Chip on board (COB) area light source packaging structure without granular sensation

Abstract

The utility model relates to the field of lighting equipment, and discloses a granular-sensation-free COB area light source packaging structure which comprises a chip, the bottom end of the chip is fixedly connected with an installation column, a circuit board is arranged at the bottom end of the chip, an installation groove is formed in the top end of the circuit board in a penetrating mode, and the outer wall of the bottom end of the installation column is slidably arranged on the inner wall of the installation groove. A mounting assembly is arranged on the inner wall of the mounting column and comprises a clamping block, the outer wall of the clamping block is slidably connected to the inner wall of the mounting column, a limiting column is fixedly connected to the inner side, close to the mounting column, of the clamping block, and a clamping groove is formed in the inner wall, close to the outer side of the clamping block, of the mounting column. According to the utility model, through the cooperative use of the installation assembly and the installation column, when the chip is installed, the installation column is firstly inserted into the installation groove on the circuit board, and then the installation column is rapidly installed and fixed through the installation assembly, so that the installation efficiency is improved, and the damage of installation to the chip is reduced at the same time.

Description

Technical Field

[0001] The utility model relates to the field of lighting devices, in particular to a COB surface light source packaging structure without graininess. Background Technique

[0002] With the continuous development of lighting technology, LED light sources have been widely used in various lighting scenarios due to their characteristics such as high efficiency, energy saving, and environmental protection. Among them, the COB (Chip On Board) packaging technology, as an advanced LED packaging method, has gradually occupied an important position in the high-end lighting market due to its characteristics such as high integration, high brightness, and good uniformity.

[0003] After retrieval, Chinese Patent Publication No.: CN221004757U discloses a COB surface light source packaging structure without graininess. The utility model includes a circuit board, an installation groove is arranged at the top of the circuit board, a COB chip is installed inside the installation groove, and a light-emitting crystal is installed on the top of the COB chip. For this COB surface light source packaging structure without graininess, by setting a first clamping part, first, the second clamping part and the third clamping part are directly installed into the guiding groove inside the connecting rod through the first guiding surface and the second guiding surface, and then the bottom of the COB chip is directly clamped between the second clamping part and the third clamping part through the first clamping part. When the clamping head needs to pass through the second clamping part and the third clamping part, by guiding the entry and exit of the clamping head through the installation guiding surface and the disassembly guiding surface, the gap between the two connecting protrusions will be enlarged, enabling the clamping head to pass through the two identical connecting protrusions for installation or disassembly.

[0004] In the above technology, although it realizes that guiding the entry and exit of the clamping head through the installation guiding surface and the disassembly guiding surface will enlarge the gap between the two connecting protrusions, enabling the clamping head to pass through the two identical connecting protrusions for installation or disassembly, in the above device, the first clamping part, the second clamping part, and the third clamping part are all made of plastic elastic materials. When the clamping head needs to pass through the second clamping part and the third clamping part, the second clamping part and the third clamping part are deformed by extrusion, and the second clamping part and the third clamping part are closely attached to the positioning block, resulting in the need to use a relatively large force to install the COB chip, which may cause extrusion of the COB chip during installation and may damage the COB chip. Therefore, a COB surface light source packaging structure without graininess is proposed to solve the above problems. Content of the Utility Model

[0005] In order to make up for the above deficiencies, the utility model provides a COB surface light source packaging structure without graininess, aiming to improve the problem of "extruding the COB chip during installation, which may damage the COB chip" in the prior art.

[0006] To achieve the above object, the present utility model adopts the following technical solution: A COB surface light source packaging structure without graininess, including a chip, an installation post is fixedly connected to the bottom end of the chip, a circuit board is arranged at the bottom end of the chip, an installation groove is penetrated and opened at the top end of the circuit board, the outer wall of the bottom end of the installation post slides on the inner wall of the installation groove, an installation component is arranged on the inner wall of the installation post, the installation component includes a clamping block, the outer wall of the clamping block slides on the inner wall of the installation post, and a limiting post is fixedly connected to the inner side of the clamping block close to the installation post.

