Apparatus for characterizing a system channel and associated methods and systems

Abstract

Apparatuses for characterizing system channels and associated methods and systems are disclosed. In one embodiment, a tester is coupled to an adapter configured to be inserted into a CPU socket of a system platform, such as a motherboard. The motherboard includes a memory socket connected to the CPU socket by a system channel. The adapter can include a connector configured to physically and electrically engage with the CPU socket, an interface configured to receive test signals from the tester, and circuitry configured to internally route the test signals to the connector. The adapter, when inserted into the CPU socket, can facilitate the tester directly evaluating signal transfer characteristics of the system channel. Accordingly, the tester can determine optimal operating parameters for a memory device in view of the system channel characteristics.

Description

Technical Field

[0001] This disclosure generally relates to devices and associated methods and systems for characterizing system channels. Background Technology

[0002] Providing high-performance semiconductor devices (e.g., high bandwidth, low power consumption) requires careful testing and optimization of operating parameters. Significant engineering resources can be allocated to testing semiconductor devices to verify functionality and / or detect potential problems, as well as estimate design robustness and performance under various operating conditions. For example, during the signal integrity (SI) testing phase, mixed-mode analysis (e.g., using an oscilloscope) can be performed to capture analog signals from the semiconductor device on a printed circuit board (PCB). The analog signals can be compared with simulation results and / or specifications to determine if the semiconductor device performs properly as designed and / or meets specifications. Furthermore, analog signals can help determine if the semiconductor device has sufficient timing margins.

[0003] In addition, various margin tests can be performed on semiconductor devices, for example, after SI testing verifies the functionality of the semiconductor device under certain operating conditions. Margin testing may include protection band testing and / or corner testing (e.g., four-corner testing) by varying voltage and temperature. Variations in temperature and voltage levels to extreme conditions can identify potential problems that the semiconductor device may encounter. Furthermore, such extreme conditions can help identify limitations (or shortcomings) in the margins met by the semiconductor device.

[0004] The performance of a semiconductor device (such as a memory device, like a DRAM device) can vary depending on the overall operating environment (or setup) in which the semiconductor devices are deployed. For example, a memory device can be tested and verified to meet various specifications under certain test environments (such as manufacturing test environments or setups). Furthermore, optimal operating parameters can be determined in the test environment of the memory device, for example, by optimizing read / write timings and voltages for optimal performance. However, when a memory device is deployed within a system (such as a system platform, like a motherboard) to operate alongside other semiconductor devices (such as the motherboard's central processing unit (CPU)), the optimal operating parameters require further modification (e.g., tuning, optimization), at least in part due to the dissimilar physical and electrical operating environments associated with the motherboard.

[0005] For example, varying lengths (and / or material properties) of the conductive traces forming one or more channels between the CPU and the memory device can alter the impedance characteristics (and associated reflection characteristics) of signals traveling across the channel. Such changes in channel characteristics can adversely affect memory device performance, necessitating modifications to the memory device's operating conditions. These modifications (e.g., tuning of operating parameters) can involve complex factors determining the memory device's performance, such as properly setting on-die termination (ODT) parameters, read / write leveling, Vref tuning, and timing training for command / address / control signals. Furthermore, tuning may be tailored to the channel characteristics of a specific motherboard, and different system vendors designing their own proprietary system platforms (e.g., motherboards) may need to perform "fine-tuning" and margin testing when deploying memory devices in their system platforms. Summary of the Invention

[0006] According to one aspect of this application, an apparatus is provided. The apparatus includes: a connector configured to connect to a first socket on a motherboard, the first socket being configured to receive a semiconductor device; an interface including a plurality of electrical contacts configured to receive one or more test signals from a tester coupled to the apparatus; and a circuit system configured to route the one or more test signals from the interface to the connector.

[0007] According to another aspect of this application, a method is provided. The method includes: receiving one or more signals at an adapter connected to a first socket of a motherboard, the adapter including a plurality of pins engaging with a plurality of sockets of the first socket; mapping the one or more signals to the plurality of pins; transmitting the one or more signals to a memory device connected to a second socket of the motherboard via a system channel coupled to the first socket, wherein the system channel couples the first socket and the second socket; receiving an output from the memory device via the system channel at the adapter, the output being generated by the memory device in response to receiving the one or more signals; and transmitting the output from the memory device to a tester that has generated the one or more signals.

