Chip overturning, positioning and centering mechanism

Abstract

The utility model discloses a chip overturning, positioning and centering mechanism, and relates to the technical field of conductor packaging and testing. The device comprises a base, an X-direction supporting plate capable of moving in the Y direction is installed on the base through a Y-direction moving assembly, a supporting plate capable of moving in the X direction is installed on the X-direction supporting plate through an X-direction moving assembly, and a chip tray rotating mechanism, a chip X-direction positioning mechanism, a chip Y-direction positioning mechanism and a turnover mechanism are installed on the supporting plate. The chip centering and overturning mechanism is small in size, high in flexibility, capable of simultaneously completing two actions of positioning, centering and overturning a chip, and high in efficiency; the push rod pushes the chip to move forwards and backwards, a sensor is arranged behind the push rod, once the push rod moves backwards to a certain position, the force of the push rod reaches a set value, and at the moment, the sensor gives an alarm and stops moving, so that the chip is prevented from being damaged by continuous forward movement; the positioning position and angle can be controlled through a servo motor, and the device is suitable for various products.

Description

Technical Field

[0001] The utility model belongs to the technical field of conductor packaging and testing, and particularly relates to a chip flipping, positioning and centering mechanism. Background Technique

[0002] Before being put on the market, chips need to be strictly tested and sorted. At present, an automatic chip test sorter is mostly used. For automated test sorting, the position of the chip needs to be accurate during the transfer process to facilitate the grasping and transfer by an automated manipulator. Therefore, it is necessary to position, center and correct the angle of the chip. And since the chip has two sides, a flipping action is also involved during centering.

[0003] In the prior art, such as a magnetically controlled self-centering chip wafer cleaning robot disclosed in CN110993553A and a magnetically controlled self-centering chip wafer manipulator disclosed in CN110957253A, both of them only have the function of clamping and cannot perform chip flipping, positioning and centering, as well as horizontal and vertical movement, thus affecting the subsequent fully automated test sorting process and procedures. Therefore, in view of the above problems, a chip flipping, positioning and centering mechanism is proposed. Summary of the Utility Model

[0004] The utility model provides a chip flipping, positioning and centering mechanism, which can flip the chip by 180°, and can position and center the chip after flipping. The mechanism for angle correction enables the flipping action of the flipped chip and the positioning and centering action to be carried out synchronously, with high efficiency and accurate chip positioning and centering. It can be applied to a fully automated chip test sorter. In summary, the problems in the background technique are solved.

[0005] To solve the above technical problems, the utility model is realized through the following technical solutions:

[0006] A chip flipping, positioning and centering mechanism of the utility model includes a base. An X-direction support plate capable of moving in the Y direction is installed on the base through a Y-direction moving component. A support plate capable of moving in the X direction is installed on the X-direction support plate through an X-direction moving component. A chip tray rotating mechanism, a chip X-direction positioning mechanism, a chip Y-direction positioning mechanism and a flipping mechanism are installed on the support plate.

[0007] The flipping mechanism includes a first cylinder hingedly mounted on the support plate, a cylinder connection block connected to the top lifting end of the first cylinder, a reversing block hingedly connected to the front end of the cylinder connection block through a reversing shaft, a rotating shaft connected to the top of the reversing block, a rotating shaft sleeve and a first rotating shaft sleeve sleeved on the rotating shaft. The rotating shaft sleeve passes through the first rotating shaft sleeve and its top is connected to the flipping support plate. The reversing block is driven to perform a cycloid motion by the linear motion of the first cylinder. A second cylinder is vertically installed on the support plate, and a limiting guide rail is vertically installed on the support plate through a flipping mechanism guide rail seat. The first rotating shaft sleeve is slidably fitted on the limiting guide rail through a flipping mechanism slider. A rotating positioning stopper support is installed on the side of the first rotating shaft sleeve. The top lifting end of the second cylinder is connected to a cylinder connecting plate on the rotating positioning stopper support through a cylinder connecting shaft. A rotating positioning stopper for limiting and blocking the flipping support plate is installed on the rotating positioning stopper support.

[0008] A first motor and a rotating shaft seat are installed on the flipping support plate. The first motor is connected to a first rotating shaft output from the rotating shaft seat through a first coupling. The front end of the first rotating shaft is a hollow tube structure with a first vacuum extraction inlet at the front and a sunken plane with first suction nozzle holes for carrying the chip on the surface.

