Blanking device for PCB electroplating

Abstract

The utility model is applicable to the technical field of PCB (printed circuit board) electroplating processing, and provides a blanking device for PCB electroplating, which comprises a support frame, and a mounting frame is arranged on the support frame; the hydraulic rod is fixedly mounted on the mounting frame, and a mounting plate is fixedly mounted on an output shaft of the hydraulic rod; the first placing frames are fixedly installed on the installation plate, the first air cylinders are fixedly installed on the first placing frames correspondingly, first clamping plates are fixedly installed on output shafts of the first air cylinders correspondingly, and the first clamping plates are used for clamping and discharging PCBs; the plurality of placing plates are arranged on the mounting plate, and transposition clamping mechanisms are arranged on the plurality of placing plates. According to the discharging device for PCB electroplating, electroplating discharging can be conducted on a PCB, meanwhile, the electroplated PCB can be subjected to transposition clamping, then electroplating treatment can be well conducted on the whole PCB, and the electroplating treatment effect of the PCB is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of PCB board electroplating processing, and particularly relates to a blanking device for PCB board electroplating. Background Art

[0002] During the processing of PCB boards, electroplating treatment needs to be carried out on the PCB boards, so corresponding blanking devices are required to blank the PCB boards into corresponding electroplating tanks.

[0003] However, some existing blanking devices for PCB board electroplating still have certain deficiencies in the actual use process. When using the blanking device for PCB board electroplating to blank the PCB board, the PCB board is clamped, and then the clamped PCB board is inserted into the electroplating tank. However, the clamped part of the PCB board cannot be well electroplated, resulting in incomplete electroplating treatment on the PCB board, thereby reducing the electroplating treatment effect on the PCB board. Summary of the Utility Model

[0004] The utility model provides a blanking device for PCB board electroplating, aiming to solve the problem that the currently used blanking device for PCB board electroplating cannot comprehensively electroplate the PCB board as mentioned in the above background art.

[0005] To solve the above problems, the utility model is realized as follows. A blanking device for PCB board electroplating includes: a support frame, on which an installation frame is arranged; a hydraulic rod fixedly installed on the installation frame, and an installation plate is fixedly installed on the output shaft of the hydraulic rod; a plurality of first placement frames fixedly installed on the installation plate, first cylinders respectively fixedly installed on the plurality of first placement frames, and first clamping plates are fixedly installed on the output shafts of the plurality of first cylinders. The first clamping plates are used for clamping and blanking the PCB board; a plurality of placement plates arranged on the installation plate, and a transposition clamping mechanism is arranged on the plurality of placement plates. The transposition clamping mechanism is used for transposition clamping of the PCB board; a vibration mechanism is arranged on the installation plate and the placement plates, and the vibration mechanism is used for vibrating and discharging the electroplated PCB board; a moving mechanism assembled on the support frame and the installation frame, and the moving mechanism is used for driving the clamped PCB board to move.

[0006] Preferably, the transposition clamping mechanism includes: a telescopic rod fixedly installed on the placement plate; a second placement frame fixedly installed on the output shaft of the telescopic rod; two second cylinders fixedly installed on the second placement frame; two second clamping plates respectively fixedly installed on the output shafts of the two second cylinders. The second clamping plates are used for transposition clamping of the electroplated PCB board.

[0007] Preferably, the vibration mechanism includes: a mounting shell fixedly installed on the mounting plate; a plurality of connecting rods slidably arranged on the mounting shell, one end of the connecting rod being fixedly connected to the placing plate, and a first spring being sleeved on the connecting rod; a connecting plate arranged in the mounting shell, the connecting plate being fixedly connected to one end of the connecting rod; a driving motor fixedly installed in the mounting shell, a convex block being fixedly sleeved on the output shaft of the driving motor, the convex block being located on one side of the connecting plate, the convex block being adapted to the connecting plate, and the convex block being used for extruding the connecting plate.

[0008] Preferably, the moving mechanism includes: a dual-axis motor fixedly installed on the support frame, mounting shafts being fixedly installed on both output shafts of the dual-axis motor; two lead screws rotatably installed on the support frame; four bevel gears respectively fixedly sleeved on the two lead screws and the two mounting shafts, the two bevel gears fixedly sleeved on the two lead screws and the two bevel gears fixedly sleeved on the two mounting shafts being meshed with each other; two mounting blocks respectively threadedly sleeved on the two lead screws, both of the two mounting blocks being fixedly connected to the mounting frame.