[0008] According to another aspect of this application, a system is provided. The system includes: a tester; and an adapter connected to the tester, the adapter comprising: a connector configured to connect to a first socket on a motherboard, the first socket being configured to receive a central processing unit (CPU); an interface including a plurality of electrical contacts configured to receive one or more test signals from the tester; and a circuit system configured to route the one or more test signals from the interface to the connector. Attached Figure Description

[0009] This disclosure will be more fully understood from the detailed description given below and from the accompanying drawings of various embodiments thereof. Components in the drawings are not necessarily drawn to scale. Instead, the focus is on clearly illustrating the principles of this disclosure.

[0010] Figure 1 This is a block diagram illustrating the test environment for a memory device.

[0011] Figure 2 It is a block diagram illustrating the operating environment of a memory device.

[0012] Figure 3 This is a block diagram illustrating a test environment for characterizing system channels according to embodiments of the present disclosure.

[0013] Figure 4 This is a flowchart illustrating a method for characterizing a system channel according to an embodiment of the present disclosure.

[0014] Figure 5 This is a block diagram illustrating a computer system according to an embodiment of the present disclosure. Detailed Implementation

[0015] To address the aforementioned challenges, embodiments of this disclosure provide an adapter coupled to a tester (e.g., extending from the tester via a wiring harness or cable, wirelessly coupled to the tester, etc.) such that the adapter can be connected to a system platform (e.g., inserted into a CPU socket on a motherboard, replacing the CPU), the system platform including one or more sockets configured to receive memory devices (e.g., DRAM devices). Furthermore, the CPU socket is coupled to one or more DRAM sockets via one or more channels (e.g., system channels). In this manner, the tester has complete control and visibility over the system channels, across which the memory devices interact with the CPU within the system platform. In other words, the adapter facilitates the tester's evaluation of system channel characteristics to determine optimal operating parameters for memory devices deployed in the system platform, such as characterizing signal integrity on system channels of a specific motherboard and monitoring the "eye diagram" formed by digital signals traveling through the system channels.

[0016] Furthermore, adapters can be customized (e.g., custom-made) to fit into sockets on different system platforms designed by different system vendors, thus providing flexibility regarding the adaptation of different hardware configurations to system platforms. However, adapters enable testers to optimize the operating parameters of memory devices using the same test algorithms to perform best within a specific system platform, such as a complete set of test routines and / or software established for the memory device, including algorithmic patterns for programming the memory device, error correction codes optimized for the memory device, etc. Therefore, memory device manufacturers can determine the optimal set of operating parameters (e.g., ideal Basic Input / Output System (BIOS) settings) based on the system channels from various system vendors implementing the memory device, making these optimal operating parameters available to system vendors (and / or initiating their own characterization and optimization).

[0017] Figure 1 Figure 101 is a block diagram illustrating a test environment for a memory device. Figure 101 may represent a manufacturing test environment in which the functionality of a memory device (e.g., a dynamic random access memory (DRAM) device, a DRAM module containing multiple DRAM devices, a dual in-line memory module (DIMM) containing multiple memory devices) is tested and / or performance parameters (e.g., speed class, access timing, latency, etc.) of the memory device are established. Figure 101 depicts a test board 110 (which may be a printed circuit board (PCB)) containing a socket 125 and a memory device 135 connected to (e.g., inserted into) the socket 125. The socket 125 may also be referred to as a slot, such as a memory slot. The socket 125 may be coupled to a tester 115 via a test channel 120. Although Figure 101 depicts a tester 115 separate from the test board 110, in some embodiments, the tester 115 may include the test board 110.

[0018] Test channel 120 (which may include a set of sub-channels) may have been characterized prior to testing memory device 135 (e.g., based on high-frequency signal propagation characteristics, impedance characteristics, or the like), allowing tester 115 to test (or otherwise characterize) memory device 135 without any interference or disturbance from unknown characteristics of test channel 120. In this way, the manufacturer of memory device 135 can determine the operating characteristics of memory device 135 (e.g., based on signal integrity parameters and / or various analog signals captured during mixed-mode analysis) to identify any design and / or manufacturing problems associated with memory device 135. In this regard, Figure 101 can be considered an ideal operating environment for testing the functionality of memory device 135 and / or establishing performance parameters of memory device 135, for example, through signal integrity testing and / or margin testing. Furthermore, tester 115 can determine and set various parameters of memory device 135 to operate under conditions such as optimal ODT parameters, read / write leveling parameters to avoid simultaneous switching noise, Vref tuned to certain levels, etc.

