Heat preservation box

Abstract

The utility model discloses a heat preservation box. The heat preservation box comprises a bottom plate structure; the heat preservation structure comprises a bottom plate structure and a plurality of heat preservation structures installed on the bottom plate structure, the heat preservation structures are sequentially arranged along the edge of the bottom plate structure, the bottom plate structure and the heat preservation structures define a box body with an opening in the top, and each heat preservation structure comprises a frame and a first heat preservation layer; the frame is arranged on the outer side of the first heat preservation layer. The frames of any two adjacent heat preservation structures are connected through the connecting assemblies; and the top structure is mounted at the top of the box body. In the embodiment of the invention, the incubator does not need to reserve a space for a tester to enter the incubator for operation, so that the size of the incubator is reduced, and the occupied area of the incubator is reduced. The frame can protect the first heat preservation layer, and the first heat preservation layer is prevented from being damaged or cracked in the repeated disassembling and assembling process. The first heat preservation layer can improve the heat preservation effect.

Description

Technical Field

[0001] This application relates to the technical field of fuel cells, and particularly to a heat preservation box. Background Art

[0002] In related technologies, the mutual conversion between electrical energy and chemical energy is achieved through various electrochemical energy conversion devices, such as fuel cells and electrolytic cells. Common fuel cells include alkaline fuel cells (AFC), phosphoric acid fuel cells (PAFC), molten carbonate fuel cells (MCFC), proton exchange membrane fuel cells (PEMFC), direct methanol fuel cells (DMFC), solid oxide fuel cells (SOFC), etc. Common electrolytic cells include alkaline electrolytic cells (AWE), proton exchange membrane water electrolytic cells (PEMWE), anion exchange membrane water electrolytic cells (AEMWE), and solid oxide electrolytic cells (SOEC), etc.

[0003] Among them, solid oxide fuel cells (SOFC) and solid oxide electrolytic cells (SOEC) can be collectively referred to as solid oxide cells (SOC). Solid oxide cells (SOC) are advanced electrochemical energy storage and conversion devices, and have broad application prospects in the fields of clean energy power generation and CO2 conversion. A solid oxide fuel cell (SOFC) is an energy conversion device that can directly convert the chemical energy stored in fuels and oxidants into electrical energy. It has a relatively high operating temperature, usually in the range of 700 - 1000 °C. Therefore, it can utilize its waste heat to achieve combined heat and power generation while generating electricity, and the energy utilization efficiency can be as high as 90%. A solid oxide electrolytic cell (SOEC) is an electrochemical energy conversion device that converts electrical energy and heat energy into chemical energy, and its reaction is the reverse reaction of a solid oxide fuel cell. As one of the main technical routes for hydrogen production by electrolyzing water today, SOEC usually operates at 700 - 850 °C, and the electrolysis efficiency is as high as 85% - 95%.

[0004] During the operation of fuel cells and solid oxide electrolytic cells, it is necessary to keep the internal high-temperature components in a high-temperature state, and the high-temperature components need to be tested multiple times during the heat preservation process.

[0005] For such large high-temperature components, a semi-closed + one-side open heat preservation box is usually used for heat preservation. If it is necessary to test the high-temperature components, it is necessary to enter the heat preservation box. Therefore, space needs to be reserved inside the heat preservation box, resulting in a large occupied area of the heat preservation box. In addition, when testing the high-temperature components multiple times, it is necessary to disassemble and assemble the heat preservation box multiple times, and the current structure of the heat preservation box is rather troublesome to disassemble and assemble. Utility Model Content

[0006] This application aims to solve at least one of the technical problems existing in the prior art. To this end, this application proposes an incubator that can be easily disassembled and assembled and also helps to reduce the volume of the incubator.

[0007] The incubator according to an embodiment of this application includes:

[0008] A bottom plate structure;

[0009] A plurality of heat preservation structures mounted on the bottom plate structure, the plurality of heat preservation structures are sequentially arranged along the edge of the bottom plate structure, and the bottom plate structure and the plurality of heat preservation structures enclose a box body with an open top. Wherein, each heat preservation structure includes a frame and a first heat preservation layer, and the frame is arranged outside the first heat preservation layer;

[0010] A connecting component, and the frames of any two adjacent heat preservation structures are connected by the connecting component;

[0011] A top structure, mounted on the top of the box body.

[0012] Further, the contour of the bottom plate structure is presented as a polygon, the heat preservation structure includes a first part and a second part connected to each other, and the included angle between the first part and the second part matches the top angle of the polygon.

