Adjustable bonding wire pressing plate

Abstract

The utility model relates to an adjustable bonding wire pressure plate, which is characterized in that mounting plates are arranged at two ends of a pressure plate body, mounting holes are formed in the mounting plates, a mounting groove is formed in the pressure plate body, a bonding wire plate is arranged in an inner cavity of the mounting groove, bonding wire holes are uniformly formed in the bonding wire plate, and positioning holes are symmetrically formed in two sides of the bonding wire plate. The inner cavity of the pressing plate body is symmetrically provided with moving rods in a sliding mode, one side of each moving rod is provided with a positioning rod in a sliding mode, each moving rod is provided with a conical block, one end of each positioning rod makes contact with the corresponding conical block, and the other end of each positioning rod penetrates through the corresponding mounting groove and is inserted into the corresponding positioning hole. The wire welding plate can be positioned and fixed by rotating the pressing plate, the wire welding plate can be taken out from the mounting groove only by rotating the pressing plate in the direction during disassembly, the operation is more convenient and simpler, the pressing plate can be conveniently adjusted, and the wire welding efficiency is improved.

Description

Technical Field

[0001] The utility model relates to an adjustable wire bonding pressing plate, belonging to the technical field of chip packaging wire bonding. Background Technique

[0002] During the chip packaging process, wires need to be welded to the product, and the main function of the wire bonding pressing plate is to level the chip during wire bonding to ensure subsequent welding effects and product yield.

[0003] A wire bonding machine pressing plate with the patent number 202222153534.0 discloses a pressing plate fixing seat. A stepped window is opened on the pressing plate fixing seat, and an intermediate pressing plate is inserted into the stepped window. The size and shape of the intermediate pressing plate match the stepped window; a wire bonding window is opened in the middle of the intermediate pressing plate, grooves are opened on both sides of the wire bonding window, and elastic members are arranged in the grooves; a cover plate is arranged above the elastic members, a window is opened in the middle of the cover plate, and the size of the window corresponds to the wire bonding window; the cover plate is fixed on the pressing plate fixing seat, and the cover plate fixes the elastic members and the intermediate pressing plate in the stepped window. The intermediate pressing plate is held between the cover plate and the stepped window by the elastic members and telescopically protrudes outwards through the stepped window; this utility model has the beneficial effects of elastic pressing, more compact pressing, stronger reliability, simple structure, and strong adaptability. However, the existing pressing plate structure does not have the function of convenient disassembly and maintenance. When the wire bonding machine packaging pressing plate structure is damaged, since a large number of bolts are required to fix the pressing plate structure, it is time-consuming and laborious for workers to disassemble the pressing plate structure, affecting the efficiency of wire bonding. Content of the Utility Model

[0004] In view of the problems in the related art, the utility model provides an adjustable wire bonding pressing plate to overcome the above-mentioned technical problems existing in the existing related art.

[0005] Therefore, the specific technical solution adopted by the utility model is as follows:

[0006] An adjustable wire bonding pressing plate includes a pressing plate body. Installation plates are fixedly arranged at both ends of the pressing plate body. Installation holes are opened on the installation plates. An installation groove is opened on the pressing plate body. A wire bonding plate is fixedly arranged in the inner cavity of the installation groove. Wire bonding holes are evenly opened on the wire bonding plate. Positioning holes are symmetrically opened on both sides of the wire bonding plate. Moving rods are symmetrically and slidably arranged in the inner cavity of the pressing plate body. A positioning rod is slidably arranged on one side of the moving rod. A conical block is fixedly arranged on the moving rod. One end of the positioning rod contacts the conical block, and the other end penetrates through the installation groove and is inserted into the positioning hole.

[0007] As a further optimization, the installation plate and the pressing plate body are fixedly connected by a diagonal bracing plate. A reinforcing rod is fixedly arranged between both sides of the installation plate, and the reinforcing rod is located above both sides of the pressing plate body.

[0008] As a further optimization, buffer rods are fixedly arranged at the bottom of the mounting plate. The buffer rods include fixed sleeves and buffer support rods. A buffer spring is fixedly arranged in the fixed sleeve, and the top end of the buffer support rod is embedded into the fixed sleeve and connected to the buffer spring.

