Fusion packaging structure of driving IC (Integrated Circuit) and LED (Light Emitting Diode) chip and light emitting device

Abstract

The utility model discloses a drive IC and LED chip fusion packaging structure and a light emitting device, the packaging structure comprises a support, a bonding pad assembly, a light emitting chip and a drive IC, the support is provided with a first bowl cup and a second bowl cup, and a cup opening of the first bowl cup and a cup opening of the second bowl cup are respectively located on two opposite side surfaces of the support; the bonding pad assembly comprises a positive electrode bonding pad, a negative electrode bonding pad, a data input bonding pad and a driving output bonding pad which are arranged on the support, the first side faces of the positive electrode bonding pad and the driving output bonding pad are exposed in the first bowl cup, and the second side faces of the positive electrode bonding pad, the negative electrode bonding pad, the data input bonding pad and the driving output bonding pad are exposed in the second bowl cup; the light-emitting chip is arranged in the first bowl cup, and the light-emitting chip is electrically connected with the positive electrode bonding pad and the driving output bonding pad; the driving IC is arranged in the second bowl cup and electrically connected with the positive electrode bonding pad, the negative electrode bonding pad, the data input bonding pad and the driving output bonding pad. According to the technical scheme, the light-emitting effect of a product can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp beads, and particularly relates to a fusion packaging structure of a driving IC and an LED chip and a light-emitting device. Background Art

[0002] A light-emitting diode (LED) is a semiconductor light-emitting device that emits light by exciting a semiconductor material with an electric current and is widely used in the fields of lighting, display, and signal. With the continuous expansion of LED application scenarios, especially in intelligent lighting systems, higher requirements are put forward for the precise control and multifunctionalization of LEDs. To achieve more complex light output control, such as functions like brightness adjustment and color change, modern LED structures not only include light-emitting chips but also integrate driving integrated circuits (driving ICs). A driving IC is a dedicated electronic controller used to manage the current and voltage supplied to the LED to achieve precise control and protection of the LED.

[0003] However, the existing LED packaging structures integrating driving ICs usually adopt a single bowl-cup design, that is, the driving IC and the light-emitting chip are packaged in the same bowl-cup. This design has several obvious disadvantages: First, since the driving IC occupies part of the space inside the bowl-cup, the light-emitting chip cannot be placed at the geometric center of the bowl-cup, which will affect the light-emitting uniformity and optical performance of the LED and it is difficult to achieve an ideal light-emitting effect. Summary of the Utility Model

[0004] The main purpose of the utility model is to propose a fusion packaging structure of a driving IC and an LED chip, aiming to solve the technical problem of poor light-emitting effect of the LED in the prior art.

[0005] To achieve the above purpose, the fusion packaging structure of the driving IC and the LED chip proposed by the utility model includes a bracket, a pad assembly, a light-emitting chip, and a driving IC;

[0006] The bracket is formed with a first bowl-cup and a second bowl-cup, and the cup mouths of the first bowl-cup and the second bowl-cup are respectively located on two opposite sides of the bracket;

[0007] The pad assembly includes a positive pad, a negative pad, a data input pad, and a driving output pad provided on the bracket. The first sides of the positive pad and the driving output pad are exposed inside the first bowl-cup, and the second sides of the positive pad, the negative pad, the data input pad, and the driving output pad are exposed inside the second bowl-cup;

[0008] The light-emitting chip is arranged inside the first bowl-cup, and the light-emitting chip is electrically connected to the positive pad and the driving output pad respectively;

[0009] The driving IC is disposed within the second bowl cup, and the driving IC is electrically connected to the positive electrode pad, the negative electrode pad, the data input pad, and the driving output pad respectively.

[0010] Optionally, the pad assembly includes a data output pad disposed on the bracket, a second side surface of the data output pad is exposed within the second bowl cup, and the driving IC is electrically connected to the data output pad.

[0011] Optionally, the volume of the first bowl cup is larger than the volume of the second bowl cup.

[0012] Optionally, the number of the driving output pads is three, first side surfaces of the three driving output pads are each exposed within the first bowl cup, and second side surfaces of the three driving output pads are each exposed within the second bowl cup;

[0013] The number of the light-emitting chips is the same as and corresponds one-to-one to the number of the driving output pads, each light-emitting chip is disposed within the first bowl cup, and each light-emitting chip is electrically connected to the positive electrode pad and the corresponding driving output pad respectively;

[0014] The driving IC is electrically connected to the three driving output pads respectively.

