Electronic device

Abstract

The utility model provides electronic equipment, and belongs to the technical field of electronics. The electronic equipment comprises a middle frame module and a screen module, the screen module is connected with the middle frame module; the middle frame module comprises a frame piece, a middle plate piece and a ground returning rib. The frame piece is provided with at least two antenna radiators, the at least two antenna radiators are respectively connected with the grounding ribs, and the grounding ribs are connected with the middle plate piece; the screen module comprises a screen body and a metal layer, and the metal layer is located on a non-display surface, facing the middle frame module, of the screen body; the middle frame module further comprises a conductive structure which is located between the grounding rib and the metal layer. According to the electronic equipment provided by the utility model, the conductive structure is arranged between the grounding rib and the metal layer of the screen module, the current of the grounding rib is guided to the metal layer, and the current dispersion effect of the grounding rib is enhanced, so that the isolation effect of the at least two antenna radiators is improved, the decoupling effect of the antenna radiators sharing the grounding rib is realized, and the service life of the antenna radiator is prolonged. And the antenna performance of the electronic equipment is improved.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, and particularly to an electronic device. Background Art

[0002] With the development of electronic devices such as mobile phones and tablet computers, the number of antennas required by electronic devices has increased significantly. In the related art, multiple antennas are usually required on the frame of the electronic device, and a common ground rib position design is often adopted between adjacent antennas to reduce the space occupied by the ground rib position. However, if two antennas have the same operating frequency band, there will be a problem of poor isolation between the two antennas. Summary of the Utility Model

[0003] The utility model provides an electronic device, which can solve the problem of poor isolation of antennas with a common ground rib position.

[0004] The technical solution is as follows:

[0005] An electronic device, comprising: a middle frame module and a screen module;

[0006] The screen module is connected to the middle frame module;

[0007] The middle frame module includes a frame member, a middle plate member and a ground rib;

[0008] At least two antenna radiators are provided on the frame member, the at least two antenna radiators are respectively connected to the ground rib, and the ground rib is connected to the middle plate member;

[0009] The screen module includes a screen body and a metal layer, and the metal layer is located on the non-display surface of the screen body facing the middle frame module;

[0010] The middle frame module further includes a conductive structure, and the conductive structure is located between the ground rib and the metal layer.

[0011] In some embodiments, the conductive structure includes a first surface facing the ground rib and a second surface facing the metal layer;

[0012] The area of the first surface is smaller than the area of the second surface.

[0013] In some embodiments, the ground rib includes a stepped concave portion, the conductive structure is located in the stepped concave portion, and the conductive structure is in a stepped shape.

[0014] In some embodiments, the distance D1 between the conductive structure and the ground rib ranges from 0.1 to 0.3 mm.

[0015] In some embodiments, the distance D1 between the conductive structure and the ground return rib in the thickness direction of the electronic device Z ranges from 0.1 to 0.3 mm.

[0016] In some embodiments, the distance D1 between the conductive structure and the ground return rib in the plane direction of the electronic device XY ranges from 0.1 to 0.3 mm.

[0017] In some embodiments, the distance D2 between the conductive structure and the metal layer in the thickness direction of the electronic device ranges from 0.05 to 0.15 mm.

[0018] In some embodiments, the distance D3 between the conductive structure and the at least two antenna radiators in the plane direction of the electronic device ranges from 0.5 to 0.9 mm.

[0019] In some embodiments, the middle frame module further includes a plastic layer that covers the ground return rib, and the conductive structure is connected to the plastic layer.

[0020] In some embodiments, the middle frame module is a folding middle frame, the conductive structure is a metal magnetic structure, and the conductive structure is further configured to provide a magnetic closing force when the folding middle frame is in a folded state.

