Processing equipment for adding plating layer on base material

Abstract

The utility model relates to processing equipment for adding a coating on a base material, which comprises a deposition chamber, a coating chamber, a coating chamber and a coating chamber, the pulsed electron beam deposition module is arranged on the deposition chamber, the pulsed electron beam deposition module and the deposition chamber jointly form a closed cavity, and the cavity can form a vacuum environment through air exhaust; and the pulsed electron beam deposition module is arranged at the top, or the bottom, or the top and the bottom, or a single side surface or double side surfaces of the deposition chamber. Compared with sputtering coating in the prior art, the pulse electron beam deposition is more excellent in energy consumption due to the pulse characteristic of the pulse electron beam deposition. By adjusting the pulse interval parameter and the energy consumption cost of coating of the base layer material per square meter, 70% can be reduced, in addition, the deposition thickness can be randomly adjusted on line under the working condition through parameter adjustment, the step thickness difference can be realized on the same film, and the relative deposition material utilization rate is excellent, so that the cleaning cost of the target material and the deposition chamber is further saved.

Description

Technical Field

[0001] The utility model relates to the field of coating material processing, in particular to a processing device for adding a coating to a polymer material. Background Art

[0002] Taking the most popular composite current collector in the new energy industry at present as an example, by plating a metal layer on a film made of a polymer material, the weight of the battery can be reduced and the energy density of the battery can be increased.

[0003] The metal layer can generally be plated by sputtering, evaporation, electroplating, or a combination of the above methods. However, the traditional solutions are not friendly in terms of energy consumption, waste of plating materials, equipment maintenance, environmental pollution, etc. Therefore, new solutions need to be proposed to solve the deficiencies in the traditional solutions. Summary of the Utility Model

[0004] In view of the above situation, it is necessary to provide a processing device for adding a coating to a base material that can solve at least one of the above problems.

[0005] A processing device for adding a coating to a base material includes:

[0006] A deposition chamber, the internal cavity of which is a working space for coating;

[0007] A pulsed electron beam deposition module is arranged on the deposition chamber and forms a closed cavity together with the deposition chamber. This cavity can be evacuated to form a vacuum environment with a background vacuum degree lower than 1E-3 Pa;

[0008] The pulsed electron beam deposition module is arranged at the top, or bottom, or top and bottom, or a single side, or both sides of the deposition chamber.

[0009] Taking the coating of the film material as an example, in the coating processing of the film material, depending on the different feeding methods of the film material, the position of the pulsed electron beam deposition module is also different. For example, when the film material is in a horizontal state during feeding, the processing surface directions are up and down, so the pulsed electron beam deposition module is arranged at the top or bottom of the deposition chamber; if the film material is in a vertical state during feeding, the processing surface direction is the side, so the pulsed electron beam deposition module is arranged on both sides of the deposition chamber.

[0010] Compared with sputtering in the prior art, due to the characteristics of its pulse and direction, pulsed electron beam deposition is more excellent in terms of energy consumption and plating material saving. By adjusting the pulse interval parameter, the energy consumption cost for coating per square meter of the base material can be reduced by 70%.

[0011] Compared with evaporation coating and electroplating, pulsed electron beam deposition does not produce harmful waste gas or wastewater, is quite friendly to environmental protection, and will not have adverse health effects on operators during maintenance.

[0012] In terms of equipment maintenance, only the quartz tube of the pulsed electron beam gun needs to be cleaned, and the later maintenance cost is low.

[0013] As a further solution of the present utility model: the pulsed electron beam deposition module includes:

[0014] An installation substrate, on which there are a number of pulsed electron beam guns for emitting pulsed electron beams, and the pulsed electron beam guns are arbitrarily distributed on the installation substrate;

[0015] A target, there is at least one target, and the electron beam generated by the pulsed electron beam gun can bombard the target, and each pulsed electron beam gun independently bombards one target or multiple pulsed electron beam guns jointly bombard one target.

[0016] The pulsed electron beam deposition module can be regarded as an aggregate of multiple pulsed electron beam guns, and can be disassembled and assembled in the form of a module, which can reduce the time-consuming during equipment maintenance and reduce the maintenance cost.

[0017] As a further solution of the present utility model: a target clamping mechanism is further provided on the installation substrate, and the target clamping mechanism includes two types: fixed type and movable type. When the fixed type clamps the target, the target is fixed and immovable, and the movable target clamping mechanism includes a rotating device and / or a translation device;

[0018] The target is clamped by the movable target clamping mechanism, and its posture or position is adjusted by the rotating device and the translation device.

