Leveling device and semiconductor processing equipment

Through the coordinated design of differential adjusting parts, fixed blocks and connectors, the accuracy and load capacity of the heater and shower head parallelism adjustment in semiconductor processing equipment is solved, and a high-precision and low-cost adjustment effect is achieved.

CN223079081UActive Publication Date: 2025-07-08ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Application Number
CN202422119467.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-29
Publication Date
2025-07-08
Estimated Expiration
2034-08-29

AI Technical Summary

Technical Problem

The existing leveling mechanism cannot meet the high-precision parallelism adjustment requirements between the heater and the showerhead in the semiconductor processing equipment, and there are problems such as weak load capacity, short service life and high processing costs.

Method used

Differential adjusting parts are adopted, and the horizontal adjustment of the heater is adjusted through the matching of differential bolts and differential nuts, combined with the design of the fixing blocks and connectors, to prevent the heater from being offset, and to improve the adjustment accuracy and load capacity.

Benefits of technology

High-precision parallelism adjustment between the heater and the shower head is realized, ensuring uniform distribution of process gases, improving adjustment accuracy and load capacity, and reducing processing costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a leveling device and semiconductor processing equipment, and the leveling device comprises a differential adjusting part which is fixed between a supporting plate and a heater, and is used for adjusting the levelness of the top of the heater through the cooperation of a discrete differential bolt and a differential nut; the fixing block is arranged on the supporting plate, abuts against the heater and is used for providing thrust for the heater; the connecting piece is adjustably and fixedly connected with the fixing block and the heater and used for providing pulling force for the heater; and the pulling force and the pushing force are opposite in direction, so that the heater does not deviate when the levelness of the heater is adjusted. According to the utility model, the adjustment precision of the levelness of the heater can be improved, and the heater can be prevented from deviating when the levelness of the heater is adjusted.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor preparation, in particular to a leveling device and a semiconductor processing equipment. Background Art

[0002] In a semiconductor processing equipment, a base and a shower head are arranged oppositely inside a reaction chamber, and a heater for carrying and heating a wafer is usually arranged on the base; wherein, the parallelism between the carrying surface of the heater carrying the wafer and the shower head has a great influence on the process result, so a leveling mechanism is needed to accurately adjust the parallelism between the carrying surface of the heater and the shower head.

[0003] In the prior art, the leveling mechanism usually includes a coarse-thread mechanism and a fine-thread mechanism; due to the large pitch of the coarse-thread mechanism, its adjustment accuracy cannot meet the process requirements; although the adjustment accuracy of the fine-thread mechanism can meet the process requirements, its load capacity is weak, its service life is short and its processing cost is high. In addition, when the parallelism between the carrying surface of the heater and the shower head is adjusted by using the existing leveling mechanism, the heater will also shift, affecting the adjustment accuracy. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a leveling device and a semiconductor processing equipment, which can improve the adjustment accuracy of the levelness of the heater and can also prevent the heater from shifting when adjusting the levelness of the heater.

[0005] In order to achieve the above purpose, the utility model is realized by the following technical solutions:

[0006] A leveling device is applied to a semiconductor processing equipment; the semiconductor processing equipment includes a reaction chamber, and a base and a heater are arranged inside the reaction chamber; the base includes a support plate for carrying the heater; the leveling device includes:

[0007] A differential adjusting member is fixed between the support plate and the heater, and the levelness of the top of the heater is adjusted by a discrete differential bolt cooperating with a differential nut;

[0008] A fixing block is arranged on the support plate and abuts against the heater for providing a thrust force to the heater;

[0009] A connecting member is adjustably and fixedly connected with the fixing block and the heater for providing a pulling force to the heater; and the directions of the pulling force and the thrust force are opposite to prevent the heater from shifting when adjusting the levelness of the heater.

[0010] Optionally, the fixing block includes a horizontal portion fixedly connected with the support plate and a vertical portion extending upward along the outer edge of the horizontal portion;

[0011] The vertical part contacts and abuts against the chassis of the heater, or the vertical part abuts against the chassis of the heater through a pushing member.

[0012] Optionally, the pushing member is a protruding portion, and the protruding portion is fixed on the side surface of the vertical part facing the heater and abuts against the chassis of the heater.