[0015] Optionally, each driving output pad includes a strip-shaped pad strip, the pad strips of the three driving output pads are disposed within the bracket and arranged in parallel, a first side surface of each pad strip is exposed within the first bowl cup, and a second side surface of each pad strip is exposed within the second bowl cup.

[0016] Optionally, a first exposed portion and a first pressed portion are included on the first side surface of each pad strip, and the first exposed portion is electrically connected to the corresponding light-emitting chip;

[0017] The fusion packaging structure of the driving IC and the LED chip includes a first fixing glue block, the first fixing glue block is fixed within the first bowl cup and abuts against each of the first pressed portions, and a positive projection of the first fixing glue block on the bottom of the first bowl cup and a positive projection of each light-emitting chip on the bottom of the first bowl cup do not overlap.

[0018] Optionally, a second exposed portion and a second pressed portion are included on the second side surface of each pad strip, and the second exposed portion is electrically connected to the driving IC;

[0019] The fusion packaging structure of the driving IC and the LED chip includes a second fixing glue block, the second fixing glue block is fixed within the second bowl cup and abuts against each of the second pressed portions.

[0020] Optionally, the first bowl cup is filled with a first colloid, and the material of the first colloid is a light-transmitting material.

[0021] Optionally, the second bowl cup is filled with a second colloid.

[0022] Optionally, the second bowl cup forms a cup mouth on the back surface of the bracket;

[0023] The positive electrode pad, the negative electrode pad, the data input pad, and the drive output pad are all embedded in the bracket, and each pad extends from the inside of the bracket to the side surface of the bracket and forms an exposed section outside the bracket, and each of the exposed sections extends to the back surface of the bracket after being bent to form corresponding external electrical connection pins.

[0024] The present utility model also provides a light-emitting device, which includes a fusion packaging structure of a driving IC and an LED chip. The fusion packaging structure of the driving IC and the LED chip includes a bracket, a pad assembly, a light-emitting chip, and a driving IC;

[0025] The bracket is formed with a first bowl cup and a second bowl cup, and the cup mouths of the first bowl cup and the second bowl cup are respectively located on two opposite side surfaces of the bracket;

[0026] The pad assembly includes a positive electrode pad, a negative electrode pad, a data input pad, and a drive output pad provided on the bracket. The first side surfaces of the positive electrode pad and the drive output pad are exposed in the first bowl cup, and the second side surfaces of the positive electrode pad, the negative electrode pad, the data input pad, and the drive output pad are exposed in the second bowl cup;

[0027] The light-emitting chip is disposed in the first bowl cup, and the light-emitting chip is electrically connected to the positive electrode pad and the drive output pad respectively;

[0028] The driving IC is disposed in the second bowl cup, and the driving IC is electrically connected to the positive electrode pad, the negative electrode pad, the data input pad, and the drive output pad respectively.

[0029] The integrated packaging structure of the driving IC and the LED chip in the technical solution of the present utility model realizes multiple technical effects by separately arranging the light-emitting chip and the driving IC in two independent bowl cups: First, since only the light-emitting chip is accommodated in the first bowl cup, the chip can be accurately placed at the geometric center position of the first bowl cup, thereby significantly improving the light-emitting uniformity and optical performance of the integrated packaging structure of the driving IC and the LED chip; Second, the driving IC is separately packaged in the second bowl cup, effectively avoiding the stress problem caused by the difference in material properties (especially the different coefficients of thermal expansion) between the light-emitting chip and the driving IC, greatly improving the reliability of the packaging structure, and reducing the risk of peeling or cracking of the colloid used for packaging in the bowl cup (the first bowl cup or the second bowl cup); Furthermore, this separated design improves the overall thermal management because the heat generated by the driving IC no longer directly affects the light-emitting chip, thereby improving the heat dissipation effect of the integrated packaging structure of the driving IC and the LED chip, which is beneficial to maintaining high luminous efficiency and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0031] Figure 1 FIG. is a schematic structural diagram of an embodiment of the integrated packaging structure of the driving IC and the LED chip of the present utility model;

[0032] Figure 2 is Figure 1 a schematic structural diagram of another perspective of the integrated packaging structure of the driving IC and the LED chip in ;

[0033] Figure 3 is Figure 1 a schematic structural diagram of the pad assembly in the integrated packaging structure of the driving IC and the LED chip in ;

[0034] Figure 4 is Figure 3 a schematic structural diagram of another perspective of the pad assembly in.

