Adjustable semiconductor packaging device

Abstract

The utility model discloses an adjustable packaging device for a semiconductor. The adjustable semiconductor packaging device comprises a base layer, a circuit layer, an integrated optical path chip, a reflecting surface and an optical fiber array element, the top of the integrated optical path chip is provided with a light receiving and emitting part. An L-shaped reflecting part is mounted on the base layer, and the reflecting part is connected with a non-reflecting light part on the reflecting surface; the top of the circuit layer is provided with a driving part used for driving the reflection part to deform. According to the adjustable semiconductor packaging device provided by the utility model, the reflecting surface part is connected with the reflecting part, so that when the driving part drives the reflecting part to deform, the intensity of light reflected by the reflecting surface cannot be changed, and the coupling light transmission between the optical fiber array element and the integrated optical path chip is more stable.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to an adjustable semiconductor packaging device. Background Art

[0002] Silicon Photonics (Si-Ph) technology uses laser beams to transmit data instead of electronic signals, and it is a low-cost and high-speed optical communication technology based on silicon photonics.

[0003] A document with the existing application publication number CN116088109A discloses a semiconductor packaging device, including: an optical fiber array element; an integrated optical path chip disposed on the first side of the optical fiber array element; a reflecting surface disposed on the first side of the optical fiber array element and above the integrated optical path chip, wherein the angle of the reflecting surface relative to the optical fiber array element or the integrated optical path chip is adjustable. This semiconductor packaging device can finely adjust the optical path between the optical fiber array element and the integrated optical path chip after the semiconductor packaging device is manufactured, which is beneficial to improving the light coupling efficiency of the semiconductor packaging device.

[0004] However, the reflecting surface of this device is completely attached to the reflecting component. By relying on the deformation of the deformation component, the reflecting component is pushed to deform, and then the reflection angle of the reflecting surface is deflected. However, since the reflecting surface is completely attached to the reflecting component, when the reflecting component deforms, the reflecting surface will also bend, which will cause the reflecting surface to change from a plane to a curved surface, and the light beam reflected by the reflecting surface is difficult to maintain parallel emission. Therefore, it will cause a change in the intensity of the reflected light beam, making the light coupling transmission between the optical fiber array element and the integrated optical path chip unstable.

[0005] Therefore, it is necessary to provide an adjustable semiconductor packaging device to solve the above technical problems. Summary of the Utility Model

[0006] In view of the above situation, to overcome the defects of the prior art, the utility model provides an adjustable semiconductor packaging device that can make the light coupling transmission between the optical fiber array element and the integrated optical path chip more stable.

[0007] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0008] Adjustable semiconductor packaging device, comprising: a base layer, a circuit layer, an integrated optical path chip, a reflecting surface and an optical fiber array element. A light receiving and emitting part is arranged on the top of the integrated optical path chip, and the light receiving and emitting part is used for receiving or emitting optical signals. An L-shaped reflecting component is installed on the base layer, and the reflecting component is fixedly connected to a part of the reflecting surface, that is, there is a certain gap between the back of the part of the reflecting surface that reflects light and the reflecting component. A driving part is installed on the top of the circuit layer, and the driving part can be telescopic, and its top end is connected to one end of the reflecting component, thereby driving the reflecting component to deform.

[0009] Preferably, an integrated circuit chip is installed on the top of the circuit layer, and the integrated circuit chip is electrically connected to the integrated optical path chip.

[0010] Preferably, a V-shaped groove is formed on the top of the reflecting component, so that the thickness of the reflecting component at this place is the smallest.

[0011] Preferably, the driving part is made of a thermally deformable material.

[0012] Preferably, the driving part is made of a piezoelectric deformable material.

[0013] Preferably, an adhesive is installed between the reflecting component and the base layer.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] (1) By connecting the reflecting surface part to the reflecting component, when the driving part drives the reflecting component to deform, the intensity of the light reflected by the reflecting surface will not change, thereby making the optical coupling transmission between the optical fiber array element and the integrated optical path chip more stable;

[0016] (2) By installing an integrated circuit chip on the top of the circuit layer, the signals can be analyzed, which is convenient for receiving and sending information;

[0017] (3) By forming a V-shaped groove on the top of the reflecting component, the reflecting component is easier to bend, which is convenient for changing the angle of the reflecting surface;

[0018] (4) By setting the driving part made of a thermally deformable material or a piezoelectric deformable material, it can be conveniently telescoped, thereby driving the reflecting component to deform. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of the adjustable semiconductor packaging device provided by the utility model;

[0020] Figure 2 is Figure 1 a schematic usage diagram of the adjustable semiconductor packaging device shown.

[0021] Among them, the names corresponding to the reference numerals are: 1 - base layer, 2 - circuit layer, 3 - integrated optical circuit chip, 4 - light-receiving and emitting part, 5 - reflecting component, 6 - reflecting surface, 7 - integrated circuit chip, 8 - fiber array element, 9 - driving part, 10 - V-shaped groove, 11 - bonding part. Specific embodiments

[0022] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments. The embodiments of the present utility model include but are not limited to the following embodiments.