[0013] Optionally, a first through hole is provided on the vertical part, and the pushing member passes through the first through hole and abuts against the chassis of the heater.

[0014] Optionally, the first through hole is a threaded hole, and the pushing member is a screw rod or a bolt.

[0015] Optionally, a second through hole is provided on the vertical part, a connection hole is provided in the chassis of the heater, and the connecting member passes through the second through hole and is fixed in the connection hole.

[0016] Optionally, the connection hole is a threaded hole, and the connecting member is a bolt.

[0017] Optionally, the connection hole is a blind hole.

[0018] Optionally, a third through hole is provided on the support plate, and a first internal thread is provided on the side wall of the third through hole; a first external thread is provided on the outer side wall of the differential nut, and the first external thread and the first internal thread form a first thread pair.

[0019] Optionally, a second internal thread is provided on the inner side wall of the differential nut, a second external thread is provided on the outer side wall of the differential bolt, and the second external thread and the second internal thread form a second thread pair.

[0020] Optionally, the pitch of the first thread pair is not less than the pitch of the second thread pair.

[0021] Optionally, the leveling device further includes: a first locking nut, sleeved on the outer side wall of the differential nut, for locking the differential nut on the support plate so that the differential bolt rotates independently.

[0022] Optionally, the leveling device further includes: a second locking nut, sleeved on the outer side wall of the differential bolt, located below the differential nut, for locking the differential bolt on the differential nut so that the differential nut and the differential bolt rotate synchronously.

[0023] Optionally, the length of the differential bolt is greater than the sum of the lengths of the differential nut and the second locking nut.

[0024] Optionally, the differential bolt and the heater are connected by a spherical bearing.

[0025] Optionally, the number of the differential nuts and the differential bolts is the same and at least three.

[0026] Optionally, the differential nuts are evenly distributed on the support plate.

[0027] On the other hand, the present invention further provides a semiconductor processing apparatus, including:

[0028] A reaction chamber;

[0029] A base disposed at the inner bottom of the reaction chamber;

[0030] A heater disposed on the base for carrying and heating a wafer; and

[0031] The leveling device as described above.

[0032] The present invention has at least one of the following advantages:

[0033] For the leveling device and the semiconductor processing apparatus provided by the present invention, in the differential adjustment member, the differential bolt and the differential nut cooperate with each other, so that the levelness of the top of the heater can be adjusted and the adjustment accuracy can be improved. In addition, the cooperation of the differential bolt and the differential nut can also improve the load capacity of the differential adjustment member and reduce the processing cost of the differential adjustment member.

[0034] In the present invention, the fixing block can provide a thrust force to the heater, and the connecting member can provide a pulling force opposite to the thrust force to the heater. Then, through the cooperation of the fixing block and the connecting member, the force balance of the heater can be ensured, so that when the levelness of the heater is adjusted, the heater is radially tensioned and limited, and the position and levelness can be finely adjusted by tensioning, thereby ensuring the adjustment accuracy of the levelness of the heater.

[0035] In the present invention, the connecting member is adjustably and fixedly connected to the fixing block and the heater. In this way, when the levelness of the heater is adjusted, the connecting member fixed in the heater can move on the fixing block after being stressed, so that while the connecting member provides a pulling force to the heater, it does not prevent the heater from lifting in the vertical direction, and thus does not prevent the adjustment of the levelness of the heater. Description of the Drawings

[0036] Figure 1 is a perspective schematic diagram of a base, a heater and a leveling device provided by an embodiment of the present invention;

[0037] Figure 2 is a top view of a support plate in a base provided by an embodiment of the present invention;

[0038] Figure 3 is a three-dimensional schematic diagram of a differential adjusting member in a leveling device provided by an embodiment of the present invention;

[0039] Figure 4 is a cross-sectional schematic diagram of a differential adjusting member in a leveling device provided by an embodiment of the present invention;

[0040] Figure 5 is a schematic diagram when a differential nut and a differential bolt in a leveling device provided by an embodiment of the present invention rotate synchronously as a whole;

[0041] Figure 6 is a schematic diagram when the differential bolt rotates alone in a leveling device provided by an embodiment of the present invention;

[0042] Figure 7 is a schematic diagram when the differential nut rotates in a leveling device provided by an embodiment of the present invention;

[0043] Figure 8 is a three-dimensional schematic diagram of a fixing block and a connecting member in a leveling device provided by an embodiment of the present invention;