[0019] Based on rotation and translation, the bombardment position of the electron beam emitted by the pulsed electron beam gun on the target is not limited to a single point or a certain fixed area, increasing the utilization rate of the target and reducing the production cost.

[0020] As a further solution of the present utility model: there are at least two groups of pulsed electron beam deposition modules, which are respectively a first pulsed electron beam deposition module group and a second pulsed electron beam deposition module group, and each group has at least one pulsed electron beam deposition module;

[0021] The first pulsed electron beam deposition module group is arranged on one of the four faces, and the second pulsed electron beam deposition module group is arranged on the opposite face of the first pulsed electron beam deposition module group;

[0022] Along the movement direction of the base material in the deposition chamber, the first pulsed electron beam deposition module group is in the upstream position relative to the second pulsed electron beam deposition module group.

[0023] The electron beam deposition module group is misaligned, providing a basis for the heat dissipation of the base material.

[0024] As a further solution of the present utility model: it further includes a laser drilling machine;

[0025] The laser drilling machine is arranged outside the deposition chamber, and the laser is introduced into the deposition chamber through an optical fiber for laser drilling; the laser generator of the laser drilling machine is a nanosecond, or picosecond, or femtosecond ultraviolet laser;

[0026] The laser drilling machine and the second pulsed electron beam deposition module group are located on the same side;

[0027] The spatial position of the laser drilling machine is between the first pulsed electron beam deposition module group and the second pulsed electron beam deposition module group.

[0028] The added laser drilling machine laser-scrapes the base film before depositing the coating on the second side to generate blind holes, and then deposits the coating on the second side, so that the coatings on the base material are connected. If it is a metal coating, the coatings on the front and back sides are electrically connected. It should be noted that the blind holes here refer to those formed by scraping (ablating) a circular area on the base film with the coating on the first side as the base; on the basis of forming the blind holes, when depositing the coating on the second side, the coatings on both sides will contact at the blind holes.

[0029] As a further solution of the present utility model: at least one of the pulsed electron beam deposition modules located on the same side of the deposition chamber;

[0030] In the moving direction of the base material in the deposition chamber, the base material is divided into several regions according to the coating deposition thickness;

[0031] The number of pulsed electron beam guns for depositing a thicker coating region is more than the number of pulsed electron beam guns for depositing a thinner coating region.

[0032] When the moving speed of the base material in the deposition chamber is constant, by changing the number of electron beam guns, the regional thickness control of the coating can be achieved.

[0033] As a further solution of the present utility model: on each pulsed electron beam deposition module, the number of pulsed electron beam guns for depositing a thicker coating region is more than the number of pulsed electron beam guns for depositing a thinner coating region.

[0034] As a further solution of the present utility model: multiple pulsed electron beam deposition modules are divided into several groups;

[0035] Each group of pulsed electron beam deposition modules is respectively used to deposit the coating of one region;

[0036] The total number of the pulsed electron beam guns for depositing thicker coatings is more than the total number of the pulsed electron beam guns for depositing thinner coating regions.

[0037] Similarly to the above, but in this solution, it is in units of modules, which is more suitable for mass production in large chemical plants.

[0038] The above processing equipment uses a pulsed electron beam deposition module to achieve the deposition of coatings, and has the advantages of energy conservation, environmental protection, easy maintenance, and low product production cost. Description of the Drawings

[0039] Figure 1 is a schematic structural diagram of an embodiment of the present utility model;

[0040] Figure 2 is a schematic diagram of the arrangement of two film materials in a deposition chamber in an embodiment of the present utility model;

[0041] Figure 3 is a schematic diagram of the position distribution of pulsed electron beam deposition modules in an embodiment of the present utility model;

[0042] Figure 4 is a superimposed schematic diagram of the plume deposition regions generated by a pulsed electron beam gun array in an embodiment of the present utility model;

[0043] Figure 5 is a schematic diagram of the clamping of a target in an embodiment of the present utility model;

[0044] Figure 6 is a schematic diagram of the setting positions of the first and second pulsed electron beam deposition module groups in an embodiment of the present utility model;

[0045] Figure 7 is a schematic diagram of the deposition effects of pulsed electron beam deposition technology on through holes and blind holes in an embodiment of the present utility model;

[0046] Figure 8 is a schematic diagram of the second form of winding and unwinding of a polymer thin film in a deposition chamber in an embodiment of the present utility model;

[0047] Figure 9 is a schematic diagram of the distribution of pulsed electron beam guns on a single pulsed electron beam deposition module in an embodiment of the present utility model;

[0048] Figure 10 is a schematic diagram of the distribution of pulsed electron beam guns on the first pulsed electron beam deposition module group in an embodiment of the present utility model. Detailed Embodiments

[0049] In order to make the objectives, technical solutions and advantages of the present utility model more clear and understandable, the present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0050] In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more; the terms "center", "longitudinal", "lateral", "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0051] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and defined, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific situations.

