Anti-deformation jig for server CPU socket maintenance

Abstract

The utility model relates to the technical field of electronic maintenance welding, in particular to a server CPU socket maintenance anti-deformation jig which comprises a front pressing plate and a back pressing plate. A connecting piece is arranged between the front pressure plate and the back pressure plate, the middle of the front pressure plate and the middle of the back pressure plate are each provided with a chip containing groove of a quasi-rectangular structure, the chip containing grooves correspond to the chip circuit board in position, and a containing frame of a rectangular structure is installed in the middle of the chip containing groove in the back pressure plate. Diagonal ribs are connected between the outer right-angle position of the containing groove and the inner wall of the chip containing groove, middle ribs are connected between the long straight face of the containing groove and the inner wall of the chip containing groove, and the containing frame is separated by the diagonal ribs and the middle ribs. The jig is simple in structure and convenient to assemble and disassemble, and can be used for safely and accurately positioning and maintaining the circuit board chip.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic maintenance welding, in particular to a deformation prevention fixture for server CPU socket maintenance. Background Technique

[0002] A CPU socket (translated into Central Processing Unit socket in Chinese) is a slot for inserting a CPU, usually made of metal. It allows the CPU to be connected to the motherboard for data transmission and the execution of various calculation and control instructions. How to correctly select and install a CPU socket is crucial for computer performance. Different types of sockets are suitable for CPUs of different manufacturers, so it is necessary to ensure the correct selection of the socket. With the development of technology, more and more CPU sockets adopt a solidified design, that is, the socket is directly fixed on the motherboard using welding technology, which can improve the signal transmission speed and durability.

[0003] However, in the existing field of electronic maintenance, when heating and welding the core position of the CPU socket of a chip server, heating the circuit board easily causes deformation of the circuit board at the heating part, which in turn leads to the failure of maintenance welding, resulting in problems such as dry soldering, bridging, and pad detachment and scrapping.

[0004] Therefore, in view of the above existing problems, this technical solution proposes a deformation prevention fixture for server CPU socket maintenance. Content of the Utility Model

[0005] The purpose of the utility model is to provide a deformation prevention fixture for server CPU socket maintenance to solve the problems put forward in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A deformation prevention fixture for server CPU socket maintenance, including a positive pressure plate and a back pressure plate; a connecting piece is arranged between the positive pressure plate and the back pressure plate to control the disassembly between the positive pressure plate and the back pressure plate. The circuit board chip to be repaired is placed between the positive pressure plate and the back pressure plate for clamping and positioning before maintenance. A chip receiving groove in the shape of a quasi-rectangle is opened in the middle of both the positive pressure plate and the back pressure plate. The chip receiving groove corresponds to the position of the chip circuit board. A rectangular structure receiving frame is installed in the middle of the chip receiving groove in the back pressure plate. Diagonal ribs are connected between the outer right angles of the receiving frame and the inner wall of the chip receiving groove. Middle ribs are connected between the long straight surface of the receiving frame and the inner wall of the chip receiving groove. Under the separation of the diagonal ribs and the middle ribs, the receiving frame and the outer chip receiving groove are divided into multiple hollow slots. The receiving frame, the hollow slots, and the chip receiving groove separate the components on the chip circuit board, reducing the probability of damage to adjacent components during maintenance.

[0007] Compared with the prior art, the beneficial effects of the utility model are: the chip circuit board is clamped and positioned by the cooperation of the positive pressure plate and the back pressure plate, so that the circuit board is prevented from being heated and deformed when the circuit board is repaired, thereby increasing the repair success rate and later stability. At the same time, the cooperation between the hollow groove, the accommodating frame, the reinforcing frame and the chip accommodating groove staggers the components, improves the maintenance accuracy, and enhances the anti-deformation strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a schematic diagram of the structure of the positive pressure plate pair in the anti-deformation fixture for repairing the server CPU socket.

[0009] Figure 2 This is a schematic diagram of the structure of the back pressure plate in the anti-deformation fixture for repairing the server CPU socket.

[0010] Figure 3 Schematic diagram of the overall structure of the anti-deformation fixture for repairing the server CPU socket.

[0011] Among them: positive pressure plate 1, back pressure plate 2, fixing hole 3, containing frame 5, hollow groove 6, chip containing groove 7, reinforcing frame 8, diagonal ribs 9, middle ribs 10, bolts 11, nuts 12. DETAILED DESCRIPTION

[0012] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0013] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0014] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0015] The present utility model will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0016] Please refer to Figures 1-3 , a server CPU socket repair anti-deformation fixture, including a positive pressure plate 1 and a back pressure plate 2; a connecting member is arranged between the positive pressure plate 1 and the back pressure plate 2 for controlling the installation and removal between the positive pressure plate 1 and the back pressure plate 2. The circuit board chip to be repaired is placed between the positive pressure plate 1 and the back pressure plate 2 for clamping and positioning before repair. A chip receiving groove 7 with a quasi-rectangular structure is provided in the middle of both the positive pressure plate 1 and the back pressure plate 2. The chip receiving groove 7 corresponds to the position of the chip circuit board. A receiving frame 5 with a rectangular structure is installed in the middle of the chip receiving groove 7 in the back pressure plate 2. Diagonal ribs 9 are connected between the outer right angles of the receiving frame 5 and the inner wall of the chip receiving groove 7. Middle ribs 10 are connected between the long straight surface of the receiving frame 5 and the inner wall of the chip receiving groove 7. Under the separation of the diagonal ribs 9 and the middle ribs 10, the chip receiving groove 7 outside the receiving frame 5 is separated into a plurality of hollow grooves 6. The receiving frame 5, the hollow grooves 6, and the chip receiving groove 7 separate the components on the chip circuit board, reducing the damage probability to adjacent components during repair.

