LED light-emitting device

Abstract

The utility model provides an LED light-emitting device, which comprises a substrate and at least two LED devices arranged on the front surface of the substrate, a metal retaining wall part is arranged on the substrate, the metal retaining wall part is at least arranged between two adjacent LED devices, each LED device comprises an LED chip and a fluorescent layer arranged on the LED chip, and the fluorescent layers are arranged on the LED chips. And the height of the metal retaining wall part is not less than that of the LED device. According to the LED light-emitting device provided by the utility model, the two adjacent LED devices are separated by arranging the metal retaining wall part, the emergent light of the LED devices is prevented from being conducted to the fluorescent powder layers of the nearby LED devices and exciting the fluorescent powder to emit light, and the strength attribute, the thermal conductivity and the heat resistance of the metal retaining wall part are superior to those of plastic, so that the LED light-emitting device is more suitable for high-power LED products; and the concentration of the light-emitting chromaticity of each LED chip can be improved, and the lighting effect of the product is good.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED packaging, and particularly relates to an LED lighting device. Background Art

[0002] In current high-power LED products, such as in-vehicle high-power LED lighting products, when multi-core LEDs are used for optical testing as independent light sources, they are easily interfered by nearby light sources, resulting in inaccurate optical detection data and high data dispersion. Therefore, a white glue caulking process is adopted during the process of packaging LED chips into light sources.

[0003] As an isolation layer between the windows of two adjacent light sources (LED devices), it is formed by heating and leveling the liquid white glue for filling. During the manufacturing process, the height of the white glue cannot be precisely controlled. There are also existing technologies that set the white glue through a molding process. However, when setting the white glue through the molding process, it is necessary to avoid the mold pressing on the phosphor layer in the LED device, resulting in a complex mold design and high cost.

[0004] The LED device includes a phosphor layer disposed above the chip. Since the white glue contacts the side surface of the phosphor layer in the LED device as an isolation layer between two adjacent light sources, when the upper surface of the white glue exceeds the upper surface of the phosphor sheet, it may climb above the phosphor layer and affect the light output. Therefore, in the prior art, the upper surface of the white glue is designed not to exceed the height of the upper surface of the phosphor layer. However, this causes another problem. The light emitted by the LED chip will be conducted to the phosphor layer of the adjacent LED device and excite the phosphor sheet to emit light, easily resulting in light crosstalk. The yield of the light color concentration of the product is reduced, affecting the light efficiency of the product. Summary of the Utility Model

[0005] The purpose of the utility model is to at least overcome one of the above-mentioned deficiencies in the prior art, and provides an LED lighting device, which can improve the concentration of the light chromaticity of each LED chip and has good light efficiency of the product.

[0006] The technical solution of the utility model is: an LED lighting device, including a substrate and at least two LED devices disposed on the front surface of the substrate. The LED device includes an LED chip and a phosphor layer disposed on the LED chip. A metal barrier portion is disposed on the substrate, and the metal barrier portion is disposed at least between two adjacent LED devices. The height of the metal barrier portion is not lower than the height of the LED device.

[0007] Optionally, the metal barrier portion is formed on the substrate by electroplating.

[0008] Optionally, the substrate includes an insulating plate body and a metal base layer disposed on one side of the insulating plate body. The metal barrier portion is formed on the metal base layer by electroplating.

[0009] Optionally, the substrate has a first side surface and an opposite second side surface, and both ends of the metal barrier portion are flush with the first side surface and the second side surface respectively;

[0010] Alternatively, only one end of the metal barrier portion is flush with the first side surface or the second side surface of the substrate;

[0011] Alternatively, both ends of the metal barrier portion are spaced apart from the first side surface and the second side surface respectively.

[0012] Optionally, the metal barrier portion is in a straight bar shape and is centrally disposed between two adjacent LED devices;

[0013] Alternatively, the metal barrier portion is in a frame shape and is disposed around at least one of the LED devices.

[0014] Optionally, a pad connection portion is provided on the back surface of the substrate, and the positive and negative electrodes of the LED chip are respectively connected to the pad connection portion through conductive holes provided in the substrate.

[0015] Optionally, a light-absorbing layer is provided on the outer surface of the metal barrier portion.

[0016] Optionally, a reflective glue is provided on the outside of the LED device, and the reflective glue fills the side surface of the metal barrier portion and does not protrude from the metal barrier portion.

[0017] Optionally, the reflective glue is a white glue layer.

[0018] Optionally, the height of the upper surface of the white glue layer between the fluorescent layer and the metal barrier portion increases in a direction close to the metal barrier portion.