[0052] This embodiment provides a processing device for adding a coating to a base material, and uses pulsed electron beam deposition technology (PED) for coating. This embodiment will be illustrated by taking the production of composite current collectors as an example.

[0053] As Figure 1 shown, it includes a deposition chamber 100 and a pulsed electron beam deposition module 200. The pulsed electron beam deposition module 200 is arranged on the deposition chamber 100, and the two form a sealed cavity that can be evacuated, and the coating work is carried out in this vacuum chamber.

[0054] Since pulsed electron beam deposition coating needs to be carried out in a vacuum chamber, the deposition chamber 100 needs to be evacuated before each operation, which is very time-consuming and energy-consuming. At the same time, a large number of pulsed electron beam guns 220 need to be installed for pulsed electron beam deposition coating. Currently, during testing, a considerable number of electron beam guns need to be installed according to the process efficiency requirements, and this number may be several hundred or even thousands. If one gun is not installed properly, the machine needs to be stopped to break the vacuum and find the air leakage point, and only after solving it can the machine be restarted for processing. Based on such a large number of pulsed electron beam guns, it is quite time-consuming to find the problem point; in addition, it takes a lot of energy to re-evacuate the vacuum after breaking the vacuum, resulting in unnecessary waste; after working for a period of time, the quartz tubes of the pulsed electron beam guns 220 also need to be cleaned, and at this time the equipment will not be able to work. Therefore, the pulsed electron beam gun 220 is made into a pulsed electron beam deposition module 200. When maintenance is needed, it can be maintained and tested for airtightness offline separately. The well-maintained module can be directly stored in the warehouse. During the maintenance process, the well-maintained module can be directly replaced, greatly reducing the maintenance time. At the same time, offline maintenance can completely avoid the problem of stopping the machine for troubleshooting due to improper installation before.

[0055] For the production of composite current collectors, since they are thin film materials, there are at least two ways to set the polymer materials as the base materials in the deposition chamber 100. As Figure 2a shown, the first is that the polymer thin film is in a horizontal state in the deposition chamber 100, that is, both sides of the film face the top and bottom of the deposition chamber 100 respectively; the other is that the polymer thin film is in a vertical state in the deposition chamber 100, as Figure 2b shown, that is, both sides of the film face the two side surfaces of the deposition chamber 100 respectively; it should be noted that in these two setting methods, the winding and unwinding directions of the thin film in the deposition chamber 100 are along the length direction of the deposition chamber 100.

[0056] As Figure 3 shown, corresponding to the winding and unwinding directions of the polymer thin film in the deposition chamber 100, the installation positions of the pulsed electron beam deposition module 200 on the deposition chamber 100 include the following five: top, bottom, top and bottom, single side, double side; it should be noted that the side surface here refers to the side surface of the deposition chamber 100 in the length direction. Specifically, for the base material wound horizontally, the pulsed electron beam deposition module 200 is set at the top, bottom or top and bottom. Among them, when set on a single side, that is, only set at the top and bottom, it is single-sided coating, and when set at the top and bottom at the same time, it is double-sided deposition, and coating is carried out on both sides of the base material at the same time. Similarly, when the pulsed electron beam deposition module 200 is set on a single side surface, it is single-sided deposition, and when set on a double side surface, it is double-sided deposition.

[0057] The pulsed electron beam deposition module 200 includes a mounting substrate 210, and a plurality of pulsed electron beam guns 220 are arranged on the mounting substrate 210. In this embodiment, the shape of the mounting substrate 210 is not limited to a "plate", and it can also be a "herringbone" structure similar to the roof of a tile house, or an isosceles trapezoidal cross-section structure, a hemispherical structure or other geometric shapes, as long as it meets the basic conditions in the foregoing content such as being able to mount the array of pulsed electron beam guns 220 and being able to form a sealed cavity with the deposition chamber 100. The setting of the pulsed electron beam deposition module 200 realizes the "plug and play" function. It can be understood that by preparing multiple pulsed electron beam deposition modules 200, the downtime can be greatly reduced. When maintenance is required, the pulsed electron beam deposition module 200 on the equipment can be directly removed and the prepared pulsed electron beam deposition module 200 can be installed to start production. While producing, the removed pulsed electron beam deposition module 200 is maintained, and after the maintenance is completed, it is directly put into the warehouse for storage and waiting for the next use.