[0019] although Figure 1 The test board 110 is depicted with a socket 125 (and memory device 135 inserted into the socket 125) coupled to the tester 115 via a test channel 120 to clearly illustrate the principles of the present technology. However, in other embodiments, the test board 110 may include multiple sockets 125 (e.g., 2, 3, 4, 8, 16, or even more), each configured to connect to an individual memory device 135. Thus, the test channel 120 may also be configured to couple at least a subset of the multiple sockets 125 (and therefore the multiple memory devices 135 connected thereto) to the tester 115 at a time, for example by utilizing one or more chip select (CS) signals. Alternatively or additionally, multiple test channels 120 (and / or individual test channels 120 comprising multiple sub-channels) may exist to couple the tester 115 to the test board 110 having multiple sockets 125. In some embodiments, the tester 115 may be coupled to multiple test boards 110 via multiple test channels 120.

[0020] Figure 2 Figure 201 is a block diagram illustrating the operating environment of a memory device (e.g., a DRAM device, a DRAM module, a DIMM). Figure 201 may represent an operating environment in which a system vendor deploys the memory device to include other semiconductor devices (e.g., a CPU, a reference chip, etc.). Figure 5This describes a portion of a system (such as static memory 506, data storage system 518, etc.). Figure 201 depicts a motherboard 210 (e.g., a PCB, a system platform) that includes a socket 225 (memory slot) connected to a memory device 135 (e.g., a memory device 135 inserted into a socket 225), another socket 250 (CPU socket) connected to a semiconductor device 245 (e.g., a CPU), and a system channel 220 coupling the socket 225 (and thus the memory device 135) and the socket 250 (and thus the semiconductor device 245). In some embodiments, the system channel 220 may be referred to as a bus or system bus. The semiconductor device 245 may correspond to one of a CPU, a graphics processing unit (GPU), a field-programmable gate array (FPGA), a memory controller, or an application-specific integrated circuit (ASIC). The semiconductor device 245 may be referred to hereinafter as CPU 245.

[0021] Memory device 135 may have been tested and "tuned" as described above. Figure 1 The described manufacturing test environment operates with a set of optimal operating parameters. However, the system supplier of motherboard 210 may have to verify the aforementioned set of operating parameters for memory device 135, which now operates in different operating environments depicted in FIG. 201, for example, due to differences between socket 125 of test board 110 and socket 225 of motherboard 210 (where memory device 135 is inserted), differences between test channel 120 and system channel 220, differences between tester 115 and semiconductor device 245 inserted into socket 250, etc. The system supplier may need to expend significant engineering resources (e.g., performing extensive margin testing under various operating conditions) to verify and / or determine the optimal operating conditions for memory device 135 within the operating environment of FIG. 201.

[0022] although Figure 2 The motherboard 210 is depicted as having a socket 225 (and a memory device 135 inserted into the socket 225) coupled to the CPU 245 via system channel 220 to clearly illustrate the principles of the present technology. However, in other embodiments, the motherboard 210 may include more than one socket 225, each configured to connect to an individual memory device 135. Additionally, the motherboard 210 may include more than one system channel 220. For example, the motherboard 210 may be configured to include two (2) DIMMs per system channel 220. Furthermore, the CPU 245 may transmit (receive) all signals shared between the two DIMMs except for the chip select (CS) signal.

[0023] Figure 3This is a block diagram 301 illustrating a test environment for characterizing a system channel according to embodiments of the present disclosure. Block diagram 301 includes aspects of block diagram 201. For example, FIG301 depicts a motherboard 210, which includes a socket 225, a socket 250 connected to a memory device 135 (e.g., a memory device 135 inserted into a socket 225), and a system channel 220 coupling the socket 225 (and thus the memory device 135) to the socket 250. Furthermore, FIG301 depicts an adapter 360 connected to the socket 250 (e.g., inserted into the socket 250, replacing the CPU 245). Additionally, the adapter 360 is coupled to a tester 115, for example, via a wiring harness, cable, or wireless link. Thus, FIG301 illustrates an adapter 360 inserted into the socket 250 to replace the CPU 245 (which is coupled to the tester 115). In this manner, the tester 115 can establish complete control and / or visibility over system channel 220, and the memory device 135 exchanges (transmit / receive, transmit) signals with the CPU 245 across system channel 220 in the operating environment of the motherboard 210. In some embodiments, the adapter 360 may be configured as a daughterboard compatible with the motherboard 210.