[0019] An LED lighting device provided by the present utility model separates two adjacent LED devices by providing a metal barrier portion, preventing the direct light of the LED chip from being conducted to the nearby fluorescent layer, avoiding the excitation of the phosphor in the adjacent LED device to emit light, reducing the occurrence of crosstalk, and the metal barrier portion is a metal structure, and its strength property, thermal conductivity, and heat resistance are superior to those of plastics, and it is more suitable for high-power LED products. Compared with a resin (white glue) barrier, the metal barrier portion is not prone to deformation and yellowing and aging phenomena in a long-term high-heat environment, and the metal barrier portion can adopt a relatively dark metal color, which can absorb light to a certain extent. Generally, the isolation layer between two adjacent light sources (LED devices) adopts white resin to reflect light to the main light-emitting surface of the LED lighting device. At the same time, the white resin will also cause diffuse reflection of light, and the reflected light excites the phosphor in the adjacent LED device to emit light, resulting in the problem of crosstalk, which affects the chromaticity concentration of the LED light emission. It can be seen that adopting a metal barrier portion can reduce the probability of reflected light being emitted to the fluorescent layer on the nearby LED chip to generate crosstalk and improve the chromaticity concentration of the LED light emission. Brief Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings required for use in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0021] Figure 1 is a top view of an LED lighting device provided by an embodiment of the present invention;

[0022] Figure 2 is a cross-sectional view of an LED lighting device provided by an embodiment of the present invention;

[0023] Figure 3 is a rear view of an LED lighting device provided by an embodiment of the present invention;

[0024] Figure 4 is a top view of an LED lighting device (with the metal barrier portion flush with both sides of the substrate) provided by an embodiment of the present invention;

[0025] Figure 5 is a top view of an LED lighting device (with the metal barrier portion sleeved on each LED device) provided by an embodiment of the present invention;

[0026] Figure 6 is a cross-sectional view of an LED lighting device (with the metal barrier portion sleeved on each LED device) provided by an embodiment of the present invention. Detailed Description of the Embodiments

[0027] In order to make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0028] It should be noted that the terms "arranged" and "connected" should be understood in a broad sense. For example, it can be directly arranged and connected, or indirectly arranged and connected through intermediate components and intermediate structures.

[0029] In addition, in the embodiments of the present utility model, if there are terms indicating orientation or positional relationships, such as "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., they are based on the orientation or positional relationships shown in the drawings or the conventional placement state or usage state. They are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the structures, features, devices or elements referred to must have a specific orientation or positional relationship, nor must they be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0030] In the specific embodiments described, the various specific technical features and each embodiment, without contradiction, can be combined in any suitable manner. For example, different embodiments can be formed by combining different specific technical features / embodiments. To avoid unnecessary repetition, various possible combination methods of the various specific technical features / embodiments in the present utility model will not be described separately.

[0031] Such as Figures 1 to 3As shown in the figure, an LED lighting device provided by an embodiment of the present invention includes a substrate 100 and at least two LED devices 400 disposed on the front surface of the substrate 100. The LED device 400 includes an LED chip 410 and a phosphor layer 420 disposed on the LED chip 410. A metal barrier portion 200 is disposed on the substrate 100, and the metal barrier portion 200 is disposed at least between two adjacent LED devices 400 and can separate the two adjacent LED devices 400. The height of the metal barrier portion 200 is not lower than the height of the LED device 400. The LED structure can be applied to high-power LED products. By providing the metal barrier portion 200, two adjacent LED devices 400 are separated, preventing the direct light of the LED chip 410 from being conducted to the phosphor layer 420 in an adjacent LED device, and exciting the phosphor layer 420 to generate excitation light matching the phosphor layer. Moreover, the metal barrier portion 200 is a metal structure, and its strength property, thermal conductivity, and heat resistance are superior to those of plastics, making it more suitable for high-power LED products and avoiding the phenomena of easy deformation and yellowing and aging of plastic barriers in a long-term high-heat environment. In addition, the metal barrier portion 200 can adopt a relatively dark metal color, which can absorb light to a certain extent, while the plastics in existing LED packages generally have a white surface, which will generate diffuse reflection of light. The light emitted by the LED chip will be conducted to the phosphor sheet in an adjacent LED device and excite the phosphor sheet to emit light, easily causing light crosstalk, which will affect the concentration of the LED emission chromaticity. It can be seen that using the metal barrier portion 200 can reduce diffuse reflection relative to white glue, avoid the reflected light from hitting the phosphor layer 420 on the nearby LED chip 410, prevent light crosstalk, avoid affecting the concentration of the emission chromaticity of each LED chip 410, and the deviation direction of the color point is relatively controllable, and the light efficiency of the product is good.

