Electric control device and air conditioner

Abstract

The utility model discloses an electric control device and an air conditioner. The electric control device comprises a first circuit board, a second circuit board, a first electric control box and a second electric control box. Wherein the second circuit board is connected with the first circuit board, and a power module needing heat dissipation is arranged on the second circuit board; a first circuit board is arranged in the first electric control box; a second circuit board is arranged in the second electric control box, and the second circuit board and the second electric control box form a sealed cavity. Thus, the circuit board is re-divided into the first circuit board and the second circuit board, the power modules needing heat dissipation are concentrated on the second circuit board, and the second circuit board is arranged in the second electric control box in a sealed mode, so that the upper surface and the lower surface of the second circuit board are isolated from external air. Therefore, even if condensation is generated during heat dissipation of the power module, the condensation does not affect the safety of the second circuit board, efficient heat dissipation of the power module is guaranteed, temperature rise of the power module is reduced, derating type selection is carried out on the power module, and the cost is reduced.

Description

Technical Field

[0001] This application relates to the technical field of manufacturing electric control devices, and particularly to an electric control device and an air conditioner. Background Art

[0002] In the existing outdoor electric control device of a household variable-frequency air conditioner, the internal power module has a relatively high heat rise. Therefore, a radiator is usually used for air-cooling the power module or a low-temperature refrigerant pipe is built in for refrigerant cooling.

[0003] In the prior art, air-cooling is limited by factors such as a low temperature difference from the environment, a small contact area between the radiator and air, a small air volume and a low wind speed in the air duct, and usually has a poor heat dissipation effect. For low-temperature refrigerant cooling, due to the fast refrigerant flow rate, large flow, and high heat transfer coefficient, its heat dissipation effect is better than that of air-cooling. However, when the temperature of the radiator is lower than the ambient temperature, condensed water will be generated on the radiator by the high-temperature air in the electric control box, thus affecting the safety of the circuit board.

[0004] Therefore, how to avoid the influence of condensed water during the heat dissipation of the electric control device is a problem that needs to be solved. Summary of the Invention

[0005] In view of the above problems, this application provides an electric control device and an air conditioner. According to the power module that needs to be cooled, the circuit board is redistributed and arranged, and the circuit board that needs to be cooled is hermetically arranged in the corresponding electric control box to avoid the condensed water generated during the heat dissipation of the power module from affecting the safety of the circuit board.

[0006] According to the first aspect of this application, an electric control device is provided, and the electric control device includes:

[0007] A first circuit board;

[0008] A second circuit board, connected to the first circuit board, and a power module that needs to be cooled is arranged on the second circuit board;

[0009] A first electric control box, in which the first circuit board is arranged;

[0010] A second electric control box, in which the second circuit board is arranged, and the second circuit board and the second electric control box form a sealed cavity.

[0011] Optionally, the electric control device further includes a three-phase bus capacitor, an absorption resistor, a sampling resistor and a control circuit arranged on the second circuit board;

[0012] The three-phase bus capacitor, the absorption resistor, the control circuit and the sampling resistor are respectively connected to the power module.

[0013] Optionally, a support portion is provided in the second electronic control box, and the support portion is used to support the second circuit board;

[0014] A target gap is formed between the second circuit board and the second electronic control box, and the target gap and the upper surface of the second circuit board are filled with a waterproof material, wherein the power module is arranged on the upper surface of the second circuit board.

[0015] Optionally, the second electronic control box includes a box bottom and a side wall surrounding the box bottom;

[0016] The support portion includes a support plate arranged on the side wall, and the support plate contacts a target area of the second circuit board to support the second circuit board, and the target area is an area where the distance from the edge of the second circuit board is less than a threshold value.

[0017] Optionally, the support plate and the side wall are integrally formed.

[0018] Optionally, the first end of the side wall is connected to the box bottom, the second end of the side wall expands outwards to form a boss, and the support plate is located between the first end and the second end of the side wall.

[0019] Optionally, the filling thickness of the waterproof material on the upper surface of the second circuit board is greater than or equal to 1 mm.

[0020] Optionally, the electric control device further includes a radiator, and the radiator is arranged on the power module to dissipate heat from the power module.