[0058] On the mounting substrate 210, the pulsed electron beam guns 220 can be arranged in any distribution, including but not limited to the array form of regular distribution. Since the pulsed electron beam guns 220 can adjust various parameters such as frequency and power, theoretically any distribution can also achieve uniform coating. Considering the convenience of parameter setting of each pulsed electron beam gun 220, a regular distribution is preferred. After the pulsed electrons emitted by a single pulsed electron beam gun 220 bombard the target material, a plasma plume will be generated. The plume faces the base material, and finally a circular area is deposited on the base material. In this circular area, the thickness of the material deposition shows a Gaussian distribution. Combining Figure 4 As shown, as the most preferred, when multiple pulsed electron beam guns 220 are arranged in a rectangular array with the deposition radius of the plume as the spacing, the coating obtained on the base material is theoretically the most uniform and the most easily controllable distribution method.

[0059] Furthermore, as Figure 5As shown, on the mounting substrate 210, a target clamping mechanism 211 is further provided for clamping the target 212. The target 212 itself is a solid brick made of the same material as the coating material. For example, a copper brick is selected for copper plating, and so on. On the premise of using pulsed electron beam deposition, it is not limited to metal materials. The electron beam generated by the pulsed electron beam gun 220 bombards the target 212, causing local vaporization of the target 212 to generate a plasma plume. The target clamping mechanism 211 further includes a rotation device and / or a translation device for adjusting the relative position between the target 212 and the pulsed electron beam gun 220. The electron beam generated by the pulsed electron beam gun 220 generally does not deviate. Therefore, if the target 212 can be moved, the bombardment point of the electron beam on the target 212 can be moved to any position on the target 212, which can improve the utilization rate of the target, reduce material waste, and further reduce the production cost of the finished product. It should be noted that the above rotation device and translation device can be common R-axis and XY-axis drive devices, so no further description is given.

[0060] Furthermore, when pulsed electron beam deposition modules 200 are provided on two opposite sides of the deposition chamber, they are grouped according to the surfaces on which they are provided, that is, they are divided into two groups, respectively used for coating deposition on one side of the composite current collector. As Figure 6 shown, it includes a first pulsed electron beam deposition module group 200A and a second pulsed electron beam deposition module group 200B. In the figure, the first pulsed electron beam deposition module group 200A is provided on the top surface, and the second pulsed electron beam deposition module group 200B is provided on the opposite surface of the first pulsed electron beam deposition module group 200A, that is, the bottom surface of the deposition chamber; in addition to what is shown in the figure, the first pulsed electron beam deposition module group 200A can also be provided on the bottom surface or side surface of the deposition chamber, and the second pulsed electron beam deposition module group 200B can be provided on the opposite surface. Specifically, both the first pulsed electron beam deposition module group 200A and the second pulsed electron beam deposition module group 200B include at least one electron beam deposition module 200. Its function is to coat both sides of the base material of the composite current collector on one production line at a time.

[0061] Furthermore, when processing the composite current collector, the polymer base material is unrolled from one end of the deposition chamber 100 and wound up at the other end of the deposition chamber 100, as Figure 3As shown in the figure, the first pulsed electron beam deposition module group 200A is used to coat the A side of the base material, and the second pulsed electron beam deposition module 200B is used to coat the B side of the base material; correspondingly, with the winding direction of the base material as the reference, the first pulsed electron beam deposition module 200A is in the upstream position relative to the second pulsed electron beam deposition module group 200B, that is to say, the deposition modules on the two sides of the deposition chamber 100 are arranged in a staggered manner. During the coating process, the A side of the base material will be coated first, and then the B side will be coated. There are two purposes for this staggered setting. One is to increase the laser drilling process, and the other is to reduce the heat accumulation during coating through the position interval.