[0009] The chip tray rotating mechanism includes a second motor at the bottom of the support plate, a second rotating shaft sleeve installed and fixed on the support plate by a support frame, a second rotating shaft arranged in the second rotating shaft sleeve, a positioning disk installed at the top of the second rotating shaft with a chip sunken bearing surface, second suction nozzle holes arranged on the chip sunken bearing surface, and a second vacuum extraction inlet connected to the second suction nozzle hole channel in the positioning disk.

[0010] The chip X-direction positioning mechanism includes a positioning support base (49) vertically installed on the support plate, a third cylinder horizontally installed on the top of the positioning support base, an L-shaped cylinder push seat installed on the top lifting end of the third cylinder, and a positioning seat installed on the L-shaped cylinder push seat. A positioning push rod is installed on the positioning seat through a spring.

[0011] The chip Y-direction positioning mechanism has the same structure as the chip X-direction positioning mechanism, and the chip X-direction positioning mechanism, the chip Y-direction positioning mechanism and the flipping mechanism are arranged around the chip tray rotating mechanism.

[0012] Furthermore, the Y-direction moving component includes a Y-direction guide rail arranged on the base, a Y-direction guide rail slider slidably fitted on the Y-direction guide rail. The X-direction support plate is driven to perform Y-direction movement by the cooperation between the bottom of the X-direction support plate and the ball nut of the first ball screw mechanism. The first ball screw mechanism is driven by a Y-direction motor.

[0013] Further, a Y-direction photoelectric sensor is fixedly installed on the side of the base, and the Y-direction photoelectric sensor is matched with the Y-direction photoelectric sensor trigger on the side of the X-direction support plate.

[0014] Further, the X-direction moving assembly includes an X-direction guide rail arranged on the X-direction support plate and an X-direction guide rail slider slidably fitted on the X-direction guide rail. The support plate is driven to move in the X direction by the cooperation of the bottom of the support plate and the ball nut of the second ball screw mechanism; the second ball screw mechanism is driven by an X-direction motor.

[0015] Further, an X-direction photoelectric sensor is fixedly installed on the side of the X-direction support plate, and the X-direction photoelectric sensor is matched with the X-direction photoelectric sensor trigger on the side of the support plate.

[0016] Further, a pressure sensor for detecting the thrust of the positioning push rod is installed at the rear of the positioning seat.

[0017] The utility model has the following beneficial effects compared with the prior art:

[0018] (1) The mechanism has a small volume and high flexibility, and can simultaneously complete two actions of chip positioning and centering and flipping, with high efficiency;

[0019] (2) It does not damage the chip: the push rod pushes the chip forward, and the push rod moves backward. There is a sensor behind the push rod. Once the push rod moves backward to a certain position, it means that the push rod force has reached the set value. At this time, the sensor will alarm and stop moving to avoid damaging the chip by continuing to move forward; by adding a pressure sensor, the chip is protected from damage during the positioning process. The time to complete the positioning, centering and flipping actions is about 3 seconds; installing a sensor can prevent excessive thrust from damaging the chip during the positioning process, protect the chip, and reduce losses;

[0020] (3) The positioning position and angle can be controlled by a servo motor, which is applicable to a variety of products.

[0021] Of course, it is not necessary for any product implementing the utility model to achieve all the above advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a structural schematic diagram of a chip flipping, positioning and centering mechanism of the present utility model;

[0024] Figure 2 is Figure 1 the front view of the structure of

[0025] Figure 3 is Figure 1 the schematic diagram of the structure of the flipping mechanism in

[0026] Figure 4 is Figure 3 the right view of the structure of

[0027] Figure 5 is Figure 3 the front view of the structure of

[0028] Figure 6 the schematic diagram of the structure of the chip tray rotating mechanism;

[0029] Figure 7 the schematic diagram of the structure of the X-direction moving component;