[0024] Adapter 360 may include a connector 375 configured to connect to (e.g., insert into) a receptacle 250 of motherboard 210. Adapter 360 may also include an interface 365 comprising multiple electrical contacts configured to receive one or more signals (e.g., test signals) from a tester 115 coupled to adapter 360. Furthermore, adapter 360 may receive output from memory device 135 via system channel 220, and interface 365 may be configured to transmit the output of memory device 135 to tester 115. In some embodiments, adapter 360 includes a circuit system 370 (e.g., a router) configured to route one or more signals from interface 365 to connector 375. Connector 375 may include multiple pins (e.g., leads) configured to engage with multiple sockets of receptacle 250 to provide mechanical and electrical connections therebetween. Therefore, circuit system 370 is configured to map one or more signals to individual pins of connector 375. In other embodiments, circuitry 370 may be omitted; for example, interface 365 may be directly coupled to connector 375, as depicted by dashed lines bypassing circuitry 370. In such embodiments, interface 365 may be configured to route signals to connector 375 and vice versa. Additionally, interface 365 (or connector 375) may be configured to map signals to individual pins of connector 375.

[0025] In this manner, adapter 360 can transmit one or more signals (e.g., test signals) across system channel 220, which couples second socket 250 to first socket 225 of motherboard 210, to memory device 135 connected to first socket 225. In response to receiving one or more signals across system channel 220, memory device 135 can generate an output (e.g., if one or more signals contain a read command, then data is transferred from a data pin across system channel 220). The output generated by memory device 135 may contain current and / or voltage waveforms as a function of time, such as a pulse sequence representing two or more levels of one or more information bits. Adapter 360 is configured to receive output from memory device 135 via system channel 220 such that adapter 360 can transmit the output from memory device 135 to tester 115 via interface 365, for example, via multiple electrical contacts further configured to transmit the output to tester 115.

[0026] In some embodiments, one or more signals (e.g., test signals) have been determined based on testing the memory device 135 in a test environment unaffected by a specific motherboard (e.g., the manufacturing test environment of FIG. 101 including test channel 120). Referring above... Figure 1 To elaborate further, the signal transmission characteristics of test channel 120 may have been predetermined before testing memory device 135 by coupling it to tester 115 via test channel 120. Furthermore, memory device 135 may have been configured with optimal operating parameters based on testing and characterizing memory device 135 via test channel 120. Therefore, one or more signals can be considered as initial test conditions (e.g., a first set of signals) for tester 115 to test (or characterize) memory device 135 in the test environment of FIG. 301, which includes system channel 220.

[0027] Tester 115 can receive the output of memory device 135 via adapter 360 and determine that a second set of signals (e.g., test signals) different from the first set of signals (e.g., test signals) is generated. Tester 115 can then transmit the second set of signals to adapter 360, allowing adapter 360 to transmit the second set of signals to memory device 135 across system channel 220. Memory device 135 can generate another output (e.g., a second output) in response to receiving the second set of signals and transmit the second output to adapter 360 across system channel 220. Adapter 360 can then transmit the second output to tester 115 via interface 365. In some embodiments, tester 115 can compare the output with the second output to determine the signal transmission characteristics of system channel 220 based on the comparison. Furthermore, tester 115 can determine to modify certain operating parameters of memory device 135 (e.g., decrease / increase Vref settings, adjust ODT parameters, fine-tune timing parameters of internal command / address signal lines of the memory module, etc.) to optimize the performance of memory device 135. Tester 115 can repeatedly exchange signals and corresponding outputs from memory device 135 across system channel 220 via adapter 360 until an optimal set of operating conditions for memory device 135 can be determined in a test environment including system channel 220.

