Efficient laser cutting equipment for full-automatic wafer cleaning machine shell

Abstract

The utility model discloses efficient laser cutting equipment for a full-automatic wafer cleaning machine shell, which belongs to the technical field of laser cutting of the full-automatic wafer cleaning machine shell, and is characterized by comprising an adjusting assembly, a fixing assembly, support legs, a bottom plate, a base, a support frame and a laser cutting machine body, the adjusting assembly is arranged at the top of the bottom plate, the fixing assembly is arranged at the top of the base, the supporting legs are fixedly connected to the bottom of the bottom plate, the base is fixedly connected to the top of the bottom plate, the supporting frame is fixedly connected to the top of the base, and the laser cutting machine body is fixedly connected to the top of the interior of the supporting frame. Through the arrangement of the adjusting assembly, the adjusting assembly can achieve the effect of connecting the fixing assembly and adjusting the fixing assembly front and back, so that the front and back adjustment of the shell can be completed; and through the arrangement of the fixing assembly, the fixing assembly can achieve the effect of clamping and fixing the shell, and meanwhile the shell can be adjusted left and right.

Description

Technical Field

[0001] The utility model relates to the technical field of laser cutting of a fully automatic wafer cleaning machine shell, in particular to a high-efficiency laser cutting device for a fully automatic wafer cleaning machine shell. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. The original material of the wafer is silicon, and there is an inexhaustible supply of silicon dioxide on the surface of the earth's crust.

[0003] The existing wafer to be cleaned is fixed on the cleaning table of the wafer cleaning machine, and the wafer on the cleaning table is rinsed by a water spray head located above the cleaning table. The cleaning range is limited, and the back side of the wafer cannot be cleaned. The wafer needs to be placed again in the reverse direction, which makes the cleaning efficiency low.

[0004] The existing patent (publication number: CN216323723U) discloses a wafer cleaning machine for wafer processing, including a box shell and a flip cover located on the top of the box shell, the front and rear side walls of the inner cavity of the box shell are rotatably connected with straight rods, and a wafer fixing piece is fixedly connected between the two straight rods, and a power piece that is transmission-connected to the straight rods on the back is arranged on the box shell, and the interior of the box shell is rotatably connected with a horizontal tube located on the left side of the wafer fixing piece, the right end of the horizontal tube is connected with a short tube, and the right side of the short tube is connected with nozzles distributed at equal distances. This wafer cleaning machine for wafer processing has the advantages of high cleaning efficiency, etc., and solves the problem that in the prior art, the wafer plate to be cleaned is fixed on the cleaning table of the wafer cleaning machine, and the wafer plate on the cleaning table is rinsed by a water spray head located above the cleaning table, the cleaning range is limited, and the reverse side of the wafer plate cannot be cleaned, and the wafer plate needs to be placed again in the reverse direction, resulting in low cleaning efficiency.

[0005] In view of the above problems, the existing patent provides a solution. During the processing and production process, the shell of the fully automatic wafer cleaning machine needs to be drilled and grooved, which requires the use of high-efficiency laser cutting equipment for the shell of the fully automatic wafer cleaning machine. Most of the existing laser cutting settings for the shell of the fully automatic wafer cleaning machine can only clamp and fix the two sides of the shell, resulting in poor stability and inconvenience for multi-directional adjustment, which in turn affects the cutting efficiency.

[0006] Therefore, an efficient laser cutting device for the shell of a fully automatic wafer cleaning machine is proposed. Utility Model Content

[0007] The purpose of the present utility model is to provide an efficient laser cutting device for the outer shell of a fully automatic wafer cleaning machine, which can solve the problems of the existing laser cutting devices for the outer shell of a fully automatic wafer cleaning machine. Most of them can only clamp and fix the two sides of the outer shell, resulting in poor stability and inconvenient multi-directional adjustment, thus affecting the cutting efficiency.

[0008] To achieve the above object, the present utility model provides the following technical solutions: An efficient laser cutting device for the outer shell of a fully automatic wafer cleaning machine, including an adjustment component, a fixing component, legs, a bottom plate, a base, a support frame, and a laser cutting machine body. The adjustment component is arranged on the top of the bottom plate, the fixing component is arranged on the top of the base, the legs are fixedly connected to the bottom of the bottom plate, the base is fixedly connected to the top of the bottom plate, the support frame is fixedly connected to the top of the base, and the laser cutting machine body is fixedly connected to the top inside the support frame;

[0009] The adjustment component includes a first adjustment rod, adjustment holes, a first motor, and a connection seat. The first adjustment rod is rotatably connected to the inner wall of the base. The adjustment holes are opened on the front and rear sides of the connection seat. The first motor is fixedly connected to the front side of the first adjustment rod, and the connection seat is threadedly connected to the surface of the first adjustment rod.