[0007] As a further description of the above technical solution:

[0008] A clamping groove is opened on the inner wall of the installation post close to the outer side of the clamping block, the outer side of the clamping block slides on the inner wall of the clamping groove, a moving plate is fixedly connected to the bottom end of the clamping block, and the outer wall of the bottom end of the moving plate slides on the inner wall of the installation post.

[0009] As a further description of the above technical solution:

[0010] The moving plate and the installation post are elastically connected through an elastic sheet, a sliding post is arranged on the inner wall of the installation post, and the outer wall of the top end of the sliding post slides on the inner wall of the installation post.

[0011] As a further description of the above technical solution:

[0012] The upper side of the sliding post is set to be convex arc-shaped and symmetrically arranged on both sides of the sliding post.

[0013] As a further description of the above technical solution:

[0014] The outer wall of the top end of the sliding post slides on the inner side of the clamping block, a limiting groove is opened on the convex arc-shaped outer side of the top end of the sliding post, and the outer wall of the limiting post slides on the inner wall of the limiting groove.

[0015] As a further description of the above technical solution:

[0016] Two groups of clamping blocks are provided, and the two groups of clamping blocks are symmetrically arranged with the center line of the installation post as the axis of symmetry.

[0017] As a further description of the above technical solution:

[0018] A heat dissipation component is arranged at the bottom end of the sliding post, the heat dissipation component includes a bottom plate, the top end of the bottom plate is fixedly connected to the bottom end of the sliding post, and two stabilizing plates are fixedly connected to both sides of the top end of the bottom plate, and the top ends of the stabilizing plates are attached to the bottom end of the circuit board.

[0019] As a further description of the above technical solution:

[0020] Heat dissipation holes are penetrated and opened in the inner wall of the bottom plate, and multiple groups of heat dissipation holes are opened.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the utility model, through the combined use of the installation component and the installation column, when installing the chip, the installation column is inserted into the installation groove on the circuit board, and then the installation column is quickly installed and fixed through the installation component, thereby improving the installation efficiency and reducing the damage to the chip during installation.

[0023] 2. In the utility model, through the combined use of the auxiliary component and the sliding column, the bottom plate is separated from the circuit board by the stabilizing plate to maintain the heat dissipation effect of the circuit board. At the same time, the heat is transferred to the bottom plate through the sliding column, and the heat is dissipated through multiple groups of heat dissipation holes opened in the bottom plate, thereby improving the heat dissipation efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a three-dimensional structural schematic diagram of the overall device in the utility model;

[0025] Figure 2 is a front three-dimensional structural sectional schematic diagram of the circuit board in the utility model;

[0026] Figure 3 is a disassembled three-dimensional structural schematic diagram of the installation column and the bottom plate in the utility model;

[0027] Figure 4 is a top three-dimensional structural sectional schematic diagram of the installation column in the utility model;

[0028] Figure 5 is a front three-dimensional structural partial sectional schematic diagram of the installation column in the utility model;

[0029] Figure 6 is the utility model Figure 3 is an enlarged three-dimensional structural schematic diagram of part A in the utility model.

[0030] LEGEND DESCRIPTION:

[0031] 1. Chip; 2. Installation column; 3. Circuit board; 4. Installation groove; 51. Block; 52. Limit post; 53. Card slot; 54. Moving plate; 55. Elastic piece; 56. Sliding column; 57. Limit groove; 61. Bottom plate; 62. Stabilizing plate; 63. Heat dissipation hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0033] Reference Figure 1 - Figure 3 As an embodiment provided by the present utility model: A COB surface light source packaging structure without particle feeling, including a chip 1, which is a COB chip and is an existing structure and can be realized by those skilled in the art. Since it is an existing technology, it will not be described in detail in this case. A mounting post 2 for mounting and positioning the chip 1 is fixedly connected to the bottom end of the chip 1. A circuit board 3 is arranged at the bottom end of the chip 1. A mounting groove 4 for mounting and positioning the mounting post 2 is penetrated and opened at the top end of the circuit board 3. The outer wall of the bottom end of the mounting post 2 slides on the inner wall of the mounting groove 4. An installation component for fixing the mounting post 2 on the inner wall of the circuit board 3 is arranged on the inner wall of the mounting post 2. The installation component includes a clamping block 51 for limiting the mounting post 2. The outer wall of the clamping block 51 slides on the inner wall of the mounting post 2. A limiting post 52 for limiting the clamping block 51 and cooperating with the limiting groove 57 is fixedly connected to the inner side of the clamping block 51 close to the mounting post 2.

