Heat-dissipation-improved EEB motherboard used as chassis component, and routing method

Abstract

The present invention relates to the technical field of EEB motherboards and provides a heat-dissipation-improved EEB motherboard used as a chassis component, and a routing method. The EEB motherboard comprises: a PCB provided with a first extension portion and a second extension portion; a first CPU socket diposed on the PCB and located at the lower left of the PCB; a second CPU socket disposed on the PCB and located at the lower right of the PCB; a first power module located directly below the first CPU socket; a second power module located directly below the second CPU socket; a first memory slot group disposed on the PCB and located on left and right sides of the first CPU socket; a second memory slot group disposed on the PCB and located on left and right sides of the second CPU socket; a PCIE slot group located above the PCB; a first PCIE expansion interface disposed on the PCB; a second PCIE expansion interface disposed on the PCB; a PCH disposed on the PCB; and four MCIO connectors disposed on the PCB and the first extension portion. The present invention has the advantages: under the premise of ensuring compatibility, it greatly improves the heat dissipation performance, signal stability and expandability of the EEB motherboard.

Description

An improved heat dissipation EEB motherboard as a chassis component and its wiring method Technical Field

[0001] This invention relates to the field of EEB motherboard technology, and in particular to an improved heat dissipation EEB motherboard and wiring method used as a chassis component. Background Technology

[0002] EEB (Enterprise Electronics Bay) motherboards are standard motherboards for dual-socket servers. The EEB motherboard is one of the most important components of the chassis. The EEB motherboard standard was updated to version 1.01 in 2012, defining the motherboard size, screw hole locations, PCIe slot locations, I / O interface locations, and clearance areas within the chassis. In the server application field at the time, it primarily supported Intel Xeon E5 series processors and AMD Opteron series processors. These processors had a power consumption range of 100-200W and a maximum PCIe link speed of PCIe 3.0.

[0003] The structure and layout of a traditional EEB motherboard (a standard EEB motherboard for dual CPUs) is shown in Figure 6. The EEB motherboard is installed in the chassis. The right side houses the 2.5-inch hard drive bracket and power supply module cage, while the pack fan is located below the EEB motherboard. The gap between the 2.5-inch hard drive bracket and the EEB motherboard is 10mm, allowing for a margin greater than the standard requirement of at least 5.08mm. The gap between the pack fan and the EEB motherboard is 20mm, exceeding the standard requirement of at least 12.7mm. On the EEB motherboard, CPU1 and CPU0 are arranged vertically, with CPU PWR1 (power supply module) located above CPU1 and CPU PWR0 (power supply module) located below CPU0. The I / O interface area (IO AERA) is located below the CPU... Above PWR1, with a width of 152.15mm, are 7 (6 in most designs) PCIe slots located in the upper left corner of the EEB motherboard. Memory slots are located on the left and right sides of CPU1 and CPU0, respectively. There are also components such as MCIO connectors, PCH, and PCIe expansion interfaces (PCIe devices).

[0004] The wiring of a traditional EEB motherboard is shown in Figure 7. CPU0 is connected to the PCIe slot, and some traces need to pass through the memory slot (high-speed DDR5 signal line area); the traces of CPU1 connected to the PCIe slot also need to pass through the memory slot; the PCIe signal of CPU0 is connected to the MCIO connector, which needs to pass through the memory slot; due to space limitations, the PCIe signal of CPU1 cannot be connected to the MCIO connector; the DMI signal of CPU0 connected to the PCH needs to pass through the memory slot; there are three sets of UPI interconnection signals between CPU0 and CPU1, with 48 pairs of transmit and receive signals in each set, and the third set needs to pass through the memory slot.

[0005] The traditional EEB motherboard structure and wiring have the following drawbacks: 1. The air blown out by the fan passes sequentially through CPU PWR0, CPU0, CPU1, and CPU PWR1. This means that the heat from CPU PWR0 is transferred to CPU0, CPU1, and CPU PWR1; the heat from CPU0 is transferred to CPU1 and CPU PWR1; and the heat from CPU1 is transferred to CPU PWR1. This creates heat overlap in the airflow, resulting in CPU1 having a higher temperature than CPU0, and CPU PWR1 having the highest temperature. With the development of processor technology, CPU power consumption is increasing, and PCIe speeds are rising. Traditional EEB motherboards can only meet the cooling requirements for 200W power consumption, which is insufficient for the current 350W power consumption requirements. 2. Due to the long distances involved in wiring, and the unavoidable need to cross related components (memory slots, etc.), the number of PCB layers needs to be increased to complete the wiring. This undoubtedly increases interference and degrades the quality of high-speed signals. 3. Due to the influence of memory slots and CPU PWR1, the space in the I / O interface area is very limited, allowing only shallow I / O interfaces (approximately 30mm deep), restricting expandability.