[0009] As a further optimization, extrusion blocks are symmetrically arranged in the inner cavity of the mounting hole. A storage groove is formed in the inner wall of the mounting hole, and an extrusion spring is fixedly arranged in the storage groove and fixedly connected to the extrusion block.

[0010] As a further optimization, the mounting groove is arranged in a stepped shape. A convex platform is fixedly arranged on the top of the wire bonding board, and the convex platform is located on the stepped platform. The bottom of the wire bonding board and the bottom of the pressing plate body are in the same plane, and rubber pressing blocks are fixedly arranged on both.

[0011] As a further optimization, moving grooves are symmetrically formed in the inner cavity of the pressing plate body. The tapered blocks and the positioning rods are both slidably arranged in the moving grooves. The moving grooves are located on both sides of the mounting groove, and the positions of the positioning rods correspond to the positions of the positioning holes.

[0012] As a further optimization, a fixing plate is fixedly arranged on the positioning rod, and the fixing plate is connected to the inner wall of the moving groove through a return spring. One side of the tapered block is arranged in an inclined plane, and an arc surface is arranged at the contact end of the positioning rod and the tapered block.

[0013] As a further optimization, a threaded hole is formed in the front side of the pressing plate body. A threaded rod is rotatably arranged at the front end of the moving rod, and the threaded rod penetrates through the threaded hole and is fixedly provided with a rotating handle.

[0014] The beneficial effects of the utility model are as follows:

[0015] 1. By arranging the mounting plate, it is convenient to fixedly install the pressing plate body on the wire bonding machine. The extrusion blocks in the mounting holes can make the installation more stable, avoiding the situation of shaking during use of the pressing plate, and the buffer rods at the bottom can protect the chip, avoiding damage caused by excessive pressure during pressing.

[0016] 2. By arranging the wire bonding board, when wire bonding different chips is required, the wire bonding board can be disassembled, and then the corresponding wire bonding board can be selected according to the specifications of the chips, which is convenient for adjusting the pressing plate, improving the adaptability of the wire bonding pressing plate, and increasing the wire bonding efficiency.

[0017] 3. By setting the movable rod, when installing the wire bonding board, the wire bonding board can be directly placed into the installation groove, and then the front end of the movable rod can be manually rotated to make the movable rod move within the pressing plate body, so that the conical block moves forward, and further extrudes the positioning rod outward to move, enabling the positioning rod to accurately insert into the positioning hole, thus completing the positioning and fixing installation of the top of the wire bonding board. When disassembling, just rotate in the opposite direction to take out the wire bonding board from the installation groove. The operation is more convenient and simple, improving its practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and form a part of the specification. Together with the specific embodiments of the present invention, they are used to explain the present invention, but do not constitute a limitation to the present invention.

[0019] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 is a schematic cross-sectional structure diagram of the wire bonding board of the present invention;

[0021] Figure 3 is a schematic cross-sectional structure diagram of the mounting plate of the present invention;

[0022] Figure 4 is a schematic cross-sectional view of the movable rod of the present invention;

[0023] Reference numerals in the figures: 1, pressing plate body; 2, mounting plate; 3, mounting hole; 4, installation groove; 5, wire bonding board; 6, wire bonding hole; 7, positioning hole; 8, movable rod; 9, positioning rod; 10, conical block; 11, strengthening rod; 12, buffer rod; 13, extrusion block; 14, storage groove; 15, extrusion spring; 16, convex platform; 17, moving groove; 18, fixing plate; 19, return spring; 20, threaded hole; 21, threaded rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] To further illustrate the embodiments, the present invention provides accompanying drawings. These accompanying drawings are a part of the disclosure of the present invention, mainly used to illustrate the embodiments, and can be used to explain the operating principle of the embodiments in conjunction with the relevant descriptions in the specification. With reference to these contents, those of ordinary skill in the art should be able to understand other possible embodiments and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0025] According to an embodiment of the present invention, an adjustable wire bonding pressing plate is provided.