[0035] Description of the reference numerals in the drawings:

[0036] 1. Bracket; 11. First bowl cup; 12. Second bowl cup; 2. Pad assembly; 21. Positive pad; 211. Exposed section; 22. Negative pad; 23. Data input pad; 24. Data output pad; 25. Drive output pad; 251. Pad strip; 251a. First exposed part; 251b. First compressed part; 251c. Second exposed part; 251d. Second compressed part; 3. Light-emitting chip; 4. Drive IC; 5. First fixing glue block; 6. Second fixing glue block.

[0037] The realization, functional characteristics and advantages of the purpose of the present utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings. Specific embodiments

[0038] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0039] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0040] In addition, the descriptions involving "first", "second", etc. in the present utility model are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, "and / or" throughout the text includes three solutions. Taking A and / or B as an example, it includes the technical solution of A, the technical solution of B, and the technical solution that both A and B are satisfied. In addition, the technical solutions between the various embodiments can be combined with each other, and it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0041] The present utility model proposes a fusion packaging structure of a drive IC and an LED chip.

[0042] In the embodiments of the present utility model, as Figures 1 to 4 shown, the fusion packaging structure of the drive IC and the LED chip includes a bracket 1, a pad assembly 2, a light-emitting chip 3 and a drive IC 4;

[0043] The bracket 1 is formed with a first cup 11 and a second cup 12. The mouths of the first cup 11 and the second cup 12 are respectively located on two opposite sides of the bracket 1.

[0044] The pad assembly 2 includes a positive pad 21, a negative pad 22, a data input pad 23, and a drive output pad 25 disposed on the bracket 1. The first sides of the positive pad 21 and the drive output pad 25 are exposed inside the first cup 11, and the second sides of the positive pad 21, the negative pad 22, the data input pad 23, and the drive output pad 25 are exposed inside the second cup 12.

[0045] The light-emitting chip 3 is disposed inside the first cup 11, and the light-emitting chip 3 is electrically connected to the positive pad 21 and the drive output pad 25 respectively.

[0046] The drive IC 4 is disposed inside the second cup 12, and the drive IC 4 is electrically connected to the positive pad 21, the negative pad 22, the data input pad 23, and the drive output pad 25 respectively.

[0047] It should be noted that the side of the bracket 1 where the first cup 11 is formed is the light-emitting surface, and the side of the bracket 1 where the second cup 12 is formed is the back surface. During installation, the back surface of the bracket 1 faces the circuit board.

[0048] Specifically, the bracket 1 is the main structure of the integrated package structure of the drive IC and the LED chip. It can be made of various suitable materials, such as plastic, ceramic, or metal, etc. The bracket 1 is formed with a first cup 11 and a second cup 12. The first cup 11 is used to accommodate the light-emitting chip 3, while the second cup 12 is used to accommodate the drive IC 4. This design can effectively separate the light-emitting part and the control part.

[0049] The light-emitting chip 3 can be of various types, such as made of materials like gallium arsenide (GaAs), gallium nitride (GaN), etc. Different light-emitting chips 3 can emit different colors of light. The light-emitting chip 3 realizes power supply and control through electrical connection with the positive pad 21 and the drive output pad 25. The drive IC 4 can be various types of integrated circuits, such as a constant current driver, a PWM controller, etc. The drive IC 4 realizes precise control of the light-emitting chip 3 and function management of the entire integrated package structure of the drive IC and the LED chip through electrical connection with each pad.

[0050] There are various implementation methods for the electrical connection between the light-emitting chip 3 and the pads. The light-emitting chip 3 can be welded to the positive pad 21 and the drive output pad 25 respectively through two solder joints provided at its bottom, or can be connected to these two pads through two conductive wires (such as gold wires) respectively, or one solder joint can be directly welded to one of the pads, and the other end is connected to the other pad through a conductive wire. These different connection methods can be selected according to the specific chip size, pad layout and process requirements to achieve optimal electrical performance and reliability.

[0051] Similarly, there are also various possible implementation methods for the electrical connection between the drive IC 4 and each pad (positive pad 21, negative pad 22, data input pad 23 and drive output pad 25). Multiple welding points can be provided at the bottom of the drive IC 4, and these welding points are directly welded to each pad respectively to achieve a more compact structure and a shorter electrical connection path. Another way is that the drive IC 4 is connected to each pad through multiple conductive wires, which provides greater layout flexibility.