[0032] Specifically, a pad connection group 300 is disposed on the back surface of the substrate 100. The pad connection group 300 includes at least one positive pad connection portion 431 and at least one negative pad connection portion 432. The positive and negative electrodes of the LED chip 410 are respectively connected to the pad connection group 300 through conductive holes (not shown in the figure) disposed in the substrate 100. The metal barrier portion 200 does not affect the circuit connection of the LED chip 410. In a specific application, a group of positive pad connection portion 431 and negative pad connection portion 432 can be disposed on the back surface of the substrate 100 corresponding to each LED chip 410.

[0033] Specifically, the metal retaining wall portion 200 can be formed on the substrate 100 by electroplating. The metal retaining wall portion 200 is a metal structure formed by an electroplating process. By increasing the electroplating time and the thickness of the surface electroplating layer, the metal retaining wall portion 200 of the required thickness (height) is grown. Alternatively, the metal retaining wall portion 200 can also be formed by electroplating in batches (multiple electroplating), and its forming principle is similar to the forming principle of the electrode on the back side of the substrate 100.

[0034] Specifically, the substrate includes an insulating plate body, a metal base layer is disposed on one side of the insulating plate body, and the metal retaining wall portion 200 is formed on the metal base layer by electroplating, that is, metal is deposited on the metal base layer by electroplating to form the metal retaining wall portion 200. The metal retaining wall portion 200 has a certain thickness, and preferably the metal retaining wall portion 200 is not lower than the LED device 400.

[0035] In specific applications, the metal retaining wall portion 200 is prefabricated on the substrate 100, that is, when the substrate 100 is electroplated, the metal retaining wall portion 200 is formed on the substrate 100 by electroplating deposition. The bonding force between the metal retaining wall portion 200 and the substrate 100 is stronger than that through a snap-on or adhesive solution. The metal has good thermal conductivity. At the same time, the size of the metal retaining wall portion 200 can be finely controlled, and different patterns can be formed as needed, with good design flexibility.

[0036] Specifically, the projections of the LED devices 400 in the direction of the metal barrier 200 are all located on the metal barrier 200. The metal barrier 200 can completely separate the adjacent LED devices 400, that is, any straight line connecting two points of two adjacent LED devices 400 is blocked by the metal barrier 200, so as to avoid affecting the concentration of the luminous chromaticity of the LED chip 410.

[0037] Specifically, the substrate 100 has a first side and an opposite second side, and both ends of the metal retaining wall portion 200 are flush with the first side and the second side, respectively, that is, the metal retaining wall portion 200 is strip-shaped and extends to the edge of the substrate 100 to completely separate two adjacent LED devices 400.

[0038] Alternatively, only one end of the metal barrier portion 200 is flush with the first side or the second side of the substrate 100, and the other end may be spaced from the side of the substrate 100. When at least one side is not flush, the two LED chips 410 can be connected in series through the metal layer on the substrate 100, and the metal wiring method on the substrate 100 is more flexible. Alternatively, both ends of the metal barrier portion 200 are spaced from the first side and the second side respectively to meet the requirements of different usage scenarios. In some embodiments, a plurality of metal barrier portions 200 are provided to separate a plurality of LED devices 400. In specific applications, the arrangement of the metal barrier portions 200 can be in a straight line, cross, L shape, ring shape, etc.

[0039] Specifically, the metal barrier portion 200 is straight and is centrally disposed between two adjacent LED devices 400, with a simple structure and low cost.

[0040] Alternatively, the metal barrier portion 200 is in a frame shape and surrounds at least one of the LED devices 400. The two adjacent LED chips 410 can be connected in series through the metal layer on the back surface of the substrate 100. For example, when the LED lighting device is provided with two spaced LED devices 400, each LED device 400 is surrounded by a frame-shaped metal barrier portion 200, and one wall portion of the metal barrier portion 200 is shared by the two LED devices 400 between adjacent LED devices 400, which can simplify the structure of the metal barrier portion 200 and improve the manufacturing efficiency of the metal barrier portion 200, as Figure 5 shown.

[0041] In some alternative embodiments, an absorbent layer is provided on the outer surface of the metal barrier portion 200 to avoid the influence of light diffuse reflection on the chromaticity concentration to a certain extent.

[0042] Specifically, the upper surface of the metal barrier portion 200 is higher than the upper surface of the fluorescent layer 420 to avoid the influence of direct light on the chromaticity concentration.

[0043] In some alternative embodiments, a reflective glue, such as a white glue layer, which has a reflective effect on light, is provided on the outside of the LED device 400. The white glue can be selected from one of resin glue, silica gel or silicone resin glue. The white glue layer is filled to the side of the metal barrier portion 200 and does not protrude from the metal barrier portion 200. A Zener device can be provided on the front surface of the substrate 100, and the white glue layer can cover the Zener device to avoid the Zener device absorbing light and affecting the light efficiency.