[0030] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0031] 1 - Base, 2 - Support plate, 3 - Chip tray rotating mechanism, 4 - Chip X-direction positioning mechanism, 5 - Chip Y-direction positioning mechanism, 6 - Flipping mechanism, 7 - X-direction moving component, 8 - Y-direction moving component, 9 - Y-direction guide rail, 10 - Y-direction guide rail slider, 11 - First ball screw mechanism, 12 - X-direction photoelectric sensor trigger, 13 - X-direction photoelectric sensor, 14 - X-direction motor, 15 - X-direction guide rail slider, 16 - X-direction guide rail, 17 - X-direction support plate, 18 - Y-direction photoelectric sensor trigger, 19 - Y-direction photoelectric sensor, 20 - First suction nozzle hole, 21 - First rotating shaft, 22 - First vacuum connection port, 23 - First coupling, 24 - First motor, 25 - Second cylinder, 26 - Rotating positioning block, 27 - Commutating shaft, 28 - First cylinder, 29 - Cylinder connection block, 30 - First rotating shaft sleeve, 31 - Flipping support plate, 33 - Rotating positioning block support, 34 - Rotating shaft sleeve, 35 - Rotating shaft, 36 - Commutating block, 37 - Cylinder connection plate, 38 - Limit guide rail, 39 - Flipping mechanism slider, 40 - Flipping mechanism guide rail seat, 41 - Cylinder connection shaft, 42 - Second motor, 43 - Support frame, 44 - Second rotating shaft sleeve, 45 - Second rotating shaft, 46 - Second vacuum connection port, 47 - Positioning disk, 48 - Second suction nozzle hole, 49 - Positioning support seat, 50 - Third cylinder, 51 - L-shaped cylinder push seat, 52 - Positioning seat, 53 - Pressure sensor, 54 - Spring, 55 - Positioning push rod. Detailed implementation method

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present utility model.

[0033] In the description of the present utility model, it should be understood that the terms "X direction", "Y direction", "top", "lifting head end", "sinking bearing surface", "side part", etc. indicating the orientation or position relationship are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0034] Please refer to Figures 1-7 As shown in the figure, a chip flipping, positioning and centering mechanism of the present utility model includes a base 1. An X-direction support plate 17 capable of moving in the Y direction is installed on the base 1 through a Y-direction moving component 8. A support plate 2 capable of moving in the X direction is installed on the X-direction support plate 17 through an X-direction moving component 7. A chip tray rotating mechanism 3, a chip X-direction positioning mechanism 4, a chip Y-direction positioning mechanism 5 and a flipping mechanism 6 are installed on the support plate 2;

[0035] The flipping mechanism 6 includes a first cylinder 28 hingedly installed on the support plate 2, a cylinder connection block 29 connected to the lifting head end of the first cylinder (28), a reversing block 36 hingedly connected to the front end of the cylinder connection block 29 through a reversing shaft 27, a rotating shaft 35 connected to the top of the reversing block 36, a rotating shaft sleeve 34 and a first rotating shaft sleeve 30 sleeved on the rotating shaft 35. The rotating shaft sleeve 34 passes through the first rotating shaft sleeve 30 and the top is connected to a flipping support plate 31; the first cylinder 28 makes a linear motion to drive the reversing block 36 to make a cycloidal motion; a second cylinder 25 is vertically installed on the support plate 2, and a limiting guide rail 38 is vertically installed on the support plate 2 through a flipping mechanism guide rail seat 40. The first rotating shaft sleeve 30 is slidably fitted on the limiting guide rail 38 through a flipping mechanism slider 39; a rotating positioning block support 33 is installed on the side part of the first rotating shaft sleeve 30; the lifting head end of the second cylinder 25 is connected to a cylinder connection plate 37 on the rotating positioning block support 33 through a cylinder connection shaft 41, and a rotating positioning block 26 for limiting and blocking the flipping support plate 31 is installed on the rotating positioning block support 33;

[0036] A first motor 24 and a rotating shaft seat are installed on the flipping support plate 31. The first motor 24 is connected to a first rotating shaft 21 output from the rotating shaft seat through a first coupling 23. The front end of the first rotating shaft 21 is of a hollow tube structure, with a first vacuum extraction inlet 22 at the front part, and the surface is a sunken plane with first suction nozzle holes 20 for carrying the chip.