[0034] Reference Figure 2 、 Figure 4 and Figure 5 , a clamping groove 53 for fixing the mounting post 2 is opened on the inner wall of the mounting post 2 close to the outer side of the clamping block 51. The outer side of the clamping block 51 slides on the inner wall of the clamping groove 53. A moving plate 54 for extruding the elastic piece 55 is fixedly connected to the bottom end of the clamping block 51. The outer wall of the bottom end of the moving plate 54 slides on the inner wall of the mounting post 2 to improve the stability of the moving plate 54 when moving. The moving plate 54 and the mounting post 2 are elastically connected by the elastic piece 55. When the clamping block 51 is released from the limit, the elastic force of the elastic piece 55 drives the clamping block 51 to slide out of the inner wall of the clamping groove 53. A sliding column 56 capable of driving two groups of clamping blocks 51 to move is arranged on the inner wall of the mounting post 2. The outer wall of the top end of the sliding column 56 slides on the inner wall of the mounting post 2.

[0035] Reference Figure 4 - Figure 6 , the upper side of the sliding column 56 is set as a convex arc shape and is symmetrically arranged on both sides of the sliding column 56. Rotate the sliding column 56, and the symmetrically arranged convex arc shape at the top end extrudes the inclined surfaces on the inner sides of the two groups of clamping blocks 51, so that the two groups of clamping blocks 51 slide out of the inner wall of the mounting post 2 and slide into the inner wall of the clamping groove 53, thereby limiting the mounting post 2. The outer wall of the top end of the sliding column 56 slides on the inner side of the clamping block 51. A limiting groove 57 is opened on the outer side of the convex arc shape at the top end of the sliding column 56. The limiting groove 57 is symmetrically opened on the outer wall of the middle part of the convex arc shape at the top end of the sliding column 56. The outer wall of the limiting post 52 slides on the inner wall of the limiting groove 57. By sliding the limiting post 52 into the inner wall of the limiting groove 57, the two groups of clamping blocks 51 are limited, so that the two groups of clamping blocks 51 are stably inserted into the inner wall of the clamping groove 53. Two groups of clamping blocks 51 are provided, and the two groups of clamping blocks 51 are symmetrically arranged with the center line of the mounting post 2 as the axis of symmetry, which can improve the stability of the mounting post 2 after installation.

[0036] Reference Figure 2 -Figure 4 , a heat dissipation component for enhancing the heat dissipation effect is provided at the bottom end of the sliding column 56. The heat dissipation component includes a bottom plate 61 for fixing the sliding column 56. The top end of the bottom plate 61 is fixedly connected to the bottom end of the sliding column 56. On both sides of the top end of the bottom plate 61, two groups of stabilizing plates 62 are fixedly connected. The stabilizing plates 62 are used to support between the bottom plate 61 and the circuit board 3, so that there is a certain distance between the circuit board 3 and the bottom plate 61, facilitating air circulation and dissipating heat from the circuit board 3. The top ends of the stabilizing plates 62 are attached to the bottom end of the circuit board 3. A plurality of heat dissipation holes 63 are penetrated through the inner wall of the bottom plate 61. The heat transferred from the sliding column 56 made of metal material to the bottom plate 61 increases the contact area with air through the plurality of heat dissipation holes 63, thereby improving the heat dissipation effect.

[0037] Working principle: When in use, when the chip 1 needs to be installed, first insert the installation post 2 at the bottom end of the chip 1 into the inner wall of the installation groove 4 on the circuit board 3, and then insert the sliding column 56 into the inner wall of the installation post 2, so that the top end of the sliding column 56 contacts the inner wall of the installation post 2, and the stabilizing plate 62 on the bottom plate 61 contacts the bottom end of the circuit board 3. At this time, rotate the bottom plate 61 to drive the sliding column 56 to rotate in the inner wall of the installation post 2.