[0006] Chinese utility model patent application number 202020536636.9 and classification number G12B9 / 10 discloses an instrument motherboard with an anti-static coil. Although the motherboard is a single-channel CPU motherboard, its heat dissipation and wiring also have certain defects.

[0007] While traditional EEB motherboards present challenges related to heat dissipation and cabling, the relatively low cost and maturity of EEB standard chassis makes them a preferred choice for small and medium-sized enterprises (SMEs). Therefore, providing an improved EEB motherboard with enhanced heat dissipation as a chassis component, along with a suitable cabling method, that improves heat dissipation, signal stability, and expandability while maintaining compatibility, has become a pressing technical challenge. Technical issues

[0008] The technical problem to be solved by the present invention is to provide an improved heat dissipation EEB motherboard and wiring method as a chassis component, so as to improve the heat dissipation performance, signal stability and expandability of the EEB motherboard while ensuring compatibility. Technical solutions

[0009] In a first aspect, the present invention provides a heat-dissipating improved EEB motherboard as a chassis component, comprising:

[0010] An EEB standard PCB board has a first extension on the bottom side and a second extension on the right side.

[0011] A first CPU socket is provided on the PCB board, located at the lower left of the PCB board;

[0012] A second CPU socket is disposed on the PCB board, located at the lower right of the PCB board, and arranged symmetrically with the first CPU socket;

[0013] A first power supply module is disposed on the PCB board, located directly below the first CPU socket, and connected to the first CPU socket;

[0014] A second power supply module is disposed on the PCB board, located directly below the second CPU socket, and connected to the second CPU socket;

[0015] An ATX power connector is disposed on the second extension and connected to the first power module and the second power module;

[0016] A first memory slot group is disposed on the PCB board, located on the left and right sides of the first CPU slot, and connected to the first CPU slot;

[0017] A second memory slot group is disposed on the PCB board, located on the left and right sides of the second CPU slot, and connected to the second CPU slot;

[0018] A PCIe slot group is disposed on the PCB board, located above the PCB board, and connected to the first CPU slot and the second CPU slot;

[0019] A first PCIe expansion interface is provided on the PCB board and connected to the first CPU socket;

[0020] A second PCIe expansion interface is provided on the PCB board and connected to the second CPU socket;

[0021] A PCH is disposed on the PCB board and connected to the first CPU socket;

[0022] Two upper MCIO connectors are arranged side by side on the PCB board and connected to the second CPU socket;

[0023] Two lower MCIO connectors are arranged side by side on the left and right sides of the first extension, and are respectively connected to the first CPU socket and the second CPU socket;

[0024] Several locking accessories are provided on the PCB board, and the EEB motherboard is locked inside the chassis by the locking accessories to serve as a chassis component.

[0025] Furthermore, the dimensions of the first extension are 304.8mm*15mm; the dimensions of the second extension are 10mm*185.3mm, and the bottom is flush with the first extension.

[0026] Furthermore, both the first power module and the second power module are seven-phase power supply modules.

[0027] Furthermore, the first memory slot group includes:

[0028] Four first memory slots are symmetrically arranged on the left and right sides of the first CPU slot, and the first memory slots on the same side are arranged vertically.

[0029] Furthermore, the second memory slot group includes:

[0030] Four second memory slots are symmetrically located on the left and right sides of the second CPU slot, with the second memory slots on the same side arranged vertically.

[0031] Furthermore, the PCIe slot group includes:

[0032] A PCIe slot with a number 1 is located at the upper left of the PCB board and is connected to the first CPU socket;

[0033] A second PCIe slot is located at the upper left of the PCB board, to the right of the first PCIe slot, and connected to the first CPU slot.

[0034] A sixth PCIe slot is located at the upper left of the PCB board, to the right of the second PCIe slot, three slots away from the second PCIe slot, and connected to the first CPU socket.

[0035] An eighth-position PCIe slot is located at the upper right of the PCB board, at the same height as the first-position PCIe slot, and is connected to the second CPU socket.

[0036] A 9-position PCIe slot is located at the upper right of the PCB board, to the right of the 8-position PCIe slot, and connected to the second CPU slot.

[0037] A PCIe slot with a 10-position is located at the upper right of the PCB board, to the right of the PCIe slot with a 9-position, and is connected to the second CPU socket.

[0038] Furthermore, the first PCIe expansion interface is located above the middle of the second PCIe slot and the sixth PCIe slot.