[0021] Optionally, the radiator includes a heat dissipation body and a flow channel arranged inside the heat dissipation body, and the flow channel is used for the circulation of refrigerant. Wherein, when the power module is in a heat dissipation state, the temperature of the refrigerant flowing through the flow channel is lower than the ambient temperature where the second circuit board is located.

[0022] According to the second aspect of the present application, an air conditioner is provided, and the air conditioner includes the aforementioned electric control device.

[0023] One or more of the above technical solutions in the embodiments of this specification have at least the following technical effects:

[0024] An electronic control device and an air conditioner provided by an embodiment of this specification include a first circuit board, a second circuit board, a first electronic control box, and a second electronic control box. Among them, the second circuit board is connected to the first circuit board, and a power module that needs to be cooled is provided on the second circuit board; the first circuit board is arranged in the first electronic control box; the second circuit board is arranged in the second electronic control box, and the second circuit board and the second electronic control box form a sealed cavity. In this way, by re-dividing the circuit board into a first circuit board and a second circuit board, concentrating the power module that needs to be cooled on the second circuit board, and sealing the second circuit board in the second electronic control box, both the upper and lower surfaces of the second circuit board are isolated from the external air. Therefore, even if condensation occurs when the power module dissipates heat, the condensation will not affect the safety of the second circuit board, ensuring that the power module can dissipate heat efficiently, reducing the temperature rise of the power module, so as to derate and select the power module, and reducing costs.

[0025] The above description is only an overview of the technical solution of this application. In order to be able to understand the technical means of this application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features, and advantages of this application more obvious and understandable, the following specifically enumerates the specific implementation manners of this application. Brief Description of the Drawings

[0026] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of this application. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0027] Figure 1 A circuit topology diagram in an embodiment of this application is shown.

[0028] Figure 2 A schematic diagram of a circuit board layout in an embodiment of this application is shown.

[0029] Figure 3 A schematic diagram of the assembly of a second circuit board in an embodiment of this application is shown.

[0030] Figure 4 A cross-sectional schematic diagram of an electronic control device in an embodiment of this application is shown.

[0031] Legend:

[0032] Second electronic control box - 1, second circuit board - 2, power module - 3, heat dissipation body - 4, flow channel - 5, waterproof material - 6, target gap - 7, sealed cavity - 8, side wall - 11, box bottom - 12, support plate - 13, convex platform - 14, support column - 15. Detailed Description of the Embodiment

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are only a part rather than all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0034] In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0035] The present application will be described below with reference to the accompanying drawings and specific embodiments:

[0036] In the related art, air-cooled heat dissipation is limited by factors such as a low temperature difference with the environment, a small contact area between the radiator and air, a small air volume in the air duct, and a small wind speed, and usually has a poor heat dissipation effect. The low-temperature refrigerant heat dissipation has a better heat dissipation effect than air-cooled heat dissipation due to its fast refrigerant flow rate, large flow rate, and high heat transfer coefficient. However, when the temperature of the radiator is lower than the ambient temperature, high-temperature air in the electronic control box will generate condensation on the radiator, thus affecting the safety of the circuit board.

[0037] Based on the above situation, the present application provides an electronic control device and an air conditioner. By re-dividing the circuit board into a first circuit board and a second circuit board, concentrating the power modules that need to be cooled on the second circuit board, and hermetically setting the second circuit board in the second electronic control box, both the upper surface and the lower surface of the second circuit board are isolated from the external air. Therefore, even if condensation occurs when the power module is in a heat dissipation state, the condensation will not affect the safety of the circuit board, ensuring that the power module can dissipate heat efficiently, reducing the temperature rise of the power module, and thus enabling derating selection of the power module to reduce costs.

[0038] Combined Figure 1 、 Figure 2 、 Figure 3 and Figure 4 as shown, an electronic control device provided in an embodiment of the present application includes: a first circuit board, a second circuit board 2, a first electronic control box, a second electronic control box 1, and a power module 3.

[0039] Among them, the second circuit board 2 is connected to the first circuit board, and a power module 3 that needs to be cooled is arranged on the upper surface of the second circuit board 2; the first circuit board is arranged in the first electronic control box, the second circuit board 2 is hermetically arranged in the second electronic control box 1, and the second circuit board 2 and the second electronic control box 1 form a sealed cavity 8.

