Buffer black glue attaching system for circuit board

Abstract

The utility model discloses a buffer black adhesive attaching system for a circuit board, which comprises a feeding module, a carrying module, a moving module, an adhesive attaching module, a detecting module and a discharging module, and is characterized in that the feeding module is provided with at least two feeding stations; the carrying module is located on the downstream of the feeding module and provided with a plurality of carrying mechanisms. A bearing jig of the movable module is at least movably arranged on an undetermined station and a rubberizing station; the rubberizing module is located at the downstream of the moving module, and the rubberizing end of the rubberizing module performs rubberizing operation on the circuit board on the bearing jig located at the rubberizing station; the detection module is located at the downstream of the rubberizing module, and the detection end of the detection module is arranged opposite to the detection station; the discharging module is located on the downstream of the detection module and provided with a discharging station. According to the invention, the problems of relatively poor production efficiency, relatively high reject ratio and relatively long time consumption due to the fact that black glue of a circuit board is manually attached and semi-automatically attached in the prior art are at least solved.

Description

Technical Field

[0001] The present application relates to the technical field of automated equipment, and in particular, to a buffer black glue attaching system for circuit boards. Background Art

[0002] In the manufacturing process of printed circuit boards (PCBs), the attachment of buffer black glue is one of the key processes to ensure the quality of printed circuit boards. The existing buffer black glue attachment processes mainly use manual and semi-automatic methods for attachment. Among them, although manual attachment can handle different types of PCBs, due to its high dependence on operators with rich operation experience, it not only has low efficiency, but also is extremely prone to problems such as inaccurate attachment positions and uneven thickness, which in turn affect the electrical performance and mechanical stability of the product. In addition, manual attachment is difficult to ensure a consistent yield rate, increasing production costs and management difficulties.

[0003] Compared with manual attachment, semi-automatic attachment equipment, although it improves production efficiency to a certain extent, still has significant limitations. Such equipment usually requires frequent manual loading and unloading, and the changeover debugging takes a long time, making it difficult to meet the flexible production requirements of multi-variety and small-batch production. Summary of the Utility Model

[0004] The present application provides a buffer black glue attaching system for circuit boards to at least solve the problems of poor production efficiency, high defect rate, and long time consumption in the related art when using manual and semi-automatic attachment methods for black glue on circuit boards.

[0005] The present application provides a buffer black glue attaching system for a circuit board, including a loading module, a handling module, a moving module, a glue attaching module, a detection module and a discharging module. Among them, the loading module has at least two loading stations to simultaneously load at least two circuit boards to which black glue is to be attached; the handling module is located downstream of the loading module, and the handling module has a plurality of handling mechanisms; the moving module has a carrying fixture, and the carrying fixture is at least movably arranged at a pending station and a glue attaching station. The first handling mechanism among the plurality of handling mechanisms is used to transport the circuit board at the loading station to the carrying fixture at the pending station; the glue attaching module is located downstream of the moving module, and the glue attaching module has a movably arranged glue attaching end, and the glue attaching end is used to perform a glue attaching operation on the circuit board on the carrying fixture at the glue attaching station; the detection module is located downstream of the glue attaching module, and the detection module has a detection station and a detection end, and the detection end is arranged opposite to the detection station, and the detection end is used to detect whether the circuit board that has completed the glue attaching operation at the detection station is qualified in glue attaching; the discharging module is located downstream of the detection module, and the discharging module has a discharging station; among them, the second handling mechanism among the plurality of handling mechanisms is used to transport the circuit board that has completed the glue attaching operation on the carrying fixture at the pending station to the detection station; the third handling mechanism among the plurality of handling mechanisms is used to transport the circuit board with unqualified glue attaching at the detection station to the discharging station; or, the third handling mechanism among the plurality of handling mechanisms is used to transport the circuit board with qualified glue attaching at the detection station to the station of the next process.

[0006] In an exemplary embodiment, the handling directions A of the plurality of handling mechanisms are all the same, and the plurality of handling mechanisms move synchronously; and / or, the loading direction B of the loading module is the same as the handling direction A of the plurality of handling mechanisms; and / or, the moving direction C of the carrying fixture is perpendicular to the loading direction B of the loading module.

[0007] In an exemplary embodiment, the loading module includes a loading support base, a first driving mechanism, a second driving mechanism and a flipping mechanism. Among them, the first driving mechanism is arranged on the loading support base, and the first driving mechanism has a first driving end, and the first driving end is movably arranged along the loading direction B of the loading module; the first driving end is drivingly connected to the second driving mechanism, and the second driving mechanism has a second driving end, and the second driving end is movably arranged along the vertical direction; the second driving end is drivingly connected to the flipping mechanism, and the flipping mechanism has a flipping end, and the flipping end has a suction cup for adsorbing the circuit board, and the flipping end is used to flip the surface of the circuit board on the corresponding same loading station on the side to which black glue is to be attached to face upward.