[0013] Further, the contour of the bottom plate structure is presented as a square, and the first part and the second part are arranged in an L shape.

[0014] Further, the frame is a metal frame, and the metal frame overlaps with the edge of the first heat preservation layer. Wherein, the position of the metal frame corresponding to the middle part of the first heat preservation layer is a hollow structure.

[0015] Further, the heat preservation structure includes a first screw and a first nut, and the first screw sequentially passes through the first heat preservation layer and the metal frame from the inner surface of the first heat preservation layer, and then is cooperatively connected with the first nut.

[0016] Further, it further includes a heat insulation rod, and the heat insulation rod is arranged at the connection part between the metal frame and the first nut. Wherein, there is a gap between the heat insulation rod and the first nut.

[0017] Further, the first screw is cooperatively connected with the first nut, and the gap between the nut and the heat insulation rod is greater than or equal to 10 mm.

[0018] Further, the number of the first heat preservation layers is multiple, and the multiple first heat preservation layers are arranged with staggered joints.

[0019] Further, the bottom plate structure includes a second heat-insulating layer, which is stepped along the thickness direction. The structure at the junction of the heat-insulating structure and the second heat-insulating layer is stepped and matches the step shape of the second heat-insulating layer.

[0020] Further, at least one of the first heat-insulating layer and the second heat-insulating layer includes a nano-board.

[0021] Further, at least one of the first heat-insulating layer and the second heat-insulating layer includes a first ceramic fiber board, a nano-board, and a second ceramic fiber board arranged in sequence.

[0022] Further, at least one of the first heat-insulating layer and the second heat-insulating layer includes a ceramic fiber board and a nano-board. The ceramic fiber board has a hollow cavity, and the nano-board is arranged in the hollow cavity.

[0023] The incubator of the embodiment of the present application has at least the following beneficial effects: In the embodiment of the present application, there is a cavity in the incubator for placing high-temperature components that need to be heat-insulated. When testing is required, the top structure and each heat-insulating structure can be disassembled by a lifting tool to facilitate the testing of the high-temperature components in the incubator. In this way, it is not necessary to reserve space for testers to enter the incubator for operation, which helps to reduce the volume of the incubator and thus helps to reduce the occupied area of the incubator. At the same time, the incubator is enclosed by a bottom plate structure, multiple heat-insulating structures, and a top structure. The connecting components are used to connect two adjacent heat-insulating structures, so that the top structure and the heat-insulating structures can be easily disassembled, and it is possible to conveniently test the high-temperature components placed in the incubator by disassembling the incubator. In addition, the heat-insulating structure includes a frame and a first heat-insulating layer. Among them, the frame can protect the first heat-insulating layer and reduce the damage or cracking of the first heat-insulating layer during repeated disassembly and assembly; the first heat-insulating layer can improve the heat-insulating effect.

[0024] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0025] The following will further describe the present application with reference to the drawings and embodiments, where:

[0026] Figure 1 is a schematic structural diagram of an incubator according to an embodiment of the present application, where the top structure is omitted in the illustration;

[0027] Figure 2 is a partial structural diagram of an incubator according to an embodiment of the present application, and the illustration shows an assembly diagram of the heat-insulating structure and the bottom plate structure;

[0028] Figure 3Explosion structure schematic diagram of the first heat insulation layer or the second heat insulation layer of an embodiment of the present application.

[0029] Reference numerals:

[0030] 100, bottom plate structure; 110, stepped structure;

[0031] 210, frame; 220, first heat insulation layer; 221, first ceramic fiber board; 2221, hollow cavity; 222, nano board; 223, second ceramic fiber board; 230, first screw; a, first part; b, second part;

[0032] 300, connection assembly;

[0033] 400, heat insulation rod. Detailed implementation manners

[0034] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application.

[0035] In the description of the present application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0036] In the description of the present application, the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If the first and second are described only for the purpose of distinguishing technical features, they should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0037] In the description of the present application, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present application in combination with the specific content of the technical solution.

[0038] In the description of the present application, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0039] See Figure 1 and Figure 2 , an embodiment of the present application discloses a heat preservation box, which includes a bottom plate structure 100, a heat preservation structure, a connection assembly 300, and a top structure.