[0026] Embodiment 1:

[0027] As Figures 1 to 4As shown in the figure, an adjustable wire bonding pressing plate includes a pressing plate body 1. Installation plates 2 are fixedly provided at both ends of the pressing plate body 1. Installation holes 3 are formed in the installation plates 2. An installation groove 4 is formed in the pressing plate body 1. A wire bonding plate 5 is fixedly provided in the inner cavity of the installation groove 4. Wire bonding holes 6 are evenly formed in the wire bonding plate 5. Positioning holes 7 are symmetrically formed on both sides of the wire bonding plate 5. Moving rods 8 are symmetrically and slidably arranged in the inner cavity of the pressing plate body 1. A positioning rod 9 is slidably arranged on one side of the moving rod 8. A tapered block 10 is fixedly provided on the moving rod 8. One end of the positioning rod 9 contacts the tapered block 10, and the other end penetrates through the installation groove 4 and is inserted into the positioning hole 7. The installation plate 2 and the pressing plate body 1 are fixedly connected by an inclined support plate. A reinforcing rod 11 is fixedly provided between both sides of the installation plate 2, and the reinforcing rod 11 is located above both sides of the pressing plate body 1. When the pressing plate body 1 moves downward, the installation plate 2 will be under pressure first, and the reinforcing rod 11 can effectively prevent the pressing plate body 1 from deforming, making the pressure more evenly distributed on the pressing plate body 1, avoiding the situation that the circuit board is bent due to uneven force. Buffer rods 12 are fixedly provided at the bottom of the installation plate 2. The buffer rods 12 include fixed sleeves and buffer support rods. A buffer spring is fixedly provided in the fixed sleeve. The top end of the buffer support rod is embedded in the fixed sleeve and connected to the buffer spring. When the pressing plate body 1 moves downward, the buffer rods 12 will contact the buffer seats on the wire bonding machine first, thereby offsetting the impact force during downward movement and avoiding damage to the circuit board caused by excessive impact force. Extrusion blocks 13 are symmetrically arranged in the inner cavity of the installation hole 3. A storage groove 14 is formed in the inner wall of the installation hole 3, and an extrusion spring 15 is fixedly provided in the storage groove 14, and the extrusion spring 15 is fixedly connected to the extrusion block 13. The extrusion blocks 13 can extrude both sides of the installation rod, thereby ensuring the stability during installation.

[0028] Embodiment 2:

[0029] As Figures 1 to 4 shown in the figure, for an adjustable wire bonding pressing plate, its installation groove 4 is arranged in a stepped shape. A boss 16 is fixedly provided at the top of the wire bonding plate 5, and the boss 16 is located on the stepped platform. The bottom of the wire bonding plate 5 and the bottom of the pressing plate body 1 are in the same plane, and rubber pressing blocks are fixedly provided on both, ensuring that the pressing plate body 1 is more tightly pressed against the circuit board when pressing it stably, preventing the occurrence of gaps. The rubber pressing blocks will also avoid scratching the surface of the circuit board. The stepped installation groove 4 also facilitates the placement of the wire bonding plate 5. A threaded hole 20 is formed on the front side of the pressing plate body 1. A threaded rod 21 is rotatably provided at the front end of the moving rod 8, and the threaded rod 21 penetrates through the threaded hole 20 and is fixedly provided with a rotating handle.

[0030] Embodiment 3:

[0031] As Figures 1 to 4As shown in the figure, moving grooves 17 are symmetrically formed in the inner cavity of the pressing plate body 1. The tapered blocks 10 and the positioning rods 9 are both slidably arranged in the moving grooves 17. The moving grooves 17 are located on both sides of the installation groove 4. The position of the positioning rod 9 corresponds to the position of the positioning hole 7. A fixing plate 18 is fixedly arranged on the positioning rod 9, and the fixing plate 18 is connected to the inner wall of the moving groove 17 through a return spring 19. One side of the tapered block 10 is provided with an inclined surface. The contact end of the positioning rod 9 and the tapered block 10 is provided with an arc surface. When the moving rod 8 is driven by the threaded rod 21, the tapered block 10 can extrude the positioning rod 9, so that the positioning rod 9 enters the positioning hole 7. When disassembling, the tapered block 10 is reset, and the positioning rod 9 will return to its original position under the action of the return spring 19, and the wire bonding plate 5 can be taken out, and the operation is more convenient and simple.