[0008] In an exemplary embodiment, at least the number of the flipping mechanisms is the same as the number of the loading stations, and the flipping directions of the flipping ends of two adjacent flipping mechanisms are opposite.

[0009] In an exemplary embodiment, the handling module further includes a handling support base and a third driving mechanism. The third driving mechanism is disposed on the handling support base and has a third driving end and a transmission part. At least the third driving end is movably arranged along the handling direction A of the handling mechanism, and the third driving end is drivingly connected to the transmission part. The third driving end is simultaneously drivingly connected to the first handling mechanism, the second handling mechanism, and the third handling mechanism to synchronously move the first handling mechanism, the second handling mechanism, and the third handling mechanism.

[0010] In an exemplary embodiment, the transmission part includes a first conveyor belt, and the first handling mechanism, the second handling mechanism, and the third handling mechanism are connected to the first conveyor belt at equal intervals.

[0011] In an exemplary embodiment, in the direction from the handling module to the glue - sticking module, the moving module sequentially has a recycling station, a pending station, and a glue - sticking station. The recycling station is used to recycle the circuit boards with unqualified glue - sticking discharged from the discharging station, and the carrier fixture is movably arranged at the recycling station, the pending station, and the glue - sticking station.

[0012] In an exemplary embodiment, the buffer black glue attaching system further includes a code - scanning module. The code - scanning module is located downstream of the loading module and upstream of the handling module. The code - scanning module has a code - scanning end, and the code - scanning end is used to perform two - dimensional code scanning and identification on the circuit board that has completed the flipping operation.

[0013] In an exemplary embodiment, the detection module includes a detection support base and a first detection mechanism. The first detection mechanism is disposed on the detection support base, and the first detection mechanism at least has a displacement sensor. The displacement sensor is at least used to detect whether the thickness of the black glue attached to the circuit board at the detection station is qualified.

[0014] In an exemplary embodiment, the discharging module includes a second conveyor belt. The second conveyor belt is movably arranged along a direction perpendicular to the handling direction A of the handling module. The discharging module has a discharging station at the inner - side area of the transmission part of the handling module and a temporary storage station at the outer - side area of the transmission part of the handling module. The second conveyor belt is movably arranged at the discharging station and the temporary storage station.

[0015] In an exemplary embodiment, the buffer black glue attaching system further includes a black glue feeding module and a material table. The black glue feeding module has a feeding part, and the feeding part is located on the moving path of the glue - sticking end. The material table is arranged at an interval from the black glue feeding module. The material table, the glue - sticking station, and the feeding part are all located on the moving path of the glue - sticking end, and the material table is used to place the unqualified black glue.

[0016] In an exemplary embodiment, the buffer black glue attaching system further includes a second detection mechanism and a control module. The second detection mechanism is used to detect whether the black glue at the feeding part is qualified. The control module is signal-connected to the second detection mechanism and is control-connected to the glue attaching module, so that the control module controls the glue attaching end to grab the black glue and move it to the glue attaching station or to the material table according to the detection signal obtained by the second detection mechanism.

[0017] In an exemplary embodiment, the black glue feeding module has a plurality of feeding parts, and the plurality of feeding parts independently perform the feeding operation respectively. The black glue feeding module further has a driving and switching mechanism, and the driving and switching mechanism has a driving and switching end, and the driving and switching end can be selectively drivingly connected to one of the plurality of feeding parts.

[0018] In an exemplary embodiment, the plurality of feeding parts are arranged at intervals along the conveying direction A of the conveying module.

[0019] In an exemplary embodiment, one side surface of the material table for receiving unqualified black glue, one side surface of the loading fixture for receiving the circuit board, and one side surface of the loading station for receiving the circuit board to be attached with black glue are located in the same plane.

