Chip cleaning device

Abstract

The utility model provides a chip cleaning device. The chip cleaning device comprises a cleaning suction head used for sucking pollutants on the surface of a chip, and the cleaning suction head further comprises an adsorption face, dust suction ports penetrating through the adsorption face, dust suction channels located in the cleaning suction head and connected with the dust suction ports, and receding grooves located between every two adjacent dust suction ports and recessed towards the interior of the cleaning suction head; the connector is connected to one end, away from the adsorption surface, of the cleaning suction head; the vacuum dust collection assembly is connected to the connector and used for providing vacuum suction force and collecting pollutants; the cleaning suction head, the connector and the vacuum dust collection assembly form a vacuum channel. According to the technical scheme, vacuum connection is established through the cleaning suction head, the connector and the vacuum dust collection assembly, the vacuum dust collection assembly not only provides vacuum suction for the whole cleaning device, but also is responsible for efficiently collecting and filtering all sucked particulate pollutants, it is guaranteed that the cleaning process is thorough and environmentally friendly, and secondary pollution is avoided.

Description

Technical Field

[0001] The utility model relates to the field of chip packaging, in particular to a chip cleaning device. Background Art

[0002] The packaging of microelectromechanical system (MEMS) chips can realize the electrical and mechanical connection between MEMS chips and the outside, and provide physical protection for MEMS chips to protect them from the influence of the external environment. For some MEMS sensor chips, their surfaces are often attached with fine suspended microstructures or sensitive sensing films, and these parts are extremely fragile and need to avoid any form of adsorption and touch. During the MEMS chip packaging process, it is often necessary to use tools such as suction nozzles to suck the chips and perform operations such as transferring, placing, and mounting them. During the operation process, the suction nozzle will contact the chip and apply a certain pressure to the chip according to the process requirements. Therefore, this process requires strict control of the contact area between the suction nozzle and the chip, usually limited to the non-sensitive area outside the MEMS structure to prevent damage.

[0003] However, with the trend of miniaturization and high integration of MEMS technology, the non-MEMS structure areas that were originally used as suction areas are gradually given other functions, further reducing the safe operating space. In actual production, it is inevitable that surface particulate contaminants will fall on MEMS chips, including but not limited to silicon slag, metal debris, and fibrous impurities. If these particulate matters are not removed in time, they will pose a major hidden danger when the suction nozzle is operating. Especially when the suction nozzle presses down, if it accidentally presses on hard particles, it is very likely to cause irreversible physical damage to the chip, thereby affecting its normal function and even directly causing the chip to fail. Therefore, the cleaning work on the surface of MEMS chips during packaging is particularly important and is a key link to ensure the packaging quality.

[0004] In the current technical practice, for the cleaning of particulate matters on the surface of MEMS chips, the commonly used method is local purging. This process involves accurately locking the position of the particulate matters with the assistance of high magnification observation equipment such as microscopes, and then aiming and blowing the air outlet one by one to remove them. However, this method has limited efficiency and is prone to secondary pollution problems. More seriously, it may directly cause irreversible damage to the MEMS structure due to improper operation (such as deviation of the purging direction and out-of-control force).

[0005] Therefore, how to efficiently clean the chip and avoid secondary pollution is a problem that needs to be solved currently. Summary of the Invention

[0006] The technical problem to be solved by the utility model is how to efficiently clean the chip and avoid secondary pollution, and provide a chip cleaning device.

[0007] To solve the above problems, the present utility model provides a chip cleaning device, comprising: a cleaning suction head for sucking pollutants on the surface of the chip, the cleaning suction head further comprising an adsorption surface, a dust suction port penetrating the adsorption surface, a dust suction channel located inside the cleaning suction head and connected to the dust suction port, and a relief groove recessed into the interior of the cleaning suction head between two adjacent dust suction ports; a connector connected to one end of the cleaning suction head away from the adsorption surface; a vacuum dust collection assembly connected to the connector for providing vacuum suction and collecting the pollutants; the cleaning suction head, the connector and the vacuum dust collection assembly form a vacuum channel.

[0008] In some embodiments, the edge of the dust suction port has a side wall protruding from the adsorption surface, and the side wall can block the adsorption air flow from flowing to the vulnerable area of the chip.