[0040] Combined Figure 4 As shown, in this embodiment, the upper side surface of the second circuit board 2 is used as the upper surface of the second circuit board 2; correspondingly, the lower side surface of the second circuit board 2 is used as the lower surface of the second circuit board 2. The upper surface and the lower surface of the second circuit board 2 are isolated from the outside air, that is to say, the condensed water generated when the power module 3 dissipates heat does not contact the upper surface and the lower surface of the second circuit board 2. The upper surface and the lower surface of the second circuit board are oppositely arranged on the second circuit board, the lower surface of the second circuit board faces the sealed cavity 8, and the upper surface of the second circuit board faces the outside of the second electronic control box.

[0041] Combined Figure 1 As shown, the electronic control device in this embodiment can be an outdoor controller of an air conditioner powered by three-phase power, and its circuit topology is a three-phase rectification + three-phase inversion circuit, but it is not limited to this, and it can also be other three-phase circuit topology types, which are not limited in this embodiment for comparison.

[0042] This embodiment is described by taking the circuit topology of three-phase rectification + three-phase inversion circuit as an example, and mainly includes a filter circuit, a power module, a bus capacitor E1, a sampling resistor R2, and an absorption resistor R1. The power module is the main heat-generating module in the electronic control device. The power module can be a PIM module (Power Integrated Module), or it can be composed of discrete power devices. This embodiment is described by taking the PIM module as an example.

[0043] Among them, the input terminals AC1, AC2, AC3, and N of the AC380V three-phase AC power supply are connected to the filter circuit, and the output terminals L1, L2, and L3 of the filter circuit (including EMI filter circuit, surge protection circuit, inrush current protection circuit, phase loss and phase sequence detection circuit, etc.) are connected to the PIM-a part (three-phase rectification, composed of 6 diodes D1-D6) of the PIM module. The PIM-a part is also connected to the bus capacitor E1. The absorption resistor R1 is connected to the PIM-b part (composed of an insulated gate bipolar transistor IGBT and a fast recovery diode FRD, where the emitter of the IGBT is connected to the absorption resistor R1 and then returns to the negative terminal of the bus) of the PIM module. The sampling resistor R2 is connected to the PIM-c part (three-phase inversion, composed of 6 power tubes Q1-Q6, where the sources of Q4-Q6 are connected to the sampling resistor R2 and then return to the negative terminal of the bus) of the PIM module. The PIM-c part is also connected to the compressor comp.

[0044] In one embodiment, the circuit board can be repartitioned and laid out according to the above circuit topology, and the above-mentioned components and / or modules are respectively arranged on the first circuit board or the second circuit board. The components and modules can be directly inserted and installed on the circuit board, or welded on the circuit board.

[0045] In one embodiment, in combination with Figure 2 as shown, a power module, a three-phase bus capacitor E1, an absorption resistor R1, a sampling resistor R2, and a control circuit are provided on the second circuit board.

[0046] Among them, the three-phase bus capacitor E1, the absorption resistor R1, the control circuit, and the sampling resistor R2 are respectively connected to the power module. The second circuit board is also provided with power input interfaces L1, L2, and L3, compressor interfaces U, V, and W, and a power supply & communication interface. The first circuit board is connected to the second circuit board through the power supply & communication interface.

[0047] The three-phase power input interfaces L1, L2, and L3 are arranged in the upper right corner of the second circuit board, the power module is arranged in a region slightly to the right of the middle of the second circuit board, the compressor interfaces U, V, and W are arranged in the lower right corner of the second circuit board, the three-phase bus capacitor E1 is arranged in the upper left corner of the second circuit board, the power supply & communication interface, the absorption resistor R1, and the sampling resistor R2 are arranged in the middle position on the left side of the second circuit board, and the control circuits for the drive MCU, compressor drive, and braking are arranged in the lower left corner and the bottom region of the second circuit board.

[0048] The first circuit board is provided with power interfaces AC1, AC2, AC3, and N for inputting AC 380V three-phase AC power, power output interfaces L1, L2, and L3 for outputting three-phase power, a fan interface, an electric heating circuit & interface, a valve circuit & interface, a sensor circuit & interface, and a power supply & communication interface. Among them, the power supply & communication interface of the first circuit board is connected to the power supply & communication interface of the second circuit board. The power output interfaces L1, L2, and L3 of the first circuit board are connected to the power input interfaces L1, L2, and L3 of the second circuit board.