[0044] Specifically, when the white glue layer is filled, it is in a liquid state. The liquid white glue will adsorb on the side surface of the metal barrier portion 200. After the white glue layer is heated and cured, a curved surface that climbs along the metal barrier portion 200 will be formed on the upper surface of the white glue layer. Since the upper surface of the metal barrier portion 200 is higher than the upper surface of the fluorescent layer 420 in the height direction, the height of the upper surface of the white glue near the metal barrier portion 200 is greater than the height of the upper surface of the white glue near the fluorescent layer 420. And because the white glue layer has a reflection effect, the white glue located between the fluorescent layer 420 and the metal barrier portion 200 can enhance the reflection effect on the light emitted by the LED device, further preventing the light emitted by the LED device from hitting the fluorescent layer of the adjacent LED device and exciting the adjacent fluorescent layer to emit light, and improving the chromaticity consistency of the LED device, as Figure 2 and Figure 6 shown.

[0045] In this embodiment, the width of the metal barrier portion 200 is 0.04 - 0.1 mm, the height of the metal barrier portion 200 is 0.38 mm, the height of the LED chip is 0.15 mm, the thickness of the fluorescent layer is 0.15 mm, and the thickness of the electroplated metal layer on the upper surface of the metal front for placing the LED chip is 0.065. That is, the height of the metal barrier portion 200 is not less than the height of the LED device, and the height of the LED device is the sum of the thickness of the electroplated metal layer on the upper surface, the height of the LED chip, and the thickness of the fluorescent layer.

[0046] An LED lighting device provided by the present utility model separates two adjacent LED devices 400 by setting the metal barrier portion 200, avoiding the direct light of the LED chip 410 from being conducted to the nearby fluorescent layer 420, preventing the phosphor in the adjacent LED device 400 from being excited to emit light, reducing the occurrence of crosstalk. And the metal barrier portion 200 is a metal structure, and its strength property, thermal conductivity, and heat resistance are better than those of plastics, and it is more suitable for high-power LED products. Compared with the resin (white glue) barrier, the metal barrier portion 200 is not easily deformed, yellowed, or aged in a long-term high-heat environment. Moreover, the metal barrier portion 200 can adopt a relatively dark metal color, which can absorb light to a certain extent. While the isolation layer between two adjacent existing light sources (LED devices 400) generally uses white resin to reflect light to the main light-emitting surface of the LED lighting device, and at the same time, the white resin will also cause diffuse reflection of light, and the reflected light excites the phosphor in the adjacent LED device to emit light, resulting in the problem of crosstalk, which affects the chromaticity concentration of the LED light emission. It can be seen that using the metal barrier portion can reduce the probability of the reflected light hitting the fluorescent layer on the nearby LED chip and generating crosstalk, and improve the chromaticity concentration of the LED light emission.

[0047] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An LED lighting device, characterized in that, It includes a substrate and at least two LED devices disposed on the front side of the substrate. The LED device includes an LED chip and a fluorescent layer disposed on the LED chip. A metal barrier portion is provided on the substrate, and the metal barrier portion is at least disposed between two adjacent LED devices, and the height of the metal barrier portion is not lower than the height of the LED device.

2. The LED lighting device according to claim 1, characterized in that, The metal barrier portion is formed on the substrate by electroplating.

3. The LED lighting device according to claim 2, wherein, The substrate includes an insulating plate body and a metal base layer disposed on one side of the insulating plate body, and the metal barrier portion is formed on the metal base layer by electroplating.

4. The LED lighting device according to claim 1, wherein The substrate has a first side surface and an opposite second side surface, and both ends of the metal barrier portion are flush with the first side surface and the second side surface respectively; Alternatively, only one end of the metal barrier portion is flush with the first side surface or the second side surface of the substrate; Alternatively, there are intervals between both ends of the metal barrier portion and the first side surface and the second side surface respectively.

5. An LED lighting device according to claim 1, wherein The metal barrier portion is straight and is centrally disposed between two adjacent LED devices; Alternatively, the metal barrier portion is in a frame shape and surrounds at least one of the LED devices.

6. An LED lighting device according to claim 1, wherein A pad connection portion is provided on the back surface of the substrate, and the positive and negative electrodes of the LED chip are respectively connected to the pad connection portion through conductive holes provided in the substrate.

7. An LED lighting device according to claim 1, wherein An absorbent layer is provided on the outer surface of the metal barrier portion.

8. An LED lighting device according to claim 1, wherein A reflective glue is provided on the outside of the LED device, and the reflective glue fills the side surface of the metal barrier portion and does not protrude from the metal barrier portion.

9. An LED lighting device according to claim 8, wherein, The reflective glue is a white glue layer.

10. An LED lighting device according to claim 9, wherein, The height of the upper surface of the white glue layer between the fluorescent layer and the metal barrier portion increases in the direction close to the metal barrier portion.

Images