[0037] The chip tray rotating mechanism 3 includes a second motor 42 at the bottom of the support plate 2 and a second rotating shaft sleeve 44 installed and fixed on the support plate 2 by a support frame 43. A second rotating shaft 45 arranged in the second rotating shaft sleeve 44, a positioning disk 47 installed at the top end of the second rotating shaft 45 with a chip sunken bearing surface, second suction nozzle holes 48 arranged on the chip sunken bearing surface, and a second vacuum extraction inlet 46 connected to the channels of the second suction nozzle holes 48 in the positioning disk 47.

[0038] The chip X-direction positioning mechanism 4 includes a positioning support seat 49 vertically installed on the support plate 2, a third cylinder 50 horizontally installed on the top of the positioning support seat 49, an L-shaped cylinder push seat 51 installed at the jacking head end of the third cylinder 50, and a positioning seat 52 installed on the L-shaped cylinder push seat 51. A positioning push rod 55 is installed on the positioning seat 52 through a spring 54.

[0039] The chip Y-direction positioning mechanism 5 has the same structure as the chip X-direction positioning mechanism 4, and the chip X-direction positioning mechanism 4, the chip Y-direction positioning mechanism 5, and the flipping mechanism 6 are arranged around the chip tray rotating mechanism 3.

[0040] Among them, the Y-direction moving component 8 includes a Y-direction guide rail 9 arranged on the base 1 and a Y-direction guide rail slider 10 slidably matched with the Y-direction guide rail 9. The X-direction support plate 17 is driven to move in the Y direction by the cooperation between the bottom of the X-direction support plate 17 and the ball nut of the first ball screw mechanism 11, and the first ball screw mechanism 11 is driven by a Y-direction motor.

[0041] Among them, a Y-direction photoelectric sensor 19 is fixedly installed on the side of the base 1, and the Y-direction photoelectric sensor 19 is matched with a Y-direction photoelectric sensor trigger 18 on the side of the X-direction support plate 17.

[0042] Among them, the X-direction moving component 7 includes an X-direction guide rail 16 arranged on the X-direction support plate 17 and an X-direction guide rail slider 15 slidably matched with the X-direction guide rail 16. The support plate 2 is driven to move in the X direction by the cooperation between the bottom of the support plate 2 and the ball nut of the second ball screw mechanism; the second ball screw mechanism is driven by an X-direction motor 14.

[0043] Among them, an X-direction photoelectric sensor 13 is fixedly installed on the side of the X-direction support plate 17, and the X-direction photoelectric sensor 13 is matched with an X-direction photoelectric sensor trigger 12 on the side of the support plate 2.

[0044] Among them, a pressure sensor 53 for detecting the thrust of the positioning push rod 55 is installed at the rear of the positioning seat 52.

[0045] As Figure 2 shown, a Y-direction moving component 8 is installed above the base 1. The Y-direction moving component 8 includes a Y-direction guide rail 9, a Y-direction guide rail slider 10, a Y-direction ball screw 11, a Y-direction photoelectric sensor trigger 18, and a Y-direction photoelectric sensor 19. The Y-direction ball screw 11 is driven by a motor to drive the nut to move repeatedly along the ball screw track. The nut is connected to the X-direction support plate 17, driving the X-direction support plate to reciprocate along the Y-direction guide rail. The Y-direction photoelectric sensor 19 is fixed on the base. The Y-direction photoelectric sensor trigger 18 and the Y-direction photoelectric sensor 19 cooperate to determine the origin position of the Y-direction ball screw. An X-direction moving component 7 is installed above the X-direction support plate. The X-direction moving component 7 includes an X-direction photoelectric sensor trigger 12, an X-direction photoelectric sensor 13, an X-direction motor 14, an X-direction guide rail slider 15, and a Y-direction photoelectric sensor trigger 18. The Y-direction photoelectric sensor. The X-direction moving component 7 has the same principle as the Y-direction moving component 8. An upper support plate 2 is installed above the X-direction moving component, which can drive the components on the support plate 2 to reciprocate in the X direction. Using the Y-direction moving component 8 and the X-direction moving component 7 can make the entire flipping and positioning centering mechanism move in the X direction and the Y direction, and the position of the mechanism can be adjusted according to the adjustment of the machine, making this mechanism highly adaptable and widely applicable.

