Detector submodule, detector module, detector and medical imaging equipment

Abstract

The utility model discloses a detector sub-module, a detector module, a detector and medical imaging equipment, and relates to the technical field of medical equipment. The detector sub-module comprises a photoelectric conversion unit and a carrier plate, the carrier plate is stacked on one side of the photoelectric conversion unit in the Y direction, in the Y direction, the projection of the photoelectric conversion unit on the carrier plate is completely located in the carrier plate, and the edge of the projection of the photoelectric conversion unit does not coincide with the edge of the carrier plate. According to the detector sub-module provided by the embodiment of the utility model, the photoelectric conversion unit is comprehensively supported, and gaps or dislocation caused by exposure of the edge of the photoelectric conversion unit is reduced. The probability that the adjacent sub-modules extrude or collide the photoelectric conversion unit is reduced, the photoelectric conversion unit is prevented from being deformed during extrusion and collision, distortion is reduced, the accuracy of images detected by the detector is improved, and the reliability of the sub-modules of the detector is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular, to a detector sub-module, a detector module, a detector, and a medical imaging device. Background Art

[0002] In existing medical imaging devices, a detector sub-module converts an optical signal into an electrical signal through a photoelectric conversion component thereon. Since the photoelectric conversion component is thin and manufactured by a semiconductor process, it is very sensitive to mechanical stress, etc. The abutment of adjacent detector sub-modules during the assembly process may also cause damage or even failure of the photoelectric conversion component, thereby affecting the imaging effect of the medical imaging device.

[0003] Therefore, there is a certain room for improvement in the detector sub-module. Summary of the Utility Model

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. For this reason, the first aspect of the utility model aims to propose a detector sub-module to improve the possible damage to the photoelectric conversion unit during the installation process, thereby improving the accuracy of the image measured by the detector.

[0005] The second aspect of the utility model aims to propose a detector module.

[0006] The third aspect of the utility model aims to propose a detector.

[0007] The fourth aspect of the utility model aims to propose a medical imaging device.

[0008] The detector sub-module according to the embodiment of the first aspect of the utility model includes: a photoelectric conversion unit; a carrier plate, the carrier plate is stacked on one side of the photoelectric conversion unit along the Y direction. In the Y direction, the projection of the photoelectric conversion unit on the carrier plate is completely located inside the carrier plate, and the projection edge of the photoelectric conversion unit does not coincide with the edge of the carrier plate.

[0009] The detector sub-module according to the embodiment of the utility model enables the photoelectric conversion unit to be fully supported, reducing the gaps or misalignments caused by the edge exposure. The probability of extrusion or collision of adjacent sub-modules to the photoelectric conversion unit is reduced, thereby improving the reliability of the detector sub-module.

[0010] For a detector sub-module according to some embodiments of the present utility model, the photoelectric conversion unit includes: a first edge located on one side of the photoelectric conversion unit in the Z direction, where the Z direction is the arrangement direction when a plurality of the detector sub-modules form a detector module; two second edges, with the two second edges respectively connecting the two ends of the first edge; the carrier board includes: a first side edge located on one side of the carrier board in the Z direction; two second side edges, with the two second side edges respectively connecting the two ends of the first side edge; the distance between the Y-direction projection of the first edge on the carrier board and the first side edge is W1, satisfying W1 ≤ 0.1 mm; the distance between the Y-direction projection of each second edge on the carrier board and the corresponding second side edge is W2, satisfying W2 ≤ 0.1 mm.

[0011] For a detector sub-module according to some embodiments of the present utility model, it further includes: a flexible cable, one end of the flexible cable is connected to the carrier board through a connector, and the connector is located on the side of the carrier board away from the photoelectric conversion unit; wherein, the flexible cable is an FPC cable and the carrier board is a PCB board.

[0012] For a detector sub-module according to some embodiments of the present utility model, a heat-conducting material layer is provided on the carrier board, the heat-conducting material layer and the connector are on the same side of the carrier board, and a plurality of vias are provided on the heat-conducting material layer; the connector extends along the X direction; in the Z direction and in the direction towards the connector, the arrangement density of the vias gradually increases; where the Z direction is the arrangement direction when a plurality of the detector sub-modules form a detector module.

[0013] For a detector sub-module according to some embodiments of the present utility model, the photoelectric conversion unit includes an analog-digital chip and a photodiode arranged along the Z direction, and the size of the photoelectric conversion unit in the Y direction is a thickness T, satisfying 0.08 mm ≤ thickness T ≤ 0.60 mm; where the Z direction is the arrangement direction when a plurality of the detector sub-modules form a detector module.