[0040] Specifically, the bottom plate structure 100 plays a supporting role for each heat preservation structure; there are multiple heat preservation structures, and the multiple heat preservation structures are installed on the bottom plate structure 100, and the multiple heat preservation structures are arranged in sequence along the edge of the bottom plate structure 100. The bottom plate structure 100 and the multiple heat preservation structures enclose a box body with an open top. Among them, each heat preservation structure includes a frame 210 and a first heat preservation layer 220, and the frame 210 is arranged outside the first heat preservation layer 220. The frames 210 of any two adjacent heat preservation structures are connected by a connection assembly 300; the top structure is installed on the top of the box body.

[0041] In an embodiment of the present application, the heat preservation box has a cavity for placing high-temperature components that need to be heat-preserved. When testing is required, the top structure and each heat preservation structure can be disassembled through a lifting tool, so as to facilitate the testing of the high-temperature components in the heat preservation box. In this way, it is not necessary to reserve a space for testers to enter the heat preservation box for operation, which helps to reduce the volume of the heat preservation box, and thus helps to reduce the occupied area of the heat preservation box. At the same time, the heat preservation box is enclosed by the bottom plate structure 100, multiple heat preservation structures, and the top structure, and the connection assembly 300 is used to connect two adjacent heat preservation structures, so that the top structure and the heat preservation structure can be easily disassembled, and it is possible to conveniently test the high-temperature components placed in the heat preservation box by disassembling the heat preservation box.

[0042] In some embodiments of the present application, see Figure 1 and Figure 2 , the connection assembly 300 is specifically a bolt, and the connection assembly 300 is provided near the connection part of two adjacent frames 210. By passing the bolt through the connection assembly 300 of two adjacent frames 210, the two adjacent frames 210 are connected and fixed.

[0043] In some embodiments of the present application, see Figure 1 and Figure 2, the outline of the bottom plate structure 100 is presented as a polygon. The thermal insulation structure includes a first part a and a second part b that are connected to each other. The included angle between the first part a and the second part b matches the vertex angle of the polygon. Specifically, each thermal insulation structure includes a first part a and a second part b arranged at an included angle, and the included angle between the two parts matches the vertex angle of the polygon, so that the number of thermal insulation structures of the incubator can be effectively reduced, and it is convenient to disassemble the incubator. At the same time, the first part a and the second part b of the thermal insulation structure are arranged at an included angle, which also helps to improve the structural strength of each thermal insulation structure and is conducive to reducing the deformation of the thermal insulation structure. At the same time, it also helps to reduce the heat in the box from escaping through the gap between the first part a and the second part b.

[0044] In a possible implementation manner, refer to Figure 1 and Figure 2 , the outline of the bottom plate structure 100 is presented as a square, and the first part a and the second part b are arranged in an L shape. Specifically, the included angle between the first part a and the second part b is set at 90°. Among them, the number of thermal insulation structures is four, and the four thermal insulation structures are respectively arranged at one vertex position of the bottom plate structure 100. During the assembly process, by directly placing each thermal insulation structure at each vertex position of the bottom plate structure 100, the incubator can be quickly assembled, improving the disassembly and assembly efficiency of the incubator; at the same time, during the assembly process, the included angle between the first part a and the second part b can be aligned with the included angle of the bottom plate structure 100 to achieve the alignment of the thermal insulation structure, which is conducive to improving the alignment and installation efficiency.

[0045] It should be understood that the first thermal insulation layer 220 is provided on both the first part a and the second part b. The frame 210 can be an integral structure. In this way, the two first thermal insulation layers 220 can be fixed to the frame 210 to assemble the thermal insulation structure of this embodiment.

[0046] In the above embodiment, the first thermal insulation layer 220 provided on the first part a and the second part b is an integral structure. In this way, the heat dissipation from the connection between the first part a and the second part b can be reduced, thereby weakening the thermal insulation effect.

[0047] It should be noted that the width of the first part a can be the same as or different from the width of the second part b.

[0048] Exemplarily, refer to Figure 1 and Figure 2 , the widths of the first part a and the second part b are the same, and the widths of both the first part a and the second part b are equal to half of the side length of the bottom structure.

[0049] In some embodiments of the present application, refer to Figure 1 and Figure 2, the frame 210 is a metal frame, and the metal frame overlaps with the edge of the first thermal insulation layer 220. Among them, the position of the metal frame corresponding to the middle part of the first thermal insulation layer 220 is a hollow structure. That is to say, the metal frame is arranged at the edge of the first thermal insulation layer 220 to seal the connection of the two pieces of the first thermal insulation layer 220. Compared with the frame 210 completely covering the first thermal insulation layer 220, this embodiment can achieve the purpose of protecting the first thermal insulation layer 220 while reducing the material cost of the frame 210.

