaic module and the number of solar cells included in each cell string.

[0083] The working process of the backplane film - pasting device in the embodiment of the present application is as follows:

[0084] The film - laying component 22 in the inter - cell film - pasting mechanism 2A lays the inter - cell gap film strips 6 on the film - laying table 21 in the inter - cell film - pasting mechanism 2A. The handling mechanism 1 transports the backplane 3 from the feeding area to the inter - cell film - pasting station M and places it on the laid inter - cell gap film strips 6. The heating component 23 in the inter - cell film - pasting mechanism 2A heats the laid inter - cell gap film strips 6 from below, so that the inter - cell gap film strips 6 are bonded to the backplane 3 laid thereon. The film - laying component 22 in the inter - string film - pasting mechanism 2B lays the string gap film strips 7 on the film - laying table 21 in the inter - string film - pasting mechanism 2B. The handling mechanism 1 then transports the backplane with the inter - cell gap film strips 6 pasted thereon to the inter - string film - pasting station N and places it on the laid string gap film strips 7. The heating component 23 in the inter - string film - pasting mechanism 2B heats the laid string gap film strips 7 from below, so that the string gap film strips 7 are bonded to the backplane 3 laid thereon. The heating components 23 in both the inter - cell film - pasting mechanism 2A and the inter - string film - pasting mechanism 2B heat the film strips from below the backplane 3, so that the inter - cell gap film strips 6 and the string gap film strips 7 are pasted on the backplane 3. After the inter - cell gap film strips 6 and the string gap film strips 7 are pasted well, they are located on the lower surface of the backplane 3. In the subsequent component glass - combining process, there is no need to reverse the backplane 3, which simplifies the overall manufacturing process of the photovoltaic cell module and improves the production efficiency. In some embodiments, referring to Figures 4 to 7 as shown, the film - laying table 21 for inter - cell film - pasting in the inter - cell film - pasting mechanism 2A includes: a frame 2a1, a first lifting drive assembly 2a2, and a first film strip adsorption table 2a3 arranged inside the frame 2a1;

[0085] The frame 2a1 is configured to support the backplane 3 at the top; the first film strip adsorption table 2a3 is configured to adsorb and fix the sheet gap film strip 6 laid by the corresponding film laying assembly 22; the first lifting drive assembly 2a2 is drivingly connected to the first film strip adsorption table 2a3 for driving the first film strip adsorption table 2a3 to lift; by adsorbing and fixing the sheet gap film strip 6 with the first film strip adsorption table 2a3, the thin and light sheet gap film strip 6 can be stably fixed, ensuring the film sticking accuracy of the film strip; by drivingly connecting the first film strip adsorption table 2a3 with the first lifting drive assembly 2a2, when the handling mechanism 1 places the backplane 3 on the top of the frame 2a1, the first film strip adsorption table 2a3 and the adsorbed sheet gap film strip 6 can be first controlled to descend to the avoidance low position, and after the position of the backplane 3 is adjusted, the first film strip adsorption table 2a3 and the adsorbed sheet gap film strip 6 are then controlled to rise, so that the sheet gap film strip 6 contacts the lower surface of the backplane 3, thereby avoiding affecting the position accuracy of the sheet gap film strip 6 and the surface quality of the sheet gap film strip 6 due to directly adjusting the position of the backplane 3 on the sheet gap film strip 6.

[0086] Optionally, referring to Figure 4 and Figure 5 as shown, the first film strip adsorption table 2a3 is provided with at least two (such as Figure 4 5 in Figure 5 ), and each first film strip adsorption table 2a3 is used for adsorbing and fixing at least one sheet gap film strip 6. Optionally, referring to Figure 6 and

[0087] as shown, at least one row of adsorption holes 13 is provided on each first film strip adsorption table 2a3, and each row of adsorption holes 13 corresponds to adsorb one sheet gap film strip 6. The sum of the number of rows of adsorption holes 13 on each first film strip adsorption table 2a3 is equal to the number of sheet gap film strips 6 to be pasted on the backplane 3, and the positions of each row of adsorption holes 13 are designed according to the positions of the sheet gap film strips 6 to be laid. Figure 4 Continuing to refer to Figure 4 as shown, at least one support member 2a11 for carrying the backplane 3 (such as