[0038] While the sliding column 56 is rotating, the two clamping blocks 51 are squeezed, so that the clamping blocks 51 move outward to the outer side of the installation post 2, and the clamping blocks 51 slide into the inner wall of the clamping groove 53 opened on the inner wall of the installation post 2, thereby limiting the installation post 2. While the clamping blocks 51 are moving, the moving plate 54 drives the elastic piece 55 to be squeezed. When the sliding column 56 rotates, the limiting post 52 slides into the inner wall of the limiting groove 57 through the arc surface on the outer side of the bottom end, and the sliding column 56 can be limited. At this time, the installation of the chip 1 is completed.

[0039] When the chip 1 needs to be disassembled, only rotate the bottom plate 61 in the opposite direction to release the limitation on the clamping block 51, and drive the clamping block 51 to slide back into the inner wall of the installation post 2 through the elastic force of the elastic piece 55, so as to release the limitation on the chip 1. The operation is simple and the disassembly efficiency is improved.

[0040] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A COB surface light source packaging structure without granularity, comprising a chip (1), characterized in that: A mounting post (2) is fixedly connected to the bottom end of the chip (1). A circuit board (3) is arranged at the bottom end of the chip (1). An installation groove (4) is penetrated and opened at the top end of the circuit board (3). The outer wall of the bottom end of the mounting post (2) slides on the inner wall of the installation groove (4). An installation component is arranged on the inner wall of the mounting post (2). The installation component includes a clamping block (51). The outer wall of the clamping block (51) slides on the inner wall of the mounting post (2). A limiting post (52) is fixedly connected to the inner side of the clamping block (51) close to the mounting post (2).

2. The packaging structure of a COB surface light source without granularity according to claim 1, wherein: A clamping groove (53) is opened on the inner wall of the mounting post (2) close to the outer side of the clamping block (51). The outer side of the clamping block (51) slides on the inner wall of the clamping groove (53). A moving plate (54) is fixedly connected to the bottom end of the clamping block (51). The outer wall of the bottom end of the moving plate (54) slides on the inner wall of the mounting post (2).

3. The COB surface light source packaging structure without particle feeling according to claim 2, characterized in that: The moving plate (54) and the mounting post (2) are elastically connected by an elastic sheet (55). A sliding post (56) is arranged on the inner wall of the mounting post (2). The outer wall of the top end of the sliding post (56) slides on the inner wall of the mounting post (2).

4. A COB surface light source packaging structure without granularity according to claim 3, characterized in that: The upper side of the sliding post (56) is in a convex arc shape and is symmetrically arranged on both sides of the sliding post (56).

5. The packaging structure of a COB surface light source without graininess according to claim 3, characterized in that: The outer wall of the top end of the sliding post (56) slides on the inner side of the clamping block (51). A limiting groove (57) is opened on the outer convex arc-shaped side of the top end of the sliding post (56). The outer wall of the limiting post (52) slides on the inner wall of the limiting groove (57).

6. The packaging structure of a COB surface light source without graininess according to claim 1, characterized in that: Two groups of the clamping blocks (51) are provided, and the two groups of the clamping blocks (51) are symmetrically arranged with the center line of the mounting post (2) as the axis of symmetry.

7. A particle-free COB surface light source packaging structure according to claim 3, characterized in that: A heat dissipation component is arranged at the bottom end of the sliding post (56). The heat dissipation component includes a bottom plate (61). The top end of the bottom plate (61) is fixedly connected to the bottom end of the sliding post (56). Two stabilizing plates (62) are fixedly connected to both sides of the top end of the bottom plate (61). The top ends of the stabilizing plates (62) are attached to the bottom end of the circuit board (3).

8. A particle-free COB surface light source packaging structure according to claim 7, characterized in that: Heat dissipation holes (63) are penetrated and opened in the inner wall of the bottom plate (61), and multiple groups of the heat dissipation holes (63) are opened.

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