[0050] In some embodiments of the present application, refer to Figure 1 and Figure 2 , the thermal insulation structure includes a first screw 230 and a first nut. The first screw 230 sequentially passes through the first thermal insulation layer 220 and the metal frame from the inner surface of the first thermal insulation layer 220, and then is connected in cooperation with the first nut. The first screw 230 passes through the first thermal insulation layer 220 and the frame 210 from the inner surface of the first thermal insulation layer 220 to reach the outer surface of the frame 210, and then the first nut and the first screw 230 cooperate to lock the first thermal insulation layer 220 and the frame 210, so as to fix the first thermal insulation layer 220. Compared with pasting and fixing the first thermal insulation layer 220 on the frame 210, in this embodiment, the first thermal insulation layer 220 and the frame 210 are fixedly connected by the first screw 230 and the first nut, which can avoid the situation of the adhesive failing at high temperature and is beneficial to improving the high-temperature resistance of the thermal insulation structure of this embodiment.

[0051] In a possible implementation manner, the first screw 230 is a ceramic screw and the first nut is a ceramic nut.

[0052] Since the high-temperature component has a very high temperature, when the first thermal insulation layer 220 and the frame 210 are connected by the first screw 230 and the first nut (i.e., the bolt), the heat will be transferred to the bolt, and the bolt will pass through the first thermal insulation layer 220 to transfer the heat to the outside.

[0053] In some embodiments of the present application, refer to Figure 1 and Figure 2 , it further includes a heat insulation rod 400. The heat insulation rod 400 is arranged at the connection of the frame 210 and the first nut. Among them, there is a gap between the heat insulation rod 400 and the first nut. That is to say, the heat insulation rod 400 covers the periphery of the first nut, and there is no direct contact between the heat insulation rod 400 and the first nut. In this way, in this embodiment, by arranging the heat insulation rod 400 at the connection of the outer wall of the frame 210 and the first nut and surrounding the first nut with the heat insulation rod 400, it can prevent external heat conduction and also prevent the operator from touching the first nut and being scalded.

[0054] In some embodiments of the present application, the first screw 230 is connected in cooperation with the first nut, and the gap between the nut and the heat insulation rod 400 is greater than or equal to 10 mm.

[0055] In the above embodiments, by way of example, the distance between the heat insulation rod 400 and the first screw 230 and the first nut is greater than 10 mm, and there is no connection or contact in between. The temperature conducted from the first screw 230 to the first nut is about 100 °C, and most of this temperature will be carried away by the flowing air, and only about 30 °C of the temperature is transmitted to the heat insulation rod 400.

[0056] In some embodiments of the present application, the number of the first heat insulation layers 220 is multiple, and the multiple first heat insulation layers 220 are arranged with staggered joints. If each heat insulation layer is stacked one by one correspondingly, then the heat will be transmitted out from the gaps. Therefore, in this embodiment, when the multiple first heat insulation layers 220 are arranged on the side, staggered joints will be made. By arranging the staggered joints for each first heat insulation layer 220, the heat insulation ability is enhanced.

[0057] In some embodiments of the present application, the bottom structure includes a bottom plate, and the bottom plate is made of a metal material or a hard material. By way of example, the bottom plate is made of a metal plate or a perforated metal plate, and the bottom plate provides support for each heat insulation structure.

[0058] By using the bottom plate to hold the bottom, the heat insulation structure is positioned and relatively fixed by the bottom plate.

[0059] In some embodiments of the present application, referring to Figure 1 and Figure 2 , the bottom plate structure 100 includes a second heat insulation layer, the second heat insulation layer is arranged on the bottom plate, the second heat insulation layer is in a stepped shape along the thickness direction, and the structure at the connection between the heat insulation structure and the second heat insulation layer is in a stepped shape and is matched with the stepped shape of the second heat insulation layer. Among them, the connection between the first heat insulation layer 220 and the second heat insulation layer is set as a stepped structure 110, which can reduce the heat conduction of the bottom plate holding the bottom to the outside from the internal high-temperature components, and is beneficial to improving the heat insulation performance. Among them, the thickness direction of the second heat insulation layer is the X direction shown in the figure.