[0088] 4 in Figure 4 is provided on the top surface of the frame 2a1, and an avoidance gap 2a4 for avoiding the support member 2a11 during lifting is provided between two adjacent first film strip adsorption tables 2a3; a specific structural setting of the first film strip adsorption table 2a3 and the frame 2a1 is provided. When the first film strip adsorption table 2a3 descends below the support member 2a11 under the drive of the first lifting drive assembly 2a2, the sheet gap film strip 6 adsorbed and fixed by it can be separated from the backplane 3 carried by the support member 2a11, facilitating the position movement of the backplane 3 without rubbing the sheet gap film strip 6. The first lifting drive assembly 2a2 can be any drive device such as a motor or a cylinder that can drive the first film strip adsorption table 2a3 to lift, and this embodiment does not make specific limitations on this.Figure 5 As shown, the inter-chip film laminating mechanism 2A for inter-chip film lamination further includes a rectifying component 24, which is configured to clamp the backplane 3 on the film laying table 21 carried to the film lamination station M between chips and rectify the position of the backplane 3. By providing the rectifying component 24 at the film laying table 21 at the film lamination station M between chips, it is possible to rectify the position of the backplane 3 with the rectifying component 24 before laminating the film strip on the backplane 3, avoid misalignment of the film strip during pasting, and ensure the lamination accuracy.

[0089] Optionally, the rectifying component 24 includes an X-direction guide rail 241, a Y-direction guide rail 242, and a pair of rectifying members 243 arranged in pairs. At least one rectifying member 243 is provided on each side of the film laying table 21 for inter-chip film lamination. The X-direction guide rail 241 and the Y-direction guide rail 242 are both horizontally arranged and perpendicular to each other. As Figure 4 shown, the X-direction guide rail 241 extends along the Figure 4 X direction in Figure 4 and the Y-direction guide rail 242 extends along the

[0090] Y direction in

[0091] The rectifying member 243 is configured to slide along the X-direction guide rail 241 or the Y-direction guide rail 242 to approach or move away from the backplane 3 laid on the film laying table 21. By providing at least one rectifying member 243 on each side of the backplane 3 that moves closer to or away from the backplane 3, the backplane 3 can be rectified quickly and accurately.

[0092] The alignment member 243 is connected to an alignment driver 244; the alignment member 243 is longitudinally arranged and slidably connected to the X-direction guide rail 241 or the Y-direction guide rail 242, and the alignment member 243 is driven by the alignment driver 244 to approach and abut against or move away from the backplane 3 laid on the film laying table 21. The alignment member 243 can be any component such as an alignment block, an alignment wheel, etc. that can apply a force to the backplane 3 to move the position of the backplane 3. Optionally, the surface of the alignment member 243 in contact with the backplane 3 is an arc surface to avoid excessive stress damage to the backplane 3 when pushing the backplane 3. Exemplarily, the alignment member 243 is an alignment wheel. Optionally, an elastic pad is covered on the contact surface of the alignment member 243 and the backplane 3 to buffer when pushing the backplane 3, avoiding excessive stress damage to the backplane 3 when pushing the backplane 3. The alignment member 243 can be set at a fixed height or can be set with adjustable height. When the height of the alignment member 243 is adjustable, the alignment member 243 can be fixed on a length-adjustable connecting member, and the connecting member is slidably connected to the X-direction guide rail 241 or the Y-direction guide rail 242; or the alignment member 243 can be slidably connected to the X-direction guide rail 241 or the Y-direction guide rail 242 through a detachable and replaceable connecting member, and the height of the alignment member 243 is adjusted by replacing connecting members of different lengths; or the alignment member 243 is provided with a lifting drive assembly for driving the alignment member to lift, and the lifting drive assembly is slidably connected to the X-direction guide rail 241 or the Y-direction guide rail 242, and the height of the alignment member 243 is adjusted by driving the alignment member 243 to lift through the lifting drive assembly.