[0046] The flipping mechanism is as Figure 3 shown. A motor 24, a first coupling 23, a rotating shaft 21, and a first suction nozzle 20 are installed on the flipping support plate 31. The first rotating shaft 21 is connected to the first motor 24 through the first coupling 23. The rotation of the first motor 24 drives the rotation of the shaft. When a chip is received above the first suction nozzle 20, the first vacuum connection port 22 reduces the air pressure inside the suction nozzle 20, and the chip on the first suction nozzle 20 will be pressed by the atmospheric pressure. Then the first motor 24 rotates to rotate the first rotating shaft 21 by 180°.

[0047] As Figure 4As shown in the figure, a first rotating shaft sleeve 30, a rotating shaft sleeve 34, a rotating shaft 35, a reversing block 36, a reversing shaft 27, a first cylinder 28, and a cylinder connecting block 29 are installed below the flipping support plate 31. The first cylinder 28 is connected to the cylinder connecting block 29. The reversing shaft 27 is sleeved in the cylinder connecting block 29. When the first cylinder 28 makes a linear motion, the cylinder drives the cylinder connecting block 29 to make a linear motion. The reversing shaft 27 is sleeved in the cylinder connecting block 29, and the cylinder connecting block 29 is connected to the reversing block 36 through the reversing shaft 27 at a certain angle. When the cylinder 28 makes a linear motion, the cylinder connecting block 29 makes a linear motion, and the reversing shaft 27 sleeved in the cylinder connecting block 29 makes a cycloid motion. The reversing shaft 27 makes a swinging motion and is connected to the reversing block 36, driving the reversing block 36 to make a cycloid motion. Above the reversing block 36, a rotating shaft 35 is connected. The rotating shaft 35 is sleeved with a rotating shaft sleeve 34 and a first rotating shaft sleeve 30. The first rotating shaft sleeve 30 is connected to the flipping support plate 31. The linear motion of the cylinder 28 drives the reversing block 36 to make a cycloid motion, thereby causing the flipping support plate 31 to also make a cycloid motion. On the other side of the flipping support plate 31, a rotating positioning block support 33 is installed. A rotating positioning block 26 is installed at the upper end of the rotating positioning block support 33. When the flipping support plate 31 swings to a certain position, it contacts the rotating positioning block 26, and the rotating positioning block 26 stops the flipping support plate 31 from continuing to swing.

[0048] As Figure 5 shown, the first rotating shaft sleeve 30 is installed on the cylinder connecting plate 37. The cylinder connecting plate 37 is connected to the cylinder 25. The cylinder connecting plate 37 is installed on the flipping mechanism guide rail seat 40 through the flipping mechanism slider 39. The second cylinder 25 is connected to the cylinder connecting plate through the cylinder connecting shaft 41. When the second cylinder 25 reciprocates up and down, it drives the cylinder connecting plate to reciprocate up and down through the cylinder connecting shaft 41;

[0049] The chip tray rotating mechanism is as Figure 6 shown, and it includes a second motor 42, a support frame 43, a second rotating shaft sleeve 44, a second rotating shaft 45, a second vacuum inlet 46, a positioning disk 47, and a second suction nozzle 48. The second motor 42 is fixed below the support plate. The second motor 42 is connected to the second rotating shaft 45 through a coupling. The second rotating shaft sleeve 44 is coaxial with the second rotating shaft 45 and is installed on the support frame 43 to protect the rotating shaft. The positioning disk 47 is installed at the upper end of the second rotating shaft 45. The chip is rotated 180° and placed on the positioning disk for positioning. After positioning, the second suction nozzle 48 sucks the chip, and the second motor 42 starts to rotate. The positioning disk 47 is connected to the second motor 42 and rotates simultaneously with the second motor 42;

[0050] As Figure 7As shown in the figure, the chip X-axis direction positioning mechanism 4 is as shown in the figure, including a positioning support base 49, a third cylinder 50, a cylinder push seat 51, a positioning seat 52, a pressure sensor 53, a spring 54, and a positioning push rod 55. The third cylinder 50 is installed at the upper end of the positioning support base. The cylinder push seat 51 is connected to the third cylinder 50. The positioning seat 52 is installed above the cylinder push seat 51 and moves synchronously with the cylinder push seat 51. The linear motion of the third cylinder 50 drives the linear motion of the positioning seat 52. The positioning push rod 55 is installed at the center of the positioning seat 52. When the positioning push rod 55 follows the third cylinder 50 and moves forward to push the chip, the positioning push rod 55 moves in the opposite direction to the moving direction of the third cylinder 50 and moves towards the sensor direction. When the position of the positioning push rod 55 exceeds the sensor 53, the machine will alarm. When the third cylinder 50 returns, the cylinder push rod 55 returns to its original position through the spring force generated by the 54 spring. The structure of the chip Y-direction positioning mechanism 5 is exactly the same as the structure of the chip X-direction positioning mechanism 4.