[0049] The first circuit board is also provided with a filter circuit, a single-phase rectification module, a single-phase bus electrolytic capacitor, a switching power supply circuit, a main control MCU and its peripheral control circuits, and a fan drive circuit. The arrangement of the components and / or modules on the first circuit board can refer to Figure 2 , or can be arranged according to the actual situation, and this embodiment does not make a limitation on this.

[0050] In this embodiment, in combination with Figure 4 as shown, the electric control device further includes a radiator, and the radiator is arranged on the power module 3 for dissipating heat from the power module 3. The radiator includes a heat dissipation body 4 and a flow channel 5. Among them, the heat dissipation body 4 is in close contact with the surface of the power module 3 to absorb the heat of the power module 3. A flow channel 5 is arranged inside the heat dissipation body 4, and the refrigerant circulates in the flow channel 5. When the power module 3 needs to dissipate heat, a low-temperature refrigerant heat dissipation method is adopted to dissipate heat from the power module 3.

[0051] Specifically, the heat dissipation body 4 absorbs the heat of the power module 3, and the refrigerant flows through the flow channel 5. The refrigerant exchanges heat with the heat dissipation body 4 and takes away the heat, thereby reducing the temperature rise of the power module 3 and ensuring the normal operation of the power module 3. It should be noted that the refrigerant flowing in the flow channel 5 is the low-temperature refrigerant after throttling in the air conditioner system, and the temperature of the refrigerant flowing through the flow channel 5 is lower than the ambient temperature where the second circuit board 2 is located.

[0052] It should be noted that when the low-temperature refrigerant heat dissipation method is adopted, when the air with a higher temperature in the second electronic control box 1 comes into contact with the radiator through which the low-temperature refrigerant flows, condensation is likely to occur on the radiator. After the condensation gathers on the second circuit board 2, it will affect the safety of the second circuit board 2.

[0053] Based on this, as shown in Figure 3 、 Figure 4 In this embodiment, a support part is provided in the second electronic control box 1, and the support part is used to support the second circuit board 2. The second electronic control box 1 is a semi-sealed box body, that is, five of the six sides of the second electronic control box 1 are closed, and the top side is left open. During assembly, the top opening of the second electronic control box 1 is blocked by the second circuit board 2, and the second circuit board 2 and the second electronic control box 1 form a sealed cavity 8. The lower surface of the second circuit board 2 faces the sealed cavity 8, and the upper surface faces the outside of the second electronic control box 1. A power module 3 is provided on the upper surface, and a radiator is provided on the power module 3. The radiator includes a heat dissipation body 4 and a flow channel 5.

[0054] It should be noted that the lower surface of the second circuit board 2 is not a flat surface, and the pins of some modules or components will penetrate the lower surface and be exposed. Even some modules or components are arranged on the lower surface of the second circuit board 2. Therefore, a support part is provided in the second electronic control box 1. The support part contacts the second circuit board 2 and supports the second circuit board 2 at a certain height in the second electronic control box 1. The height of the support part can be set according to the distance between the second circuit board 2 and the bottom 12 of the second electronic control box 1, and this embodiment does not limit this.

[0055] After the second circuit board 2 is placed in the second electronic control box 1, the second circuit board 2 is in close contact with the support part, and the second circuit board 2 is in a horizontal placement state. In this embodiment, fixing parts such as buckles or screws can be used to fix the second circuit board 2. After fixing the second circuit board 2, a target gap 7 will be formed between the edge of the second circuit board 2 and the second electronic control box 1.

[0056] In this embodiment, a waterproof material 6 is filled on the upper surface of the second circuit board 2 and in the target gap 7. The waterproof material 6 in this embodiment refers to a material that can play a role in waterproofing, electrical insulation and heat conduction. The waterproof material 6 can be a sealant, a waterproof glue or a potting glue, etc.

[0057] This embodiment is illustrated by taking waterproof glue as an example. After fixing the second circuit board 2, the waterproof glue is poured in. The waterproof glue evenly covers the upper surface of the second circuit board 2 in a self-leveling manner, and at the same time fills the target gap 7. The covered waterproof glue needs to reach a certain thickness. For example, the thickness of the waterproof glue on the upper surface of the second circuit board 2 is greater than or equal to 1 mm. After the waterproof glue cures, it covers the upper surface of the second circuit board 2 and fills the target gap 7, thereby isolating the surface of the second circuit board 2 from the external air and forming a sealed cavity 8 between the second circuit board 2 and the second electronic control box 1. External water vapor cannot enter, so as to eliminate the influence of condensation on the second circuit board 2. In addition, it can better prevent dust and corrosion, which is beneficial to improving the safety of the electronic control device.