[0009] In some embodiments, the side wall gradually narrows from top to bottom.

[0010] In some embodiments, a microchannel is further provided on the side wall of the dust suction port away from the vulnerable area of the chip, and the microchannel penetrates the side wall in a direction parallel to the adsorption surface.

[0011] In some embodiments, the relief groove is independent of the dust suction channel.

[0012] In some embodiments, there are multiple dust suction ports, and each dust suction port is communicated with the dust suction channel.

[0013] In some embodiments, the vacuum dust collection assembly comprises: a vacuum tube connected to the connector; a vacuum generator connected to the vacuum tube for providing vacuum suction; a dust collection box connected to the vacuum tube for collecting the pollutants.

[0014] In some embodiments, the vacuum dust collection assembly further comprises a precision valve and a vacuum gauge for regulating the intensity of the vacuum suction.

[0015] The above technical solution establishes a vacuum connection through the cleaning suction head, the connector and the vacuum dust collection assembly. The vacuum dust collection assembly not only provides vacuum suction for the entire cleaning device, but also is responsible for efficiently collecting and filtering all the inhaled particulate pollutants, ensuring that the cleaning process is both thorough and environmentally friendly without generating secondary pollution.

[0016] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present utility model. Technologies, methods and devices known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technologies, methods and devices should be regarded as part of the authorization specification. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the specific embodiments of the present utility model, the following will briefly introduce the drawings required for use in the description of the specific embodiments. Obviously, the drawings in the following description are only some specific embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 It is a schematic structural diagram of an embodiment of the chip cleaning device described in the present utility model.

[0019] Figure 2 It is a schematic structural diagram of an embodiment of the cleaning suction head of the chip cleaning device described in the present utility model. Specific Embodiments

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0021] In order to efficiently clean the chip and avoid secondary pollution, the present utility model proposes a cleaning device for MEMS chip packaging, which uses vacuum adsorption to remove dust and clean the contact area between the cleaning suction nozzle and the chip, can achieve multi-point synchronous cleaning, will not cause secondary pollution, and the cleaning process will not damage the chip.

[0022] Please refer to Figure 1 , which is a schematic structural diagram of an embodiment of the chip cleaning device described in the present utility model. As Figure 1 shown, the chip cleaning device includes: a cleaning suction head 11, a connector 12, and a vacuum dust collection assembly 13. The cleaning suction head 11 is used to suck the contaminants on the surface of the chip 19. The cleaning suction head 11 further includes an adsorption surface 110, a dust suction port 111 penetrating through the adsorption surface 110, a dust suction channel 112 located inside the cleaning suction head 11 and connected to the dust suction port 111, and a relief groove 113 recessed into the interior of the cleaning suction head 11 between two adjacent dust suction ports 111. The connector 12 is connected to one end of the cleaning suction head 11 away from the adsorption surface 110. The vacuum dust collection assembly 13 is connected to the connector 12 and is used to provide vacuum suction and collect the contaminants. The cleaning suction head 11, the connector 12, and the vacuum dust collection assembly 13 form a vacuum channel.

[0023] The above technical solution establishes a vacuum connection through the cleaning suction head, the connector, and the vacuum dust collection assembly. The vacuum dust collection assembly not only provides vacuum suction for the entire cleaning device but also is responsible for efficiently collecting and filtering all the inhaled particulate pollutants, ensuring that the cleaning process is thorough and environmentally friendly without generating secondary pollution.

[0024] As Figure 1 shown, the upper end of the cleaning suction head 11 of the chip cleaning device is connected to the connector 12, and the lower adsorption surface 110 closely adheres to the surface of the chip 19. Under the action of the vacuum air flow generated by the vacuum dust collection assembly 13, the tiny particulate matters on the surface of the chip 19 are effectively peeled off and then inhaled into the built-in vacuum channel through the cleaning suction head 11. Finally, these particulate matters are efficiently captured and collected by the vacuum dust collection assembly 13, realizing the cleaning and purification of the surface of the chip 19.

[0025] In some embodiments, the dust suction port 111 penetrates the adsorption surface 110 of the cleaning suction head 11 close to the chip 19; the dust suction channel 112 is located inside the cleaning suction head 11, connected to the dust suction port 111 and connected to the vacuum channel.