[0052] In the present utility model, there is no direct connection between the drive IC 4 and the light-emitting chip 3 through a conductive wire, but an indirect connection is achieved through the drive output pad 25. This design avoids the drive IC 4 or the light-emitting chip 3 from becoming a "two-solder joint". A "two-solder joint" refers to the second connection point of the conductive wire during the welding process. Specifically, when one end of the conductive wire is first welded to the drive IC 4 and then the other end is welded to the light-emitting chip 3, the light-emitting chip 3 becomes a "two-solder joint". On the contrary, if the conductive wire is first welded to the light-emitting chip 3 and then welded to the drive IC 4, then the drive IC 4 becomes a "two-solder joint". Different from a single solder joint, a single solder joint melts the gold wire into a sphere through current and then directly welds the sphere to the corresponding electrode using the ultrasonic bonding principle; a two-solder joint requires the gold wire to be cut into a specific shape by a ceramic nozzle and cutting and bonding are carried out synchronously on the electrode.

[0053] During the two-solder joint welding process, the ceramic nozzle cuts and welds synchronously on the electrode, which exerts greater power and pressure on the electrode, increasing the mechanical stress. This mechanical stress forms a relative shear force between the two electrodes of the chip. At the same time, the heat generated during the welding process causes thermal deformation stress, further exacerbating the influence of the mechanical stress. For the thin and brittle light-emitting chip 3 (especially the red light chip) and the drive IC 4, this increased mechanical stress and thermal deformation stress are extremely likely to cause the light-emitting chip 3 or the drive IC 4 to crack or be damaged due to stress.

[0054] By avoiding the drive IC 4 and the light-emitting chip 3 from becoming two-solder joints, the present utility model greatly reduces the risk of cracking or damage to the light-emitting chip 3 or the drive IC 4 and improves the product reliability.

[0055] It is not difficult to understand that for the integrated packaging structure of the driving IC and the LED chip in the technical solution of the present utility model, by separately arranging the light-emitting chip 3 and the driving IC 4 in two independent cup-shaped holders, this design achieves multiple technical effects: First, since only the light-emitting chip 3 is accommodated in the first cup-shaped holder 11, the chip can be accurately placed at the geometric center position of the first cup-shaped holder 11, thereby significantly improving the light-emitting uniformity and optical performance of the integrated packaging structure of the driving IC and the LED chip; Second, the driving IC 4 is separately packaged in the second cup-shaped holder 12, effectively avoiding the stress problem caused by the difference in material properties (especially the different coefficients of thermal expansion) between the light-emitting chip 3 and the driving IC 4, greatly improving the reliability of the packaging structure and reducing the risk of peeling or cracking of the colloid used for packaging in the cup-shaped holder (the first cup-shaped holder 11 or the second cup-shaped holder 12); Moreover, this separated design improves the overall thermal management because the heat generated by the driving IC 4 no longer directly affects the light-emitting chip 3, thereby improving the heat dissipation effect of the integrated packaging structure of the driving IC and the LED chip, which is beneficial to maintaining high light-emitting efficiency and extending the service life.

[0056] Optionally, the pad assembly 2 includes a data output pad 24 provided on the bracket 1, and the second side surface of the data output pad 24 is exposed in the second cup-shaped holder 12, and the driving IC 4 is electrically connected to the data output pad 24.

[0057] Specifically, the introduction of the data output pad 24 provides additional functionality for the integrated packaging structure of the driving IC and the LED chip. In the application of the integrated packaging structure of the driving IC and the LED chip, especially in intelligent lighting or the integrated packaging structure display system of the driving IC and the LED chip, the data output function allows the integrated packaging structure of the driving IC and the LED chip to not only receive control signals but also transmit data to the next-level device or control system. Such data may include the working state of the integrated packaging structure of the driving IC and the LED chip, temperature information, or the cascaded transmission of signals when multiple integrated packaging structures of the driving IC and the LED chip are connected in series.