[0039] The second PCIe expansion interface is located in the middle of the sixth PCIe slot and the eighth PCIe slot;

[0040] The PCH is located above the second PCIe expansion interface.

[0041] Furthermore, the upper MCIO connector is located between the second PCIe expansion interface and the eighth-position PCIe slot, and is positioned above the second CPU socket.

[0042] Furthermore, it also includes:

[0043] An I / O interface group is disposed on the PCB board, located above the middle of the sixth and eighth PCIe slots, and connected to the PCH.

[0044] Secondly, the present invention provides a wiring method for an improved heat dissipation EEB motherboard as a chassis component, comprising the following steps in no particular order:

[0045] Step S1: The top center of the first CPU socket is connected in a straight line to the bottom of the first PCIe slot, the second PCIe slot, the sixth PCIe slot, and the first PCIe expansion interface via PCIe11 signal line, PCIe12 signal line, PCIe13 signal line, and PCIe14 signal line, respectively.

[0046] Step S2: The top center of the first CPU socket is connected to the top center of the second CPU socket via UPI1 signal line and UPI2 signal line, bypassing the top of the first memory slot group and the second memory slot group, and is directly connected to the PCH via DMI signal line.

[0047] Step S3: The bottom center of the first CPU socket is directly connected to the lower MCIO connector on the left side via a PCIE15 signal line, and the UPI3 signal line is bypassed to the bottom center of the second memory slot group and connected to the bottom center of the second CPU socket via a UPI3 signal line.

[0048] Step S4: The top center of the second CPU socket is directly connected to the PCIe slot 8, PCIe slot 9, and PCIe slot 10 via PCIe21, PCIe22, and PCIe23 signal lines, respectively, and is directly connected to the two upper MCIO connectors via PCIe24 and PCIe25 signal lines, respectively.

[0049] Step S5: The bottom center of the second CPU socket is directly connected to the lower MCIO connector on the right side via a PCIE26 signal line, and the bottom left side is connected to the second PCIE expansion interface via a PCIE27 signal line through the middle of the first and second memory slot groups. Beneficial effects

[0050] The advantages of this invention are:

[0051] 1. By symmetrically placing the first and second CPU sockets on the lower left and right sides of the PCB board, and placing the first and second power modules below them respectively, the traditional vertical layout is changed to a horizontal layout. This prevents heat from the first CPU socket and the first power module from being transferred to the second CPU socket and the second power module, and vice versa. The first memory slot group is located on the left and right sides of the first CPU socket, and the second memory slot group is located on the left and right sides of the second CPU socket. This allows the memory installed in the first and second memory slot groups to be closer to the fan plate, thereby greatly improving the heat dissipation performance of the EEB motherboard.

[0052] 2. A first CPU socket and a second CPU socket are symmetrically arranged on the lower left and lower right sides of the PCB board. First memory slots are located on the left and right sides of the first CPU socket, and second memory slots are located on the left and right sides of the second CPU socket. Above the first CPU socket are PCIe slots 1, 2, and 6; above the second CPU socket are PCIe slots 8, 9, and 10. The first PCIe expansion interface is positioned above and between the second and 6 PCIe slots. The second PCIe expansion interface is located in the middle of the 6 and 8 PCIe slots. The PCH is located above the second PCIe expansion interface. The upper MCIO connector is located between the second PCIe expansion interface and the 8 PCIe slot, and above the second CPU socket. The lower MCIO connector is located on the left and right sides of the first extension at the bottom of the PCB board. This allows the first CPU socket to transmit signals via PCIe 11, PCIe 12, PCIe 13, PCIe 14, PCIe 15, and DMI signals. The first CPU socket is directly connected to the PCIe slots 1, 2, and 6, the first PCIe expansion interface, the lower MCIO connector on the left, and the PCH via PCIe21, PCIe22, PCIe23, PCIe24, PCIe25, and PCIe26 signal lines, respectively, to the PCIe slots 8, 9, and 10, the upper MCIO connector, the upper MCIO connector, and the lower MCIO connector on the right. The three sets of UPI signal lines connecting the first and second CPU sockets only need to pass short distances around the first and second memory modules from above or below. The bottom left side of the second CPU socket connects to the second PCIe expansion interface via the PCIe27 signal line through the middle of the first and second memory slot groups. This overall wiring greatly shortens the signal line length and eliminates the need to cross the first and second memory slot groups as in the traditional method, thus avoiding the need to increase the number of PCB layers and introducing unnecessary interference, thereby greatly improving the signal stability of the EEB motherboard.