[0058] It is worth mentioning that there are various implementation manners for the supporting part.

[0059] In an optional implementation manner, the supporting part can be a surrounding support plate 13. Specifically, the second electronic control box 1 includes a box bottom 12 and side walls 11 surrounding the box bottom 12. A target gap 7 is formed between the side walls 11 and the edge of the second circuit board 2, and the target gap 7 is filled with waterproof glue. The support plate 13 contacts the target area of the second circuit board 2 and is used to support the second circuit board 2. The target area refers to the area where the distance from the edge of the second circuit board 2 is less than a threshold value. The threshold value can be 5 mm, 10 mm or even larger, and is specifically set according to the actual situation of the second circuit board 2.

[0060] The support plate 13 can be arranged in a ring on the inner surface of the side wall 11, that is, the support plate 13 is horizontally continuously arranged around the side wall 11 for one week. In design and production, preferably, the support plate 13 can be integrally formed with the side wall 11. In addition, the shape of the support plate 13 can also have various styles.

[0061] In one embodiment, the widths of all parts of the support plate 13 are equal.

[0062] In another embodiment, the widths of all parts of the support plate 13 are not completely the same, and the width of the support plate 13 depends on the layout of the modules or components on the second circuit board 2. If some modules or components are arranged close to the edge, making the distance from this module or component to the edge of the second circuit board 2 relatively close, correspondingly, the width of the support plate 13 corresponding to this place is reduced.

[0063] If the support plate 13 is used to support the second circuit board 2, when pouring the waterproof glue, the waterproof glue will not flow into the cavity between the second circuit board 2 and the second electronic control box 1. In this way, the amount of waterproof glue used can be reduced and the cost can be saved.

[0064] In an alternative embodiment, the supporting part may also be a plurality of supporting columns 15. Specifically, the second electronic control box 1 includes a box bottom 12 and side walls 11 surrounding the box bottom 12. One end of the supporting column 15 is fixed to the box bottom 12, and the other end contacts the second circuit board 2 to support the second circuit board 2. The plurality of supporting columns 15 may be evenly distributed on the box bottom 12. For example, the distance between adjacent supporting columns 15 is equal, or the distance from each supporting column 15 to the center point of the box bottom 12 is equal.

[0065] If the supporting columns 15 are used to vertically support the second circuit board 2, the overall supporting effect on the second circuit board 2 can be ensured. When there are many modular components on the horizontally installed second circuit board 2, the supporting columns 15 can prevent the middle part of the second circuit board 2 from sagging.

[0066] In another alternative embodiment, the supporting part includes a support plate 13 and a plurality of supporting columns 15. For the specific content, reference can be made to the foregoing, and details will not be repeated here. It should be noted that the height of the supporting column 15 from the box bottom 12 is less than or equal to the height of the support plate 13 from the box bottom 12.

[0067] If the support plate 13 and the supporting columns 15 are used together to support the second circuit board 2, it can not only save the amount of waterproof glue, but also ensure the overall supporting effect on the second circuit board 2.

[0068] In addition, it is worth mentioning that the first end of the side wall 11 is connected to the box bottom 12, and the second end of the side wall 11 expands outward to form a convex platform 14. The support plate 13 is located between the first end and the second end of the side wall 11. The convex platform 14 is above the support plate 13, and the convex platform 14 can be parallel to the box bottom 12. When pouring the waterproof glue, the convex platform 14 is also covered with the waterproof glue. The convex platform 14 can increase the contact area between the waterproof glue and the side wall 11. And adding the convex platform 14 makes the side wall 11 have a turning angle, preventing the waterproof glue from separating from the side wall 11 during thermal expansion and contraction, so as to improve the sealing effect.