[0014] For a detector sub-module according to some embodiments of the present utility model, the corner of the carrier board adjacent to the photoelectric conversion unit is the upper corner of the board, and the corner of the carrier board away from the photoelectric conversion unit is the lower corner of the board; the upper corner of the board and the lower corner of the board are on the same side of the carrier board in the Z direction, where the Z direction is the arrangement direction when a plurality of the detector sub-modules form a detector module; the upper corner of the board is used to connect to an adjacent detector sub-module along the Z direction; an avoidance groove is formed on the lower corner of the board for avoiding an adjacent detector sub-module.

[0015] According to some embodiments of the present utility model, the detector sub-module further includes an anti-scattering grating, and the anti-scattering grating is disposed on a side of the photoelectric conversion unit away from the carrier board; when adjacent detector sub-modules are spliced along the Z direction, a corner of the board of one detector sub-module is tightly connected to the anti-scattering grating of the other detector sub-module.

[0016] According to a detector module of a second aspect embodiment of the present utility model, it includes: a module bracket; a control circuit board disposed on the module bracket; a plurality of detector sub-modules according to the first aspect embodiment of the present application, the plurality of detector sub-modules are mounted on the module bracket and are arranged in sequence along the Z direction, and at least one side of each detector sub-module is provided with a wiring harness on both sides along the X direction, and each detector sub-module is connected to the control circuit board through the corresponding wiring harness; wherein the Z direction is the arrangement direction when there are multiple detector sub-modules and a detector module is formed.

[0017] According to some embodiments of the present utility model, the wiring harnesses of at least two detector sub-modules are symmetrically arranged.

[0018] According to a detector of a third aspect embodiment of the present utility model, it includes: a housing; a plurality of detector modules as described in the second aspect embodiment of the present application, and the plurality of detector modules are arranged side by side along the X direction on the housing.

[0019] According to a medical imaging device of a fourth aspect embodiment of the present utility model, it includes a scanning frame, a radiation source, and a detector as described in the third aspect embodiment of the present application; the scanning frame is used to receive a scanning object, the radiation source and the detector are respectively disposed on the scanning frame, the radiation source is used to emit rays to the scanning object, and the detector is used to receive the rays attenuated by the scanning object.

[0020] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. Description of the Drawings

[0021] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0022] Figure 1 is a schematic structural diagram of a detector sub-module in some embodiments of the present application;

[0023] Figure 2 is a schematic structural diagram of a carrier board and a photoelectric conversion unit in some embodiments of the present application;

[0024] Figure 3 is Figure 2 The partial enlarged view at position A in

[0025] Figure 4 is the schematic layout diagram of the vias in some embodiments of the present application;

[0026] Figure 5 is the schematic structural diagram of the avoidance groove of the carrier board in some embodiments of the present application;

[0027] Figure 6 is the schematic splicing diagram of the first sub-module and the second sub-module in some embodiments of the present application;

[0028] Figure 7 is the schematic splicing structure diagram of multiple detector sub-modules in some embodiments of the present application;

[0029] Figure 8 is the schematic structural diagram of the detector module in some embodiments of the present application;

[0030] Figure 9 is a schematic connection diagram of the flexible cable and the carrier board in some embodiments of the present application;

[0031] Figure 10 is another schematic connection diagram of the flexible cable and the carrier board in some embodiments of the present application;

[0032] Figure 11 is the schematic structural diagram of the flexible cable in some embodiments of the present application;

[0033] Figure 12 is the schematic layout principle diagram of the detector sub-modules in the detector module in some embodiments of the present application;

[0034] Figure 13 is the schematic structural diagram of the medical imaging device in some embodiments of the present application.

[0035] Reference numerals:

[0036] Medical imaging device 1000,

[0037] Detector 100, gantry 200, scan cavity 201, radiation source 300, examination table 400, examination object 500,

[0038] Detector module 101, module bracket 102,

[0039] Detector sub-module 103, first sub-module 1031, second sub-module 1032,

[0040] Anti-scatter grating 1, scintillator array 2,

[0041] Photoelectric conversion unit 3, photoelectric conversion module 30, first edge 301, second edge 302, analog-digital chip 31, photodiode 32,

[0042] Carrier board 4, first side edge 401, second side edge 402, upper corner of the board 403, lower corner of the board 404, avoidance groove 4041, connector 41, heat-conducting material layer 42, via hole 420,

[0043] Flat cable 5. Specific embodiments

[0044] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present utility model and should not be construed as limiting the present utility model.