[0053] 3. By setting a first extension of 304.8mm*15mm downwards on the bottom side of the PCB board, and a second extension of 10mm*185.3mm to the right on the right side, with the bottom of the second extension flush with the bottom of the first extension, the expansion of the first and second extensions can perfectly fit existing cases due to the space margin in the design of the EEB motherboard. Meanwhile, on the upper left of the PCB board, PCIe slots 1, 2, and 6 are sequentially arranged, with PCIe slots 2 and 6 spaced three slots apart. That is, PCIe slots 1, 2, and 6 are located in the traditional mounting positions. Later, as needed, PCIe slots 3, 4, 5, and 7 can be added between PCIe slots 2 and 6, and to the right of PCIe slot 6, thus ensuring the compatibility of the EEB motherboard.

[0054] 4. By adjusting the traditional vertical heat dissipation layout to a horizontal heat dissipation layout, the heat dissipation performance of the EEB motherboard is effectively improved. This allows the first and second power modules to use seven-phase power supply modules instead of the traditional eight-phase power supply modules, which not only reduces the cost of the EEB motherboard but also provides more space for the routing of the UPI3 signal lines between the first and second CPU sockets.

[0055] 5. By spacing the PCIe slot 2 and PCIe slot 6 by three slots, and providing ample space between the PCIe slot 6 and PCIe slot 8, expansion can be made between the PCIe slots 2 and 6, and between the PCIe slot 6 and PCIe slot 8. Furthermore, the ample space between the PCIe slots 6 and 8 allows for an 81.6mm wide I / O interface area for I / O interface groups, and its depth is greater than traditional EEB motherboards, accommodating I / O interfaces larger than dual network sockets (e.g., 60mm deep dual optical sockets), facilitating more flexible interface expansion. Although the right side of the I / O interface group cannot directly accommodate connectors due to the PCIe slot 8, additional connectors can be connected via cables to the three slots on the left (PCIe slots 4, 5, and 6), ultimately greatly improving the expandability of the EEB motherboard.

[0056] 6. By providing a second extension, the ATX power connector can be installed on the second extension, ensuring that the 12V power supply current capability meets the requirement of 700W. Attached Figure Description

[0057] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0058] Figure 1 is a schematic diagram of the structure of an improved heat dissipation EEB motherboard as a chassis component according to the present invention.

[0059] Figure 2 is a schematic diagram of the dimensions of an improved heat dissipation EEB motherboard as a chassis component according to the present invention.

[0060] Figure 3 is a wiring diagram of an improved heat dissipation EEB motherboard as a chassis component according to the present invention.

[0061] Figure 4 is a circuit block diagram of an improved heat dissipation EEB motherboard as a chassis component according to the present invention.

[0062] Figure 5 is a flowchart of a wiring method for a heat-dissipating improved EEB motherboard as a chassis component according to the present invention.

[0063] Figure 6 is a schematic diagram of the structure of a traditional EEB motherboard.

[0064] Figure 7 is a schematic diagram of the wiring of a traditional EEB motherboard.

[0065] Figure 8 is a schematic diagram of the screw hole positions of a traditional EEB motherboard (EEB standard screw hole positions).

[0066] Marker explanation:

[0067] 100 - An improved heat dissipation EEB motherboard as a chassis component, 1 - PCB board, 2 - First CPU socket, 3 - Second CPU socket, 4 - First power module, 5 - Second power module, 6 - ATX power connector, 7 - First memory slot group, 8 - Second memory slot group, 9 - PCIe slot group, 10 - First PCIe expansion interface, 20 - Second PCIe expansion interface, 30 - PCH, 40 - Upper MCIO connector, 50 - Lower MCIO connector, 60 - Locking accessory, 70 - IO interface group, 80 - Fan plate, 11 - First extension, 12 - Second extension, 71 - First memory slot, 81 - Second memory slot, 91 - PCIe slot 1, 92 - PCIe slot 2, 93 - PCIe slot 6, 94 - PCIe slot 8, 95 - PCIe slot 9, 96 - PCIe slot 10. Embodiments of the present invention

[0068] The overall concept of the technical solution in this application embodiment is as follows: By strictly limiting the size of the first extension and the second extension, the first, second, and sixth PCIe slots are placed in the traditional mounting positions to ensure compatibility; by adjusting the traditional vertical heat dissipation arrangement structure to a horizontal heat dissipation arrangement structure, the heat dissipation performance is improved; by adjusting the layout of each component to shorten the length of the signal lines, there is no need to cross the first and second memory slot groups as in the traditional way, thus avoiding the need to increase the number of PCB layers, avoiding the introduction of unnecessary interference, and improving signal stability.