[0058] Optionally, the volume of the first cup-shaped holder 11 is larger than that of the second cup-shaped holder 12. It is not difficult to understand that the light-emitting chip 3 usually generates more heat and requires a larger heat dissipation area. The larger first cup-shaped holder 11 provides better heat dissipation conditions, which helps to extend the service life of the light-emitting chip 3 and maintain its performance. In addition, the larger first cup-shaped holder 11 can accommodate more or larger light-emitting chips 3, potentially improving the overall brightness and light output of the product, and the larger reflection area on the peripheral wall of the first cup-shaped holder 11 can improve the light distribution and enhance the lighting uniformity.

[0059] Optionally, the number of the driving output pads 25 is three. The first side surfaces of the three driving output pads 25 are respectively exposed in the first bowl 11, and the second side surfaces of the three driving output pads 25 are respectively exposed in the second bowl 12.

[0060] The number of the light-emitting chips 3 is the same as and corresponds one by one to the number of the driving output pads 25. Each light-emitting chip 3 is disposed in the first bowl 11, and each light-emitting chip 3 is electrically connected to the positive electrode pad 21 and the corresponding driving output pad 25 respectively.

[0061] The driving IC 4 is electrically connected to the three driving output pads 25 respectively.

[0062] Specifically, the light-emitting chips 3 can be chips of different types, such as red, green, and blue chips, for realizing full-color display or color mixing function. They can also be chips of the same color, for improving the overall brightness or realizing zonal control. The size and shape of each chip may be slightly different, but they should all be adapted to the space of the first bowl 11.

[0063] The three driving output pads 25 can adopt different shapes and materials. They may be slender strips, or may be circular or square. The materials are usually metals with good conductivity, such as copper, gold, etc.

[0064] This design has significant advantages compared with the integrated packaging structure of the driving IC and the LED chip with a single light-emitting chip 3. First of all, the multi-chip design increases the functional diversity of the integrated packaging structure of the driving IC and the LED chip, and can realize more complex lighting effects, such as full-color display or precise color temperature adjustment. Secondly, each chip can be controlled separately, which improves the controllability and flexibility of the integrated packaging structure of the driving IC and the LED chip, enabling it to adapt to more diverse application scenarios. In addition, by integrating multiple light-emitting chips 3 in a single package, this design improves the integration degree and space utilization efficiency of the integrated packaging structure of the driving IC and the LED chip, which is beneficial to manufacturing more compact lighting or display devices. Finally, this design provides more control possibilities for the intelligent lighting system, such as realizing more delicate dimming and color mixing, complex light effect changes, etc., thus greatly expanding the application scope of the integrated packaging structure of the driving IC and the LED chip and laying a foundation for the development of innovative lighting solutions and intelligent lighting systems.

[0065] Optionally, each driving output pad 25 includes a strip-shaped pad strip 251. The pad strips 251 of the three driving output pads 25 are disposed in the bracket 1 and arranged in parallel. The first side surface of each pad strip 251 is exposed in the first bowl 11, and the second side surface of each pad strip 251 is exposed in the second bowl 12.

[0066] Specifically, the "strip shape" can be understood as a slender rectangular or strip-like structure. There are several possible implementation manners of this shape: it can be a completely straight strip, or a strip that is slightly curved to fit the shape of the bracket 1, or even a Z-shaped or S-shaped strip to increase the length and flexibility.

[0067] The design of the pad strip 251 has multiple advantages compared with traditional dot-shaped or small-area pads. First, the strip design provides a larger connection area, which not only enhances the reliability of the electrical connection but also improves the heat conduction efficiency and helps with heat dissipation. Second, its design that penetrates through the two bowl cups simplifies the signal transmission path, reduces signal attenuation and interference, and improves the overall performance of the integrated packaging structure of the driving IC and the LED chip.

[0068] Optionally, a first exposed portion 251a and a first pressed portion 251b are included on the first side surface of each of the pad strips 251, and the first exposed portion 251a is electrically connected to the corresponding light-emitting chip 3;

[0069] The integrated packaging structure of the driving IC and the LED chip includes a first fixing glue block 5, the first fixing glue block 5 is fixed in the first bowl cup 11 and abuts against each of the first pressed portions 251b, and the orthographic projection of the first fixing glue block 5 on the bottom of the first bowl cup 11 and the orthographic projection of each of the light-emitting chips 3 on the bottom of the first bowl cup 11 do not overlap.

[0070] Specifically, the first pressed portion 251b is a region on the pad strip 251 that is specially designed to contact the first fixing glue block 5. The purpose of this design is to provide additional mechanical support and stability. The surface of the first pressed portion 251b can be specially treated, such as roughening or coating with a special material, to enhance the adhesion force with the first fixing glue block 5.