[0028] In this way, the manufacturer of memory device 135 can test in the environment of FIG301, which includes system channel 220 (which is consistent with reference). Figure 2 The optimal operating conditions for memory device 135 are determined within an operating environment (e.g., very similar to that in a customer system), the test environment of Figure 301. In some cases, the manufacturer may physically modify aspects of the design and manufacturing process of memory device 135 (e.g., the pin configuration of the DIMM) and / or change aspects of the design and manufacturing process of memory device 135 (or a future product similar to memory device 135) based on the determined optimal operating conditions to improve performance in the customer system. Furthermore, the manufacturer may determine multiple sets of optimal operating conditions, each customized for its corresponding system platform, allowing system vendors to begin their verification (and / or optimization) using optimal operating conditions customized for their proprietary system platforms. In some cases, the manufacturer may offer suggestions for physically modifying the system platform. For example, the manufacturer may suggest repositioning socket 225 (and / or socket 250) to improve routing of motherboard 210, changing the overall layout and / or materials of motherboard 210 to reduce crosstalk, modifying power delivery to memory device 135, or utilizing different sockets to improve signal integrity.

[0029] Although in the foregoing example embodiments, memory devices deployed in a system platform (e.g., a motherboard) have been described and illustrated as DRAM devices and / or DRAM modules (or DIMMs), in other embodiments, additional and / or alternative memory devices may be provided. For example, 3D NAND memory devices, phase-change memory (PCM) devices, ferroelectric random access memory (FRAM) devices, synchronous dynamic RAM (SDRAM) devices, etc., may also be utilized. Furthermore, while adapters have been described and illustrated as being mounted (e.g., inserted) into CPU sockets to characterize the system channel between the CPU socket and memory socket of the system platform, the technology is not limited thereto. For example, adapters may be designed (or modified) to be mounted (e.g., inserted) into other sockets of the system platform, such that the adapter can cross different channels (e.g., a portion of bus 530 coupled to static memory 506, a portion of bus 530 coupled to data storage system 518 (e.g., a solid-state drive), as referenced... Figure 5 (Description) Provides direct access to other sockets coupled to different components of the system platform. In some embodiments, this technology can be used to characterize (or control) power consumption at the system level (e.g., within the system platform), for example, to determine the optimal operating conditions for various components of the system platform from a power control perspective.

[0030] Figure 4 This is a flowchart 400 illustrating a method for characterizing a system channel according to an embodiment of the present disclosure. Flowchart 400 may be an example of a method executable by an adapter (e.g., adapter 360) coupled to a tester, or may include aspects of said method, as referenced... Figure 3 describe.

[0031] The method includes receiving one or more signals at an adapter connected to a first socket on the motherboard, the adapter comprising multiple pins engaging with multiple sockets of the first socket (block 410). According to one aspect of the present technology, the receiving feature of block 410 may be performed by interface 365, as referenced... Figure 3 describe.

[0032] The method further includes mapping one or more signals to multiple pins (block 415). According to one aspect of this technology, the mapping feature of block 415 can be performed by circuit system 370, as referenced... Figure 3 describe.

[0033] The method further includes transmitting one or more signals to a memory device connected to a second socket on a motherboard via a system channel coupled to the first socket, wherein the system channel couples the first socket to the second socket (block 420). According to one aspect of the present invention, the transmission characteristics of block 420 may be performed by connector 375, as referenced... Figure 3 describe.

[0034] The method further includes receiving an output from the memory device via a system channel at the adapter, the output being generated by the memory device in response to receiving one or more signals (block 425). According to one aspect of the present invention, the receiving feature of block 425 may be performed by connector 375, as referenced... Figure 3 describe.

[0035] The method further includes transmitting output from the memory device to a tester that has generated one or more signals (block 430). According to one aspect of the present invention, the transmission feature of block 430 can be performed by interface 365, as referenced... Figure 3 describe.

[0036] In some embodiments, one or more signals correspond to a first set of signals, and the method may further include: receiving a second set of signals at an adapter in response to transmitting an output from a memory device to a tester, the second set of signals being different from the first set of signals; mapping the second set of signals to a plurality of pins; and transmitting the second set of signals to the memory device via a system channel.

[0037] In some embodiments, the output corresponds to a first output generated by the memory device, and the method may further include: receiving a second output from the memory device via a system channel at an adapter, the second output being generated by the memory device in response to receiving a second set of signals; and transmitting the second output from the memory device to a tester.

[0038] Figure 5 This is a block diagram illustrating a computer system according to embodiments of the present disclosure. (See reference...) Figure 5 As can be seen, an instance machine of computer system 500 may contain a set of instructions that, when executed, cause the machine to perform various functions. In alternative embodiments, the machine may be connected (e.g., networked) to other machines in a LAN, intranet, extranet, and / or the Internet. The machine may operate as a server or client machine in a client-server network environment, as a peer-to-peer (or distributed) network environment, or as a server or client machine in a cloud computing infrastructure or environment.