[0009] Preferably, a connecting mechanism is arranged on the mounting shell and the connecting plate, and the connecting mechanism includes: a guide rod fixedly installed in the mounting shell; a guide block fixedly installed on the connecting plate, the guide block being slidably connected to the guide rod; a second spring sleeved on the guide rod.

[0010] Preferably, a sliding frame is fixedly installed on the mounting frame, a sliding rod is fixedly installed on the mounting plate, and the sliding rod is slidably connected to the sliding frame.

[0011] Preferably, a controller is arranged on one side of the mounting frame, and the controller is used for controlling operations.

[0012] Compared with the related art, the blanking device for PCB plating provided by the present utility model has the following beneficial effects:

[0013] Compared with the prior art, the blanking device for PCB plating provided by this solution:

[0014] Through the support frame, mounting frame, hydraulic rod, mounting plate, first placing frame, first cylinder, placing plate, transposition clamping mechanism, vibration mechanism, moving mechanism, connecting mechanism, sliding frame, sliding rod and controller, a blanking device for PCB plating is formed, which can perform electroplating blanking on the PCB, and at the same time can perform transposition clamping on the electroplated PCB, so as to well perform electroplating treatment on the entire PCB and improve the electroplating treatment effect of the PCB. Description of the Drawings

[0015] Figure 1It is the front view structural schematic diagram of a blanking device for PCB board electroplating provided by the present utility model;

[0016] Figure 2 It is the front view sectional structural schematic diagram of the present utility model;

[0017] Figure 3 It is Figure 2 the enlarged structural schematic diagram of part A shown in

[0018] Figure 4 It is Figure 3 the enlarged structural schematic diagram of part B shown in

[0019] Figure 5 It is Figure 2 the enlarged structural schematic diagram of part C shown in

[0020] Figure 6 It is the top view sectional structural schematic diagram of the support frame and the moving mechanism in the present utility model;

[0021] Figure 7 It is the three - dimensional structural schematic diagram of the first placement rack, the first cylinder and the first clamping plate in the present utility model.

[0022] Reference numerals: 1, support frame; 2, mounting frame; 3, hydraulic rod; 4, mounting plate; 5, first placement rack; 6, first cylinder; 601, first clamping plate; 7, placement plate; 8, telescopic rod; 9, second placement rack; 10, second cylinder; 11, second clamping plate; 12, mounting shell; 13, connecting rod; 14, first spring; 15, connecting plate; 16, drive motor; 17, convex block; 18, double - shaft motor; 19, mounting shaft; 20, lead screw; 21, bevel gear; 22, mounting block; 23, guide rod; 24, guide block; 25, second spring; 26, sliding frame; 27, sliding rod. Detailed implementation manners

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order; the orientation or positional relationship indicated by the terms "inner", "outer", "left", "right" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0025] An embodiment of the present utility model provides a blanking device for PCB board electroplating, as Figure 1-7 shown. The blanking device for PCB board electroplating includes: a support frame 1, on which an installation frame 2 is provided; a hydraulic rod 3 fixedly installed on the installation frame 2, and an installation plate 4 fixedly installed on the output shaft of the hydraulic rod 3; a plurality of first placement frames 5 fixedly installed on the installation plate 4, first cylinders 6 respectively fixedly installed on the plurality of first placement frames 5, and first clamping plates 601 fixedly installed on the output shafts of the plurality of first cylinders 6. The first clamping plates 601 are used for clamping and blanking the PCB board; a plurality of placement plates 7 provided on the installation plate 4, and a transposition clamping mechanism is provided on the plurality of placement plates 7. The transposition clamping mechanism is used for transposition clamping of the PCB board; a vibration mechanism is provided on the installation plate 4 and the placement plates 7, and the vibration mechanism is used for vibrating and discharging the electroplated PCB board; a moving mechanism is assembled on the support frame 1 and the installation frame 2, and the moving mechanism is used for driving the clamped PCB board to move.

[0026] In this embodiment, the corresponding PCB board is placed between the corresponding first clamping plates 601. The controller is used to start the first cylinder 6 to drive the first clamping plates 601 to move, so as to clamp and fix the PCB board. Then, the controller is used to start the moving mechanism to move the clamped PCB board above the corresponding electroplating bath. Then, the controller is used to start the hydraulic rod 3 to drive the PCB board clamped on the mounting plate 4 to move down into the electroplating bath for electroplating operation. When the electroplating operation is completed for a certain period of time, the controller is used to start the transposition clamping mechanism to clamp and fix other positions on the PCB board. Then, the controller is used to start the first cylinder 6 to drive the first clamping plates 601 to move away from the clamping of the PCB board, so as to expose the position clamped by the first clamping plates 601 for electroplating. In this way, the entire PCB board can be well electroplated, improving the electroplating effect of the PCB board. At the same time, after the electroplating of the PCB board is completed, the controller is used to start the vibration mechanism to vibrate the electroplated PCB board, so that the electroplating solution on the PCB board can fall off faster.