[0020] Through the present application, a buffer black glue attaching system including a loading module, a conveying module, a moving module, a glue attaching module, a detection module and a discharging module is provided. When performing the black glue attaching operation on the circuit board, at least two loading stations of the loading module load at least two circuit boards to be attached with black glue. The first conveying mechanism of the conveying module conveys the circuit board at the loading station to the loading fixture at the pending station. The loading fixture at the pending station moves to the glue attaching station. The glue attaching end of the glue attaching module is used to perform the glue attaching operation on the circuit board on the loading fixture at the glue attaching station, so as to complete the precise attachment of the black glue. After the glue attaching operation is completed, the second conveying mechanism of the conveying module conveys the circuit board that has completed the glue attaching operation on the loading fixture at the pending station to the detection station. The detection end detects whether the circuit board that has completed the glue attaching operation at the detection station is qualified for glue attaching. The third conveying mechanism of the conveying module conveys the circuit board with unqualified glue attaching at the detection station to the discharging station; or, the third conveying mechanism among the plurality of conveying mechanisms conveys the circuit board with qualified glue attaching at the detection station to the station of the next process, thereby completing the black glue attaching operation on the circuit board. The entire attaching process realizes automation, greatly improves the attaching efficiency of the black glue, and can also ensure the precision of the black glue attaching, greatly improves the automation degree of the buffer black glue attaching system, realizes the intelligent attaching of the black glue, and is beneficial to reducing the defective rate of the black glue attaching. Description of the Drawings

[0021] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 Structural schematic diagram of one side of the handling module of a buffer black glue attaching system provided by an embodiment of the present application;

[0023] Figure 2 For Figure 1 Structural schematic diagram of the top view perspective of the handling module in

[0024] Figure 3 For Figure 1 Structural schematic diagram of one side of the loading module of the buffer black glue attaching system in

[0025] Figure 4 For Figure 3 Enlarged structural schematic diagram at position D in

[0026] Figure 5 Shows Figure 1 Structural schematic diagram of one side of the black glue feeding module of the buffer black glue attaching system in

[0027] Figure 6 Shows Figure 3 Structural schematic diagram of the top view perspective of the buffer black glue attaching system in

[0028] Among them, the above-mentioned drawings include the following reference numerals:

[0029] 1. Circuit board;

[0030] 10. Loading module; 11. Loading station; 12. Loading support base; 13. First driving mechanism; 14. Second driving mechanism; 15. Flipping mechanism; 16. Flipping suction head;

[0031] 20. Handling module; 21. First handling mechanism; 22. Second handling mechanism; 23. Third handling mechanism; 24. Handling support base; 25. Third driving mechanism;

[0032] 30. Moving module; 31. Carrying fixture; 32. To-be-determined station; 33. Glue pasting station; 34. Recycling station; 35. Moving support base;

[0033] 40. Glue pasting module; 41. Black glue suction head;

[0034] 50. Detection module; 51. Detection station; 52. Detection support base; 53. First detection mechanism;

[0035] 60. Discharging module; 61. Discharging station; 62. Second conveyor belt; 63. Temporary storage station;

[0036] 70. Scanning code module;

[0037] 80. Black glue feeding module; 81. Feeding part;

[0038] 90. Material table; 100. Second detection mechanism; 110. Driving and switching mechanism. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0040] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. The terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors related to the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.

[0041] To enable those skilled in the art of this technical field to better understand the solution of this application, the following further detailed description of this application will be given in conjunction with the accompanying drawings and specific embodiments.

[0042] Embodiments of this application provide a buffer black glue attaching system for a circuit board. In combination with the structure and working principle of the buffer black glue attaching system, the device will be described in detail (technical terms involved must be explained).

[0043] As Figures 1 to 6 shown, the buffer black glue attaching system for a circuit board includes a loading module 10, a handling module 20, a moving module 30, a glue attaching module 40, an inspection module 50, and a discharging module 60. Among them, the loading module 10 has at least two loading stations 11 for loading at least two circuit boards 1 to which black glue is to be attached simultaneously; the handling module 20 is located downstream of the loading module 10, and the handling module 20 has multiple handling mechanisms; the moving module 30 has a carrying fixture 31, and the carrying fixture 31 is at least movably arranged at a pending station 32 and a glue attaching station 33. The first handling mechanism 21 among the multiple handling mechanisms is used to transport the circuit board 1 at the loading station 11 to the carrying fixture 31 at the pending station 32; the glue attaching module 40 is located downstream of the moving module 30, and the glue attaching module 40 has a movably arranged glue attaching end, and the glue attaching end is used to perform a glue attaching operation on the circuit board 1 on the carrying fixture 31 at the glue attaching station 33; the inspection module 50 is located downstream of the glue attaching module 40, the inspection module 50 has an inspection station 51 and an inspection end, and the inspection end is arranged opposite to the inspection station 51, and the inspection end is used to detect whether the circuit board 1 that has completed the glue attaching operation at the inspection station 51 is qualified in glue attaching; the discharging module 60 is located downstream of the inspection module 50, and the discharging module 60 has a discharging station 61; among them, the second handling mechanism 22 among the multiple handling mechanisms is used to transport the circuit board 1 that has completed the glue attaching operation on the carrying fixture 31 at the pending station 32 to the inspection station 51; the third handling mechanism 23 among the multiple handling mechanisms is used to transport the circuit board 1 with unqualified glue attaching at the inspection station 51 to the discharging station 61; or, the third handling mechanism 23 among the multiple handling mechanisms is used to transport the circuit board 1 with qualified glue attaching at the inspection station 51 to the station of the next process.