[0093] In some embodiments, referring to Figure 7 and Figure 8 as shown, the inter-sheet film laminating mechanism 2A for inter-sheet film lamination further includes a punching assembly 25;

[0094] The punching assembly 25 is arranged below the film laying table 21 at the inter-sheet film laminating station M. An avoidance channel is arranged at the position of the inter-sheet film strip 6 corresponding to the middle of the backplane 3 on the film laying table 21 at the inter-sheet film laminating station M. The punching assembly 25 is configured to pass through the avoidance channel to punch through holes 8 corresponding to the positions of the lead holes on the backplane 3 on the inter-sheet film strip 6 in the middle of the backplane 3; after the inter-sheet film strip is laminated, by arranging the punching assembly 25 below the film laying table 21 at the inter-sheet film laminating station M, after the inter-sheet film lamination is completed at the inter-sheet film laminating station M, the punching assembly 25 can punch one inter-sheet film strip 6 in the middle of the backplane 3, facilitating the subsequent combination of glass, and the leads in the battery string group of the photovoltaic module extend out through the punched part and the lead holes of the backplane 3 and are installed with the junction box.

[0095] Optionally, the punching assembly 25 includes a punch 251 longitudinally arranged for punching the strip gap film strip 6 in the middle of the back plate 3, and a second lifting drive assembly 252 for driving the punch 251 to lift and lower; by driving the punch 251 to punch the strip gap film strip 6 in the middle of the back plate 3 through the second lifting drive assembly 252, and driving the punch 251 to descend after punching, it can avoid affecting the subsequent laying and pasting of the strip gap film strip 6 and the back plate 3. The second lifting drive assembly 252 is any driving device capable of driving the punch 251 to lift and lower, and this embodiment does not make specific limitations on this.

[0096] In some embodiments, as Figure 10 shown, the film laying table 21 for inter-string film pasting in the inter-string film pasting mechanism 2B includes a second film strip adsorption table 2b1, and the second film strip adsorption table 2b1 is configured to adsorb and fix the inter-string gap film strip 7 laid by the corresponding film laying assembly 22 and carry the back plate 3; after the inter-string gap film strip 7 is laid on the second film strip adsorption table 2b1, the back plate 3 can be directly carried by the second film strip adsorption table 2b1 without adjusting the position of the back plate 3, and the structure is simpler and more compact.

[0097] Optionally, the back plate 3 has been rectified before inter-strip film pasting at the strip gap film pasting station M. When the handling mechanism 1 can ensure the position accuracy of the back plate handling, the position of the back plate 3 does not need to be rectified again after the back plate is moved to the film laying table at the inter-string gap film pasting station N. Therefore, in order to simplify the equipment, there is no need to set steps and mechanisms for separating the laid inter-string gap film strip 7 from the back plate 3 at the inter-string gap film pasting station N, and the second film strip adsorption table 2b1 can be directly used to carry both the inter-string gap film strip 7 and the back plate 3.

[0098] Optionally, at least one row of adsorption holes 13 is provided on the second film strip adsorption table 2b1, each row of adsorption holes 13 corresponds to adsorbing one inter-string gap film strip 7, the number of rows of adsorption holes 13 on the second film strip adsorption table 2b1 is equal to the number of inter-string gap film strips 7 to be pasted on the back plate 3, and the positions of each row of adsorption holes 13 are designed according to the positions of the inter-string gap film strips 7 to be laid.

[0099] Optionally, as Figure 5 and Figure 10 shown, both the first film strip adsorption table 2a3 and the second film strip adsorption table 2b1 include: an adsorption table main body 10 provided with a hollow inner cavity and a vacuum pumping structure (not shown in the figure) communicated with the hollow inner cavity of the adsorption table main body 10; as Figure 6 and Figure 11 shown, at least one row of adsorption holes 13 communicated with the hollow inner cavity is opened on the top surface of the adsorption table main body 10.