[0026] Please refer to Figure 2 , which is a schematic structural view of an embodiment of the cleaning suction head of the chip cleaning device of the present utility model. Among them, Figure 2 is a view looking obliquely upward to the upper right. As Figure 2 shown, in some embodiments, the edge of the dust suction port 111 has a side wall 114 protruding from the adsorption surface 110, and the side wall 114 can block the adsorption air flow from flowing to the vulnerable area 190 of the chip 19. To accurately protect the vulnerable area 190 of the chip 19, the corresponding area of the cleaning suction head 11 is recessed inward to form an avoidance groove 113, ensuring that the vulnerable area 190 of the chip 19 is not touched during the operation.

[0027] In some embodiments, the side wall 114 gradually narrows from top to bottom. Among them, the top of the side wall 114 is the side close to the adsorption surface 110 of the side wall 114, and the bottom is the side far from the adsorption surface 110 of the side wall 114, that is, the side close to the chip 19 during adsorption cleaning. In this embodiment, the cross-section of the side wall 114 is trapezoidal. The side wall 114 gradually narrows from top to bottom, and this design effectively reduces the contact area between the adsorption surface 110 of the cleaning suction head 11 and the chip 19, thereby significantly reducing the risk of the cleaning suction head 11 pressing and damaging the chip 19 during operation.

[0028] During the cleaning operation, first, precisely align the avoidance groove 113 with the vulnerable area 190 of the chip 19. Subsequently, make the bottom of the side wall 114 of the dust suction port 111 closely fit the surface of the chip 19. At this time, the side wall 114 of the dust suction port 111 serves as a natural barrier, effectively blocking the adsorption air flow from flowing towards the vulnerable area 190 of the chip 19, ensuring that the entire cleaning process does not damage the MEMS structure of the chip 19.

[0029] In some embodiments, a micro-channel 116 is further provided on the side wall 114 of the dust suction port 111 away from the vulnerable area 190 of the chip 19. The micro-channel 116 penetrates the side wall 114 in a direction parallel to the adsorption surface 110, so that the micro-channel 116 is communicated with the air outside the dust suction port 111. Specifically, if the dust suction port 111 is square, and among the four side walls 114 of the dust suction port 111, only one side wall 114 is close to the vulnerable area 190 of the chip 19, then the micro-channel 116 can be provided on the other three side walls 114, or one or two of the other three side walls 114 can be selected to provide the micro-channel 116. If two of the four side walls of the dust suction port 111 are close to the vulnerable area 190 of the chip 19, then the micro-channel 116 can be provided on the other two side walls 114, or one of the other two side walls 114 can be selected to provide the micro-channel 116. The through-type micro-channel 116 is designed on the side wall 114 of the dust suction port 111 that avoids the vulnerable area 190 of the chip 19, and these micro-channels 116 are cleverly communicated with the air outside the dust suction port 111. The micro-channel 116 can form an adsorption air flow during the dust suction operation. When flowing through the surface of the chip 19, it can effectively roll up and carry away the particulate matter, and then be strongly adsorbed and transported into the dust suction channel 112, ensuring the high efficiency and precision of the cleaning process.

[0030] In some embodiments, the avoidance groove 113 and the dust suction channel 112 are kept independent to avoid air flow interference.

[0031] In some embodiments, there are multiple dust suction ports 111, and each dust suction port 111 is communicated with the dust suction channel 112. When necessary, multiple dust suction ports 111 can be flexibly set, and all dust suction ports 111 are communicated with the dust suction channel 112 to achieve multi-point synchronous cleaning, significantly improving the efficiency and coverage of the cleaning operation.

[0032] In some embodiments, the vacuum dust collection assembly 13 includes a vacuum tube 131, a vacuum generator 132, and a dust collection box (not shown). The vacuum tube 131 is connected to the connector 12. The vacuum generator 132 is connected to the vacuum tube 131 and is used to provide vacuum suction. The dust collection box is connected to the vacuum tube 131 and is used to collect the pollutants. The vacuum dust collection assembly 13 not only provides vacuum suction for the entire chip cleaning device, but also is responsible for efficiently collecting and filtering all the inhaled particulate pollutants, ensuring that the cleaning process is both thorough and environmentally friendly and will not cause secondary pollution.