[0021] The beneficial effects brought by the technical solution provided by the present utility model at least include:

[0022] In the electronic device of the present utility model, at least two antenna radiators are arranged on the frame member in the middle frame module, and the at least two antenna radiators are commonly grounded by using the ground return rib. In order to improve the isolation degree of the at least two antenna radiators, a conductive structure is arranged between the ground return rib and the metal layer of the screen module. The conductive structure can direct the current of the ground return rib to the metal layer, enhance the current dispersion effect of the ground return rib, thereby improving the isolation effect of the at least two antenna radiators, realizing the decoupling effect of the antenna radiators sharing the ground return rib, and improving the performance of the antenna of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 is a partial structural schematic diagram of the electronic device provided by the embodiment of the present utility model;

[0025] Figure 2 is a partial structure cross-sectional view of an electronic device provided by an embodiment of the present utility model;

[0026] Figure 3 is a schematic structural diagram of a conductive structure provided by an embodiment of the present utility model;

[0027] Figure 4 is a partial structure cross-sectional view of an electronic device provided by another embodiment of the present utility model;

[0028] Figure 5 is a schematic structural diagram of a middle frame module provided by an embodiment of the present utility model;

[0029] Figure 6 is a schematic structural diagram of a middle frame module provided by another embodiment of the present utility model;

[0030] Figure 7 is a schematic structural diagram of an electronic device in a folded state provided by an embodiment of the present utility model;

[0031] Figure 8 is an effect diagram of current dispersion of an electronic device provided by an embodiment of the present utility model;

[0032] Figure 9 is a test curve of antenna isolation of an electronic device provided by an embodiment of the present utility model;

[0033] Figure 10 is a test curve of antenna radiation efficiency of an electronic device provided by an embodiment of the present utility model.

[0034] The reference numerals in the figures are respectively represented as:

[0035] 1, middle frame module;

[0036] 101, first middle frame; 102, second middle frame; 103, rotating shaft structure;

[0037] 11, frame member; 111, antenna radiator; 1111, upper frame point; 12, middle plate member; 13, ground return rib; 131, stepped concave portion; 14, conductive structure; 1401, first surface; 1402, second surface; 15, plastic layer;

[0038] 2, screen module;

[0039] 21, screen body; 2101, non-display surface; 22, metal layer. Detailed implementation manners

[0040] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the Figure 1 orientation or positional relationship shown, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0042] It should be understood that in the present invention, "electrically connected" can be understood as physical contact and electrical conduction between components; it can also be understood as a form of connection between different components in a circuit structure through physical lines such as copper foils or wires of a printed circuit board (PCB) that can transmit electrical signals. "Communication connection" can refer to electrical signal transmission, including wireless communication connection and wired communication connection. Wireless communication connection does not require a physical medium and does not belong to the connection relationship that defines the product structure. "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship, that is, A is connected to B or A is connected with B can mean that there are fastening members (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and it is difficult to separate A and B.

[0043] Unless otherwise defined, all technical terms used in the embodiments of the present invention have the same meaning as commonly understood by those of ordinary skill in the art.

[0044] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0045] On the one hand, as shown in Figure 1 and Figure 2 this embodiment provides an electronic device, which includes a middle frame module 1 and a screen module 2.

[0046] The screen module 2 is connected to the middle frame module 1; the middle frame module 1 includes a frame member 11, a middle plate member 12, and a ground return rib 13; at least two antenna radiators 111 are provided on the frame member 11, and the at least two antenna radiators 111 are respectively connected to the ground return rib 13, and the ground return rib 13 is connected to the middle plate member 12.

[0047] The screen module 2 includes a screen body 21 and a metal layer 22, and the metal layer 22 is located on the non-display surface 2101 of the screen body 21 facing the middle frame module 1; the middle frame module 1 further includes a conductive structure 14, and the conductive structure 14 is located between the ground return rib 13 and the metal layer 22, and the conductive structure 14 is used to direct the current of the ground return rib 13 to the metal layer 22.

[0048] In the electronic device of this embodiment, at least two antenna radiators 111 are arranged on the frame member 11 in the middle frame module 1, and the at least two antenna radiators 111 are commonly grounded by using the ground return rib 13. In order to improve the isolation degree of the at least two antenna radiators 111, a conductive structure 14 is arranged between the ground return rib 13 and the metal layer 22 of the screen module 2. The conductive structure 14 can direct the current of the ground return rib 13 to the metal layer 22, enhance the current dispersion effect of the ground return rib 13, thereby improving the isolation effect of the at least two antenna radiators 111, realizing the decoupling effect of the antenna radiators 111 sharing the ground return rib 13, and improving the performance of the antenna of the electronic device.