[0069] Referring to Figures 1 to 8, a preferred embodiment of the improved heat dissipation EEB motherboard 100 as a chassis component of the present invention includes:

[0070] An EEB standard PCB board 1 has a first extension 11 on the lower side and a second extension 12 on the right side; the first extension 11 is used to install the lower MCIO connector 50; the second extension 12 is used to install the ATX power connector 6; the PCB board 1 has EEB standard screw holes, namely screw holes A, C, F', F, G, H, H', J, J', K, K', L, L', M, M', X, Y, Y', Z as shown in Figure 8.

[0071] A first CPU socket 2 is provided on the PCB board 1, located at the lower left of the PCB board 1;

[0072] A second CPU socket 3 is located on the PCB board 1, at the lower right of the PCB board 1, and is symmetrically arranged with the first CPU socket 2; both the first CPU socket 2 and the second CPU socket 3 are used to install CPUs (not shown), and the horizontal arrangement is to improve the overall heat dissipation performance.

[0073] A first power module 4 is disposed on the PCB board 1, located directly below the first CPU socket 2, and connected to the first CPU socket 2, for supplying power to the CPU connected to the first CPU socket 2.

[0074] A second power supply module 5 is disposed on the PCB board 1, located directly below the second CPU socket 3, and connected to the second CPU socket 3, for supplying power to the CPU connected to the second CPU socket 3;

[0075] An ATX power connector 6 is disposed on the second extension 12 and connected to the first power module 4 and the second power module 5.

[0076] A first memory slot group 7 is disposed on the PCB board 1, located on the left and right sides of the first CPU slot 2, and connected to the first CPU slot 2;

[0077] A second memory slot group 8 is disposed on the PCB board 1, located on the left and right sides of the second CPU slot 3, and connected to the second CPU slot 3; that is, the first memory slot group 7 and the second memory slot group 8 are also arranged horizontally to be close to the fan plate 80, which effectively improves the heat dissipation performance.

[0078] A PCIe slot group 9 is disposed on the PCB board 1, located above the PCB board 1, and connected to the first CPU slot 2 and the second CPU slot 3.

[0079] A first PCIe expansion interface 10 is provided on the PCB board 1 and connected to the first CPU socket 2;

[0080] A second PCIe expansion interface 20 is provided on the PCB board 1 and connected to the second CPU socket 3;

[0081] A PCH30 is disposed on the PCB board 1 and connected to the first CPU socket 2;

[0082] Two upper MCIO connectors 40 are arranged side by side on the PCB board 1 and connected to the second CPU socket 3;

[0083] Two lower MCIO connectors 50 are arranged side by side on the left and right sides of the first extension 11 and are respectively connected to the first CPU socket 2 and the second CPU socket 3; by placing the lower MCIO connectors 50 on the first extension 11, the wiring distance is effectively shortened.

[0084] Several locking accessories 60 are provided on the PCB board 1. The EEB motherboard 100 is locked inside the chassis (not shown) by the locking accessories 60 to serve as a chassis component. That is, the locking accessories 60 are provided on the screw holes of the PCB board 1. In specific implementation, the screw holes A, C, F', G, H, J, X, Y, and Z are selected to just avoid the positions of components such as the first CPU socket 2, the second CPU socket 3, the first memory slot group 7, and the second memory slot group 8.

[0085] The first extension 11 measures 304.8mm x 15mm; the second extension 12 measures 10mm x 185.3mm, with its bottom flush with the bottom of the first extension 11. By strictly limiting the dimensions of the first extension 11 and the second extension 12, compatibility with existing chassis (not shown) is achieved.

[0086] Both the first power module 4 and the second power module 5 are seven-phase power supply modules, replacing the traditional eight-phase power supply modules, which not only reduces costs but also provides space for wiring.

[0087] The first memory slot group 7 includes:

[0088] Four first memory slots 71 are symmetrically arranged on the left and right sides of the first CPU slot 2, and the first memory slots 71 on the same side are arranged vertically.

[0089] The second memory slot group 8 includes:

[0090] Four second memory slots 81 are symmetrically arranged on the left and right sides of the second CPU slot 3, and the second memory slots 81 on the same side are arranged vertically.

[0091] The PCIe slot group 9 includes:

[0092] A PCIe slot 91 is located at the upper left of the PCB board 1 and is connected to the first CPU socket 2.

[0093] A second PCIe slot 92 is located at the upper left of the PCB board 1, to the right of the first PCIe slot 91, and is connected to the first CPU slot 2.