[0062] Specifically, the addition of the laser drill is to punch through the high-resolution base material so that the coatings on both sides of the material are electrically connected. Since the effects of pulsed electron beam deposition on through-hole parts and blind-hole parts are very different, as Figure 7 shown, there may be no deposition at the middle position of the through-hole, that is, it is impossible to form a coating at the middle position of the through-hole, resulting in disconnection. The larger the aspect ratio, the higher the disconnection rate. For blind holes, although they are also affected by the aspect ratio, relatively speaking, the effect is better. Therefore, a laser drill 300 is arranged between the first pulsed electron beam deposition module group 200A and the second pulsed electron beam deposition module group 200B, and the laser drill 300 and the second pulsed electron beam deposition module group 200B are arranged on the same side of the deposition chamber 100. First, coat the A side, then use the laser drill 300 on the B side to create blind holes in the base material, and finally coat the B side.

[0063] Regarding the technical effect of reducing heat accumulation, it can be known that the plume generated by the pulsed electron beam bombarding the target has relatively high energy. When the high-energy plasma impacts the base material, that is, the polymer film of the composite current collector or the deposited coating, the kinetic energy is converted into internal energy and heat will be released outward. Since the temperature tolerance upper limit of the polymer material is relatively low compared to that of metal materials, continuous plasma impacts will cause heat accumulation and the temperature of the polymer material will continue to rise. Therefore, this spaced arrangement of pulsed electron beam deposition module groups can solve this problem to a certain extent. In addition, since the "pulses" of the pulsed electron beam are also intermittent during operation, it will also help to reduce heat accumulation. Increasing the distance between the electron beam deposition modules 200 in the first pulsed electron beam deposition module group 200A and the second pulsed electron beam deposition module group 200B is also one of the solutions.

[0064] In addition to Figure 3 the straight-line form in, it can also be like Figure 8The "S" - shaped layout shown in [Figure 0] conducts deposition coating and laser drilling at the turning parts, making full use of the height space of the equipment, reducing the overall volume of the equipment. The base material of the "S" - shaped layout also has sufficient heat dissipation time, and there will be no problem of heat accumulation.

[0065] Furthermore, in this embodiment, by using the number and arrangement of pulsed electron beam guns, the free regulation of the coating thickness can be realized, so as to solve the blank that the coating thickness cannot be locally regulated in the traditional solution. Specifically, taking the local thickening of the tab part of the composite current collector (both sides in the winding direction of the composite current collector film) as an example, the following several solutions are included:

[0066] One, as shown in [Figure 0], on a single pulsed electron beam deposition module 200, the number of pulsed electron beam guns 220 corresponding to the coating of the tab part is more than that in the middle part. That is, on a mounting substrate 210, the pulsed electron beam guns 220 near both sides are more in number than those in the middle position. Figure 9

[0067] Figure 10 Two, as shown in [Figure 0], in the first pulsed electron beam deposition module group 200A, it includes at least two pulsed electron beam deposition modules 200. Among them, on at least one pulsed electron beam deposition module 200, pulsed electron beam guns 220 are only set at the corresponding tab parts, and the remaining pulsed electron beam deposition modules 200 are normally fully covered with pulsed electron beam guns 220; this method can also be used on the second pulsed electron beam deposition module group 200B with the same principle.

[0068]

[0069] Three, based on the second item, the difference is that except for the pulsed electron beam deposition module 200 that only deposits the tab part, the remaining pulsed electron beam deposition modules 200 only deposit the parts other than the tab part, but there is a difference in the number of pulsed electron beam guns 220. The number of pulsed electron beam guns 220 for depositing the tab part is more than that of other parts, so that the coating thicknesses of the two deposition areas are different.

[0070] Four, different from the first three items, adjust the working parameters of the pulsed electron beam guns 220 for depositing the tab part, so that more plasma can be generated per unit time, that is, more metal can be deposited at the tab part in the same time, so that the coating thickness of the tab part is greater than that of other parts. Through parameter adjustment, the deposition thickness can be adjusted online arbitrarily under working conditions, and the relative deposition material utilization rate is extremely excellent, so the target material and the cleaning cost of the deposition chamber are further saved.

[0070] In summary, through the above arrangements of several pulse electron beam guns 220, more material deposition is obtained in the tab portion. Based on this principle, by controlling the number, distribution, and operating parameters of the pulse electron beam guns 220, the free adjustment of the coating thickness can be achieved.