[0044] The present application provides a buffer black glue sticking system including a loading module 10, a handling module 20, a moving module 30, a glue sticking module 40, a detection module 50 and a discharging module 60. When performing the black glue sticking operation on a circuit board, at least two loading stations 11 of the loading module 10 load at least two circuit boards 1 to which black glue is to be stuck. The first handling mechanism 21 of the handling module 20 transports the circuit board 1 at the loading station 11 to the carrying fixture 31 at the pending station 32. The carrying fixture 31 at the pending station 32 moves to the glue sticking station 33. The glue sticking end of the glue sticking module 40 is used to perform the glue sticking operation on the circuit board 1 on the carrying fixture 31 at the glue sticking station 33, thereby completing the precise sticking of the black glue. After the glue sticking operation is completed, the second handling mechanism 22 of the handling module 20 transports the circuit board 1 that has completed the glue sticking operation on the carrying fixture 31 at the pending station 32 to the detection station 51. The detection end detects whether the circuit board 1 that has completed the glue sticking operation at the detection station 51 is qualified in glue sticking. The third handling mechanism 23 of the handling module 20 transports the circuit board 1 with unqualified glue sticking at the detection station 51 to the discharging station 61; or, the third handling mechanism 23 among the multiple handling mechanisms transports the circuit board 1 with qualified glue sticking at the detection station 51 to the station of the next process. Thus, the black glue sticking operation of the circuit board 1 is completed. The entire sticking process realizes automation, greatly improves the sticking efficiency of the black glue, and can also ensure the precision of the black glue sticking, greatly improves the automation degree of the buffer black glue sticking system, realizes the intelligent sticking of the black glue, and is beneficial to reducing the unqualified rate of the black glue sticking.

[0045] As Figure 2 shown, the handling directions A of the multiple handling mechanisms are all the same, and the multiple handling mechanisms move synchronously; and / or, the loading direction B of the loading module 10 is the same as the handling direction A of the multiple handling mechanisms; and / or, the moving direction C of the carrying fixture 31 is perpendicular to the loading direction B of the loading module 10. In this way, it is ensured that the present application compactly arranges the loading module 10, the handling module 20, the moving module 30, the glue sticking module 40, the detection module 50 and the discharging module 60, ensuring the overall structural compactness of the buffer black glue sticking system and not occupying a large installation space.

[0046] As Figure 2 shown, the moving direction C includes a first sub-moving direction C1 and a second sub-moving direction C2. The first sub-moving direction C1 is the direction in which the carrying fixture 31 moves from the pending station 32 to the glue sticking station 33, and the second sub-moving direction C2 is the direction in which the carrying fixture 31 moves from the glue sticking station 33 to the pending station 32.

[0047] As Figure 3 and Figure 4As shown in the figure, the loading module 10 includes a loading support base 12, a first driving mechanism 13, a second driving mechanism 14, and a flipping mechanism 15. Among them, the first driving mechanism 13 is arranged on the loading support base 12. The first driving mechanism 13 has a first driving end, and the first driving end is movably arranged along the loading direction B of the loading module 10. The first driving end is drivingly connected to the second driving mechanism 14. The second driving mechanism 14 has a second driving end, and the second driving end is movably arranged along the vertical direction. The second driving end is drivingly connected to the flipping mechanism 15. The flipping mechanism 15 has a flipping end, and the flipping end has a suction cup for adsorbing the circuit board 1. The flipping end is used to flip the surface of the circuit board 1 on the corresponding same loading station 11 where the black glue is to be attached to face upward. In this way, by setting the loading module 10 in a structural form including a loading support base 12, a first driving mechanism 13, a second driving mechanism 14, and a flipping mechanism 15, the loading reliability of the circuit board 1 is ensured. By flipping the circuit board 1 by the flipping mechanism 15, the surface of the circuit board 1 where the black glue is to be attached is faced upward and exposed. When the first handling mechanism 21 subsequently handles the circuit board 1, there is no need to add other stations, and the circuit board 1 can be directly sucked away from the loading station 11 and transported to the carrying fixture 31.