[0045] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0046] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0047] It should be noted that the function of the photoelectric conversion unit is to quickly respond to the transformation of optical signals and convert them into electrical signals for output. The thickness of each photoelectric conversion unit is about between 0.08 mm and 0.6 mm, and it is made by semiconductor technology. This makes the photoelectric conversion unit extremely sensitive to external forces such as mechanical stress, and bumps during the assembly process may cause damage to the photoelectric conversion unit, and even serious failure.

[0048] Generally, the photoelectric conversion unit is arranged on the carrier board. The function of the carrier board is to provide support protection and electrical signal connection for the photoelectric conversion unit. In order to avoid damage to the photoelectric conversion unit near the edge of the carrier board during subsequent splicing. The following refers to Figures 1 - 13 Describe the detector sub-module 103 according to the embodiment of the first aspect of the present invention.

[0049] As Figure 1 shown, the detector sub-module 103 according to the embodiment of the present invention includes: a photoelectric conversion unit 3 and a carrier board 4. The photoelectric conversion array is arranged along the X direction and the Z direction. Combining Figure 1 , the Z direction is the arrangement direction when multiple detector sub-modules 103 form a detector module 101, and it is also the extension direction of the scanning center. The extension direction of the scanning center is defined with reference to the CT device when the detector sub-module is applied to a Computed Tomography (CT) device. The carrier board 4 is stacked on one side of the photoelectric conversion unit 3 along the Y direction. In the Y direction, the projection of the photoelectric conversion unit 3 on the carrier board 4 is completely located within the carrier board 4, and the projection edge of the photoelectric conversion unit 3 does not coincide with the edge of the carrier board 4.

[0050] In the above technical solution, the carrier board 4 provides comprehensive support for the photoelectric conversion unit 3 in the Y direction. The projection of the photoelectric conversion unit 3 on the carrier board 4 can refer to the projection of the photoelectric conversion unit 3 on the surface of the carrier board 4. The surface of the carrier board 4 can be the surface where the photoelectric conversion unit 3 is arranged, and the edge of the carrier board 4 can be the edge of the surface of the carrier board 4.

[0051] In the Y direction, the projection of the photoelectric conversion unit 3 on the carrier board 4 is completely located within the carrier board 4, and the projection edge of the photoelectric conversion unit 3 does not coincide with the edge of the carrier board 4.

[0052] This means that there is a certain distance between the edge of the photoelectric conversion unit 3 and the edge of the carrier board 4, ensuring that the mounted photoelectric conversion unit 3 does not expose the edge of the carrier board 4.

[0053] First of all, the non-exposed-edge photoelectric conversion unit 3 reduces the gaps or misalignments caused by edge exposure during the splicing process, and adjacent detector sub-modules 103 can be abutted more closely to each other.

[0054] Secondly, the photoelectric conversion unit 3 without an exposed edge also reduces the risk of damage due to collision or extrusion. Specifically, during the splicing process, if adjacent sub-modules are squeezed or collided with each other, the exposed edge may become a stress point, resulting in damage to the photoelectric conversion unit 3. By completely mounting the photoelectric conversion unit 3 within the carrier board 4, this risk is greatly reduced, thereby improving the reliability of the detector sub-module 103.

[0055] In addition, the improved photoelectric conversion unit 3 is completely within the protection range of the carrier board 4, reducing the probability of extrusion or collision of the adjacent detector sub-module 103 against the photoelectric conversion unit 3, avoiding deformation of the photoelectric conversion unit 3 during extrusion and collision, reducing distortion, thereby improving the accuracy of the image measured by the detector 100, and thus ensuring the reliability of the detector sub-module 103.

[0056] In some alternative embodiments, the photoelectric conversion unit 3 includes multiple photoelectric conversion components 30, and multiple photoelectric conversion components 30 are mounted on each carrier board 4. The multiple photoelectric conversion components 30 work simultaneously, which can improve the efficiency of signal processing. The edge of the photoelectric conversion component 30 maintains a certain distance from the edge of the carrier board 4, thereby ensuring the stability of data while improving the processing efficiency of the detector sub-module 103.

[0057] In some embodiments, as Figure 2 shown, the photoelectric conversion unit 3 includes: a first edge 301 and two second edges 302. The first edge 301 is located on one side of the photoelectric conversion unit 3 in the Z direction. The two second edges 302 are respectively connected to both ends of the first edge 301. The carrier board 4 includes: a first side edge 401 and two second side edges 402. The first side edge 401 is located on one side of the carrier board 4 in the Z direction. The two second side edges 402 are respectively connected to both ends of the first side edge 401.