[0023] As Figure 1-2 shown, the adjustable semiconductor packaging device provided by the present utility model includes: a base layer 1, a circuit layer 2, an integrated optical circuit chip 3, a reflecting surface 6, and a fiber array element 8. A light-receiving and emitting part 4 is arranged on the top of the integrated optical circuit chip 3, and the light-receiving and emitting part 4 is used for receiving or emitting optical signals. The base layer 1, the circuit layer 2, the integrated optical circuit chip 3, the light-receiving and emitting part 4, and the fiber array element 8 adopt the structural design disclosed in CN116088109A, which will not be elaborated here. An L-shaped reflecting component 5 is installed on the base layer 1, and the reflecting component 5 is fixedly connected to a part of the reflecting surface 6 (the part avoiding the reflected light), that is, there is a certain gap between the back of the part of the reflecting surface 6 that reflects light and the reflecting component 5. A driving part 9 is installed on the top of the circuit layer 2, and the driving part 9 can be telescopic, and its top end is connected to one end of the reflecting component 5. When in use, when the optical path between the fiber array element 8 and the integrated optical circuit chip 3 is offset, at this time, as Figure 2 shown, the driving part 9 elongates, deforms the reflecting component 5, drives the reflecting surface 6 to deflect, and then changes the reflection angle of the light, so that the optical path can return to the normal path. Since the reflecting part of the reflecting surface 6 is not connected to the reflecting component 5, when the reflecting component 5 deforms, the surface of the reflecting surface 6 that reflects light will not be deformed, and light scattering will not occur, so the intensity change of the reflected light beam will not occur, and thus the optical coupling transmission between the fiber array element 8 and the integrated optical circuit chip 3 is more stable.

[0024] By setting a part of the reflecting surface 6 to be connected to the reflecting component 5, when the driving part 9 drives the reflecting component 5 to deform, the intensity change of the light reflected by the reflecting surface 6 will not occur, and thus the optical coupling transmission between the fiber array element 8 and the integrated optical circuit chip 3 is more stable.

[0025] Embodiment 2:

[0026] As Figure 1-2 shown, an integrated circuit chip 7 is installed on the top of the circuit layer 2, and the integrated circuit chip 7 is electrically connected to the integrated optical circuit chip 3 for signal analysis.

[0027] By installing the integrated circuit chip 7 on the top of the circuit layer 2, the signal can be parsed, facilitating the sending and receiving of information.

[0028] Embodiment 3:

[0029] As Figure 1-2 shown, a V-shaped groove 10 is formed at the top of the reflection component 5. The V-shaped groove 10 is located directly above one end of the connection between the reflection component 5 and the reflection surface 6, making the thickness of the reflection component 5 the smallest at this point. Therefore, the reflection component 5 is more likely to bend at this point. Specifically, as Figure 2 shown, when the driving member 9 extends, it drives the reflection component 5 to bend at the V-shaped groove 10, and the reflection surface 6 deflects, causing the back of the reflected light part of the emission surface 6 to move away from the reflection component 5, thereby changing the reflection angle of the light.

[0030] By forming a V-shaped groove 10 at the top of the reflection component 5, the reflection component 5 is more likely to bend, facilitating the change of the angle of the reflection surface 6.

[0031] Embodiment 4:

[0032] The driving member 9 is made of a thermally deformable material or a piezoelectrically deformable material. By changing the temperature or applying an electric field, it deforms, elongates, or shortens.

[0033] By providing the driving member 9 made of a thermally deformable material or a piezoelectrically deformable material, it can be easily extended and retracted, thereby driving the reflection component 5 to deform.

[0034] Embodiment 5:

[0035] As Figure 1 shown, an adhesive member 11 is installed between the reflection component 5 and the base layer 1, and the reflection component 5 is connected to the base layer 1 through the adhesive member 11.

[0036] By installing the adhesive member 11 between the reflection component 5 and the base layer 1, the connection between the reflection component 5 and the base layer 1 can be facilitated.

[0037] Working principle: During use, when there is an offset in the optical path between the fiber array element 8 and the integrated optical circuit chip 3, at this time, as Figure 2 shown, the driving member 9 extends, deforming the reflection component 5, driving the reflection surface 6 to deflect, thereby changing the reflection angle of the light, enabling the optical path to return to the normal path. Since there is no connection between the reflected light part of the reflection surface 6 and the reflection component 5, when the reflection component 5 deforms, the surface of the reflected light of the reflection surface 6 will not be deformed, so the intensity of the reflected light beam will not change, thereby making the optical coupling transmission between the fiber array element 8 and the integrated optical circuit chip 3 more stable.

Claims

1. An adjustable semiconductor packaging device, characterized in that, Including: A base layer (1), a circuit layer (2), an integrated optical circuit chip (3), a reflecting surface (6), and an optical fiber array element (8); A light receiving and emitting part (4) is provided on the top of the integrated optical circuit chip (3); An L-shaped reflecting component (5) is installed on the base layer (1), and the reflecting component (5) is connected to a non-reflecting light part on the reflecting surface (6); A driving member (9) for deforming the reflecting component (5) is installed on the top of the circuit layer (2).

2. An adjustable semiconductor packaging device according to claim 1, characterized in that, An integrated circuit chip (7) is installed on the top of the circuit layer (2), and the integrated circuit chip (7) is electrically connected to the integrated optical circuit chip (3).

3. The encapsulation device of an adjustable semiconductor according to claim 1, wherein, A V-shaped groove (10) is formed on the top of the reflecting component (5).

4. An adjustable semiconductor packaging device according to claim 1, characterized in that, The driving member (9) is made of a thermally deformable material.

5. An adjustable semiconductor packaging device according to claim 1, wherein, The driving member (9) is made of a piezoelectrically deformable material.

6. The encapsulation device of an adjustable semiconductor according to claim 1, characterized in that, An adhesive (11) is installed between the reflecting component (5) and the base layer (1).

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