[0032] In summary, by means of the above technical solution of the present invention, this device fixes and installs the pressing plate body 1 to the wire bonding machine through the mounting plate 2. When in use, select the corresponding wire bonding plate 5 according to the specifications of the chip, directly place the wire bonding plate 5 into the installation groove 4, and then manually rotate the front end of the moving rod 8, so that the moving rod 8 moves in the pressing plate body 1, so that the tapered block 10 moves forward, and then extrudes and moves the positioning rod 9 outward, so that the positioning rod 9 accurately inserts into the positioning hole 7, and the positioning and fixing installation of the wire bonding plate top can be completed. Let the pressing plate body 1 move downward to press the circuit board firmly, and then the wire bonding operation can be performed on the chip. When wire bonding different chips, the wire bonding plate 5 can be taken out of the installation groove 4 through the moving rod 8. The operation is more convenient and simple, which is convenient for adjusting the pressing plate, improving the adaptability of the wire bonding pressing plate, and increasing the wire bonding efficiency.

[0033] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An adjustable wire bonding pressing plate, comprising a pressing plate body (1), characterized in that: Both ends of the pressing plate body (1) are provided with mounting plates (2). Mounting holes (3) are formed in the mounting plates (2). A mounting groove (4) is formed in the pressing plate body (1). A wire bonding plate (5) is arranged in the inner cavity of the mounting groove (4). Wire bonding holes (6) are evenly formed in the wire bonding plate (5). Positioning holes (7) are symmetrically formed on both sides of the wire bonding plate (5). Moving rods (8) are symmetrically and slidably arranged in the inner cavity of the pressing plate body (1). A positioning rod (9) is slidably arranged on one side of the moving rod (8). A conical block (10) is fixedly arranged on the moving rod (8). One end of the positioning rod (9) contacts the conical block (10), and the other end penetrates through the mounting groove (4) and is inserted into the positioning hole (7).

2. The adjustable wire bonding pressing plate according to claim 1, wherein: The mounting plate (2) and the pressing plate body (1) are fixedly connected by a diagonal bracing plate. A reinforcing rod (11) is arranged between both sides of the mounting plate (2), and the reinforcing rod (11) is located above both sides of the pressing plate body (1).

3. The adjustable wire bonding pressing plate according to claim 2, characterized in that: Buffer rods (12) are arranged at the bottoms of the mounting plates (2). The buffer rods (12) include fixed sleeves and buffer support rods. Buffer springs are arranged in the fixed sleeves. The top ends of the buffer support rods are embedded in the fixed sleeves and connected to the buffer springs.

4. An adjustable wire bonding pressing plate according to claim 1, characterized in that: Extrusion blocks (13) are symmetrically arranged in the inner cavity of the mounting holes (3). A storage groove (14) is formed in the inner wall of the mounting holes (3). An extrusion spring (15) is arranged in the storage groove (14), and the extrusion spring (15) is fixedly connected to the extrusion block (13).

5. The adjustable wire bonding pressure plate according to claim 1, wherein: The mounting groove (4) is arranged in a stepped shape. A convex platform (16) is arranged on the top of the wire bonding plate (5), and the convex platform (16) is located on the stepped platform. The bottom of the wire bonding plate (5) and the bottom of the pressing plate body (1) are on the same plane, and rubber pressing blocks are arranged on both of them.

6. An adjustable wire bonding pressing plate according to claim 1, characterized in that: Moving grooves (17) are symmetrically formed in the inner cavity of the pressing plate body (1). The conical block (10) and the positioning rod (9) are both slidably arranged in the moving grooves (17). The moving grooves (17) are located on both sides of the mounting groove (4). The position of the positioning rod (9) corresponds to the position of the positioning hole (7).

7. An adjustable wire bonding pressure plate according to claim 6, characterized in that: A fixing plate (18) is arranged on the positioning rod (9), and the fixing plate (18) is connected to the inner wall of the moving groove (17) by a return spring (19). One side of the conical block (10) is arranged in an inclined plane. The contact end of the positioning rod (9) and the conical block (10) is provided with an arc surface.

8. The adjustable wire bonding pressure plate according to claim 7, characterized in that: A threaded hole (20) is formed in the front side of the pressing plate body (1). A threaded rod (21) is rotatably arranged at the front end of the moving rod (8), and the threaded rod (21) penetrates through the threaded hole (20) and is provided with a rotating handle.

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