[0058] Exemplarily, in combination with Figure 3 , when mounting the photoelectric conversion unit 3, the first edge 301 corresponds to the first side edge 401 of the carrier board 4, and the two second edges 302 respectively correspond to the two second side edges 402 of the carrier board 4.

[0059] The distance between the Y-direction projection of the first edge 301 on the carrier board 4 and the first side edge 401 is W1, satisfying W1 ≤ 0.1 mm.

[0060] Specifically, referring to Figure 3 , set the distance between the Y-direction projection of the first edge 301 on the carrier board 4 and the first side edge 401 as W1, satisfying W1 ≤ 0.1 mm. For example, W1 is 0.1 mm, 0.09 mm, 0.08 mm, 0.07 mm, 0.05 mm, etc. Controlling W1 within 0.1 mm can not only effectively protect the fragile photoelectric conversion unit 3 but also ensure the compactness of the structure.

[0061] The distance between the Y-direction projection of each second edge 302 on the carrier board 4 along the Y direction and the corresponding second side edge 402 is W2, satisfying W2 ≤ 0.1 mm.

[0062] Specifically, referring to Figure 3, it is set that the distance between the projection of each second edge 302 on the carrier board 4 along the Y direction and the corresponding second side 402 is W2, satisfying W2≤0.1 mm. For example, W2 is 0.1 mm, 0.09 mm, 0.08 mm, 0.07 mm, 0.05 mm, etc.

[0063] In some embodiments, as Figure 1 shown, the detector sub-module 103 further includes: a flexible cable 5. One end of the flexible cable 5 is connected to the carrier board 4 through a connector 41, and the connector 41 is located on the side of the carrier board 4 away from the photoelectric conversion unit 3. Among them, the flexible cable 5 is an FPC cable, and the carrier board 4 is a PCB board.

[0064] It is worth mentioning that the carrier board 4 also provides the function of electrical signal connection for the photoelectric conversion unit 3. Specifically, after receiving the optical signal, the photoelectric conversion unit 3 converts it into an electrical signal, and these electrical signals are then transmitted to the carrier board 4. Through its internal circuit layout and electrical connection, the carrier board 4 effectively collects and transmits the electrical signals output by the photoelectric conversion unit 3. Such a design ensures the integrity and accuracy of the electrical signals, providing reliable original data for subsequent processing.

[0065] In the above technical solution, the electrical signals on the carrier board 4 are connected to the flexible cable 5 through the connector 41.

[0066] The flexible cable 5 is an FPC flexible printed circuit board cable.

[0067] First of all, the FPC cable has excellent flexibility and can be freely bent, wound and folded to adapt to various complex installation environments and space limitations. This flexibility gives the FPC cable a high degree of flexibility in design and layout, providing installation convenience for the detector sub-module 103.

[0068] Secondly, the FPC cable has good electrical and mechanical properties. It can work stably in a variety of harsh environments to ensure the reliable transmission of electrical signals. Therefore, the FPC cable can meet the basic performance requirements for use in the thermal environment of the detector sub-module 103.

[0069] In addition, the FPC cable is lower in price than traditional partial circuit boards, thereby reducing the cost of the detector 100 and improving the economy of the detector 100. Especially as the usage of the detector sub-module 103 increases, it helps to significantly reduce the manufacturing cost of the detector 100.

[0070] In some embodiments, as Figure 4 shown, a heat-conducting material layer 42 is provided on the carrier board 4. The heat-conducting material layer 42 and the connector 41 are on the same side of the carrier board 4, and a plurality of vias 420 are provided on the heat-conducting material layer 42.

[0071] In the above technical solution, this heat-conducting material layer 42 is located on the same side of the carrier board 4 and adjacent to the connector 41, forming an effective heat conduction path.

[0072] The main function of the heat-conducting material layer 42 is to help transfer the heat generated on the carrier board 4 out in a timely and efficient manner, so as to improve the heat dissipation capacity of the carrier board 4 and reduce the impact of temperature changes on the final imaging.

[0073] The heat-conducting material layer 42 is usually selected as a material layer with a high thermal conductivity, such as a metal matrix composite material layer, a heat-conducting silica gel layer, a metal layer, etc. These material layers can quickly conduct the heat from the carrier board 4 to the surrounding environment or the heat dissipation device. Optionally, the heat-conducting material layer 42 is a copper layer.

[0074] By providing a plurality of vias 420 on the heat-conducting material layer 42, the contact area with air can be increased, thereby enhancing the heat dissipation performance.