[0044] Figure 9 is a top view of a fixing block and a connecting member in a leveling device provided by an embodiment of the present invention;

[0045] Figure 10 is an enlarged schematic diagram of a fixing block in a leveling device provided by an embodiment of the present invention;

[0046] Figure 11 is a cross-sectional schematic diagram of a fixing block and a connecting member in a leveling device provided by an embodiment of the present invention. Detailed Embodiment

[0047] The following further elaborates on a leveling device and a semiconductor processing apparatus proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and all use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features, and advantages of the present invention more obvious and understandable, please refer to the accompanying drawings. It should be noted that the structures, scales, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have a technical essence. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.

[0048] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the said element.

[0049] Combined with the attached Figures 1 to 11 As shown in the figure, this embodiment provides a leveling device, which is applied to a semiconductor processing device; the semiconductor processing device includes a reaction chamber (not shown in the figure), and a base 110 and a heater 120 are provided in the reaction chamber; the base 110 includes a support plate 1120 for carrying the heater 120 and a vertical plate 1110 fixedly connected to the support plate 1120, and the vertical plate 1110 is fixed to the inner bottom of the reaction chamber; the heater 120 is arranged on the support plate 1120 for carrying and heating a wafer (not shown in the figure).

[0050] The leveling device includes: a differential adjustment member 210, a fixed block 220 and a connecting member 230; the differential adjustment member 210 is fixed between the support plate 1120 and the heater 120; the differential adjustment member 210 includes a differential bolt 2120 (as Figure 3 shown) and a differential nut 2110 (as Figure 3 shown), and the level of the top 1210 of the heater 120 is adjusted by the discrete differential bolt 2120 cooperating with the differential nut 2110. The fixed block 220 is arranged on the support plate 1120 and abuts against the heater 120 for providing a thrust force to the heater 120. The connecting member 230 is adjustably and fixedly connected to the fixed block 220 and the heater 120 for providing a pulling force to the heater 120; and the directions of the pulling force and the thrust force are opposite to prevent the heater 120 from shifting when adjusting the level of the heater 120.

[0051] Specifically, a showerhead (not shown in the figure) is provided at the top of the reaction chamber for introducing process gas into the reaction chamber to perform a process on the wafer; and the showerhead is disposed opposite to the susceptor 110. In this embodiment, through the cooperation of the differential bolt 2120 and the differential nut 2110 in the differential adjusting member 210, the levelness of the top 1210 of the heater 120 can be adjusted and the adjustment accuracy can be improved, so as to accurately adjust the parallelism between the heater 120 and the showerhead, and further enable the process gas to be evenly distributed on the wafer, so that the process result of the wafer meets the requirements. In addition, the cooperation of the differential bolt 2120 and the differential nut 2110 can also improve the load capacity and service life of the differential adjusting member 210 and reduce the processing cost of the differential adjusting member 210.

[0052] More specifically, a first mounting hole 1122 (as Figure 2 shown) is provided on the support plate 1120, and the heater 120 is connected to an electronic control unit (not shown) below the support plate 1120 through the first mounting hole 1122.

[0053] Further, in this embodiment, the fixed block 220 in the leveling device can provide a thrust to the heater 120, and the connecting member 230 can provide a pulling force opposite to this thrust to the heater 120. Then, through the cooperation of the fixed block 220 and the connecting member 230, the force balance of the heater 120 can be ensured, so as to prevent the heater 120 from shifting when adjusting the levelness of the heater 120, and further ensure the adjustment accuracy of the levelness of the heater 120.

[0054] In addition, the connecting member 230 is adjustably and fixedly connected to the fixed block 220 and the heater 120. In this way, when adjusting the levelness of the heater 120, the connecting member 230 fixed in the heater 120 can move on the fixed block 220 after being stressed, so that while the connecting member 230 provides a pulling force to the heater 120, it does not prevent the heater 120 from lifting in the vertical direction, and further does not prevent the adjustment of the levelness of the heater 120.