[0071] The first fixing glue block 5 can be made of various materials, such as high molecular materials like epoxy resin and silica gel. These materials should have good insulation, thermal stability, and mechanical strength. The shape of the glue block can be a simple long strip shape or a more complex shape to adapt to the internal structure of the bowl cup and the arrangement of the pad strips 251.

[0072] The "orthographic projection" refers to the shadow formed by vertically projecting an object onto a plane. In this embodiment, it refers to the regions formed by vertically projecting the first fixing glue block 5 and the light-emitting chip 3 onto the bottom of the first bowl cup 11. The non-overlap of these projection regions means that the first fixing glue block 5 and the light-emitting chip 3 are spatially separated and do not interfere with each other. This design ensures that the first fixing glue block 5 does not block or interfere with the light output of the light-emitting chip 3.

[0073] It is not difficult to understand that the introduction of the first fixing glue block 5 provides additional support for the pad strip 251, which helps to avoid the deformation or displacement of the pad strip 251 under temperature changes or mechanical vibrations. Moreover, the design that ensures that the projections of the first fixing glue block 5 and the light-emitting chip 3 do not overlap optimizes the optical performance and avoids possible light output obstruction.

[0074] Similarly, optionally, a second exposed portion 251c and a second pressure-receiving portion 251d are included on the second side surface of each of the pad strips 251, and the second exposed portion 251c is electrically connected to the driving IC 4;

[0075] The integrated packaging structure of the driving IC and the LED chip includes a second fixing glue block 6, and the second fixing glue block 6 is fixed in the second bowl 12 and abuts against each of the second pressure-receiving portions 251d.

[0076] For the beneficial effects of this embodiment arranged in this way, reference can be made to the foregoing (i.e., the beneficial effects brought about by setting the first fixing glue block 5), and details will not be repeated here.

[0077] Optionally, the first bowl 11 is filled with a first colloid, and the material of the first colloid is a light-transmitting material.

[0078] Specifically, the "first colloid" refers to the encapsulation material filled in the first bowl 11. The main function of this material is to protect the light-emitting chip 3 while ensuring that light can effectively propagate from the chip. The first colloid can have various implementation manners. Common light-transmitting materials include epoxy resin, silica gel, polycarbonate, etc. These materials not only need to have good light transmittance but also need to meet other requirements, such as good thermal stability, ultraviolet resistance, and good adhesion to the chip and the bracket 1. Different materials or material combinations can be selected according to different application requirements.

[0079] Similarly, the second bowl 12 is filled with a second colloid. Specifically, the material of the second colloid can be a light-transmitting material or a non-light-transmitting material, and no specific limitation is made here.

[0080] Optionally, the second bowl 12 forms a cup mouth on the back surface of the bracket 1;

[0081] The positive electrode pad 21, the negative electrode pad 22, the data input pad 23, and the driving output pad 25 are all buried in the bracket 1, and each pad extends from the inside of the bracket 1 to the side surface of the bracket 1 and forms an exposed section 211 outside the bracket 1, and each of the exposed sections 211 extends to the back surface of the bracket 1 after being bent to form corresponding external electrical connection pins.

[0082] Specifically, the "exposed section 211" refers to the part of the pad that is visible and accessible outside the bracket 1, and these parts are used to establish connections with external circuits. Each exposed section 211 is bent and extends to the back of the bracket 1. The purpose of this bending design is to guide the connection points to the back of the bracket 1, facilitating surface mounting on substrates such as PCBs, making the integrated packaging structure of the driving IC and the LED chip more suitable for surface mount technology (SMT), and improving the compatibility and applicability of the product in modern electronic manufacturing.

[0083] The present utility model also proposes a light-emitting device, which includes an integrated packaging structure of a driving IC and an LED chip. The specific structure of the integrated packaging structure of the driving IC and the LED chip refers to the above-mentioned embodiments. Since this light-emitting device adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, and will not be elaborated here one by one.