[0094] A sixth PCIe slot 93 is located at the upper left of the PCB board 1, to the right of the second PCIe slot 92, separated from the second PCIe slot 92 by three slots, and connected to the first CPU socket 2.

[0095] An eighth-position PCIe slot 94 is located at the upper right of the PCB board 1, at the same height as the first-position PCIe slot 91, and is connected to the second CPU socket 3.

[0096] A nine-position PCIe slot 95 is located at the upper right of the PCB board 1, to the right of the eight-position PCIe slot 94, and is connected to the second CPU socket 3.

[0097] A PCIe slot 96 with a 10-position is located at the upper right of the PCB board 1, to the right of the PCIe slot 95 with a 9-position, and is connected to the second CPU socket 3.

[0098] By spacing the second PCIe slot 92 and the sixth PCIe slot 93 by three slots, and by providing ample space between the sixth PCIe slot 93 and the eighth PCIe slot 94, subsequent expansion can be made between the second PCIe slot 92 and the sixth PCIe slot 93, and between the sixth PCIe slot 93 and the eighth PCIe slot 94, thereby greatly improving the expandability of the EEB motherboard 100.

[0099] The first PCIe expansion interface 10 is located above the middle of the second PCIe slot 92 and the sixth PCIe slot 93;

[0100] The second PCIe expansion interface 20 is located in the middle of the sixth PCIe slot 93 and the eighth PCIe slot 94;

[0101] The PCH30 is located above the second PCIe expansion interface 20.

[0102] The upper MCIO connector 40 is located between the second PCIe expansion interface 20 and the eighth-position PCIe slot 94, and is located above the second CPU slot 3.

[0103] Also includes:

[0104] An I / O interface group 70 is disposed on the PCB board 1, located above the middle of the sixth PCIe slot 93 and the eighth PCIe slot 94, and is connected to the PCH30.

[0105] A preferred embodiment of the wiring method for an improved heat dissipation EEB motherboard as a chassis component of the present invention includes the following steps in no particular order:

[0106] Step S1: The top center of the first CPU socket is connected in a straight line to the bottom of the first PCIe slot, the second PCIe slot, the sixth PCIe slot, and the first PCIe expansion interface via PCIe11 signal line, PCIe12 signal line, PCIe13 signal line, and PCIe14 signal line, respectively.

[0107] Step S2: The top center of the first CPU socket is connected to the top center of the second CPU socket via UPI1 signal line and UPI2 signal line, bypassing the top of the first memory slot group and the second memory slot group, and is directly connected to the PCH via DMI signal line.

[0108] Step S3: The bottom center of the first CPU socket is directly connected to the lower MCIO connector on the left side via a PCIE15 signal line, and the UPI3 signal line is bypassed to the bottom center of the second memory slot group and connected to the bottom center of the second CPU socket via a UPI3 signal line.

[0109] Step S4: The top center of the second CPU socket is directly connected to the PCIe slot 8, PCIe slot 9, and PCIe slot 10 via PCIe21, PCIe22, and PCIe23 signal lines, respectively, and is directly connected to the two upper MCIO connectors via PCIe24 and PCIe25 signal lines, respectively.

[0110] Step S5: The bottom center of the second CPU socket is directly connected to the lower MCIO connector on the right side via a PCIE26 signal line, and the bottom left side is connected to the second PCIE expansion interface via a PCIE27 signal line through the middle of the first and second memory slot groups.

[0111] In summary, the advantages of this invention are as follows:

[0112] 1. By symmetrically placing the first and second CPU sockets on the lower left and right sides of the PCB board, and placing the first and second power modules below them respectively, the traditional vertical layout is changed to a horizontal layout. This prevents heat from the first CPU socket and the first power module from being transferred to the second CPU socket and the second power module, and vice versa. The first memory slot group is located on the left and right sides of the first CPU socket, and the second memory slot group is located on the left and right sides of the second CPU socket. This allows the memory installed in the first and second memory slot groups to be closer to the fan plate, thereby greatly improving the heat dissipation performance of the EEB motherboard.