[0048] As Figure 4 shown in the figure, the flipping end of the flipping mechanism 15 also has a flipping suction head 16, and the flipping suction head 16 realizes the adsorption effect on the circuit board 1, ensuring the flipping reliability of the flipping mechanism 15.

[0049] It should be noted that in this application, at least the number of the flipping mechanisms 15 is the same as the number of the loading stations 11, and the flipping directions of the flipping ends of two adjacent flipping mechanisms 15 are opposite. In this way, it is beneficial to save space and ensure that two adjacent flipping mechanisms 15 can achieve effective flipping on the premise that the distance between them is relatively short.

[0050] As Figure 4 shown in the figure, the flipping mechanism 15 on the left side of the figure flips clockwise, and the flipping mechanism 15 on the right side of the figure flips counterclockwise, saving the operation space to the greatest extent.

[0051] As Figures 1 to 6As shown, the handling module 20 further includes a handling support base 24 and a third driving mechanism 25. The third driving mechanism 25 is disposed on the handling support base 24. The third driving mechanism 25 has a third driving end and a transmission part. At least the third driving end is movably disposed along the handling direction A of the handling mechanism, and the third driving end is drivingly connected to the transmission part. The third driving end is simultaneously drivingly connected to the first handling mechanism 21, the second handling mechanism 22, and the third handling mechanism 23, so that the first handling mechanism 21, the second handling mechanism 22, and the third handling mechanism 23 move synchronously. In this way, by configuring the handling module 20 to further include the handling support base 24 and the third driving mechanism 25, the handling support base 24 plays a role in supporting multiple handling mechanisms, ensuring the moving stability of each handling mechanism. The setting of the third driving mechanism 25 ensures that multiple handling mechanisms can move synchronously while saving the operation space and improving the operation efficiency.

[0052] It should be noted that in an embodiment not shown in the present application, the transmission part includes a first conveyor belt. The first handling mechanism 21, the second handling mechanism 22, and the third handling mechanism 23 are connected to the first conveyor belt at equal intervals. In this way, it is ensured that the movement of the first conveyor belt can synchronously drive the first handling mechanism 21, the second handling mechanism 22, and the third handling mechanism 23 to move, so that the first handling mechanism 21, the second handling mechanism 22, and the third handling mechanism 23 can perform their respective handling operations.

[0053] Of course, each handling mechanism can be arranged to be liftable to ensure the reliability of handling the circuit board 1.

[0054] As Figure 2 shown, in the direction from the handling module 20 to the gluing module 40, the moving module 30 sequentially has a recycling station 34, a pending station 32, and a gluing station 33. Among them, the recycling station 34 is used to recycle the circuit boards 1 with unqualified gluing discharged from the discharging station 61, and the carrying fixture 31 is movably disposed at the recycling station 34, the pending station 32, and the gluing station 33. In this way, by configuring the moving module 30 in the direction from the handling module 20 to the gluing module 40 to sequentially include the recycling station 34, the pending station 32, and the gluing station 33, while ensuring the overall structural compactness of the buffer black glue attaching system, it is ensured that the circuit boards 1 with unqualified gluing discharged from the discharging station 61 are manually moved by the operator to the recycling station 34 for re-gluing operation. Of course, they can also be moved to the recycling station 34 for re-gluing operation in other ways, preventing waste of materials.

[0055] As Figure 1 、 Figure 2 、 Figure 5 and Figure 6 shown, the moving module 30 further includes a moving support base 35, and the carrying fixture 31 is movably disposed on the moving support base 35.

[0056] It should be noted that in the present application, the glue - applying end of the glue - applying module 40 has a black glue suction head 41, and the black glue suction head 41 is used to adsorb the black glue and attach it to the circuit board 1.

[0057] As Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6 shown, the buffer black - glue attaching system further includes a code - scanning module 70. The code - scanning module 70 is located downstream of the loading module 10 and upstream of the handling module 20. The code - scanning module 70 has a code - scanning end, and the code - scanning end is used to perform two - dimensional code scanning and identification on the circuit board 1 that has completed the flipping operation. In this way, the setting of the code - scanning module 70 is used to scan and record the two - dimensional code on the circuit board to which the black glue is to be attached.

[0058] As Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6 shown, the detection module 50 includes a detection support base 52 and a first detection mechanism 53. The first detection mechanism 53 is arranged on the detection support base 52. The first detection mechanism 53 has at least a displacement sensor, and the displacement sensor is at least used to detect whether the thickness of the black glue attached to the circuit board 1 at the detection station 51 is qualified. In this way, the setting of the first detection mechanism 53 is used to determine whether the thickness of the black glue attached to the circuit board 1 at the detection station 51 is qualified, so as to ensure the qualified rate of the product, prevent the thickness from being too thick due to a large number of layers of black glue attached to the same circuit board 1, or prevent the circuit board 1 from being missed with black glue application.