[0075] As Figure 4 shown, in the Z direction and in the direction towards the connector 41, the arrangement density of the vias 420 gradually increases.

[0076] When the optoelectronic conversion component 30 is working, it will generate a certain amount of heat. The area near the analog-digital chip 31, that is, the area near the connector 41, is the main source of heat generation. In order to effectively conduct this heat out and prevent heat accumulation from causing overheating of the components, not only are the vias 420 provided on the heat-conducting material layer 42, but also the arrangement density of the vias 420 gradually increases with the heat distribution. This is because a denser arrangement of vias 420 means more heat conduction paths, which can more quickly conduct the heat from the carrier board 4 to the surrounding environment or the heat dissipation device, and thus can significantly improve the heat dissipation efficiency.

[0077] Optionally, in the X direction, a plurality of vias 420 are arranged in an array. The array arrangement is a rectangular array or a circular array.

[0078] Combined Figure 4 , the vias 420 are arranged in the form of a rectangular array. In the direction towards the connector 41, the distance between adjacent two columns of vias 420 gradually decreases. This helps to conduct the heat out.

[0079] Alternatively, the vias 420 are arranged in the form of a circular array. The circular array is centered approximately on the connector 41, and as the distance from the center decreases, the density of the vias 420 in the circular array gradually increases. Thus, effective heat dissipation is achieved.

[0080] In some embodiments, the optoelectronic conversion unit 3 includes an analog-digital chip 31 and a photodiode 32 arranged along the Z direction.

[0081] As Figure 2As shown, the modulus chip 31 and the photodiode 32 form a planar structure. In combination with Figure 5 , the size of the photoelectric conversion unit 3 along the Y direction is set as the thickness T, satisfying 0.08 mm ≤ thickness T ≤ 0.60 mm. For example, the thickness T is 0.08 mm, 0.1 mm, 0.3 mm, 0.55 mm, 0.60 mm, etc. Controlling the thickness T within a certain range can help the effective propagation and conversion of light inside it, thereby improving the photoelectric conversion efficiency.

[0082] In some embodiments, as Figure 1 , Figure 5 shown, the detector sub-module 103 further includes a scintillator array 2. The scintillator array 2 is located on the side of the photoelectric conversion unit 3 away from the carrier board 4, and the scintillator array 2 is mounted above the photodiode 32 in the photoelectric conversion unit 3.

[0083] The main function of the scintillator array 2 is to absorb the rays passing through the scanning object 500 and convert them into optical signals. Subsequently, these optical signals propagate along the Y direction and enter the photodiode 32 closely adjacent to the scintillator array 2. The photodiode 32 can receive these optical signals and convert them into electrical signals, thereby realizing the detection and imaging of rays.

[0084] Optionally, the scintillator array 2 is arranged along the X direction and the Z direction. Through this arrangement, the scintillator array 2 can cover the detection area of the photodiode 32 without changing the direction or passing through an additional medium. This direct photoelectric conversion path reduces the loss and scattering of optical signals, helping to improve the resolution and clarity of imaging.

[0085] In some embodiments, as Figure 1 , Figure 5 shown, the corners of the carrier board 4 adjacent to the photoelectric conversion unit 3 are the upper board corners 403, and the corners of the carrier board 4 away from the photoelectric conversion unit 3 are the lower board corners 404. The upper board corners 403 and the lower board corners 404 are on the same side of the carrier board 4 in the Z direction.

[0086] The upper board corners 403 are used to connect with the adjacent detector sub-module 103 along the Z direction. An avoidance groove 4041 is formed on the lower board corners 404 for avoiding the adjacent detector sub-module 103.

[0087] In combination with Figure 6, two adjacent detector sub - modules 103 are respectively: the first sub - module 1031 and the second sub - module 1032. In the Y - direction, at least a part of the carrier board 4 of the first sub - module 1031 overlaps with a part of the carrier board 4 of the second sub - module 1032, so that the upper corner 403 of the carrier board 4 of the first sub - module 1031 abuts against the second sub - module 1032. At this time, the lower corner 404 on the carrier board 4 of the first sub - module 1031 just faces a corner of the light conversion unit of the second sub - module 1032. By setting the avoidance groove 4041, contact or interference between the first sub - module 1031 and a corner of the light conversion unit of the second sub - module 1032 is avoided. The advantage of such a setting is that it not only allows the two detector sub - modules 103 to be closely spliced in a limited space, while maintaining their respective functions unaffected, but also can maintain sufficient structural strength and stability.