[0010] Preferably, the fixing component includes a connecting plate. The connecting plate is fixedly connected to the top of the connection seat. The inner wall of the connecting plate is rotatably connected to a second adjustment rod. The front side of the second adjustment rod is fixedly connected to a second motor.

[0011] Preferably, an adjustment block is threadedly connected to the surface of the second adjustment rod. The top of the adjustment block is fixedly connected to a first clamping plate. A placement seat is fixedly connected to the top of the connecting plate.

[0012] Preferably, electric telescopic rods are fixedly connected to both sides inside the placement seat. Opposite sides of the electric telescopic rods are fixedly connected to a second clamping plate.

[0013] Preferably, first rotation holes are opened on both the front and rear sides of the base. The inner wall of the first rotation hole is rotatably connected to the surface of the first adjustment rod.

[0014] Preferably, a second rotation hole is opened on the front side of the connecting plate. The inner wall of the second rotation hole is rotatably connected to the surface of the second adjustment rod.

[0015] Preferably, an adjustment groove is opened on the top of the connecting plate. The inner wall of the adjustment groove is slidably connected to the surface of the adjustment block.

[0016] Preferably, a sliding groove is opened on the top of the placement seat. The inner wall of the sliding groove is slidably connected to the bottom of the second clamping plate.

[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0018] 1. Through the setting of the adjusting component, the adjusting component can achieve the effect of adjusting the fixing component before and after connection, so as to complete the front and back adjustment of the housing.

[0019] 2. Through the setting of the fixing component, the fixing component can achieve the effect of clamping and fixing the housing, and at the same time, it can also adjust the housing left and right. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is the overall structure diagram of the high-efficiency laser cutting equipment for the housing of the full-automatic wafer cleaning machine of the present utility model;

[0021] Figure 2 is the connection schematic diagram of the adjusting component and the fixing component of the present utility model;

[0022] Figure 3 is the connection schematic diagram of the adjusting component of the present utility model;

[0023] Figure 4 is the connection schematic diagram of the fixing component of the present utility model;

[0024] Figure 5 is the connection schematic diagram of the second rotation hole, the adjustment groove and the sliding groove of the present utility model.

[0025] In the figure, 1. Adjusting component; 101. First adjusting rod; 102. Adjusting hole; 103. First motor; 104. Connecting seat; 2. Fixing component; 201. Connecting plate; 202. Second adjusting rod; 203. Second motor; 204. Adjusting block; 205. Placing seat; 206. First clamping plate; 207. Electric telescopic rod; 208. Second clamping plate; 3. Leg; 4. Bottom plate; 5. Base; 6. Support frame; 7. Laser cutting machine body; 8. First rotation hole; 9. Second rotation hole; 10. Adjustment groove; 11. Sliding groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Please refer to Figures 1-5 , the present utility model provides the following technical solutions:

[0028] An efficient laser cutting device for the outer shell of a fully automatic wafer cleaning machine, comprising an adjusting component 1, a fixing component 2, legs 3, a bottom plate 4, a base 5, a support frame 6 and a laser cutting machine body 7. The adjusting component 1 is arranged on the top of the bottom plate 4, the fixing component 2 is arranged on the top of the base 5, the legs 3 are fixedly connected to the bottom of the bottom plate 4, the base 5 is fixedly connected to the top of the bottom plate 4, the support frame 6 is fixedly connected to the top of the base 5, and the laser cutting machine body 7 is fixedly connected to the top inside the support frame 6;

[0029] The adjusting component 1 includes a first adjusting rod 101, an adjusting hole 102, a first motor 103 and a connecting seat 104. The first adjusting rod 101 is rotatably connected to the inner wall of the base 5. The adjusting hole 102 is opened on the front and rear sides of the connecting seat 104. The first motor 103 is fixedly connected to the front side of the first adjusting rod 101. The connecting seat 104 is threadedly connected to the surface of the first adjusting rod 101.