[0113] 2. A first CPU socket and a second CPU socket are symmetrically arranged on the lower left and lower right sides of the PCB board. First memory slots are located on the left and right sides of the first CPU socket, and second memory slots are located on the left and right sides of the second CPU socket. Above the first CPU socket are PCIe slots 1, 2, and 6; above the second CPU socket are PCIe slots 8, 9, and 10. The first PCIe expansion interface is positioned above and between the second and 6 PCIe slots. The second PCIe expansion interface is located in the middle of the 6 and 8 PCIe slots. The PCH is located above the second PCIe expansion interface. The upper MCIO connector is located between the second PCIe expansion interface and the 8 PCIe slot, and above the second CPU socket. The lower MCIO connector is located on the left and right sides of the first extension at the bottom of the PCB board. This allows the first CPU socket to transmit signals via PCIe 11, PCIe 12, PCIe 13, PCIe 14, PCIe 15, and DMI signals. The first CPU socket is directly connected to the PCIe slots 1, 2, and 6, the first PCIe expansion interface, the lower MCIO connector on the left, and the PCH via PCIe21, PCIe22, PCIe23, PCIe24, PCIe25, and PCIe26 signal lines, respectively, to the PCIe slots 8, 9, and 10, the upper MCIO connector, the upper MCIO connector, and the lower MCIO connector on the right. The three sets of UPI signal lines connecting the first and second CPU sockets only need to pass short distances around the first and second memory modules from above or below. The bottom left side of the second CPU socket connects to the second PCIe expansion interface via the PCIe27 signal line through the middle of the first and second memory slot groups. This overall wiring greatly shortens the signal line length and eliminates the need to cross the first and second memory slot groups as in the traditional method, thus avoiding the need to increase the number of PCB layers and introducing unnecessary interference, thereby greatly improving the signal stability of the EEB motherboard.

[0114] 3. By setting a first extension of 304.8mm*15mm downwards on the bottom side of the PCB board, and a second extension of 10mm*185.3mm to the right on the right side, with the bottom of the second extension flush with the bottom of the first extension, the expansion of the first and second extensions can perfectly fit existing cases due to the space margin in the design of the EEB motherboard. Meanwhile, on the upper left of the PCB board, PCIe slots 1, 2, and 6 are sequentially arranged, with PCIe slots 2 and 6 spaced three slots apart. That is, PCIe slots 1, 2, and 6 are located in the traditional mounting positions. Later, as needed, PCIe slots 3, 4, 5, and 7 can be added between PCIe slots 2 and 6, and to the right of PCIe slot 6, thus ensuring the compatibility of the EEB motherboard.

[0115] 4. By adjusting the traditional vertical heat dissipation layout to a horizontal heat dissipation layout, the heat dissipation performance of the EEB motherboard is effectively improved. This allows the first and second power modules to use seven-phase power supply modules instead of the traditional eight-phase power supply modules, which not only reduces the cost of the EEB motherboard but also provides more space for the routing of the UPI3 signal lines between the first and second CPU sockets.

[0116] 5. By spacing the PCIe slot 2 and PCIe slot 6 by three slots, and providing ample space between the PCIe slot 6 and PCIe slot 8, expansion can be made between the PCIe slots 2 and 6, and between the PCIe slot 6 and PCIe slot 8. Furthermore, the ample space between the PCIe slots 6 and 8 allows for an 81.6mm wide I / O interface area for I / O interface groups, and its depth is greater than traditional EEB motherboards, accommodating I / O interfaces larger than dual network sockets (e.g., 60mm deep dual optical sockets), facilitating more flexible interface expansion. Although the right side of the I / O interface group cannot directly accommodate connectors due to the PCIe slot 8, additional connectors can be connected via cables to the three slots on the left (PCIe slots 4, 5, and 6), ultimately greatly improving the expandability of the EEB motherboard.

[0117] 6. By providing a second extension, the ATX power connector can be installed on the second extension, ensuring that the 12V power supply current capability meets the requirement of 700W.

[0118] While specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and not intended to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. An improved heat dissipation EEB motherboard as a chassis component, characterized in that: include: An EEB standard PCB board has a first extension on the bottom side and a second extension on the right side. A first CPU socket is provided on the PCB board, located at the lower left of the PCB board; A second CPU socket is disposed on the PCB board, located at the lower right of the PCB board, and arranged symmetrically with the first CPU socket; A first power supply module is disposed on the PCB board, located directly below the first CPU socket, and connected to the first CPU socket; A second power supply module is disposed on the PCB board, located directly below the second CPU socket, and connected to the second CPU socket; An ATX power connector is disposed on the second extension and connected to the first power module and the second power module; A first memory slot group is disposed on the PCB board, located on the left and right sides of the first CPU slot, and connected to the first CPU slot; A second memory slot group is disposed on the PCB board, located on the left and right sides of the second CPU slot, and connected to the second CPU slot; A PCIe slot group is disposed on the PCB board, located above the PCB board, and connected to the first CPU slot and the second CPU slot; A first PCIe expansion interface is provided on the PCB board and connected to the first CPU socket; A second PCIe expansion interface is provided on the PCB board and connected to the second CPU socket; A PCH is disposed on the PCB board and connected to the first CPU socket; Two upper MCIO connectors are arranged side by side on the PCB board and connected to the second CPU socket; Two lower MCIO connectors are arranged side by side on the left and right sides of the first extension, and are respectively connected to the first CPU socket and the second CPU socket; Several locking accessories are provided on the PCB board, and the EEB motherboard is locked inside the chassis by the locking accessories to serve as a chassis component.