[0071] Furthermore, when there are at least two pulse electron beam deposition modules 200 for depositing the coating on the same side, only one pulse electron beam gun 220 on one module can be controlled to operate. Since the pulse electron beam guns 220 are all electronically controlled, each pulse electron beam gun 220 on each module can be numbered and positioned. When the a gun on the first pulse electron beam deposition module 200 fails (the output power is abnormal or there are other problems), the b gun at the corresponding position on the second pulse electron beam deposition module 200 can be started for compensation. For example, the a gun is located in the third position of the second row on the first pulse electron beam deposition module 200, with the coordinate position (2, 3). The coordinate of the b gun on the second pulse electron beam deposition module 200 is the same as that of the a gun. It is easy to understand that the b gun replaces the a gun to work, avoiding the need to stop the machine during the production process due to a failure.

[0072] Based on the same principle, if there is only one pulse electron beam deposition module 200, when a certain pulse electron beam gun 220 fails, the output power of other pulse electron beam guns 220 in the same column (in the moving direction of the base material) can also be adjusted for work compensation.

[0073] The above are the technical effects brought by the pulse electron beam gun 220 in the form of an array, ensuring the yield of the finished product and greatly saving the process cost of machine downtime.

[0074] The above description is only a preferred embodiment of the present invention and does not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to the equivalent embodiments with the same change within the scope of the technical solution of the present invention without departing from the technical solution of the present invention. However, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A processing device for adding a coating to a base material, characterized in that: Comprising: A deposition chamber, the internal cavity of which is a working space for film coating; A pulsed electron beam deposition module, arranged on the deposition chamber and jointly forming a closed cavity with the deposition chamber, and the cavity can be evacuated to form a vacuum environment with a background vacuum degree lower than 1E-3 Pa; The pulsed electron beam deposition module is arranged at the top, or bottom, or top and bottom, or single side, or double sides of the deposition chamber.

2. The processing equipment according to claim 1, wherein: The pulsed electron beam deposition module comprises: A mounting substrate, on which a plurality of pulsed electron beam guns for emitting pulsed electron beams are arranged, and the pulsed electron beam guns are arbitrarily distributed on the mounting substrate; Targets, at least one target, and the electron beam generated by the pulsed electron beam gun can bombard the target, and each pulsed electron beam gun independently bombards one target or a plurality of pulsed electron beam guns jointly bombard one target.

3. The processing equipment according to claim 2, characterized in that: A target clamping mechanism is further arranged on the mounting substrate, and the target clamping mechanism is fixed or movable; The movable target clamping mechanism comprises a rotating device and / or a translation device; The target is clamped by the target clamping mechanism, and its posture or position is adjusted by the rotating device and the translation device.

4. The processing equipment according to claim 1, characterized in that: There are at least two groups of the pulsed electron beam deposition modules, namely a first pulsed electron beam deposition module group and a second pulsed electron beam deposition module group, and each group has at least one pulsed electron beam deposition module; The first pulsed electron beam deposition module group is arranged on one of the four surfaces, and the second pulsed electron beam deposition module group is arranged on the opposite surface of the first pulsed electron beam deposition module group; Along the moving direction of the base material in the deposition chamber, the first pulsed electron beam deposition module group is in the upstream position relative to the second pulsed electron beam deposition module group.

5. The processing equipment according to claim 4, characterized in that: It further comprises a laser drilling machine; The laser drilling machine is arranged outside the deposition chamber, and laser is introduced into the deposition chamber through an optical fiber for laser drilling; the laser generator of the laser drilling machine is a nanosecond, or picosecond, or femtosecond ultraviolet laser; The laser drilling machine and the second pulsed electron beam deposition module group are located on the same side; The spatial position of the laser drilling machine is between the first pulsed electron beam deposition module group and the second pulsed electron beam deposition module group, and the base material is scraped by laser, and the material deposited on the base material by the first pulsed electron beam deposition module group is retained to form a blind hole.

6. The processing equipment according to claim 2, characterized in that: There is at least one pulsed electron beam deposition module on the same surface of the deposition chamber; In the moving direction of the base material in the deposition chamber, the base material is divided into several regions according to the coating deposition thickness; The number of pulsed electron beam guns for depositing a thicker coating region is more than the number of pulsed electron beam guns for depositing a thinner coating region.

7. The processing equipment according to claim 6, characterized in that: A plurality of the pulsed electron beam deposition modules are divided into several groups; Each group of the pulsed electron beam deposition modules is respectively used for depositing a coating in one region; The total number of pulsed electron beam guns for depositing a thicker coating is more than the total number of pulsed electron beam guns for depositing a thinner coating region.

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