[0027] In a further preferred embodiment of the present invention, the transposition clamping mechanism includes: a telescopic rod 8 fixedly installed on the placement plate 7; a second placement rack 9 fixedly installed on the output shaft of the telescopic rod 8; two second cylinders 10 fixedly installed on the second placement rack 9; and two second clamping plates 11 respectively fixedly installed on the output shafts of the two second cylinders 10. The second clamping plates 11 are used to perform transposition clamping on the electroplated PCB board.

[0028] In this embodiment, when using the transposition clamping mechanism, the controller is used to start the telescopic rod 8 to drive the second clamping plates 11 to move down to a certain position. Then, the controller is used to start the second cylinders 10 to drive the second clamping plates 11 to move to clamp and fix other positions on the PCB board. Then, the controller is used to start the first cylinder 6 to drive the first clamping plates 601 to move away from the clamping of the PCB board, so as to expose the position clamped by the first clamping plates 601 for electroplating. In this way, the entire PCB board can be well electroplated, improving the electroplating effect of the PCB board.

[0029] In a further preferred embodiment of the present invention, the vibration mechanism includes: a mounting shell 12 fixedly installed on the mounting plate 4; a plurality of connecting rods 13 slidably arranged on the mounting shell 12. One end of the connecting rod 13 is fixedly connected to the placement plate 7, and a first spring 14 is sleeved on the connecting rod 13; a connecting plate 15 arranged in the mounting shell 12, and the connecting plate 15 is fixedly connected to one end of the connecting rod 13; a driving motor 16 fixedly installed in the mounting shell 12, and a convex block 17 is fixedly sleeved on the output shaft of the driving motor 16. The convex block 17 is located on one side of the connecting plate 15, and the convex block 17 is adapted to the connecting plate 15. The convex block 17 is used to squeeze the connecting plate 15.

[0030] In this embodiment, when using the vibration mechanism, the drive motor 16 is started by the controller to drive the convex block 17 to rotate. The rotating convex block 17 continuously presses the connecting plate 15. Under the action of the first spring 14, the connecting plate 15 is continuously reset, so as to drive the clamped PCB board to vibrate, and thus the electroplating solution on the PCB board can fall off faster.

[0031] In a further preferred embodiment of the present invention, the moving mechanism includes: a biaxial motor 18 fixedly installed on the support frame 1, and mounting shafts 19 are fixedly installed on both output shafts of the biaxial motor 18; two lead screws 20 rotatably installed on the support frame 1; four bevel gears 21 respectively fixedly sleeved on the two lead screws 20 and the two mounting shafts 19, the two bevel gears 21 fixedly sleeved on the two lead screws 20 and the two bevel gears 21 fixedly sleeved on the two mounting shafts 19 are meshed with each other; two mounting blocks 22 respectively threadedly sleeved on the two lead screws 20, and both of the two mounting blocks 22 are fixedly connected to the mounting frame 2.

[0032] In this embodiment, when using the moving mechanism, the biaxial motor 18 is started by the controller to drive the two mounting shafts 19 to rotate. Under the action of the bevel gears 21, the two lead screws 20 are driven to rotate. A limiting rod is fixedly installed on the support frame 1, and the limiting rod is slidably connected to the mounting block 22. The limiting rod is used to limit the mounting block 22, so that the lead screw 20 drives the mounting block 22 to move, and thus the mounting frame 2 can be driven to move, which is convenient to move the clamped PCB board to the corresponding electroplating bath for electroplating operation.

[0033] In a further preferred embodiment of the present invention, a connecting mechanism is provided on the mounting shell 12 and the connecting plate 15. The connecting mechanism includes: a guide rod 23 fixedly installed in the mounting shell 12; a guide block 24 fixedly installed on the connecting plate 15, and the guide block 24 is slidably connected to the guide rod 23; a second spring 25 sleeved on the guide rod 23.

[0034] In this embodiment, the stability of the connecting plate 15 during use can be improved through the mutual cooperation of the guide rod 23, the guide block 24 and the second spring 25.

[0035] In a further preferred embodiment of the present invention, a sliding frame 26 is fixedly installed on the mounting frame 2, and a sliding rod 27 is fixedly installed on the mounting plate 4. The sliding rod 27 is slidably connected to the sliding frame 26.

[0036] In this embodiment, the stability of the mounting plate 4 during movement can be improved through the sliding rod 27 and the sliding frame 26.