[0088] In some embodiments, as Figures 6 - 7 shown, the detector sub - module 103 further includes an anti - scattering grating 1. The anti - scattering grating 1 is arranged on the side of the photoelectric conversion unit 3 away from the carrier board 4. When adjacent detector sub - modules 103 are spliced along the Z - direction, the upper corner 403 of the carrier board of one detector sub - module 103 is tightly connected to the anti - scattering grating 1 of the other detector sub - module 103.

[0089] The anti - scattering grating 1 can absorb and filter the rays scattered and refracted and overflowed from the detector 100, so as to reduce the influence of scattered rays on the imaging quality and improve the accuracy of the detector 100.

[0090] Combined with Figures 6 - 7 , the upper corner 403 of the first sub - module 1031 is tightly connected to the anti - scattering grating 1 of the second sub - module 1032 to ensure that the detector module 101 has sufficient structural strength.

[0091] As Figure 8 shown, the detector module 101 according to the second - aspect embodiment of the present invention includes: a module bracket 102, a control circuit board, and a detector sub - module 103. The control circuit board is arranged on the module bracket 102. The detector sub - module 103 is the detector sub - module 103 of the first - aspect embodiment of the present invention.

[0092] The module bracket 102 is used to support each component, and provides good heat dissipation and installation positioning to ensure the stability of the detector sub - module 103.

[0093] A plurality of detector sub - modules 103 are installed on the module bracket 102 and are arranged in sequence along the Z - direction. Each detector sub - module 103 is provided with a wiring cable 5 on at least one side of the two sides along the X - direction. Each detector sub - module 103 is connected to the control circuit board through the corresponding wiring cable 5.

[0094] As Figure 7As shown, among at least two adjacent detector sub - modules 103 along the Z - direction, the corner 403 of the carrier board 4 of one is tightly connected to the anti - scattering grating 1 on the photoelectric conversion unit 3 of the other.

[0095] Optionally, the control circuit board is connected to multiple detector sub - modules 103. The detector module 101 further includes an FPGA (Field Programmable Gate Array) chip. The FPGA chip is arranged on the control circuit board.

[0096] After the signals of multiple detector sub - modules 103 are further processed, they are transmitted to the image reconstruction system in the detector 100, improving the signal quality, reducing the loss and interference during signal transmission, and enhancing the reliability.

[0097] In some embodiments, as Figures 9 - 11 shown, the connecting wires 5 of at least two detector sub - modules 103 are symmetrically arranged.

[0098] When multiple detector sub - modules 103 need to be spliced with each other to expand the coverage range, the data transmission between them is usually connected to a common control circuit board through the connecting wires 5.

[0099] Specifically, as Figure 9 shown, the outgoing directions of these connecting wires 5 are all set on the same side of the control circuit board, which simplifies the connection between components and is also convenient for maintenance and replacement.

[0100] In addition, since the connector 41 of each detector sub - module 103 extends along the X - direction, the connecting wires 5 between adjacent modules are designed in a symmetric form. As Figure 10 shown, when two adjacent detector sub - modules 103 are placed side by side, their connecting wires 5 form certain depressions or bends on the side facing each other, and these depressions or bends enable the connecting wires 5 to avoid each other structurally, thus preventing damage or performance degradation caused by mutual interference or extrusion.

[0101] By mass - producing symmetric connecting wires 5, the cost can be effectively controlled. This symmetric - structured connecting wire 5 allows the manufacturer to adopt standardized production processes and materials during production, improving production efficiency.

[0102] According to the detector module 101 of the second - aspect embodiment of the present utility model, by setting the detector sub - module 103 as in the first - aspect embodiment of the present application, the image accuracy of the detector module 101 can be improved.

[0103] As Figure 12As shown, the detector 100 according to the third aspect embodiment of the present utility model includes: a housing and a plurality of detector modules 101 such as those in the second aspect embodiment of the present utility model. The plurality of detector modules 101 are arranged side by side in the X direction on the housing.

[0104] The detector 100 according to the embodiment of the present utility model can not only cover a wider area and capture more image information in one scan. At the same time, it reduces the installation difficulty of the detector 100 and improves the imaging quality of the detector 100.

[0105] As Figure 13 As shown, the medical imaging device 1000 according to the fourth aspect embodiment of the present utility model includes: a gantry 200, a radiation source 300, and a detector 100 as in the third aspect of the present utility model. The gantry 200 is used to receive a scanning object 500. The radiation source 300 and the detector 100 are respectively provided on the gantry 200. The radiation source 300 is used to emit rays to the scanning object 500, and the detector 100 is used to receive the rays attenuated by the scanning object 500.