[0049] The technical solution provided by the present utility model is applicable to electronic devices adopting one or more of the following communication technologies: Bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, Wireless Fidelity (WiFi) communication technology, Global System for Mobile Communications (GSM) communication technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5G communication technology, and other future communication technologies, etc.

[0050] The electronic device in the embodiment of the present utility model may be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, a smart helmet, a smart glasses, etc. The electronic device may also be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a handheld device with wireless communication function, a computing device or other processing devices connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network or an electronic device in a future evolved Public Land Mobile Network (PLMN), etc. The embodiment of the present utility model does not limit this.

[0051] In some possible implementation manners, the conductive structure 14 is located between the ground return rib 13 and the metal layer 22, and the conductive structure 14 is electrically connected to the ground return rib 13 and the metal layer 22 in electrical contact respectively, and the current in the ground return rib 13. Also, the conductive structure 14 is non-contact connected to the ground return rib 13 or the metal layer 22, but is connected by capacitive coupling. When there is a current in the ground return rib 13, based on the principle of electromagnetic induction, an induced current will be generated in the conductive structure 14, and the metal layer 22 is affected by the conductive structure 14 to generate another induced current, so that the capacitive coupling connection can also achieve the current dispersion effect of the ground return rib 13.

[0052] In some possible implementation manners, the number of the antenna radiators 111 is two, and the two antenna radiators 111 are respectively located on two frame members 11 that are vertically connected to the electronic device, and the ground return rib 13 is located at the connection position of the two frame members 11, that is, the corner area of the middle frame module 1 of the electronic device.

[0053] Each antenna radiator 111 is provided with an upper frame point 1111, and the upper frame point 1111 may be located at any position of the antenna radiator 111 except the position where the ground return rib 13 is located. The antenna radiator 111 may use the upper frame point 1111 to connect to a feeding circuit or a matching circuit to realize the transmission and / or reception of electromagnetic waves of the antenna radiator 111.

[0054] Combined Figure 2 and Figure 3 As shown, in some embodiments, the conductive structure 14 includes a first surface 1401 facing the ground return rib 13 and a second surface 1402 facing the metal layer 22; the area of the first surface 1401 is smaller than the area of the second surface 1402.

[0055] With the above arrangement, the conductive structure 14 receives the current of the ground strap 13 using the first surface 1401 and disperses the current towards the metal layer 22 using the second surface 1402. Since the area of the second surface 1402 is larger than that of the first surface 1401, a better current dispersion effect is achieved.

[0056] Combined with Figure 4 As shown, in some embodiments, the ground strap 13 includes a stepped concave portion 131, the conductive structure 14 is located within the stepped concave portion 131, and the conductive structure 14 is stepped.

[0057] In this embodiment, the stepped conductive structure 14 is arranged within the stepped concave portion 131 of the ground strap 13. On the one hand, the space of the ground strap 13 can be fully utilized, and on the other hand, the stepped shape can make the conductive structure 14 have a smaller first surface 1401 and a larger second surface 1402.

[0058] Combined with Figure 4 As shown, in some embodiments, the value range of the spacing D1 between the conductive structure 14 and the ground strap 13 is 0.1 - 0.3 mm. When the value of the spacing D1 between the conductive structure 14 and the ground strap 13 satisfies the above value range, the current guiding effect between the conductive structure 14 and the ground strap 13 is better.

[0059] In addition, the minimum value of the spacing D1 between the conductive structure 14 and the ground strap 13 is 0.1 mm, which can achieve a gap coupling connection between the conductive structure 14 and the ground strap 13. Compared with a conductive contact connection, the gap coupling connection does not have the problem of unstable electrical contact. Moreover, in order to ensure the contact stability of the conductive contact connection, materials such as conductive glue and conductive foam need to be arranged between the conductive structure 14 and the ground strap 13, increasing the cost and being difficult to implement.

[0060] Exemplarily, the value of the spacing D1 between the conductive structure 14 and the ground strap 13, for example, is 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc. Optionally, the value of the spacing D1 is 0.2 mm.

[0061] Combined with Figure 4 As shown, in some embodiments, the spacing D1 between the conductive structure 14 and the ground strap 13 in the thickness direction of the electronic device Z has a value range of 0.1 - 0.3 mm. When the value of the spacing D1 between the conductive structure 14 and the ground strap 13 Z satisfies the above value range, the current guiding effect between the conductive structure 14 and the ground strap 13 is better.