[0037] In a further preferred embodiment of the present utility model, a controller is provided on one side of the mounting bracket 2, and the controller is used for controlling operations.

[0038] In this embodiment, control operations are facilitated through the controller.

[0039] In summary, compared with the related art, a blanking device for PCB plating is formed by the support frame 1, the mounting bracket 2, the hydraulic rod 3, the mounting plate 4, the first placement rack 5, the first cylinder 6, the placement plate 7, the transposition clamping mechanism, the vibration mechanism, the moving mechanism, the connecting mechanism, the sliding frame 26, the sliding rod 27, and the controller, which can perform blanking for PCB plating, and at the same time can transpositionally clamp the plated PCB boards, thereby enabling the entire PCB board to be well electroplated and improving the electroplating effect of the PCB board.

[0040] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways.

[0041] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the utility model. Obviously, the described embodiments are only partial embodiments of the present utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict, make combinations, additions, deletions, or other adjustments to the features in the embodiments of the present utility model according to the situation without creative efforts, so as to obtain different technical solutions that are essentially not divorced from the concept of the present utility model, and these technical solutions also fall within the scope of protection of the present utility model.

Claims

1. A blanking device for PCB board electroplating, characterized in that, Including: A support frame, on which an installation frame is provided; A hydraulic rod fixedly installed on the installation frame, and an installation plate is fixedly installed on the output shaft of the hydraulic rod; A plurality of first placement racks fixedly installed on the installation plate, first cylinders respectively fixedly installed on the plurality of first placement racks, and first clamping plates are fixedly installed on the output shafts of the plurality of first cylinders, and the first clamping plates are used for clamping and discharging the PCB board; A plurality of placement plates arranged on the installation plate, and a position-changing clamping mechanism is arranged on the plurality of placement plates, and the position-changing clamping mechanism is used for position-changing clamping of the PCB board; A vibration mechanism arranged on the installation plate and the placement plate, and the vibration mechanism is used for vibrating and discharging the electroplated PCB board; A moving mechanism assembled on the support frame and the installation frame, and the moving mechanism is used for driving the clamped PCB board to move.

2. The blanking device for PCB board electroplating according to claim 1, characterized in that, The position-changing clamping mechanism includes: An expansion rod fixedly installed on the placement plate; A second placement rack fixedly installed on the output shaft of the expansion rod; Two second cylinders fixedly installed on the second placement rack; Two second clamping plates respectively fixedly installed on the output shafts of the two second cylinders, and the second clamping plates are used for position-changing clamping of the electroplated PCB board.

3. The blanking device for PCB board electroplating according to claim 1, characterized in that, The vibration mechanism includes: An installation shell fixedly installed on the installation plate; A plurality of connecting rods slidably arranged on the installation shell, one end of the connecting rod is fixedly connected with the placement plate, and a first spring is sleeved on the connecting rod; A connecting plate arranged in the installation shell, and the connecting plate is fixedly connected with one end of the connecting rod; A driving motor fixedly installed in the installation shell, a convex block is fixedly sleeved on the output shaft of the driving motor, the convex block is located on one side of the connecting plate, the convex block is adapted to the connecting plate, and the convex block is used for extruding the connecting plate.

4. The blanking device for PCB board electroplating according to claim 1, characterized in that, The moving mechanism includes: A double-shaft motor fixedly installed on the support frame, and installation shafts are fixedly installed on the two output shafts of the double-shaft motor; Two lead screws rotatably installed on the support frame; Four bevel gears respectively fixedly sleeved on the two lead screws and the two installation shafts, the two bevel gears fixedly sleeved on the two lead screws and the two bevel gears fixedly sleeved on the two installation shafts are meshed with each other; Two installation blocks respectively threadedly sleeved on the two lead screws, and both of the two installation blocks are fixedly connected with the installation frame.

5. The blanking device for PCB board electroplating according to claim 3, characterized in that, A connecting mechanism is arranged on the installation shell and the connecting plate, and the connecting mechanism includes: A guide rod fixedly installed in the installation shell; A guide block fixedly installed on the connecting plate, and the guide block is slidably connected with the guide rod; A second spring sleeved on the guide rod.

6. The blanking device for PCB electroplating according to claim 1, characterized in that, A sliding frame is fixedly installed on the installation frame, a sliding rod is fixedly installed on the installation plate, and the sliding rod is slidably connected with the sliding frame.

7. The blanking device for PCB board electroplating according to claim 1, wherein, A controller is arranged on one side of the installation frame, and the controller is used for controlling operations.

Images