2. The improved heat dissipation EEB motherboard as a chassis component as described in claim 1, characterized in that: The dimensions of the first extension are 304.8mm*15mm; the dimensions of the second extension are 10mm*185.3mm, and the bottom is flush with the first extension.

3. The improved heat dissipation EEB motherboard as a chassis component as described in claim 1, characterized in that: Both the first power module and the second power module are seven-phase power supply modules.

4. The improved heat dissipation EEB motherboard as a chassis component as described in claim 1, characterized in that: The first memory slot group includes: Four first memory slots are symmetrically arranged on the left and right sides of the first CPU slot, and the first memory slots on the same side are arranged vertically.

5. The improved heat dissipation EEB motherboard as a chassis component as described in claim 1, characterized in that: The second memory slot group includes: Four second memory slots are symmetrically located on the left and right sides of the second CPU slot, with the second memory slots on the same side arranged vertically.

6. The improved heat dissipation EEB motherboard as a chassis component as described in claim 1, characterized in that: The PCIe slot group includes: A PCIe slot with a number 1 is located at the upper left of the PCB board and is connected to the first CPU socket; A second PCIe slot is located at the upper left of the PCB board, to the right of the first PCIe slot, and connected to the first CPU slot. A sixth PCIe slot is located at the upper left of the PCB board, to the right of the second PCIe slot, three slots away from the second PCIe slot, and connected to the first CPU socket. An eighth-position PCIe slot is located at the upper right of the PCB board, at the same height as the first-position PCIe slot, and is connected to the second CPU socket. A 9-position PCIe slot is located at the upper right of the PCB board, to the right of the 8-position PCIe slot, and connected to the second CPU slot. A PCIe slot with a 10-position is located at the upper right of the PCB board, to the right of the PCIe slot with a 9-position, and is connected to the second CPU socket.

7. The improved heat dissipation EEB motherboard as a chassis component as described in claim 6, characterized in that: The first PCIe expansion interface is located above the middle of the second PCIe slot and the sixth PCIe slot; The second PCIe expansion interface is located in the middle of the sixth PCIe slot and the eighth PCIe slot; The PCH is located above the second PCIe expansion interface.

8. The improved heat dissipation EEB motherboard as a chassis component as described in claim 6, characterized in that: The upper MCIO connector is located between the second PCIe expansion interface and the eighth-position PCIe slot, and is positioned above the second CPU socket.

9. The improved heat dissipation EEB motherboard as a chassis component as described in claim 6, characterized in that: Also includes: An I / O interface group is disposed on the PCB board, located above the middle of the sixth and eighth PCIe slots, and connected to the PCH.

10. A wiring method for an improved heat dissipation EEB motherboard as a chassis component, characterized in that: The method requires the use of the thermally improved EEB motherboard as described in any one of claims 1 to 9, and includes the following steps in no particular order: Step S1: The top center of the first CPU socket is connected in a straight line to the bottom of the first PCIe slot, the second PCIe slot, the sixth PCIe slot, and the first PCIe expansion interface via PCIe11 signal line, PCIe12 signal line, PCIe13 signal line, and PCIe14 signal line, respectively. Step S2: The top center of the first CPU socket is connected to the top center of the second CPU socket via UPI1 signal line and UPI2 signal line, bypassing the top of the first memory slot group and the second memory slot group, and is directly connected to the PCH via DMI signal line. Step S3: The bottom center of the first CPU socket is directly connected to the lower MCIO connector on the left side via a PCIE15 signal line, and the UPI3 signal line is bypassed to the bottom center of the second memory slot group and connected to the bottom center of the second CPU socket via a UPI3 signal line. Step S4: The top center of the second CPU socket is directly connected to the PCIe slot 8, PCIe slot 9, and PCIe slot 10 via PCIe21, PCIe22, and PCIe23 signal lines, respectively, and is directly connected to the two upper MCIO connectors via PCIe24 and PCIe25 signal lines, respectively. Step S5: The bottom center of the second CPU socket is directly connected to the lower MCIO connector on the right side via a PCIE26 signal line, and the bottom left side is connected to the second PCIE expansion interface via a PCIE27 signal line through the middle of the first and second memory slot groups.

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