[0059] As Figure 2 and Figure 6 shown, the discharging module 60 includes a second conveyor belt 62. The second conveyor belt 62 is movably arranged in a direction perpendicular to the handling direction A of the handling module 20. And the discharging module 60 has a discharging station 61 in the inner area of the transmission part of the handling module 20 and a temporary storage station 63 in the outer area of the transmission part of the handling module 20. The second conveyor belt 62 is movably arranged at the discharging station 61 and the temporary storage station 63. In this way, the setting of the second conveyor belt 62 ensures the reliability of temporarily storing the unqualified circuit boards 1, so as to ensure that the subsequent operators can timely take away the circuit boards 1 that need to be re - attached with black glue from the temporary storage station 63 for re - glue - applying operations.

[0060] As Figure 1 and Figure 5 ​As shown, the buffer black glue attaching system further includes a black glue feeding module 80 and a material table 90. Among them, the black glue feeding module 80 has a feeding part 81, and the feeding part 81 is located on the moving path of the gluing end; the material table 90 is arranged at an interval from the black glue feeding module 80. The material table 90, the gluing station 33, and the feeding part 81 are all located on the moving path of the gluing end. The material table 90 is used to place unqualified black glue. In this way, the setting of the black glue feeding module 80 ensures the reliability of the black glue supply, so as to ensure that the buffer black glue attaching system can operate continuously as a whole. The setting of the material table 90 ensures the reliability of the temporary storage of unqualified black glue and prevents the subsequent gluing operation from being seriously affected by unqualified black glue.

[0061] As Figures 1 to 3 As shown, the buffer black glue attaching system further includes a second detection mechanism 100 and a control module. Among them, the second detection mechanism 100 is used to detect whether the black glue at the feeding part 81 is qualified; the control module is signal-connected to the second detection mechanism 100 and is control-connected to the gluing module 40, so that the control module controls the gluing end to grab the black glue and move it to the gluing station 33 or move it to the material table 90 according to the detection signal obtained by the second detection mechanism 100. In this way, the setting of the second detection mechanism 100 is used to detect whether the black glue at the feeding part 81 is qualified, so as to ensure that the gluing end grabs the qualified black glue in time for effective gluing operation, which is beneficial to improving the overall gluing efficiency of the buffer black glue attaching system.

[0062] As Figure 5 As shown, the black glue feeding module 80 has a plurality of feeding parts 81, and the plurality of feeding parts 81 independently perform feeding operations; the black glue feeding module 80 further has a driving switching mechanism 110, and the driving switching mechanism 110 has a driving switching end, and the driving switching end can be selectively drivingly connected to one of the plurality of feeding parts 81. In this way, it is ensured that when one of the feeding parts 81 has no material, the remaining feeding parts 81 can replenish the material in time, so as to ensure the continuity of the overall operation of the buffer black glue attaching system and achieve the purpose of continuous operation.

[0063] It should be noted that in the present application, the driving switching mechanism 110 is movably arranged in the horizontal direction, and the driving switching end moves from the feeding part 81 where the black glue has been used up to the feeding part 81 where the black glue has not been used, and is drivingly connected to the feeding part 81 that has not been used, so as to realize the discharging of the black glue.

[0064] As Figure 2 and Figure 5 As shown, the plurality of feeding parts 81 are arranged at intervals along the conveying direction A of the conveying module 20. In this way, it is beneficial to make full use of the space while saving a large amount of installation space.

[0065] In some embodiments, one side surface of the material table 90 for receiving the unqualified black glue, one side surface of the carrying fixture 31 for receiving the circuit board 1, and one side surface of the feeding station 11 for receiving the circuit board 1 to which the black glue is to be attached are located in the same plane. In this way, it is ensured that the vertical movement path of the glue application end can be well controlled during the process of grasping the black glue for glue application operation, ensuring its control simplicity and preventing the need to adjust the height in the vertical direction for adaptation due to inconsistent heights.