[0060] Furthermore, at least one of the first heat insulation layer 220 and the second heat insulation layer is made of a nano board 222. The nano board 222 has good heat insulation performance, can meet the heat insulation performance while reducing the number of heat insulation layers, thereby reducing the volume of the heat insulation box.

[0061] In some embodiments of the present application, referring to Figure 3 , at least one of the first heat insulation layer 220 and the second heat insulation layer includes a first ceramic fiber board 221, a nano board 222 and a second ceramic fiber board 223 arranged in sequence. That is, the first heat insulation layer 220 or the second heat insulation layer is formed by stacking the first ceramic fiber board 221, the nano board 222 and the second ceramic fiber board 223 from left to right.

[0062] Among them, the nanoboard 222 is expensive, and the nanoboard 222 is relatively soft and brittle. The ceramic fiber board has a low cost and a relatively high hardness. Therefore, in this embodiment, by arranging ceramic fiber boards on both sides of the nanoboard 222, while ensuring the heat preservation ability, the number of layers of the nanoboard 222 can be reduced, which is beneficial to cost reduction. The nanoboard 222 can also be protected and fixed by the first ceramic fiber board 221 and the second ceramic fiber board.

[0063] In some embodiments of the present application, at least one of the first heat preservation layer 220 and the second heat preservation layer includes a ceramic fiber board and a nanoboard 222. The ceramic fiber board has a hollow cavity 2221, and the nanoboard 222 is arranged in the hollow cavity 2221. Embedding the nanoboard 222 into the ceramic fiber board can further fix the nanoboard 222.

[0064] The embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the present application is not limited to the above embodiments. Various changes can be made without departing from the spirit of the present application within the scope of knowledge possessed by those of ordinary skill in the art. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. An incubator, characterized in that, Comprising: A bottom plate structure; A plurality of heat insulation structures mounted on the bottom plate structure, the plurality of heat insulation structures being sequentially arranged along the edge of the bottom plate structure, the bottom plate structure and the plurality of heat insulation structures enclosing a box body with an open top, wherein each heat insulation structure includes a frame and a first heat insulation layer, and the frame is arranged outside the first heat insulation layer; A connecting component, and the frames of any two adjacent heat insulation structures are connected by the connecting component; A top structure, mounted on the top of the box body.

2. The incubator according to claim 1, characterized in that, The contour of the bottom plate structure presents a polygon, the heat insulation structure includes a first part and a second part connected to each other, and the included angle between the first part and the second part matches the vertex angle of the polygon.

3. The incubator according to claim 2, characterized in that, The contour of the bottom plate structure presents a square, and the first part and the second part are arranged in an L shape.

4. The incubator according to any one of claims 1 to 3, characterized in that, The frame is a metal frame, and the metal frame overlaps with the edge of the first heat insulation layer, wherein the position of the metal frame corresponding to the middle part of the first heat insulation layer is a hollow structure.

5. The incubator according to claim 4, characterized in that, The heat insulation structure includes a first screw rod and a first nut, the first screw rod sequentially passes through the first heat insulation layer and the metal frame from the inner surface of the first heat insulation layer, and then is cooperatively connected with the first nut.

6. The incubator according to claim 5, characterized in that, It further includes a heat insulation rod, and the heat insulation rod is arranged at the connection part between the metal frame and the first nut, wherein there is a gap between the heat insulation rod and the first nut.

7. The incubator according to claim 6, wherein, The first screw rod is cooperatively connected with the first nut, and the gap between the nut and the heat insulation rod is greater than or equal to 10 mm.

8. The incubator according to claim 1, characterized in that, The number of the first heat insulation layers is multiple, and the multiple first heat insulation layers are arranged with staggered joints.

9. The incubator according to claim 1 or 8, characterized in that, The bottom plate structure includes a second heat insulation layer, the second heat insulation layer presents a stepped shape along the thickness direction, and the structure at the connection part between the heat insulation structure and the second heat insulation layer is stepped and cooperates with the stepped shape of the second heat insulation layer.

10. The incubator according to claim 9, characterized in that, At least one of the first heat insulation layer and the second heat insulation layer includes a nano board; or, at least one of the first heat insulation layer and the second heat insulation layer includes a first ceramic fiber board, a nano board and a second ceramic fiber board arranged in sequence; or, at least one of the first heat insulation layer and the second heat insulation layer includes a ceramic fiber board and a nano board, the ceramic fiber board has a hollow cavity, and the nano board is arranged in the hollow cavity.

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