[0100] Optionally, as Figure 10As shown, the film laying table 21 for inter-string film pasting in the inter-string film pasting mechanism 2B further includes a fifth lifting drive assembly 2b2 for driving the lifting of the second film strip adsorption table 2b1. The second film strip adsorption table 2b1 is driven by the fifth lifting drive assembly 2b2 to lift, so as to receive the inter-string film strip 7 laid by the film laying head assembly 22 when rising. Optionally, it can also be that the second film strip adsorption table 2b1 remains stationary, and the film laying head assembly 22 in the inter-string film pasting mechanism 2B is driven by a sixth lifting drive assembly (not shown in the figure) to lift, so as to lay the inter-string film strip 7 when descending.

[0101] In some embodiments, the film laying table 21 is also used to adsorb each film strip. An avoidance hole 4 is opened on the film laying table 21 for the heating assembly 23 to pass through to heat the film strip carried and adsorbed on the film laying table 21. The heating assembly 23 below the film laying table 21 heats the film strip carried above the film laying table 21 through the avoidance hole 4, with a simple traveling path and a compact overall structure.

[0102] In some embodiments, a plurality of film strip bearing positions are provided on the film laying table 21, and each film strip bearing position is used to bear a film strip. A heating assembly 23 is correspondingly arranged below each film strip bearing position of the film laying table 21;

[0103] Each heating assembly 23 is configured to translate along the length direction of the film strip carried by the corresponding film strip bearing position to sequentially spot-weld at least two points on the corresponding film strip above, so that the film strip is pasted on the back plate 3. By using one heating assembly 23 to sequentially spot-weld a corresponding film strip above, the number of heating assemblies can be reduced and the structural cost can be lowered.

[0104] Optionally, a first translation guide rail (not shown in the figure), a first translation drive assembly (not shown in the figure) and a third lifting drive assembly are arranged below each film strip bearing position;

[0105] The first translation guide rail is parallel to the film strip on the corresponding film strip bearing position. The third lifting drive assembly (not shown in the figure) is slidably connected to the first translation guide rail and is driven to translate by the first translation drive assembly. The third lifting drive assembly is connected to the corresponding heating assembly 23 to drive the heating assembly 23 to lift. By the cooperation of the first translation drive assembly and the third lifting drive assembly to drive the heating assembly to translate and lift, the heating assembly 23 can sequentially heat at least two points to be heated on the film strip at a close distance. Through the guiding of the first translation guide rail, the position of the heating assembly 23 can be prevented from shifting during the sequential spot-welding process. The first translation drive assembly drives the third lifting drive assembly to translate along the first translation guide rail, so that the heating assembly 23 connected to the third lifting drive assembly reaches the position below the film strip to be heated, and then the third lifting drive assembly drives the heating assembly 23 to rise to spot-weld the film strip.

[0106] In another embodiment of the above-mentioned back plate film pasting device, refer toFigure 5 As shown, a plurality of film strip bearing positions are provided on the film laying table 21, and each film strip bearing position is used to bear a film strip. At least two heating components 23 are correspondingly arranged below each film strip bearing position of the film laying table 21, and the at least two heating components 23 are arranged at intervals along the length direction of the film strip on the corresponding film strip bearing position;

[0107] The at least two heating components 23 are configured to simultaneously perform spot ironing on the film strip at the corresponding film strip bearing position above, so that the film strip is bonded to the back plate 3; the plurality of heating components 23 simultaneously perform spot ironing on the corresponding film strip above, improving the speed of spot ironing the film strip and enhancing the production efficiency.

[0108] Optionally, a fourth lifting drive assembly 5 is further provided below the film laying table 21; each heating component 23 is connected to the fourth lifting drive assembly 5 and is driven by the fourth lifting drive assembly 5 to lift simultaneously; all the heating components 23 lift simultaneously, and can simultaneously rise to complete the spot ironing of all the film strips, further enhancing the production efficiency.