[0066] The present application provides a buffer black glue attaching system including a feeding module 10, a handling module 20, a moving module 30, a glue application module 40, a detection module 50, and a discharging module 60. When performing the black glue attaching operation on the circuit board, at least two feeding stations 11 of the feeding module 10 feed at least two circuit boards 1 to which the black glue is to be attached. The first handling mechanism 21 of the handling module 20 transports the circuit board 1 at the feeding station 11 to the carrying fixture 31 at the pending station 32. The carrying fixture 31 at the pending station 32 moves to the glue application station 33. The glue application end of the glue application module 40 is used to perform the glue application operation on the circuit board 1 on the carrying fixture 31 at the glue application station 33, thereby completing the precise attachment of the black glue. After the glue application operation is completed, the second handling mechanism 22 of the handling module 20 transports the circuit board 1 on the carrying fixture 31 at the pending station 32 that has completed the glue application operation to the detection station 51. The detection end detects whether the circuit board 1 on the detection station 51 that has completed the glue application operation is qualified for glue application. The third handling mechanism 23 of the handling module 20 transports the circuit board 1 with unqualified glue application at the detection station 51 to the discharging station 61; or, the third handling mechanism 23 among the multiple handling mechanisms transports the circuit board 1 with qualified glue application at the detection station 51 to the station of the next process, thereby completing the black glue attaching operation on the circuit board 1. The entire attaching process is automated, greatly improving the attaching efficiency of the black glue, and at the same time, ensuring the precision of the black glue attachment, greatly enhancing the automation degree of the buffer black glue attaching system, realizing the intelligent attachment of the black glue, and being beneficial to reducing the defective rate of the black glue attachment.

[0067] The above has introduced in detail a buffer black glue attaching system for a circuit board provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A buffer black glue attaching system for a circuit board, characterized in that, Comprising: A loading module (10), the loading module (10) having at least two loading stations (11) for simultaneously loading at least two circuit boards (1) to which black glue is to be attached; A handling module (20), the handling module (20) being located downstream of the loading module (10), the handling module (20) having a plurality of handling mechanisms; A moving module (30), the moving module (30) having a carrying fixture (31), the carrying fixture (31) being at least movably arranged at a to-be-determined station (32) and a glue-applying station (33), and a first handling mechanism (21) among the plurality of handling mechanisms being used to handle the circuit board (1) at the loading station (11) onto the carrying fixture (31) at the to-be-determined station (32); A glue-applying module (40), the glue-applying module (40) being located downstream of the moving module (30), the glue-applying module (40) having a movably arranged glue-applying end, and the glue-applying end being used to perform a glue-applying operation on the circuit board (1) on the carrying fixture (31) at the glue-applying station (33); An inspection module (50), the inspection module (50) being located downstream of the glue-applying module (40), the inspection module (50) having an inspection station (51) and an inspection end, and the inspection end being arranged opposite to the inspection station (51), and the inspection end being used to inspect whether the circuit board (1) that has completed the glue-applying operation at the inspection station (51) is qualified in terms of glue application; A discharging module (60), the discharging module (60) being located downstream of the inspection module (50), the discharging module (60) having a discharging station (61); Wherein, a second handling mechanism (22) among the plurality of handling mechanisms is used to handle the circuit board (1) that has completed the glue-applying operation on the carrying fixture (31) at the to-be-determined station (32) to the inspection station (51); A third handling mechanism (23) among the plurality of handling mechanisms is used to handle the circuit board (1) with unqualified glue application at the inspection station (51) to the discharging station (61); or, a third handling mechanism (23) among the plurality of handling mechanisms is used to handle the circuit board (1) with qualified glue application at the inspection station (51) to the station of the next process.

2. The buffer black glue attaching system according to claim 1, wherein The handling directions A of the plurality of handling mechanisms are all the same, and the plurality of handling mechanisms move synchronously; and / or, The loading direction B of the loading module (10) is the same as the handling direction A of the plurality of handling mechanisms; and / or, The moving direction C of the carrying fixture (31) is perpendicular to the loading direction B of the loading module (10).

3. The buffer black glue attaching system according to claim 1, wherein The loading module (10) includes: A loading support base (12); A first driving mechanism (13), the first driving mechanism (13) being arranged on the loading support base (12), the first driving mechanism (13) having a first driving end, and the first driving end being movably arranged along the loading direction B of the loading module (10); A second driving mechanism (14), the first driving end is drivingly connected to the second driving mechanism (14), the second driving mechanism (14) has a second driving end, and the second driving end is movably arranged in the vertical direction; A flipping mechanism (15), the second driving end is drivingly connected to the flipping mechanism (15), the flipping mechanism (15) has a flipping end, the flipping end has a suction cup for sucking the circuit board (1), and the flipping end is used to flip the surface of the circuit board (1) on the corresponding same loading station (11) where the black glue is to be attached to face upwards.

4. The buffer black glue attaching system according to claim 3, wherein at least the number of the flipping mechanisms (15) is the same as the number of the loading stations (11), and the flipping directions of the flipping ends of two adjacent flipping mechanisms (15) are opposite.