[0039] The machine may be a personal computer (PC), tablet PC, set-top box (STB), personal digital assistant (PDA), cellular phone, network device, server, network router, switch, or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) specifying actions to be taken by the machine. Furthermore, while a single machine has been described, the term "machine" should also be considered to include any collection of machines that individually or collectively execute a set (or more) of instructions to perform any or more of the methods discussed herein.

[0040] Example computer system 500 includes a processing device 502, a main memory 504 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM), such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.), a static memory 506 (e.g., flash memory, static random access memory (SRAM), etc.), and a data memory device 518, which communicate with each other via a bus 530. In some embodiments, it may be as described herein (e.g., using references) Figure 3 The described adapter 360 determines the signal transmission characteristics of bus 530, thereby optimizing the operating parameters of main memory 504 to provide high performance for computer system 500. Processing device 502 represents one or more general-purpose processing devices, such as a microprocessor, central processing unit (CPU), or the like. More specifically, processing device 502 may be a Complex Instruction Set Computing (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, a Very Long Instruction Word (VLIW) microprocessor, or a processor implementing other instruction sets or combinations of instruction sets. Processing device 502 may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, or the like. Processing device 502 is configured to execute instructions 526 for performing the operations and steps discussed herein. Computer system 500 may further include a network interface device 508 for communication via network 520.

[0041] Data storage system 518 may include non-transitory machine-readable storage medium 524 (also referred to as computer-readable medium) storing one or more sets of instructions 526 or software embodying any one or more of the methods or functions described herein. Instructions 526 may also reside wholly or at least partially in main memory 504 and / or processing device 502 during execution by computer system 500, which also constitute machine-readable storage medium.

[0042] Although the non-transitory machine-readable storage medium 524 is shown as a single medium in the exemplary embodiment, the term "machine-readable storage medium" should be considered to include a single medium or multiple media storing one or more sets of instructions. The term "machine-readable storage medium" should also be considered to include any medium capable of storing or encoding a set of instructions for machine execution and causing the machine to perform any or more of the methods of this disclosure. Therefore, the term "machine-readable storage medium" should be considered to include (but is not limited to) solid-state memory, optical media, and magnetic media.

[0043] Certain portions of the foregoing detailed description have been presented based on the algorithms and symbolic representations of operations on data bits within computer memory. These algorithmic descriptions and representations are the means by which those skilled in the art of data processing most effectively communicate the essence of their work to others skilled in the art. Here, an algorithm is generally considered to be a self-consistent sequence of operations that leads to a desired result. An operation is an operation that requires the physical manipulation of physical quantities. Usually, but not necessarily, these quantities take the form of electrical or magnetic signals that can be stored, combined, compared, and otherwise manipulated. It has sometimes proven convenient, primarily for general reasons, to refer to these signals as bits, values, elements, symbols, characters, items, numbers, or the like.

[0044] However, it should be remembered that all these and similar terms should be associated with appropriate physical quantities and are merely convenient labels applied to those quantities. This disclosure may relate to the operation and processes of a computer system or similar electronic computing device that manipulates and transforms data representing physical (electronic) quantities in the registers and memories of the computer system into other data similarly represented in the memory or registers of the computer system or other such information storage systems.

[0045] This disclosure also relates to apparatus for performing the operations described herein. Such apparatus may be specifically constructed for its intended purpose, or may comprise a general-purpose computer selectively activated or reconfigured by a computer program stored in a computer. This computer program may be stored in a computer-readable storage medium, such as (but not limited to) any type of disk (including floppy disks, optical disks, CD-ROMs, and magneto-optical disks), read-only memory (ROM), random access memory (RAM), EPROM, EEPROM, magnetic cards, or optical cards, or any type of media suitable for storing electronic instructions, each coupled to a computer system bus.

[0046] The algorithms and displays presented herein are not inherently related to any particular computer or other device. Various general-purpose systems can be used with the programs based on the teachings herein, or it may prove convenient to construct more specialized devices to execute the methods. The structures of various such systems will appear as described below. Furthermore, this disclosure is described without reference to any particular programming language. It will be understood that the teachings of this disclosure described herein can be implemented using various programming languages.