[0051] A chip flipping, positioning and centering mechanism is applied to the semiconductor packaging and testing industry and the chip flipping, positioning and centering process. This device can be directly applied to the full-automatic test and sorting machine for this process.

[0052] Technical advantages include:

[0053] 1. The flipping and positioning and centering actions can be carried out synchronously, with high efficiency;

[0054] 2. The positioning position and angle can be controlled by a servo motor, which is applicable to a variety of products;

[0055] 3. Install a sensor to prevent excessive thrust during positioning from damaging the chip, protect the chip, and reduce losses.

[0056] The positioning and centering process is as follows:

[0057] The first step: Figure 5 In the second cylinder 25 pushes the flipping mechanism to move upward, and the chip falls on the suction nozzle, and the suction nozzle sucks the chip.

[0058] The second step: Figure 5 The cylinder drops, and the flipping mechanism returns to its original position.

[0059] The third step: Figure 4 In the first cylinder 28 pushes the flipping mechanism to perform a cycloid motion and stops swinging at the rotary positioning stop block 26. At this time, the chip swings with the rotating mechanism to above the chip tray rotating mechanism. While performing the cycloid motion, the first motor 24 in the flipping mechanism drives the rotating shaft 21 to rotate 180°.

[0060] The fourth step: The suction nozzle releases the chip, and the chip falls on the chip tray rotating mechanism to complete the flipping action.

[0061] Step 5: In the X-direction positioning mechanism of the chip, the positioning cylinder 50 pushes the positioning push rod 55 forward to push the chip to one side at the groove of the chip tray. In the Y-direction positioning mechanism of the chip, the positioning cylinder pushes the positioning push rod forward to push the chip to the other side at the tray groove, and the positions of the chip in the X and Y directions are fixed.

[0062] Step 6: Figure 6 The second suction nozzle 48 in it sucks the positioned chip, and the chip tray rotation mechanism starts to rotate. When it rotates to a certain angle, other suction cups on the machine suck away the chip after being flipped, positioned, and centered, completing the operation.

[0063] The principle of not damaging the chip is that the push rod pushes the chip forward, while the push rod moves backward. There is a sensor behind the push rod. Once the push rod moves backward to a certain position, it indicates that the force of the push rod has reached the set value. At this time, the sensor will alarm and stop the movement to prevent further forward movement from damaging the chip.

[0064] Compared with the prior art, the mechanism is small in volume and high in flexibility. It can simultaneously complete two actions of positioning, centering, and flipping the chip, with high efficiency. In addition, a sensor is added to protect the chip from being damaged during the positioning process. The time taken to complete the positioning, centering, and flipping actions is about 3 seconds.