[0017] In the embodiment of the present invention, the receiving frame 5 corresponds to the position of the electronic components on the back of the circuit board where the chip is located, and the hollow grooves 6 correspond to the positions of the electronic components around the core part on the back of the chip circuit board, ensuring that when repairing the chip circuit board, each part of the electronic components is accurately separated and processed;

[0018] The size of the back pressure plate 2 is the same as the size of the pads for the chip, ensuring accurate soldering after sufficient clamping of the chip;

[0019] The setting of the hollow grooves 6 can reduce the material consumption and weight of the device while avoiding the electronic components on the circuit board;

[0020] As a preferred embodiment of the present invention, the connecting member includes a plurality of fixing holes 3 with the same number respectively and evenly opened on the positive pressure plate 1 and the back pressure plate 2. The fixing holes 3 on the positive pressure plate 1 and the back pressure plate 2 are distributed in one-to-one correspondence, and bolts 11 are inserted into the fixing holes 3 at the same position. One end of the bolt 11 is threadedly connected with a nut 12, and the bolt 11 is tightened by rotating the nut.

[0021] Specifically, the hole pitch of the fixing holes 3 is the same as that of the fixing holes of the heat sink for the circuit board chip. When the positive pressing plate 1 and the back pressing plate 2 are used, the back pressing plate 2 is attached to the back of the corresponding position of the circuit board chip, and the positive pressing plate 1 is attached to the front of the corresponding position of the circuit board chip. Then, it is fixed by the bolt 11 through the fixing holes 3, and the circuit board chip is fixedly squeezed between the positive pressing plate 1 and the back pressing plate 2.

[0022] The bolt 11 is set as a single-head bolt, that is, it can be stably fixed in the fixing hole 3 by cooperating with a set of nuts 12.

[0023] A reinforcing frame 8 is provided around the outer frame of the positive pressing plate 1. The setting of the reinforcing frame 8 can increase the anti-deformation strength of the back pressing plate 2 and the positive pressing plate 1.

[0024] Specifically, the corners of the hollow-out grooves 6 are rounded chamfers to avoid tearing at the corners when subjected to torsional forces.

[0025] Specifically, this device is made of titanium alloy material, thereby preventing the circuit board from heating and deforming, increasing the success rate of maintenance and the later stability.

[0026] It should be noted that this device can be integrally pressed by a mold, with a simple manufacturing process and low cost.

[0027] The working principle of the present utility model is as follows: At the idle place of this device, all the above-mentioned driving parts, which refer to power elements, electrical parts and the adapted power supply, are connected by wires, and the electrical connection is completed according to the sequential working order among the electrical parts. The detailed connection means are well-known technologies in the art. The following mainly introduces the working principle and process, and will not explain the electrical control. When in use, the back pressing plate 2 is attached to the back of the corresponding position of the circuit board chip, and the positive pressing plate 1 is attached to the front of the corresponding position of the circuit board chip. Then, the bolt 11 is inserted into the fixing hole 3 to fix the two, and then when the circuit board is heated, the positive pressing plate 1 and the back pressing plate 2 squeeze the circuit board. The settings of the hollow-out grooves 6, the accommodating frame 5 and the chip accommodating grooves 7 stagger the components, reducing the contact damage during welding and maintenance.

[0028] The above has made a detailed description of the preferred embodiment of this patent, but this patent is not limited to the above embodiment. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the purpose of this patent.

Claims

1. Server CPU socket repair anti-deformation fixture, characterized in that It includes a positive pressing plate (1) and a back pressing plate (2); a connecting piece is arranged between the positive pressing plate (1) and the back pressing plate (2). A chip accommodating groove (7) with a quasi-rectangular structure is provided in the middle of both the positive pressing plate (1) and the back pressing plate (2). The chip accommodating groove (7) corresponds to the position of the chip circuit board. A rectangular accommodating frame (5) is installed in the middle of the chip accommodating groove (7) in the back pressing plate (2). Diagonal ribs (9) are connected between the outer right angles of the accommodating frame (5) and the inner wall of the chip accommodating groove (7). Middle ribs (10) are connected between the long straight surface of the accommodating frame (5) and the inner wall of the chip accommodating groove (7). Under the separation of the diagonal ribs (9) and the middle ribs (10), the accommodating frame (5) and the outer chip accommodating groove (7) are separated into a plurality of hollow grooves (6).

2. The server CPU socket repair anti-deformation jig according to claim 1, wherein The accommodating frame (5) corresponds to the position of the electronic components on the back of the circuit board where the chip is located, and the hollow grooves (6) correspond to the positions of the electronic components around the core part on the back of the circuit board where the chip is located.

3. The server CPU socket repair anti-deformation jig according to claim 2, wherein, The size of the back pressing plate (2) is the same as the size of the pads for the chip.

4. The server CPU socket repair anti-deformation fixture according to claim 3, characterized in that, The connecting piece includes a plurality of fixing holes (3) with the same number evenly opened on the positive pressing plate (1) and the back pressing plate (2) respectively. The fixing holes (3) on the positive pressing plate (1) and the back pressing plate (2) are distributed in one-to-one correspondence, and bolts (11) are inserted into the fixing holes (3) at the same position. One end of the bolt (11) is threadedly connected with a nut (12).

5. The server CPU socket repair anti-deformation jig according to claim 4, characterized in that, The pitch of the fixing holes (3) is the same as the pitch of the fixing holes of the heat sink for the circuit board chip.

6. The server CPU socket repair anti-deformation jig according to claim 5, characterized in that, A reinforcing frame (8) is provided around the outer frame of the positive pressing plate (1).

7. The server CPU socket repair anti-deformation jig according to claim 6, characterized in that, The corners of the hollow grooves (6) are rounded chamfers.

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