[0062] Exemplarily, the spacing D1 between the conductive structure 14 and the ground strap 13 ZThe value of, for example, is 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc. Optionally, the spacing D1 Z has a value of 0.2 mm.

[0063] Combined with Figure 4 As shown, in some embodiments, the spacing D1 between the conductive structure 14 and the ground return rib 13 in the planar direction of the electronic device XY has a value range of 0.1 - 0.3 mm. When the spacing D1 between the conductive structure 14 and the ground return rib 13 XY has a value that satisfies the above value range, the current guiding effect between the conductive structure 14 and the ground return rib 13 is better.

[0064] Exemplarily, the value of the spacing D1 between the conductive structure 14 and the ground return rib 13 XY is, for example, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc. Optionally, the spacing D1 XY has a value of 0.2 mm.

[0065] Combined with Figure 4 As shown, in some embodiments, the value range of the spacing D2 between the conductive structure 14 and the metal layer 22 in the thickness direction of the electronic device is 0.05 - 0.15 mm. When the value of the spacing D2 between the conductive structure 14 and the metal layer 22 satisfies the above value range, the current guiding effect between the conductive structure 14 and the metal layer 22 is better.

[0066] Exemplarily, the value of the spacing D2 between the conductive structure 14 and the metal layer 22 is, for example, 0.05 mm, 0.075 mm, 0.1 mm, 0.125 mm, 0.15 mm, etc. Optionally, the spacing D2 has a value of 0.1 mm.

[0067] Combined with Figure 4 As shown, in some embodiments, the value range of the spacing D3 between the conductive structure 14 and at least two antenna radiators 111 in the planar direction of the electronic device is 0.5 - 0.9 mm. When the value of the spacing D3 between the conductive structure 14 and the antenna radiator 111 satisfies the above value range, the distance between the conductive structure 14 and the antenna radiator 111 is larger, and the interference of the conductive structure 14 on the antenna radiator 111 is smaller.

[0068] Exemplarily, the value of the spacing D3 between the conductive structure 14 and the antenna radiator 111 is, for example, 0.5 mm, 0.75 mm, 0.8 mm, 0.85 mm, 0.9 mm, etc. Optionally, the spacing D3 has a value of 0.7 mm.

[0069] Combined with Figure 4As shown, in some embodiments, the middle frame module 1 further includes a plastic layer 15, the plastic layer 15 covers the ground return rib 13, and the conductive structure 14 is connected to the plastic layer 15.

[0070] With the above arrangement, the ground return rib 13 in the middle frame module 1 is covered by the plastic layer 15, and the conductive structure 14 is arranged on the plastic layer 15, which can realize the installation and fixation of the conductive structure 14, and can also make the distance D1 between the conductive structure 14 and the ground return rib 13 meet the above value range.

[0071] Combined Figure 5 and Figure 6 As shown, in some embodiments, the middle frame module 1 is a folding middle frame, the conductive structure 14 is a metal magnetic structure, and the conductive structure 14 is also used to provide a magnetic closing force when the folding middle frame is in a folded state.

[0072] In this embodiment, for the middle frame module 1 of the folding middle frame type, the conductive structure 14 adopts a metal magnetic structure, so that the conductive structure 14 can provide a magnetic closing force when the folding middle frame is in a folded state.

[0073] In some embodiments, the middle frame module 1 includes a first middle frame 101, a second middle frame 102 and a rotating shaft structure 103, and the first middle frame 101 and the second middle frame 102 are rotatably connected through the rotating shaft structure 103. Refer to Figure 5 As shown, the first middle frame 101 and the second middle frame 102 can be folded up and down and opened along the rotating shaft structure 103. Refer to Figure 6 As shown, the first middle frame 101 and the second middle frame 102 can also be folded left and right and opened along the rotating shaft structure 103.

[0074] Among them, the number of the conductive structures 14 is at least two, which are respectively located in the corner areas of the first middle frame 101 and the second middle frame 102 facing away from the rotating shaft structure 103. When the first middle frame 101 and the second middle frame 102 rotate to Figure 7 As shown in the folded state, the conductive structures 14 in the first middle frame 101 and the conductive structures 14 in the second middle frame 102 are in corresponding positions, and the two conductive structures 14 can attract each other by their own magnetism, so as to provide a magnetic closing force for the first middle frame 101 and the second middle frame 102.