[0065] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present invention, so that those skilled in the relevant technical field can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A chip flipping, positioning and centering mechanism, comprising a base (1), characterized in that, On the base (1), an X-direction support plate (17) capable of moving in the Y direction is installed through a Y-direction moving component (8). On the X-direction support plate (17), a support plate (2) capable of moving in the X direction is installed through an X-direction moving component (7). On the support plate (2), a chip tray rotating mechanism (3), a chip X-direction positioning mechanism (4), a chip Y-direction positioning mechanism (5), and a flipping mechanism (6) are installed; The flipping mechanism (6) includes a first cylinder (28) hingedly installed on the support plate (2), a cylinder connection block (29) connected to the lifting head end of the first cylinder (28), a reversing block (36) hingedly connected to the front end of the cylinder connection block (29) through a reversing shaft (27), a rotating shaft (35) connected to the top of the reversing block (36), a rotating shaft sleeve (34) and a first rotating shaft sleeve (30) sleeved on the rotating shaft (35). The rotating shaft sleeve (34) passes through the first rotating shaft sleeve (30) and is connected to the flipping support plate (31) at the top. The first cylinder (28) makes a linear motion to drive the reversing block (36) to make a cycloidal motion. A second cylinder (25) is vertically installed on the support plate (2), and a limit guide rail (38) is vertically installed on the support plate (2) through a flipping mechanism guide rail seat (40). The first rotating shaft sleeve (30) is slidably fitted on the limit guide rail (38) through a flipping mechanism slider (39). A rotating positioning block support (33) is installed on the side of the first rotating shaft sleeve (30). The lifting head end of the second cylinder (25) is connected to a cylinder connection plate (37) on the rotating positioning block support (33) through a cylinder connection shaft (41). A rotating positioning block (26) for limiting and blocking the flipping support plate (31) is installed on the rotating positioning block support (33); A first motor (24) and a rotating shaft seat are installed on the flipping support plate (31). The first motor (24) is connected to a first rotating shaft (21) output from the rotating shaft seat through a first coupling (23). The front end of the first rotating shaft (21) is a hollow tube structure, with a first vacuum intake port (22) at the front, and the surface is a sunken plane with first suction nozzle holes (20) for carrying chips; The chip tray rotating mechanism (3) includes a second motor (42) at the bottom of the support plate (2), a second rotating shaft sleeve (44) installed and fixed on the support plate (2) by a support frame (43), a second rotating shaft (45) arranged in the second rotating shaft sleeve (44), a positioning disk (47) with a chip sunken bearing surface installed at the top end of the second rotating shaft (45), second suction nozzle holes (48) arranged on the chip sunken bearing surface, and a second vacuum intake port (46) connected to the channels of the second suction nozzle holes (48) in the positioning disk (47); The chip X-direction positioning mechanism (4) includes a positioning support base (49) vertically installed on the support plate (2), a third cylinder (50) horizontally installed on the top of the positioning support base (49), an L-shaped cylinder push seat (51) installed at the lifting head end of the third cylinder (50), and a positioning seat (52) installed on the L-shaped cylinder push seat (51). A positioning push rod (55) is installed on the positioning seat (52) through a spring (54). The chip Y-direction positioning mechanism (5) has the same structure as the chip X-direction positioning mechanism (4), and the chip X-direction positioning mechanism (4), the chip Y-direction positioning mechanism (5), and the flipping mechanism (6) are arranged around the chip tray rotating mechanism (3).

2. The chip flipping, positioning and centering mechanism according to claim 1, wherein The Y-direction moving component (8) includes a Y-direction guide rail (9) provided on the base (1) and a Y-direction guide rail slider (10) slidably fitted on the Y-direction guide rail (9). The X-direction support plate (17) is driven to move in the Y direction by the cooperation of the bottom of the X-direction support plate (17) with the ball nut of the first ball screw mechanism (11), and the first ball screw mechanism (11) is driven by a Y-direction motor.

3. The chip flipping, positioning and centering mechanism according to claim 2, characterized in that, A Y-direction photoelectric sensor (19) is fixedly installed on the side of the base (1), and the Y-direction photoelectric sensor (19) is matched with a Y-direction photoelectric sensor trigger (18) on the side of the X-direction support plate (17).

4. A chip flipping, positioning and centering mechanism according to claim 1, characterized in that, The X-direction moving component (7) includes an X-direction guide rail (16) provided on the X-direction support plate (17) and an X-direction guide rail slider (15) slidably fitted on the X-direction guide rail (16). The support plate (2) is driven to move in the X direction by the cooperation of the bottom of the support plate (2) with the ball nut of the second ball screw mechanism; the second ball screw mechanism is driven by an X-direction motor (14).

5. A chip flipping, positioning and centering mechanism according to claim 4, characterized in that, An X-direction photoelectric sensor (13) is fixedly installed on the side of the X-direction support plate (17), and the X-direction photoelectric sensor (13) is matched with an X-direction photoelectric sensor trigger (12) on the side of the support plate (2).

6. The chip flipping, positioning and centering mechanism according to claim 1, characterized in that, A pressure sensor (53) for detecting the thrust of the positioning push rod (55) is installed at the rear of the positioning seat (52).

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