[0047] This disclosure may be provided as a computer program product or software, which may include a machine-readable medium having instructions stored thereon, the instructions being used to program a computer system (or other electronic device) to perform processes according to this disclosure. The machine-readable medium includes any mechanism for storing information in a machine-readable (e.g., computer-readable) form. In some embodiments, the machine-readable (e.g., computer-readable) medium includes machine-readable (e.g., computer-readable) storage media, such as read-only memory (“ROM”), random access memory (“RAM”), disk storage media, optical storage media, flash memory components, etc.

[0048] In the foregoing description, embodiments of the present disclosure have been described with reference to specific examples. It will be apparent that various modifications can be made to the embodiments of the present disclosure without departing from the broader spirit and scope set forth in the appended claims. Therefore, the specification and drawings should be considered illustrative rather than limiting.

[0049] Those skilled in the art will understand that the above can be modified in various ways. Figures 1 to 5 The components and blocks described herein. For example, the order of logic can be rearranged, sub-steps can be executed in parallel, the described logic can be omitted, other logic can be included, and so on. In some implementations, one or more of the above components can perform one or more of the processes described below.

[0050] It should be noted that the above methods describe possible implementations, and the operations and steps may be rearranged or otherwise modified, and other implementations are possible. Furthermore, embodiments from two or more of the methods may be combined.

[0051] The information and signals described herein can be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that can be referenced throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof. Some diagrams may illustrate a signal as a single signal; however, those skilled in the art will understand that a signal can represent a signal bus, where the bus can have various bit widths.

[0052] The functionality described herein can be implemented in hardware, software executed by a processor, firmware, or any combination thereof. Other examples and implementations are within the scope of this disclosure and the appended claims. Features implementing the functionality can also be physically located at various locations, including portions distributed such that the functionality is implemented at different physical locations.

[0053] In this specification, references to "implementation" (e.g., "some implementations," "various implementations," "one implementation," "implementation," etc.) mean that a specific feature, structure, or characteristic described in connection with an implementation is included in at least one embodiment of this disclosure. These phrases appearing in various places in the specification do not necessarily all refer to the same implementation, nor do they necessarily refer to a single or alternative implementation that is mutually exclusive with other implementations. Furthermore, various features that may be exhibited by some implementations but not others are described. Similarly, various requirements are described, which may be requirements for some implementations but not others.

[0054] As used herein, above the threshold means: the value of the comparison item is higher than any other specified value, the comparison item is among a specified number of items with a maximum value, or the comparison item has a value within a specified highest percentage value. As used herein, below the threshold means: the value of the comparison item is lower than any other specified value, the comparison item is among a specified number of items with a minimum value, or the comparison item has a value within a specified lowest percentage value. As used herein, within the threshold means: the value of the comparison item is between two other specified values, the comparison item is between a specified number of items in the middle, or the comparison item has a value within a specified percentage range in the middle. When no other definition is provided, relative terms (such as high or unimportant) can be understood as assigning a value and determining how said value is compared to a given threshold. For example, the phrase "select fast connection" can be understood as meaning selecting a connection with a value assigned to its connection speed corresponding to a value above the threshold.

[0055] As used herein (included in the claims), the word "or" in a list of items (e.g., a list of items beginning with a phrase such as "at least one of..." or "one or more of...") indicates an inclusive list, such that, for example, a list of at least one of A, B, or C means A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Furthermore, as used herein, the phrase "based on" should not be construed as referring to a closed set of conditions. For example, without departing from the scope of this disclosure, an exemplary step described as "based on condition A" may be based on both condition A and condition B. In other words, as used herein, the phrase "based on" should be interpreted in the same way as the phrase "at least partially based on".

[0056] As can be understood from the foregoing, specific embodiments of the invention have been described herein for illustrative purposes, but various modifications may be made without departing from the scope of the invention. Specifically, numerous specific details have been discussed in the foregoing description to provide a thorough and feasible description of embodiments of the present technology. However, those skilled in the art will recognize that this disclosure may be practiced without one or more of these specific details. In other instances, well-known structures or operations typically associated with memory systems and devices have not been shown or described in detail so as not to obscure other aspects of the present technology. Generally, it should be understood that various other devices, systems, and methods, in addition to the specific embodiments disclosed herein, may also be within the scope of this technology.