[0109] In some embodiments, the heating component can perform local contact spot heating on the film strip by spot ironing, so that the film strip is heated and bonded to the back plate. It can also heat the film strip by means of laser heating, hot air heating, electromagnetic heating or infrared heating, etc. Exemplarily, referring to Figure 7 and Figure 10 As shown, the heating component 23 is a spot ironing component. Optionally, the spot ironing component includes a heat transfer block and a spot ironing head installed on the heat transfer block. A heating rod and a thermocouple are installed in the heat transfer block. The thermocouple controls the heating temperature of the heating rod for the heat transfer block, and the heat transfer block conducts heat to the spot ironing head, and the spot ironing head contacts the film strip to perform heating.

[0110] In some embodiments, as Figure 4 shown, the film laying assembly 22 for inter-sheet film laying in the inter-sheet film laying mechanism 2A includes a second translation guide rail 221, a second translation drive assembly (not shown in the figure) and a film laying head assembly 223; the second translation guide rail 221 is fixed on the film laying table 21 at the inter-sheet film laying station M and is arranged along the length direction of the inter-sheet film strip to be laid; the film laying head assembly 223 is configured to be driven by the second translation drive assembly to lay the inter-sheet film strip on the film laying table 21 while translating on the second translation guide rail 221; the film laying head assembly 223 includes: a moving member 2231 and a film laying head 2232 installed on the moving member;

[0111] The moving member 2231 is slidably connected to the second translation guide rail 221 and is driven by the second translation driving assembly. The number of film laying heads 2232 is equal to the number of strip gap film strips required for the strip gap film applying station M. Each film laying head 2232 is arranged on the moving member 2231 at intervals in a direction perpendicular to the second translation guide rail 221. The film laying heads 2232 equal in number to the strip gap film strips 6 required for the strip gap film applying station M are translated along the length direction of the strip gap film strip 6 under the drive of the second translation driving assembly, and the laying of the strip gap film strip 6 is completed at one time.

[0112] In some embodiments, the film laying assembly 22 for inter-string film applying in the inter-string film applying mechanism 2B includes: a third translation guide rail (not shown in the figure), a third translation driving assembly (not shown in the figure), and a group of film laying head assemblies 223. The third translation guide rail is fixed on the film laying table 21 at the string gap film applying station N and is arranged along the length direction of the string gap film strip 7 to be laid.

[0113] A group of film laying head assemblies 223 are configured to be driven by the third translation driving assembly to translate on the third translation guide rail and, while translating, perform the laying of two groups of string gap film strips on the film laying table 21 in batches.

[0114] The film laying head assembly 223 includes: a moving member 2231 and a film laying head 2232 mounted on the moving member 2231.

[0115] The moving member 2231 is slidably connected to the third translation guide rail and is driven by the third translation driving assembly. The number of film laying heads 2232 is equal to the number of a group of string gap film strips 7 required for the string gap film applying station N, so that Figure 1 Taking the back plate shown as an example, the number of film laying heads 2232 in the inter-string film applying mechanism 2B is 7. Each film laying head 2232 is arranged on the moving member 2231 at intervals in a direction perpendicular to the third translation guide rail. A group of film laying head assemblies 223 are driven by the third translation driving assembly to complete the laying of two groups of string gap film strips 7 in two times along the length direction of the string gap film strip 7, reducing the number of film laying heads 2232 and simplifying the film applying structure at the string gap film applying station N.

[0116] In some embodiments, referring to Figure 7 As shown, the film laying assembly 22 for inter-string film applying in the inter-string film applying mechanism 2B includes: a fourth translation guide rail 22a, a fourth translation driving assembly (not shown in the figure), and two groups of film laying head assemblies 223. The fourth translation guide rail 22a is fixed on the film laying table 21 at the string gap film applying station N and is arranged along the length direction of the string gap film strip 7 to be laid.

[0117] Two groups of film laying head assemblies 223 are configured to be driven by the fourth translation driving assembly to translate on the fourth translation guide rail 22a and, while translating, perform the laying of two groups of string gap film strips 7 on the film laying table 21 respectively.