[0084] The above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model. Any equivalent structural transformation made by using the content of the specification and drawings of the present utility model under the inventive concept of the present utility model, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. A fusion packaging structure of a driving IC and an LED chip, characterized in that Comprising: A bracket (1) formed with a first bowl cup (11) and a second bowl cup (12), the cup mouths of the first bowl cup (11) and the second bowl cup (12) are respectively located on two opposite sides of the bracket (1); A pad assembly (2) including a positive electrode pad (21), a negative electrode pad (22), a data input pad (23) and a drive output pad (25) provided on the bracket (1), the first sides of the positive electrode pad (21) and the drive output pad (25) are respectively exposed inside the first bowl cup (11), and the second sides of the positive electrode pad (21), the negative electrode pad (22), the data input pad (23) and the drive output pad (25) are respectively exposed inside the second bowl cup (12); A light-emitting chip (3) provided inside the first bowl cup (11), the light-emitting chip (3) is electrically connected to the positive electrode pad (21) and the drive output pad (25) respectively; A drive IC (4) provided inside the second bowl cup (12), the drive IC (4) is electrically connected to the positive electrode pad (21), the negative electrode pad (22), the data input pad (23) and the drive output pad (25) respectively.

2. The integrated packaging structure of the driving IC and the LED chip according to claim 1, wherein, The pad assembly (2) includes a data output pad (24) provided on the bracket (1), the second side of the data output pad (24) is exposed inside the second bowl cup (12), and the drive IC (4) is electrically connected to the data output pad (24); and / or, The volume of the first bowl cup (11) is larger than the volume of the second bowl cup (12).

3. The integrated packaging structure of the driving IC and the LED chip according to claim 1, characterized in that, The number of the drive output pads (25) is three, the first sides of the three drive output pads (25) are all exposed inside the first bowl cup (11), and the second sides of the three drive output pads (25) are all exposed inside the second bowl cup (12); The number of the light-emitting chips (3) is the same as and corresponds one by one to the number of the drive output pads (25), each light-emitting chip (3) is provided inside the first bowl cup (11), and each light-emitting chip (3) is electrically connected to the positive electrode pad (21) and the corresponding drive output pad (25) respectively; The drive IC (4) is electrically connected to the three drive output pads (25) respectively.

4. The integrated packaging structure of the driving IC and the LED chip according to claim 3, characterized in that, Each drive output pad (25) includes a strip-shaped pad strip (251), the pad strips (251) of the three drive output pads (25) are all provided inside the bracket (1) and arranged in parallel, the first side of each pad strip (251) is exposed inside the first bowl cup (11), and the second side of each pad strip (251) is exposed inside the second bowl cup (12).

5. The fusion packaging structure of the driving IC and the LED chip according to claim 4, wherein The first side of each pad strip (251) includes a first exposed portion (251a) and a first pressed portion (251b), and the first exposed portion (251a) is electrically connected to the corresponding light-emitting chip (3); The integrated packaging structure of the driving IC and the LED chip includes a first fixing glue block (5), the first fixing glue block (5) is fixed in the first bowl cup (11) and abuts against each of the first pressing parts (251b), and the orthographic projection of the first fixing glue block (5) on the bottom of the first bowl cup (11) and the orthographic projection of each light-emitting chip (3) on the bottom of the first bowl cup (11) do not overlap.

6. The integrated packaging structure of the driving IC and the LED chip according to claim 4, characterized in that, On the second side surface of each pad strip (251), there are a second exposed part (251c) and a second pressing part (251d), and the second exposed part (251c) is electrically connected to the driving IC (4); The integrated packaging structure of the driving IC and the LED chip includes a second fixing glue block (6), the second fixing glue block (6) is fixed in the second bowl cup (12) and abuts against each of the second pressing parts (251d).

7. The integrated packaging structure of the driving IC and the LED chip according to claim 1, characterized in that, The first bowl cup (11) is filled with a first colloid, and the material of the first colloid is a light-transmitting material.

8. The integrated packaging structure of the driving IC and the LED chip according to claim 1, characterized in that, The second bowl cup (12) is filled with a second colloid.

9. The integrated packaging structure of the driving IC and the LED chip according to claim 1, wherein The second bowl cup (12) forms a cup mouth on the back surface of the bracket (1); The positive electrode pad (21), the negative electrode pad (22), the data input pad (23) and the driving output pad (25) are all buried in the bracket (1), and each pad extends from the inside of the bracket (1) to the side surface of the bracket (1), and an exposed section (211) is formed outside the bracket (1), and each exposed section (211) extends to the back surface of the bracket (1) after being bent to form corresponding external electrical connection pins.

10. A light-emitting device, characterized in that, It includes the integrated packaging structure of the driving IC and the LED chip according to any one of claims 1 to 9.

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