[0106] The gantry 200 is used to receive a scanning object 500. The radiation source 300 and the detector 100 are respectively provided on the gantry 200. The radiation source 300 is used to emit rays to the scanning object 500, and the detector 100 is used to receive the rays attenuated by the scanning object 500. When the gantry 200 rotates around the Z axis, both the radiation source 300 and the detector 100 rotate synchronously with the gantry 200 and always remain in a radially opposite position, so that the detector 100 can receive the rays emitted by the radiation source 300 and passing through the scanning object 500, such as X-rays. Thus, due to the improvement in the image processing ability of the detector 100, it is beneficial to improve the imaging effect of the medical imaging device 1000.

[0107] The structure of the gantry 200 is not limited. For example, the gantry 200 forms a scanning cavity 201 for receiving the scanning object 500, and the radiation source 300 and the detector 100 are respectively provided on both radial sides of the scanning cavity 201, etc.

[0108] Exemplarily, in addition to the above components, the medical imaging device 1000 may further include a scanning bed 400 for carrying the scanning object 500. Of course, the present utility model is not limited thereto. For example, when the Z direction is vertical, the scanning bed 400 may not be required, and the patient can stand vertically. The gantry 200 moves up and down while rotating around the Z axis to scan the patient, which will not be elaborated here.

[0109] Next, with reference to the attached Figures 1 - 6 , the detector sub-module 103 according to a specific embodiment of the present application will be described.

[0110] With reference to Figure 1, the detector sub-module 103 includes an anti-scatter grating 1, a scintillator array 2, a photoelectric conversion unit 3, and a carrier board 4 arranged in sequence along the Y direction.

[0111] Referring to Figure 2 , in the Y direction, the projection of the photoelectric conversion unit 3 on the carrier board 4 is completely located within the carrier board 4, and the projection edge of the photoelectric conversion unit 3 does not coincide with the edge of the carrier board 4.

[0112] Referring to Figures 2 - 3 , the photoelectric conversion unit 3 includes: a first edge 301, two second edges 302, and an analog-to-digital chip 31 and a photodiode 32 arranged along the Z direction.

[0113] The first edge 301 is located on one side of the photoelectric conversion unit 3 in the Z direction.

[0114] The two second edges 302 are respectively connected to both ends of the first edge 301.

[0115] Referring to Figure 5 , the size of the photoelectric conversion unit 3 along the Y direction is the thickness T, satisfying 0.08 mm ≤ thickness T ≤ 0.60 mm.

[0116] The carrier board 4 includes: a first side 401 and two second sides 402. The first side 401 is located on one side of the carrier board 4 in the Z direction. The two second sides 402 are respectively connected to both ends of the first side 401.

[0117] Referring to Figure 3 , the distance between the Y-direction projection of the first edge 301 on the carrier board 4 and the first side 401 is W1, satisfying W1 ≤ 0.1 mm.

[0118] The distance between the Y-direction projection of each second edge 302 on the carrier board 4 and the corresponding second side 402 is W2, satisfying W2 ≤ 0.1 mm.

[0119] Referring to Figure 1 , the detector sub-module 103 further includes a flexible cable 5.

[0120] The carrier board 4 includes a connector 41, a copper layer, a corner 403 on the board, and a corner 404 on the board.

[0121] The connector 41 is located on the side of the carrier board 4 away from the photoelectric conversion unit 3.

[0122] One end of the flexible cable 5 is connected to the carrier board 4 through the connector 41, and the flexible cable 5 is an FPC cable.

[0123] Referring to Figure 4, the carrier board 4 is provided with a copper layer, and the copper layer and the connector 41 are on the same side of the carrier board 4. A plurality of vias 420 are provided on the copper layer. In the Z direction and in the direction towards the connector 41, the arrangement density of the vias 420 gradually increases.

[0124] Referring to Figure 5 , on the same side in the Z direction, the corner of the carrier board 4 adjacent to the photoelectric conversion unit 3 is the upper board corner 403, and the corner of the carrier board 4 far from the photoelectric conversion unit 3 is the lower board corner 404. The upper board corner 403 is used to connect with the adjacent detector sub-module 103 along the Z direction. An avoidance groove 4041 is formed on the lower board corner 404 for avoiding the adjacent detector sub-module 103.

[0125] Referring to Figure 6 , the anti-scattering grating 1 is disposed on the side of the photoelectric conversion unit 3 away from the carrier board 4. When the adjacent detector sub-modules 103 are spliced along the Z direction, the upper board corner 403 of one detector sub-module 103 is tightly connected to the anti-scattering grating 1 of the other detector sub-module 103.