[0030] In this embodiment: Through the setting of the laser cutting machine body 7, the laser cutting machine body 7 is an existing device for cutting, grooving and opening holes in the outer shell of a fully automatic wafer cleaning machine. Through the setting of the first adjusting rod 101, the first adjusting rod 101 can achieve the effect of adjusting the front and rear threaded connection of the connecting seat 104. Through the setting of the adjusting hole 102, the adjusting hole 102 can achieve the effect of threaded connection to the first adjusting rod 101. Through the setting of the first motor 103, the first motor 103 can provide rotational power for the first adjusting rod 101. Through the setting of the connecting seat 104, the connecting seat 104 can achieve the effect of connecting the connecting plate 201.

[0031] Specifically, as Figure 4 shown, the fixing component 2 includes a connecting plate 201. The connecting plate 201 is fixedly connected to the top of the connecting seat 104. The inner wall of the connecting plate 201 is rotatably connected to a second adjusting rod 202. The front side of the second adjusting rod 202 is fixedly connected to a second motor 203.

[0032] Specifically, as Figure 4 shown, the surface of the second adjusting rod 202 is threadedly connected to an adjusting block 204. The top of the adjusting block 204 is fixedly connected to a first clamping plate 206. The top of the connecting plate 201 is fixedly connected to a placing seat 205.

[0033] Specifically, as Figure 4 shown, both sides inside the placing seat 205 are fixedly connected to electric telescopic rods 207. Opposite sides of the electric telescopic rods 207 are fixedly connected to second clamping plates 208.

[0034] In this embodiment: Through the setting of the connecting plate 201, the connecting plate 201 can achieve the effect of connecting the placement seat 205. Through the setting of the second adjusting rod 202, since the second adjusting rod 202 is an existing bidirectional threaded rod, the effect of adjusting the adjusting block 204 in the front and rear opposite directions can be achieved. Through the setting of the second motor 203, the second motor 203 can achieve the effect of providing rotational power for the second adjusting rod 202. Through the setting of the adjusting block 204, the adjusting block 204 can achieve the effect of connecting and fixing the first clamping plate 206. Through the setting of the placement seat 205, the placement seat 205 can achieve the effect of providing a placement condition for the housing. Through the setting of the first clamping plate 206, the first clamping plate 206 can achieve the effect of clamping and fixing the front side and the rear side of the housing. Through the setting of the electric telescopic rod 207, the electric telescopic rod 207 can achieve the effect of connecting and adjusting the second clamping plate 208 left and right. Thus, when the electric telescopic rod 207 is used in cooperation with the second clamping plate 208, the effect of clamping and fixing the two sides of the housing can be achieved, and at the same time, the effect of adjusting the housing left and right can also be achieved.

[0035] Specifically, as Figure 3 shown, first rotation holes 8 are provided on both the front side and the rear side of the base 5, and the inner wall of the first rotation hole 8 is rotatably connected to the surface of the first adjusting rod 101.

[0036] Specifically, as Figure 5 shown, a second rotation hole 9 is provided on the front side of the connecting plate 201, and the inner wall of the second rotation hole 9 is rotatably connected to the surface of the second adjusting rod 202.

[0037] In this embodiment: Through the setting of the first rotation hole 8, the first rotation hole 8 can achieve the effect of threaded connection for the first adjusting rod 101. Through the setting of the second rotation hole 9, the second rotation hole 9 can achieve the effect of rotational connection for the second adjusting rod 202.

[0038] Specifically, as Figure 5 shown, an adjustment groove 10 is provided on the top of the connecting plate 201, and the inner wall of the adjustment groove 10 is slidably connected to the surface of the adjusting block 204.

[0039] Specifically, as Figure 5 shown, a sliding groove 11 is provided on the top of the placement seat 205, and the inner wall of the sliding groove 11 is slidably connected to the bottom of the second clamping plate 208.

[0040] In this embodiment: Through the setting of the adjustment groove 10, the adjustment groove 10 can achieve the effect of limiting and sliding connection for the adjusting block 204. Through the setting of the sliding groove 11, the sliding groove 11 can achieve the effect of limiting and sliding connection for the bottom of the second clamping plate 208.