5. The buffer black glue attaching system according to claim 1, wherein The handling module (20) further includes: A handling support base (24); A third driving mechanism (25), the third driving mechanism (25) is arranged on the handling support base (24), the third driving mechanism (25) has a third driving end and a transmission part, at least the third driving end is movably arranged along the handling direction A of the handling mechanism, and the third driving end is drivingly connected to the transmission part; The third driving end is simultaneously drivingly connected to the first handling mechanism (21), the second handling mechanism (22), and the third handling mechanism (23) so that the first handling mechanism (21), the second handling mechanism (22), and the third handling mechanism (23) move synchronously.

6. The buffer black glue attaching system according to claim 5, characterized in that, The transmission part includes: A first conveyor belt, and the first handling mechanism (21), the second handling mechanism (22), and the third handling mechanism (23) are connected to the first conveyor belt at equal intervals.

7. The buffer black glue attaching system according to any one of claims 1 to 6, wherein in the direction from the handling module (20) to the glue attaching module (40), the moving module (30) sequentially has a recycling station (34), the pending station (32), and the glue attaching station (33); wherein, the recycling station (34) is used to recycle the circuit boards (1) with unqualified glue attaching discharged from the discharging station (61), and the carrying fixture (31) is movably arranged at the recycling station (34), the pending station (32), and the glue attaching station (33).

8. The buffer black glue attaching system according to any one of claims 1 to 6, characterized in that, The buffer black glue attaching system further includes: A code scanning module (70), the code scanning module (70) is located downstream of the loading module (10) and upstream of the handling module (20), the code scanning module (70) has a code scanning end, and the code scanning end is used to perform two-dimensional code scanning and identification on the circuit board (1) that has completed the flipping operation.

9. The buffer black glue attaching system according to any one of claims 1 to 6, characterized in that The detection module (50) includes: A detection support base (52); The first detection mechanism (53), the first detection mechanism (53) is arranged on the detection support base (52), and the first detection mechanism (53) at least has a displacement sensor, and the displacement sensor is at least used to detect whether the thickness of the black glue attached to the circuit board (1) at the detection station (51) is qualified.

10. The buffer black glue attaching system according to any one of claims 1 to 6, characterized in that, The discharging module (60) includes: The second conveyor belt (62), the second conveyor belt (62) is movably arranged along a direction perpendicular to the conveying direction A of the handling module (20), and the discharging module (60) has the discharging station (61) at the inner area of the transmission part of the handling module (20), and the discharging module (60) has a temporary storage station (63) at the outer area of the transmission part of the handling module (20), and the second conveyor belt (62) is movably arranged at the discharging station (61) and the temporary storage station (63).

11. The buffer black glue attaching system according to any one of claims 1 to 6, characterized in that, The buffer black glue attaching system further includes: The black glue feeding module (80), the black glue feeding module (80) has a feeding part (81), and the feeding part (81) is located on the moving path of the glue attaching end; The material table (90), the material table (90) is arranged at an interval from the black glue feeding module (80), the material table (90), the glue attaching station (33), and the feeding part (81) are all located on the moving path of the glue attaching end, and the material table (90) is used to place unqualified black glue.

12. The buffer black glue attaching system according to claim 11, wherein The buffer black glue attaching system further includes: The second detection mechanism (100), the second detection mechanism (100) is used to detect whether the black glue at the feeding part (81) is qualified; The control module, the control module is signal-connected to the second detection mechanism (100), and the control module is control-connected to the glue attaching module (40), so that the control module controls the glue attaching end to grab the black glue and move it to the glue attaching station (33) or move it to the material table (90) according to the detection signal obtained by the second detection mechanism (100).

13. The buffer black glue attaching system according to claim 11, wherein The black glue feeding module (80) has a plurality of the feeding parts (81), and the plurality of the feeding parts (81) independently perform feeding operations respectively; The black glue feeding module (80) further has a driving switching mechanism (110), the driving switching mechanism (110) has a driving switching end, and the driving switching end can be selectively drivingly connected to one of the plurality of the feeding parts (81).

14. The buffer black glue attaching system according to claim 13, wherein The plurality of the feeding parts (81) are arranged at intervals along the conveying direction A of the handling module (20).

15. The buffer black glue attaching system according to claim 11, wherein One side surface of the material table (90) for receiving unqualified black glue, one side surface of the carrying fixture (31) for receiving the circuit board (1), and one side surface of the loading station (11) for receiving the circuit board (1) to be attached with black glue are located in the same plane.

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