[0069] In summary, an electronic control device provided by an embodiment of this specification divides the circuit board into a first circuit board and a second circuit board 2 again, concentrates the power modules 3 that need to dissipate heat on the second circuit board 2, and the second circuit board 2 and the second electronic control box 1 form a sealed cavity 8. In this way, both the upper and lower surfaces of the second circuit board 2 are isolated from the external air. Even if condensation occurs when the power module 3 dissipates heat, the condensation will not affect the safety of the second circuit board 2, ensuring that the power module 3 can dissipate heat efficiently, reducing the temperature rise of the power module 3, and thus derating and selecting the power module 3 to reduce costs.

[0070] Based on the same concept, the present application also provides an air conditioner, which includes the aforementioned electronic control device. The electronic control device can be the one in the outdoor unit of an air conditioner with three-phase power supply, or the one in the outdoor unit of an air conditioner with single-phase power supply. This embodiment does not limit this.

[0071] Since the air conditioner provided by the present application includes the electronic control device of the above technical solution, the air conditioner provided by the present application has all the beneficial effects of the above electronic control device.

[0072] In summary, an air conditioner provided in an embodiment of this specification. The electronic control device in the air conditioner re-divides the circuit board into a first circuit board and a second circuit board 2, concentrates the power modules 3 that need to dissipate heat on the second circuit board 2, and the second circuit board 2 and the second electronic control box 1 form a sealed cavity 8. In this way, both the upper and lower surfaces of the second circuit board 2 are isolated from the external air. Even if condensation occurs when the power module 3 dissipates heat, the condensation will not affect the safety of the second circuit board 2, ensuring that the power module 3 can dissipate heat efficiently, reducing the temperature rise of the power module 3, so as to downsize and select the power module 3, and reduce costs.

[0073] In the present application, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0074] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0075] It should be noted that all the directional indications in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture. If this specific posture changes, then the directional indications will also change accordingly.

[0076] In this application, unless otherwise clearly defined or limited, terms such as "connection" and "fixation" shall be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0077] In addition, in this application, descriptions such as "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of this application, the meaning of "a plurality" is two or more, unless otherwise clearly and specifically defined.

[0078] In the description of this specification, descriptions with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0079] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0080] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of this application. The scope of this application is defined by the claims and their equivalents.

Claims

1. An electronic control device, characterized in that, The electric control device includes: A first circuit board; A second circuit board, which is connected to the first circuit board, and a power module that needs to be cooled is provided on the second circuit board; A first electric control box, in which the first circuit board is provided; A second electric control box, in which the second circuit board is provided, and the second circuit board and the second electric control box form a sealed cavity.

2. The electronic control device according to claim 1, characterized in that, The electric control device further includes a radiator, which is provided on the power module and is used to cool the power module.

3. The electronic control device according to claim 2, characterized in that, The radiator includes a heat dissipation body and a flow channel provided inside the heat dissipation body, and the flow channel is used for the circulation of refrigerant. Wherein, when the power module is in a heat dissipation state, the temperature of the refrigerant flowing through the flow channel is lower than the ambient temperature of the second circuit board.

4. The electronic control device according to claim 1, wherein The electric control device further includes a three-phase bus capacitor, an absorption resistor, a sampling resistor and a control circuit provided on the second circuit board; The three-phase bus capacitor, the absorption resistor, the control circuit and the sampling resistor are respectively connected to the power module.

5. The electronic control device according to claim 1, characterized in that, A support part is provided in the second electric control box, and the support part is used to support the second circuit board; A target gap is formed between the second circuit board and the second electric control box, and the target gap and the upper surface of the second circuit board are filled with waterproof materials, wherein the power module is provided on the upper surface of the second circuit board.

6. The electronic control device according to claim 5, characterized in that, The second electric control box includes a box bottom and side walls surrounding the box bottom; The support part includes a support plate provided on the side wall, and the support plate contacts a target area of the second circuit board to support the second circuit board, and the target area is an area where the distance from the edge of the second circuit board is less than a threshold value.

7. The electronic control device according to claim 6, characterized in that, The support plate is integrally formed with the side wall.

8. The electronic control device according to claim 6, characterized in that, The first end of the side wall is connected to the box bottom, and the second end of the side wall expands to form a convex platform, and the support plate is located between the first end and the second end of the side wall.

9. The electronic control device according to claim 5, characterized in that The filling thickness of the waterproof material on the upper surface of the second circuit board is greater than or equal to 1 mm.

10. An air conditioner, characterized in that, The air conditioner includes the electric control device according to any one of claims 1-9.

Images