[0033] In some embodiments, the vacuum dust collection assembly 13 further includes a precision valve (not shown) and a vacuum gauge (not shown) for regulating the intensity of the vacuum suction. The vacuum dust collection assembly 13 is internally provided with a precision valve and a vacuum gauge, and can accurately regulate the intensity of the vacuum suction. According to the specific conditions such as the size difference of the particulate matter to be cleaned and the adhesion characteristics to the chip surface, the suction force is adjusted to ensure the optimization of the cleaning effect.

[0034] It should be noted that the reference to "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc. in the specification indicates that the described embodiment may include specific features, structures or characteristics, but each embodiment may not necessarily include the specific features, structures or characteristics. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure or characteristic is described in combination with an embodiment, implementing such a feature, structure or characteristic in combination with other embodiments is within the knowledge of those skilled in the relevant art, whether or not explicitly described.

[0035] Generally, the terms can be understood at least partially from their usage in the context. For example, as used herein, the term "one or more" depends at least partially on the context and can be used to describe any feature, structure or characteristic in a singular sense or can be used to describe a combination of features, structures or characteristics in a plural sense. Similarly, depending at least partially on the context, terms such as "a", "certain" or "the" can also be understood to express a singular usage or a plural usage. Additionally, the term "based on" can be understood as not necessarily aiming to express a set of exclusive factors, but rather, alternatively, can also depend at least partially on the context and allow for the existence of other factors that may not be explicitly described. It should also be noted in this specification that "connected / coupled" not only refers to a component being directly coupled to another component, but also refers to a component being indirectly coupled to another component through an intermediate component.

[0036] It should be noted that the terms "including" and "having" and their variants involved in the documents of the present utility model are intended to cover non-exclusive inclusion. The terms "first", "second", etc. are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. Unless clearly indicated by the context, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other. Furthermore, in the above description, the description of well-known components and technologies is omitted to avoid unnecessarily confusing the concept of the present utility model. In each of the above embodiments, the key point of each embodiment is to illustrate the differences from other embodiments. For the same / similar parts among the embodiments, reference can be made to each other.

[0037] The above are only the preferred embodiments of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and refinements can still be made, and these improvements and refinements should also be regarded as the protection scope of the present utility model.

Claims

1. A chip cleaning device, characterized in that, Comprising: A cleaning suction head for sucking contaminants on the surface of the chip. The cleaning suction head further includes an adsorption surface, a dust suction port penetrating the adsorption surface, a dust suction channel located inside the cleaning suction head and connected to the dust suction port, and a relief groove recessed into the interior of the cleaning suction head between two adjacent dust suction ports; A connector connected to one end of the cleaning suction head away from the adsorption surface; A vacuum dust collection assembly connected to the connector for providing vacuum suction and collecting the contaminants; The cleaning suction head, the connector, and the vacuum dust collection assembly form a vacuum channel.

2. The chip cleaning device according to claim 1, characterized in that, At the edge of the dust suction port, there is a side wall protruding from the adsorption surface, and the side wall can block the adsorption air flow from flowing to the vulnerable area of the chip.

3. The chip cleaning device according to claim 2, wherein, The side wall gradually narrows from top to bottom.

4. The chip cleaning device according to claim 2, wherein On the side wall of the dust suction port away from the vulnerable area of the chip, there is also a microchannel, and the microchannel penetrates the side wall in a direction parallel to the adsorption surface.

5. The chip cleaning device according to claim 1, wherein The relief groove is independent of the dust suction channel.

6. The chip cleaning device according to claim 1, characterized in that, There are multiple dust suction ports, and each dust suction port is communicated with the dust suction channel.

7. The chip cleaning device according to claim 1, characterized in that, The vacuum dust collection assembly includes: A vacuum tube connected to the connector; A vacuum generator connected to the vacuum tube for providing vacuum suction; A dust collection box connected to the vacuum tube for collecting the contaminants.

8. The chip cleaning device according to claim 1, wherein The vacuum dust collection assembly further includes a precision valve and a vacuum gauge for regulating the intensity of the vacuum suction.

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