Claims

1. A device for characterizing a system channel, comprising: A connector configured to connect to a first socket on a motherboard, the first socket being configured to receive a semiconductor device; An interface comprising a plurality of electrical contacts configured to receive one or more test signals from a tester coupled to the device; and A circuit system configured to route the one or more test signals from the interface to the connector. The device is configured to transmit one or more test signals to a memory device connected to the second socket via a system channel of the motherboard that couples the first socket to the second socket when connected to the first socket via the connector.

2. The device of claim 1, wherein the connector includes a plurality of pins configured to engage with a plurality of sockets of the first receptacle to provide mechanical and electrical connections therebetween, and wherein the circuitry is further configured to map the one or more test signals to individual pins of the connector.

3. The device of claim 1, wherein the semiconductor device corresponds to one of the following: a central processing unit (CPU), a graphics processing unit (GPU), a field-programmable gate array (FPGA), a memory controller, or an application-specific integrated circuit (ASIC).

4. The device of claim 1, wherein the one or more test signals have been determined based on testing a predetermined memory device in a test environment comprising a test channel having predetermined signal transmission characteristics and configured to couple the predetermined memory device to the tester.

5. The device of claim 4, wherein the memory device is a dynamic random access memory (DRAM) device.

6. The device of claim 1, wherein the device is further configured to receive an output from the memory device via the system channel, the output being generated by the memory device in response to receiving the one or more test signals.

7. The device of claim 6, wherein the output generated by the memory device comprises a current and / or voltage waveform as a function of time.

8. The device of claim 6, wherein the device is further configured to transmit the output to the tester via the interface.

9. A method for characterizing a system channel, comprising: One or more signals are received at an adapter connected to a first socket on the motherboard, the adapter comprising multiple pins that engage with multiple sockets of the first socket; Map the one or more signals to the multiple pins; The one or more signals are transmitted to a memory device connected to a second socket on the motherboard via a system channel coupled to the first socket, wherein the system channel couples the first socket and the second socket; At the adapter, an output is received from the memory device via the system channel, the output being generated by the memory device in response to receiving one or more signals; and The output from the memory device is transmitted to a tester that has generated the one or more signals.

10. The method of claim 9, wherein the one or more signals correspond to a first group of signals, the method further comprising: In response to transmitting the output from the memory device to the tester, a second set of signals, different from the first set of signals, is received at the adapter; Map the second group of signals to the plurality of pins; and The second set of signals is transmitted to the memory device via the system channel.

11. The method of claim 10, wherein the output corresponds to a first output generated by the memory device, the method further comprising: At the adapter, a second output is received from the memory device via the system channel, the second output being generated by the memory device in response to receiving the second set of signals; and The second output from the memory device is transmitted to the tester.

12. The method according to claim 9, wherein: The first socket is configured to receive one of a central processing unit (CPU), a graphics processing unit (GPU), a field-programmable gate array (FPGA), a memory controller, or an application-specific integrated circuit (ASIC); and The memory device is a dynamic random access memory (DRAM) device.

13. A system for characterizing a system channel, comprising: Tester; and An adapter, which is connected to the tester, the adapter comprising: A connector configured to connect to a first socket on a motherboard, the first socket being configured to receive a central processing unit (CPU); An interface comprising a plurality of electrical contacts configured to receive one or more test signals from the tester; and A circuit system configured to route the one or more test signals from the interface to the connector. The adapter is configured to transmit one or more test signals to a memory device connected to the second socket via a system channel of the motherboard that couples the first socket to the second socket when connected to the first socket via the connector.

14. The system of claim 13, wherein the connector includes a plurality of pins configured to engage with a plurality of sockets of the first receptacle to provide mechanical and electrical connections therebetween, and wherein the circuitry is further configured to map the one or more test signals to individual pins of the connector.

15. The system of claim 13, wherein the adapter is further configured to receive an output from the memory device via the system channel, the output being generated by the memory device in response to receiving the one or more test signals.

16. The system of claim 15, wherein the adapter is further configured to transmit the output to the tester via the interface.

17. The system of claim 16, wherein the one or more test signals correspond to a first set of test signals, and wherein the tester is configured to: Receive the output from the adapter; Based at least in part on the received output, a second set of test signals different from the first set of test signals is determined; and The second set of test signals is transmitted to the adapter.

18. The system of claim 17, wherein the tester is further configured to: Receive a second output generated by the memory device in response to the transmission of the second set of test signals; and The output is compared with the second output to determine the signal transmission characteristics of the system channel.

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