[0041] Working principle: First, place the outer shell on the placement seat 205, then turn on the second motor 203, so that the second motor 203 drives the second adjusting rod 202 to rotate, thereby enabling the second adjusting rod 202 to adjust the adjusting block 204 back and forth, and further enabling the adjusting block 204 to drive the first clamping plate 206 to clamp and fix the front and rear sides of the outer shell. Then turn on the electric telescopic rod 207, so that the electric telescopic rod 207 drives the second clamping plate 208 to clamp and fix the two sides of the outer shell. Then the laser cutting machine body 7 can be turned on to cut the outer shell. During the cutting process, the electric telescopic rod 207 can be used in cooperation with the second clamping plate 208 to adjust the outer shell left and right. Then turn on the first motor 103 to drive the first adjusting rod 101 to rotate, thereby enabling the first adjusting rod 101 to adjust the connecting seat 104 back and forth, and further enabling the connecting seat 104 to drive the connecting plate 201 and the placement seat 205 to adjust the outer shell back and forth, so as to complete the adjustment of the cutting direction of the outer shell, and thus there is no need for manual adjustment, which improves the cutting efficiency. Moreover, through the clamping and fixing of the first clamping plate 206 in cooperation with the second clamping plate 208, the stability of the outer shell during cutting can also be maintained.

[0042] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An efficient laser cutting device for the shell of a full-automatic wafer cleaning machine, comprising an adjusting component (1), a fixing component (2), legs (3), a bottom plate (4), a base (5), a support frame (6) and a laser cutting machine body (7), characterized in that: The adjustment component (1) is arranged on the top of the bottom plate (4), the fixing component (2) is arranged on the top of the base (5), the supporting legs (3) are fixedly connected to the bottom of the bottom plate (4), the base (5) is fixedly connected to the top of the bottom plate (4), the support frame (6) is fixedly connected to the top of the base (5), and the laser cutting machine body (7) is fixedly connected to the top inside the support frame (6); The adjustment component (1) includes a first adjustment rod (101), adjustment holes (102), a first motor (103) and a connecting seat (104). The first adjustment rod (101) is rotatably connected to the inner wall of the base (5). The adjustment holes (102) are formed in the front side and the rear side of the connecting seat (104). The first motor (103) is fixedly connected to the front side of the first adjustment rod (101). The connecting seat (104) is threadedly connected to the surface of the first adjustment rod (101).

2. The high-efficiency laser cutting device for the shell of a fully automatic wafer cleaning machine according to claim 1, wherein: The fixing component (2) includes a connecting plate (201). The connecting plate (201) is fixedly connected to the top of the connecting seat (104). A second adjustment rod (202) is rotatably connected to the inner wall of the connecting plate (201). A second motor (203) is fixedly connected to the front side of the second adjustment rod (202).

3. The high-efficiency laser cutting device for the shell of a fully automatic wafer cleaning machine according to claim 2, wherein: An adjustment block (204) is threadedly connected to the surface of the second adjustment rod (202). A first clamping plate (206) is fixedly connected to the top of the adjustment block (204). A placement seat (205) is fixedly connected to the top of the connecting plate (201).

4. An efficient laser cutting device for the outer shell of a fully automatic wafer cleaning machine according to claim 3, characterized in that: Electric telescopic rods (207) are fixedly connected to both sides inside the placement seat (205). A second clamping plate (208) is fixedly connected to the opposite side of the electric telescopic rods (207).

5. An efficient laser cutting device for the shell of a fully automatic wafer cleaning machine according to claim 1, characterized in that: First rotation holes (8) are formed in both the front side and the rear side of the base (5). The inner wall of the first rotation holes (8) is rotatably connected to the surface of the first adjustment rod (101).

6. The high-efficiency laser cutting device for the outer shell of a fully automatic wafer cleaning machine according to claim 2, characterized in that: A second rotation hole (9) is formed in the front side of the connecting plate (201). The inner wall of the second rotation hole (9) is rotatably connected to the surface of the second adjustment rod (202).

7. An efficient laser cutting device for the outer shell of a fully automatic wafer cleaning machine according to claim 2, characterized in that: An adjustment groove (10) is formed in the top of the connecting plate (201). The inner wall of the adjustment groove (10) is slidably connected to the surface of the adjustment block (204).

8. An efficient laser cutting device for the outer shell of a fully automatic wafer cleaning machine according to claim 3, characterized in that: A sliding groove (11) is formed in the top of the placement seat (205). The inner wall of the sliding groove (11) is slidably connected to the bottom of the second clamping plate (208).

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