[0055] Please continue to refer to Figure 2 and Figure 3, the number of the differential nuts 2110 and the differential bolts 2120 is the same and at least 3, so as to adjust the levelness of the heater 120 in multiple directions, thereby ensuring the adjustment efficiency and accuracy of the levelness of the heater 120. Optionally, the differential nuts 2110 are evenly distributed on the support plate 1120. Optionally, the differential bolts 2120 and the heater 120 are connected by spherical bearings (not shown in the figure) to further prevent the heater 120 from shifting when adjusting the levelness of the heater 120, but the present invention is not limited thereto.

[0056] Please continue to refer to Figures 2 to 7 , a third through hole 1121 is provided on the support plate 1120, and a first internal thread is provided on the side wall of the third through hole 1121; a first external thread is provided on the outer side wall of the differential nut 2110, and the first external thread and the first internal thread form a first thread pair. A second internal thread is provided on the inner side wall of the differential nut 2110, and a second external thread is provided on the outer side wall of the differential bolt 2120, and the second external thread and the second internal thread form a second thread pair, and the threads of the second thread pair and the first thread pair have the same helix direction.

[0057] Specifically, the pitch of the first thread pair is not less than the pitch of the second thread pair, so that the levelness of the top 1210 of the heater 120 can be adjusted in three adjustment modes by the cooperation of the differential bolt 2120 and the differential nut 2110.

[0058] Among them, as Figure 5 shown, the first adjustment mode is: locking the differential bolt 2120 on the differential nut 2110 to make the differential nut 2110 and the differential bolt 2120 rotate synchronously as a whole. In the first adjustment mode, when the differential nut 2110 and the differential bolt 2120 rotate as a whole for one circle, the heater 120 can be raised or lowered by a first distance, and the first distance is the pitch of the first thread pair, thereby realizing the coarse adjustment of the levelness of the heater 120.

[0059] Further, as Figure 5As shown in the figure, when adjusting the levelness of the heater 120 by using the first adjustment mode, the leveling device further includes: a second locking nut 260, sleeved on the outer side wall of the differential bolt 2120, located below the differential nut 2110, and used for locking the differential bolt 2120 on the differential nut 2110, so that the differential nut 2110 and the differential bolt 2120 rotate synchronously as a whole. Optionally, the length of the differential bolt 2120 is greater than the sum of the lengths of the differential nut 2110 and the second locking nut 260, so that the setting of the second locking nut 260 will not affect the rise or fall of the heater 120.

[0060] As Figure 6 shown in the figure, the second adjustment mode is: locking the differential nut 2110 on the support plate 1120 and rotating the differential bolt 2120 alone. In the second adjustment mode, when the differential bolt 2120 rotates one circle, the heater 120 can rise or fall by a second distance, and the second distance is the pitch of the second thread pair, so as to realize the coarse adjustment of the levelness of the heater 120.

[0061] Further, as Figure 6 shown in the figure, when adjusting the levelness of the heater 120 by using the second adjustment mode, the leveling device further includes: a first locking nut 250, sleeved on the outer side wall of the differential nut 2110, and used for locking the differential nut 2110 on the support plate 1120, so that the differential bolt 2120 rotates alone.

[0062] As Figure 7 shown in the figure, the third adjustment mode is: rotating the differential nut 2110, and based on the differential principle, the differential bolt 2120 rotates relative to the differential nut 2110. In the third adjustment mode, when the differential nut 2110 rotates one circle, the heater 120 can rise or fall by a third distance, and the third distance is the difference between the pitch of the first thread pair and the pitch of the second thread pair, so as to realize the fine adjustment of the levelness of the heater 120. Optionally, the difference between the pitch of the first thread pair and the pitch of the second thread pair is 0.5 mm to 1 mm, but the present invention is not limited thereto.

[0063] In addition, both the first locking nut 250 and the second locking nut 260 are detachable, so that the user can flexibly select one or any combination of the first adjustment mode, the second adjustment mode, and the third adjustment mode according to the adjustment requirements to adjust the levelness of the heater 120, thereby improving both the adjustment efficiency and the adjustment accuracy of the levelness of the heater 120.

[0064] Please continue to refer to Figures 8 to 11 , the fixing block 220 includes a horizontal portion 2210 fixedly connected to the support plate 1120 and a vertical portion 2220 extending upward along the outer edge of the horizontal portion 2210. A second mounting hole 2212 is provided on the horizontal portion 2210, and the horizontal portion 2210 can be fixed to the support plate 1120 through the second mounting hole 2212 and a fastener (not shown in the figure) matching the second mounting hole 2212, thereby fixing the fixing block 220 to the support plate 1120.