[0118] Each film laying head assembly 223 includes: a moving member 2231 and a film laying head 2232 mounted on the moving member 2231;

[0119] The moving member 2231 is slidably connected to the fourth translation guide rail 22a and is driven by a fourth translation drive assembly. The number of film laying heads 2232 is equal to the number of a set of inter-string gap film strips required for the inter-string gap film laying station N. Taking the backplane shown as an example, the number of film laying heads 2232 in each film laying head assembly 223 in the inter-string film laying mechanism 2B is 7. Each film laying head 2232 is arranged on the moving member 2231 at intervals in a direction perpendicular to the fourth translation guide rail 22a. Figure 1 Taking the backplane shown as an example, the number of film laying heads 2232 in each film laying head assembly 223 in the inter-string film laying mechanism 2B is 7. Each film laying head 2232 is arranged on the moving member 2231 at intervals in a direction perpendicular to the fourth translation guide rail 22a.

[0120] Setting two groups of film laying head assemblies 223 to be driven by the fourth translation drive assembly to simultaneously lay two groups of inter-string gap film strips 7 can complete the laying of two groups of inter-string gap film strips 7 on the backplane 3 at one time, improving the film laying efficiency.

[0121] Optionally, as Figure 12 shown, the film laying head 2232 includes: a connecting plate 22321, and a film strip guiding member 22322, a film strip feeding member 22323, a cutting member 22324 and a pressing member 22325 respectively mounted on the connecting plate 22321;

[0122] The connecting plate 22321 is mounted on the corresponding moving member 2231. The film strip guiding member 22322 is mounted on the top of the connecting plate 22321 and is used for guiding and limiting the film strip;

[0123] The film strip feeding member 22323 is arranged on the side of the film strip guiding member 22322 adjacent to the film laying table 21 and is used for controlling the movement of the film strip;

[0124] The cutting member 22324 and the pressing member are both located at the bottom end of the connecting plate 22321. The pressing member is used for controlling the pressing and loosening of the film strip, and the cutting member 22324 is used for cutting the film strip. The film strip enters the film strip feeding member 22323 after being limited and guided by the film strip guiding member 22322, is sent out from the film strip feeding member 22323 and is pressed by the pressing member 22325 and laid on the film laying table 21, and is cut by the cutting member 22324 after completing one laying stroke. The film strip guiding member 22322 guides and limits the film strip, the film strip feeding member 22323 controls the movement of the film strip, the pressing member 22325 presses the film strip on the film laying table 21, and the cutting member 22324 cuts the film strip, so that the film strip can be accurately laid on the film laying table 21, avoiding the deviation of the film strip position during the laying process.

[0125] Optionally, as Figure 3 shown, the handling mechanism 1 includes a first handling component 11 and a second handling component 12;

[0126] The first handling component 11 is arranged on one side of the inter-chip film pasting mechanism 2A for implementing inter-chip film pasting on the backplane 3, and is used to transport the backplane 3 from the backplane feeding area to the film laying table 21 at the inter-chip film pasting station M;

[0127] The second handling component 12 is arranged between the two film pasting mechanisms 2, and is used to transport the backplane 3 from the film laying table 21 at the inter-chip film pasting station M to the film laying table 21 at the inter-string film pasting station N.

[0128] After the first handling component 11 transports the backplane in the feeding area to the inter-chip film pasting station M to complete inter-chip film pasting, the second handling component 12 then transports the backplane 3 to the inter-string film pasting station N to complete inter-string film pasting. The two handling components can work simultaneously to achieve the transfer and handling of the backplane 3, improving production efficiency.

[0129] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0130] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0131] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A backplane film sticking device, characterized in that, Including: A handling mechanism and two film laminating mechanisms; one of the film laminating mechanisms is used for performing inter-cell film lamination on the backplane, and the other film laminating mechanism is used for performing inter-string film lamination on the backplane. The handling mechanism is used to transport the backplane to the inter-cell film lamination station for inter-cell film lamination, and after the inter-cell film lamination is completed, transport the backplane from the inter-cell film lamination station to the inter-string film lamination station for inter-string film lamination. The film laminating mechanism includes a film laying table, a film laying component, and a heating component; the film laying table is used to carry the film strip and the backplane; the film laying component is arranged above the film laying table and is used for laying the film strip on the film laying table; the heating component is arranged below the film laying table and is used for heating the film strip laid on the film laying table from below to bond the film strip to the backplane laid thereon.