[0126] Other components of the detector sub-module 103 according to the embodiments of the present invention, such as the detector module 101, the detector 100, and the medical imaging device 1000, etc., are known to those of ordinary skill in the art and will not be described in detail here.

[0127] In the description of this specification, the descriptions referring to the terms "embodiment", "example", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0128] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A detector sub-module, characterized in that, Comprising: A photoelectric conversion unit; A carrier board, which is stacked on one side of the photoelectric conversion unit along the Y direction; Wherein, along the Y direction, the projection of the photoelectric conversion unit on the carrier board is completely located within the carrier board, and the projection edge of the photoelectric conversion unit does not coincide with the edge of the carrier board.

2. The detector sub-module according to claim 1, wherein The photoelectric conversion unit includes: A first edge, located on one side of the photoelectric conversion unit in the Z direction, where the Z direction is the arrangement direction when there are multiple detector sub-modules and they form a detector module; Two second edges, which respectively connect the two ends of the first edge; The carrier board includes: A first side edge, which is located on one side of the carrier board in the Z direction; Two second side edges, which respectively connect the two ends of the first side edge; The distance between the Y-direction projection of the first edge on the carrier board and the first side edge is W1, satisfying W1≤0.1mm; The distance between the Y-direction projection of each second edge on the carrier board and the corresponding second side edge is W2, satisfying W2≤0.1mm.

3. The detector sub-module according to claim 1, wherein Further comprising: A flexible cable, one end of which is connected to the carrier board through a connector, and the connector is located on the side of the carrier board away from the photoelectric conversion unit; Wherein, the flexible cable is an FPC cable and the carrier board is a PCB board.

4. The detector sub-module according to claim 3, wherein A heat-conducting material layer is provided on the carrier board, the heat-conducting material layer and the connector are on the same side of the carrier board, and a plurality of vias are provided on the heat-conducting material layer; In the Z direction and in the direction towards the connector, the arrangement density of the vias gradually increases; where the Z direction is the arrangement direction when there are multiple detector sub-modules and they form a detector module.

5. The detector sub-module according to claim 1, characterized in that, The photoelectric conversion unit includes a modular chip and a photodiode arranged along the Z direction, and the size of the photoelectric conversion unit along the Y direction is the thickness T, satisfying 0.08mm≤thickness T≤0.60mm; where the Z direction is the arrangement direction when there are multiple detector sub-modules and they form a detector module.

6. The detector sub-module according to claim 1, characterized in that, The corner of the carrier board adjacent to the photoelectric conversion unit is the upper corner of the board, and the corner of the carrier board away from the photoelectric conversion unit is the lower corner of the board. The upper corner of the board and the lower corner of the board are on the same side of the carrier board in the Z direction. Wherein, the Z direction is the arrangement direction when there are multiple detector sub-modules and they form a detector module; The upper corner of the board is used to connect to an adjacent detector sub-module along the Z direction; An avoidance groove is formed on the lower corner of the board for avoiding an adjacent detector sub-module.

7. The detector sub-module according to claim 5, wherein The detector sub-module further includes an anti-scattering grating, and the anti-scattering grating is arranged on the side of the photoelectric conversion unit away from the carrier board; When adjacent detector sub-modules are spliced along the Z direction, the upper corner of the board of one detector sub-module is tightly connected to the anti-scattering grating of the other detector sub-module.

8. A detector module, characterized in that, Comprising: A module bracket; A control circuit board, which is arranged on the module bracket; A plurality of detector sub-modules according to any one of claims 1-7, the plurality of detector sub-modules are mounted on the module bracket and arranged in sequence along the Z direction, at least one side of each of the two sides of each detector sub-module in the X direction is provided with a wiring line, and each detector sub-module is connected to the control circuit board through the corresponding wiring line; Wherein the Z direction is the arrangement direction along which the detector sub-modules are arranged when there are a plurality of detector sub-modules to form a detector module.

9. The detector module according to claim 8, characterized in that, The wiring lines of at least two of the detector sub-modules are symmetrically arranged.

10. A detector, characterized in that, Comprising: A housing; A plurality of detector modules according to any one of claims 8-9, the plurality of detector modules are arranged in parallel along the X direction on the housing.

11. A medical imaging device, characterized in that, Comprising a scanning frame, a radiation source and a detector according to claim 10; The scanning frame is used to receive a scanning object, the radiation source and the detector are respectively arranged on the scanning frame, the radiation source is used to emit rays to the scanning object, and the detector is used to receive the rays attenuated by the scanning object.

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