[0065] In some embodiments, the vertical portion 2220 contacts and abuts against the chassis 1220 of the heater 120, so that the vertical portion 2220 directly provides a thrust force to the heater 120. In other embodiments, the vertical portion 2220 abuts against the chassis 1220 of the heater 120 through a thrust member 240, so that the vertical portion 2220 provides a thrust force to the heater 120 through the thrust member 240.

[0066] Specifically, in this embodiment, a first through hole (not shown in the figure) is provided on the vertical portion 2220, and the thrust member 240 passes through the first through hole and abuts against the chassis 1220 of the heater 120; in this case, by controlling the length of the thrust member 240 passing through the first through hole, it is possible to control whether the thrust member 240 abuts against the heater 120, and the operation is relatively convenient. Optionally, the first through hole is a threaded hole, and the thrust member 240 is a screw or a bolt to facilitate adjusting the length of the thrust member 240 passing through the first through hole, but the present invention is not limited thereto.

[0067] In other embodiments, when the vertical portion 2220 abuts against the chassis 1220 of the heater 120 through the thrust member 240, the thrust member 240 can also be a protruding portion, and the protruding portion is fixed on the side surface of the vertical portion 2220 facing the heater 120 and abuts against the chassis 1220 of the heater 120. Optionally, the protruding portion is integrally provided with the vertical portion 2220, but the present invention is not limited thereto.

[0068] Please continue to refer to Figures 8 to 11, a second through hole 2221 is provided on the vertical portion 2220, and a connection hole 1221 is provided in the chassis 1220 of the heater 120 (as Figure 11 shown); the connecting member 230 passes through the second through hole 2221 and is fixed in the connection hole 1221 to provide a pulling force to the heater 120.

[0069] Specifically, the aperture of the second through hole 2221 is larger than the diameter of the connection hole 1221 and smaller than the diameter of the end of the connecting member 230, so that the connecting member 130 can not only be fixed in the connection hole 1221 to provide a pulling force to the heater 120, but also move in the second through hole 2221, thereby realizing the adjustable fixed connection between the connecting member 230, the fixed block 220 and the heater 120; in this way, when the differential adjusting member 210 is used to adjust the levelness of the heater 120, the connecting member 230 fixed in the connection hole 1221 can move in the second through hole 2221 after being stressed, so that while the connecting member 230 provides a pulling force to the heater 120, it does not prevent the heater 120 from rising and falling in the vertical direction, and thus does not prevent the adjustment of the levelness of the heater 120.

[0070] Specifically, the connection hole 1221 is a blind hole to ensure the bearing strength of the chassis 1220 of the heater 120 while fixing the connecting member 230. Optionally, the connection hole 1221 is a threaded hole, and the connecting member 230 is a bolt. At this time, the aperture of the second through hole 2221 is larger than the diameter of the screw of the bolt, that is, the aperture of the connection hole 1221, and the aperture of the second through hole 2221 is smaller than the head of the bolt, that is, the diameter of the end of the connecting member 230, so that the bolt can not only provide a pulling force to the heater 120, but also move in the second through hole 2221. Optionally, the second through hole 2221 is an oval hole, but the present invention is not limited thereto.

[0071] On the other hand, this embodiment also provides a semiconductor processing apparatus, including: a reaction chamber (not shown in the figure); a susceptor 110 disposed at the inner bottom of the reaction chamber; a heater 120 disposed on the susceptor 110 for carrying and heating a wafer (not shown in the figure); and a leveling device as described above.

[0072] In summary, this embodiment provides a leveling device and a semiconductor processing apparatus. The leveling device includes a differential adjustment member, a fixed block, and a connecting member. In the differential adjustment member, a differential bolt and a differential nut cooperate with each other to adjust the levelness of the top of the heater and improve the adjustment accuracy. In addition, the combined use of the differential bolt and the differential nut can also improve the load capacity of the differential adjustment member and reduce the processing cost of the differential adjustment member. In this embodiment, the fixed block can provide a thrust force to the heater, and the connecting member can provide a pulling force opposite to the thrust force to the heater. Then, through the cooperation of the fixed block and the connecting member, the force balance of the heater can be ensured, so as to prevent the heater from shifting when adjusting the levelness of the heater, and further ensure the adjustment accuracy of the levelness of the heater. The connecting member is adjustably and fixedly connected to the fixed block and the heater. In this way, when adjusting the levelness of the heater, the connecting member fixed in the heater can move on the fixed block after being stressed, so that while the connecting member provides a pulling force to the heater, it does not prevent the heater from lifting in the vertical direction, and further does not prevent the adjustment of the levelness of the heater.