2. The backplane film laminating device according to claim 1, wherein The film laying table for inter-cell film lamination includes: a frame, a first lifting drive component, and a first film strip adsorption table arranged inside the frame. The frame is configured to support the backplane at the top. The first film strip adsorption table is configured to adsorb and fix the inter-cell film strip laid by the corresponding film laying component. The first lifting drive component is drivingly connected to the first film strip adsorption table and is used to drive the first film strip adsorption table to lift.

3. The backplane film pasting device according to claim 2, wherein There are at least two first film strip adsorption tables, and each first film strip adsorption table is used to adsorb and fix at least one inter-cell film strip; at least one support member for carrying the backplane is arranged on the top surface of the frame, and an avoidance gap for avoiding the support member during lifting is arranged between adjacent two first film strip adsorption tables.

4. The backplane film pasting device according to claim 1, wherein, The film laminating mechanism for inter-cell film lamination further includes a rectifying component, and the rectifying component is configured to clamp the backplane on the film laying table transported to the inter-cell film lamination station and rectify the position of the backplane.

5. The backplane film laminating device according to claim 4, wherein, The rectifying component includes an X-direction guide rail, a Y-direction guide rail, and a pair of rectifying members. At least one rectifying member is arranged on each side of the film laying table for inter-cell film lamination. The X-direction guide rail and the Y-direction guide rail are both horizontally arranged and perpendicular to each other. The rectifying member is configured to slide along the X-direction guide rail or the Y-direction guide rail to approach or move away from the backplane laid on the film laying table.

6. The backplane film pasting device according to claim 1, characterized in that The film laminating mechanism for inter-cell film lamination further includes a punching component. The punching component is arranged below the film laying table at the inter-cell film lamination station. An avoidance channel is arranged at the position of the inter-cell film strip corresponding to the middle of the backplane on the film laying table at the inter-cell film lamination station. The punching component is configured to pass through the avoidance channel to punch through holes corresponding to the positions of the lead holes on the backplane on the inter-cell film strip in the middle of the backplane.

7. The backplane film laminating device according to claim 6, wherein The punching component includes: a punch head arranged longitudinally and used for punching the inter-cell film strip in the middle of the backplane, and a second lifting drive component used for driving the punch head to lift.

8. The backplane film pasting device according to claim 1, wherein The film laying table for inter-string film lamination includes a second film strip adsorption table, and the second film strip adsorption table is configured to adsorb and fix the inter-string film strip laid by the corresponding film laying component and carry the backplane.

9. The backplane film laminating device according to claim 1, wherein The film laying table is also used to adsorb each film strip, and an avoidance hole is opened on the film laying table for the heating component to pass through to heat the film strip carried and adsorbed on the film laying table.

10. The backplane film pasting device according to claim 1, characterized in that, A plurality of film strip bearing positions are provided on the film laying table, and each of the film strip bearing positions is used to bear a film strip. A heating component is correspondingly provided below each of the film strip bearing positions on the film laying table; Each of the heating components is configured to translate along the length direction of the film strip borne by the corresponding film strip bearing position to sequentially spot-iron at least two points on the corresponding film strip above, so that the film strip is adhered to the backboard.

11. The backplane film sticking device according to claim 10, characterized in that, A first translation guide rail, a first translation driving component and a third lifting driving component are provided below each of the film strip bearing positions; The first translation guide rail is parallel to the film strip on the corresponding film strip bearing position. The third lifting driving component is slidably connected to the first translation guide rail and is driven by the first translation driving component to translate. The third lifting driving component is connected to the corresponding heating component to drive the heating component to lift.

12. The backplane film laminating device according to claim 1, characterized in that, A plurality of film strip bearing positions are provided on the film laying table, and each of the film strip bearing positions is used to bear a film strip. At least two heating components are correspondingly provided below each of the film strip bearing positions on the film laying table, and at least two heating components are arranged at intervals along the length direction of the film strip on the corresponding film strip bearing position; At least two heating components are configured to simultaneously perform spot-ironing on the film strip at the corresponding film strip bearing position above, so that the film strip is bonded to the backboard.