[0075] Optionally, two conductive structures 14 are respectively arranged in the two corner areas of the first middle frame 101 facing away from the rotating shaft structure 103, and two conductive structures 14 are respectively arranged in the two corner areas of the second middle frame 102 facing away from the rotating shaft structure 103. That is, each electronic device has four conductive structures 14, and when the electronic device is in a folded state, the four conductive structures 14 attract each other in pairs.

[0076] Figure 8It is the current dispersion effect diagram of the electronic device provided by the embodiment of the present utility model. It can be seen from the figure that the conductive structure 14 can effectively disperse the current onto the metal layer 22. In the figure, the lighter the color area, the higher the current density, and the darker the color area, the lower the current density.

[0077] Figure 9 It is the antenna isolation degree test curve of the electronic device provided by the embodiment of the present utility model. It can be seen from the figure that in this embodiment, due to the adoption of the conductive structure 14, compared with the related technology without the conductive structure 14, the antenna isolation degree is improved by about 1.5 dB at 3.6 GHz.

[0078] Figure 10 It is the antenna radiation efficiency test curve of the electronic device provided by the embodiment of the present utility model. It can be seen from the figure that in this embodiment, due to the adoption of the conductive structure 14, compared with the related technology without the conductive structure 14, the antenna radiation efficiency is significantly improved in the frequency range of 3.6 - 4.7 GHz.

[0079] It should be noted that in the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0080] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present utility model.

[0081] The above are only the embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. An electronic device, characterized in that, The electronic device includes: a middle frame module (1) and a screen module (2); The screen module (2) is connected to the middle frame module (1); The middle frame module (1) includes a frame member (11), a middle plate member (12), and a ground return rib (13); At least two antenna radiators (111) are provided on the frame member (11), the at least two antenna radiators (111) are respectively connected to the ground return rib (13), and the ground return rib (13) is connected to the middle plate member (12); The screen module (2) includes a screen body (21) and a metal layer (22), and the metal layer (22) is located on the non-display surface (2101) of the screen body (21) facing the middle frame module (1); The middle frame module (1) further includes a conductive structure (14), and the conductive structure (14) is located between the ground return rib (13) and the metal layer (22).

2. The electronic device according to claim 1, wherein The conductive structure (14) includes a first surface (1401) facing the ground return rib (13) and a second surface (1402) facing the metal layer (22); The area of the first surface (1401) is smaller than the area of the second surface (1402).

3. The electronic device according to claim 2, wherein The ground return rib (13) includes a stepped concave portion (131), the conductive structure (14) is located within the stepped concave portion (131), and the conductive structure (14) is in a stepped shape.

4. The electronic device according to claim 3, wherein The distance between the conductive structure (14) and the ground return rib (13) ranges from 0.1 to 0.3 mm.

5. The electronic device according to claim 4, characterized in that, The distance D1 between the conductive structure (14) and the ground return rib (13) in the thickness direction of the electronic device Z ranges from 0.1 to 0.3 mm.

6. The electronic device according to claim 4, characterized in that, The distance D1 between the conductive structure (14) and the ground return rib (13) in the planar direction of the electronic device XY ranges from 0.1 to 0.3 mm.

7. The electronic device according to claim 1, wherein The distance D2 between the conductive structure (14) and the metal layer (22) in the thickness direction of the electronic device ranges from 0.05 to 0.15 mm.

8. The electronic device according to claim 1, wherein The distance D3 between the conductive structure (14) and the at least two antenna radiators (111) in the plane direction of the electronic device ranges from 0.5 to 0.9 mm.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The middle frame module (1) further includes a plastic layer (15), the plastic layer (15) covers the ground return rib (13), and the conductive structure (14) is connected to the plastic layer (15).

10. The electronic device according to any one of claims 1 to 8, characterized in that, The middle frame module (1) is a folding middle frame, the conductive structure (14) is a metal magnetic structure, and the conductive structure (14) is further configured to provide a magnetic closing force when the folding middle frame is in a folded state.

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