[0073] Although the content of the present utility model has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be construed as a limitation of the present utility model. After those skilled in the art have read the above content, various modifications and substitutions to the present utility model will be obvious. Therefore, the protection scope of the present utility model should be defined by the appended claims.

Claims

1. A leveling device is applied to a semiconductor processing apparatus; the semiconductor processing apparatus includes a reaction chamber, and a susceptor and a heater are disposed in the reaction chamber; Characterized in that, The susceptor includes a support plate for carrying the heater; the leveling device includes: A differential adjusting member is fixed between the support plate and the heater, and the level of the top of the heater is adjusted by discrete differential bolts cooperating with differential nuts; A fixing block is disposed on the support plate and abuts against the heater for providing a thrust force to the heater; A connecting member is adjustably and fixedly connected to the fixing block and the heater for providing a pulling force to the heater; and the directions of the pulling force and the thrust force are opposite to prevent the heater from shifting when adjusting the level of the heater.

2. The leveling device according to claim 1, wherein The fixing block includes a horizontal portion fixedly connected to the support plate and a vertical portion extending upward along the outer edge of the horizontal portion; The vertical portion contacts and abuts against the chassis of the heater, or the vertical portion abuts against the chassis of the heater through a pushing member.

3. The leveling device according to claim 2, wherein, The pushing member is a protruding portion, and the protruding portion is fixed on the side of the vertical portion facing the heater and abuts against the chassis of the heater.

4. The leveling device according to claim 2, characterized in that, A first through hole is provided on the vertical portion, and the pushing member passes through the first through hole and abuts against the chassis of the heater.

5. The leveling device according to claim 4, wherein The first through hole is a threaded hole, and the pushing member is a screw or a bolt.

6. The leveling device according to claim 2, characterized in that, A second through hole is provided on the vertical portion, and a connecting hole is provided in the chassis of the heater, and the connecting member passes through the second through hole and is fixed in the connecting hole.

7. The leveling device according to claim 6, characterized in that The connecting hole is a threaded hole, and the connecting member is a bolt.

8. The leveling device according to claim 6 or 7, characterized in that The connecting hole is a blind hole.

9. The leveling device according to claim 1, characterized in that A third through hole is provided on the support plate, and a first internal thread is provided on the side wall of the third through hole; a first external thread is provided on the outer side wall of the differential nut, and the first external thread and the first internal thread form a first thread pair.

10. The leveling device according to claim 9, characterized in that, A second internal thread is provided on the inner side wall of the differential nut, and a second external thread is provided on the outer side wall of the differential bolt, and the second external thread and the second internal thread form a second thread pair.

11. The leveling device according to claim 10, wherein, The pitch of the first thread pair is not less than the pitch of the second thread pair.

12. The leveling device according to claim 1, wherein It further includes: A first locking nut is sleeved on the outer side wall of the differential nut for locking the differential nut on the support plate so that the differential bolt rotates independently.

13. The leveling device according to claim 1, wherein It further includes: A second locking nut is sleeved on the outer side wall of the differential bolt and is located below the differential nut for locking the differential bolt on the differential nut so that the differential nut and the differential bolt rotate synchronously.

14. The leveling device according to claim 13, wherein The length of the differential bolt is greater than the sum of the lengths of the differential nut and the second locking nut.

15. The leveling device according to claim 1, characterized in that The differential bolt is connected to the heater through a spherical bearing.

16. The leveling device according to claim 1, characterized in that, The number of the differential nuts and the differential bolts is the same and is at least 3.

17. The leveling device according to claim 16, wherein, The differential nuts are evenly distributed on the support plate.

18. A semiconductor processing apparatus, characterized in that, It includes: A reaction chamber; A susceptor disposed at the inner bottom of the reaction chamber; A heater disposed on the susceptor for carrying and heating a wafer; And The leveling device according to any one of claims 1 to 17.