13. The backplane film laminating device according to claim 12, characterized in that, A fourth lifting driving component is further provided below the film laying table; Each of the heating components is connected to the fourth lifting driving component and is driven by the fourth lifting driving component to lift simultaneously.

14. The backplane film laminating device according to claim 1, wherein, The film laying component for inter-chip film pasting includes a second translation guide rail, a second translation driving component and a film laying head component; the second translation guide rail is fixed on the film laying table at the inter-chip film pasting station and is arranged along the length direction of the inter-chip film strip to be laid; the film laying head component is configured to be driven by the second translation driving component to lay the inter-chip film strip on the film laying table while translating on the second translation guide rail; The film laying head component includes: a moving member and a film laying head installed on the moving member; The moving member is slidably connected to the second translation guide rail and is driven by the second translation driving component. The number of the film laying heads is equal to the number of the inter-chip film strips required at the inter-chip film pasting station, and each of the film laying heads is arranged on the moving member at intervals in a direction perpendicular to the second translation guide rail.

15. The backplane film laminating device according to claim 1, characterized in that The film laying component for inter-string film pasting includes: a third translation guide rail, a third translation driving component and a group of film laying head components; the third translation guide rail is fixed on the film laying table at the inter-string film pasting station and is arranged along the length direction of the inter-string film strip to be laid; A group of film laying head components are configured to be driven by the third translation driving component to lay two groups of inter-string film strips on the film laying table in batches while translating on the third translation guide rail; The film laying head component includes: a moving member and a film laying head installed on the moving member; The moving member is slidably connected to the third translation guide rail and is driven by the third translation driving assembly. The number of the film laying heads is equal to the number of a set of string gap film strips required for the string gap film laying station, and each of the film laying heads is arranged on the moving member at intervals in a direction perpendicular to the third translation guide rail.

16. The backplane film pasting device according to claim 1, wherein, The film laying assembly for string gap film laying includes: a fourth translation guide rail, a fourth translation driving assembly, and two sets of film laying head assemblies; the fourth translation guide rail is fixed on the film laying table of the string gap film laying station and is arranged along the length direction of the string gap film strip to be laid; The two sets of film laying head assemblies are configured to be driven by the fourth translation driving assembly to respectively lay two sets of string gap film strips on the film laying table while translating on the fourth translation guide rail; Each set of film laying head assemblies includes: a moving member and a film laying head mounted on the moving member; The moving member is slidably connected to the fourth translation guide rail and is driven by the fourth translation driving assembly. The number of the film laying heads is equal to the number of a set of string gap film strips required for the string gap film laying station, and each of the film laying heads is arranged on the moving member at intervals in a direction perpendicular to the fourth translation guide rail.

17. The backplane film laminating device according to any one of claims 14-16, characterized in that, The film laying head includes: a connecting plate, and a film strip guiding member, a film strip feeding member, a cutting member, and a pressing member respectively mounted on the connecting plate; The connecting plate is mounted on the corresponding moving member, and the film strip guiding member is mounted on the top of the connecting plate for guiding and limiting the film strip; The film strip feeding member is arranged on one side of the film strip guiding member adjacent to the film laying table for controlling the movement of the film strip; The cutting member and the pressing member are both located at the bottom end of the connecting plate. The pressing member is used for controlling the pressing and loosening of the film strip, and the cutting member is used for cutting the film strip; the film strip is limited and guided by the film strip guiding member and enters the film strip feeding member, is sent out from the film strip feeding member, is pressed by the pressing member and laid on the film laying table, and is cut by the cutting member after completing a laying stroke.

18. The backplane film laminating device according to claim 1, characterized in that, The handling mechanism includes a first handling component and a second handling component; The first handling component is arranged on one side of the film laying mechanism for implementing inter-chip film laying on the backplane, and is used for transporting the backplane from the backplane feeding area to the film laying table of the chip gap film laying station; The second handling component is arranged between the two film laying mechanisms, and is used for transporting the backplane from the film laying table of the chip gap film laying station to the film laying table of the string gap film laying station.

Images