Position detection device of bonding head mechanism of wire bonding machine
By strategically placing the light grid and position sensor within the X-Y axis components, the stability and welding quality of welding machines are improved, addressing uneven weight distribution and signal interference issues.
Patent Information
- Application Number
- CN202422162681.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-03
AI Technical Summary
During the high-speed movement of the TABLE motion module of the existing wire bonding machine, there are stability problems caused by uneven weight distribution of X-axis and Y-axis and improper installation position of the grating scale and grating position sensor, which affects the welding effect and product yield.
The grating scale is installed on the Y-direction moving body, and the grating position sensor is installed on the X-direction moving plate. Through the cooperation of the Y-direction moving body and the X-direction moving plate, it is ensured that the grating scale and grating position sensor are completely blocked, improving the weight distribution and displacement problems.
It improves the stability of the wire bonding machine during high-speed movement, improves welding effect, improves product yield, and reduces the impact of dust and foreign matter on signal transmission, extends service life and reduces maintenance costs.
Smart Images

Figure CN223098339U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of welding equipment, in particular to a position detection device for a wire bonding head mechanism of a wire bonder. Background Art
[0002] The TABLE motion module of a wire bonder is one of the main driving devices of the machine table, which determines the positions of the wire bonder on the X-axis and Y-axis during the working process. The motion process of the wire bonder is as follows: the TABLE motion module moves the wire bonding head mechanism to the position corresponding to the chip through software according to the signal feedback of the grating position sensor, and then the wire bonding head mechanism moves on the Z-axis for welding.
[0003] Commonly used position detection components in the market are generally installed on the right side of the TABLE motion module. Among them, the grating scale is installed on the right side of the Y-direction moving body, and the grating position sensor is installed on the right side of the X-direction moving plate. Motion control on the Y-axis is carried out through the signal feedback between the grating scale and the grating position sensor.
[0004] However, with the development of technology, the operating speed of the wire bonder machine table is getting faster and faster, and the stability of the TABLE motion module needs to be improved. The existing TABLE module has the following defects:
[0005] (1) The grating scale is installed on the right side of the Y-direction moving body, resulting in inconsistent left and right weights of the Y-direction moving body;
[0006] (2) The grating position sensor is installed on the right side of the X-direction moving plate, resulting in uneven left and right weight distribution of the X-direction moving plate;
[0007] (3) During the high-speed movement of the machine table, due to the coupling effect between the X-axis and the Y-axis, the center of gravity will not be in the same position, resulting in a slight displacement of the grating scale due to the change of centrifugal force, thus causing abnormal signal transmission.
[0008] Due to the above-mentioned existing defects, during the high-speed movement of the machine table, it will cause interference and uncertainty to the overall stability, resulting in poor welding effect and low product yield. Summary of the Utility Model
[0009] The utility model provides a position detection device for a wire bonding head mechanism of a wire bonder, which can effectively improve the stability of the machine table during high-speed movement, thereby improving the welding effect and increasing the product yield.
[0010] The technical solution adopted by the present utility model is as follows: A position detection device for the bonding head mechanism of a wire bonder, which comprises: an X-direction moving plate, a Y-direction moving body, a grating scale, and a grating position sensor; the grating scale is installed on the Y-direction moving body, the grating position sensor is installed on the X-direction moving plate, the Y-direction moving body and the X-direction moving plate are installed in cooperation with each other, and the grating position sensor is directly opposite to the grating scale; both the grating scale and the grating position sensor are clamped between the Y-direction moving body and the X-direction moving plate, and both the grating scale and the grating position sensor are completely blocked by the Y-direction moving body and the X-direction moving plate.
[0011] Further, the Y-direction moving body is provided with a first mounting surface, and four parallel Y-axis guide rails are arranged along the Y direction on the first mounting surface; two Y-axis guide rails are in a group, divided into two groups, and are respectively arranged on both side edges of the first mounting surface.
[0012] Further, a groove is arranged along the Y direction at the middle position of the first mounting surface; the grating scale is installed in the groove, and the grating scale is located between the two groups of Y-axis guide rails.
[0013] Further, the X-direction moving plate is provided with a second mounting surface, an installation hole is arranged at the middle position of the second mounting surface, and the grating position sensor is installed in the installation hole.
[0014] Further, the first mounting surface and the second mounting surface are installed in cooperation with each other.
[0015] Compared with the prior art, the position detection device for the bonding head mechanism of the wire bonder of the present utility model effectively improves the problem of uneven weight distribution of the X-axis and Y-axis of the TABLE movement module by arranging the grating scale between the Y-direction moving body and the X-direction moving plate and completely blocking it by the Y-direction moving body and the X-direction moving plate; at the same time, it improves the problem of slight displacement of the grating scale and the grating position sensor due to the coupling effect between the X-axis and Y-axis during the high-speed movement process, effectively improves the stability of the machine during the high-speed movement process, improves the welding effect, and improves the product yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification, and are used together with the following specific embodiments to explain the present utility model, but should not limit the present utility model. In the drawings,
[0017] Figure 1 : The three-dimensional combined view of the position detection device for the bonding head mechanism of the wire bonder of the present utility model;
[0018] Figure 2 : The three-dimensional view of a partial structure of the position detection device for the bonding head mechanism of the wire bonder of the present utility model;
[0019] Figure 3: Another perspective view of the structure of the position detection device for the bonding head mechanism of the wire bonding machine of the present utility model. Detailed Embodiments
[0020] The following provides a detailed description of the specific embodiments of the present utility model in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only for the purpose of illustrating and explaining the present utility model, and are not intended to limit the present utility model.
[0021] As Figures 1 to 3 shown, the position detection device for the bonding head mechanism of the wire bonding machine of the present utility model includes an X-direction moving plate 1, a Y-direction moving body 2, a grating scale 3, and a grating position sensor 4; wherein, the grating scale 3 is installed on the Y-direction moving body 2, the grating position sensor 4 is installed on the X-direction moving plate 1, the Y-direction moving body 2 and the X-direction moving plate 1 are installed in cooperation with each other, and the grating scale 3 and the grating position sensor 4 are clamped between the Y-direction moving body 2 and the X-direction moving plate 1.
[0022] The Y-direction moving body 2 is provided with a first mounting surface 201, and four parallel Y-axis guide rails 5 are provided along the Y direction on the first mounting surface 201; wherein, two Y-axis guide rails 5 are a group, divided into two groups, and are respectively arranged on the two side edges of the first mounting surface 201. A groove is provided along the Y direction at the middle position of the first mounting surface 201; the grating scale 3 is installed in the groove, and the grating scale 3 is located between the two groups of Y-axis guide rails 5.
[0023] The X-direction moving plate 1 is provided with a second mounting surface 101, an installation hole 102 is provided at the middle position of the second mounting surface 101, the grating position sensor 4 is installed in the installation hole 102, the first mounting surface 201 and the second mounting surface 101 are installed in cooperation with each other, and the grating position sensor 4 is directly opposite to the grating scale 3; and the grating scale 3 and the grating position sensor 4 are clamped between the Y-direction moving body 2 and the X-direction moving plate 1. When the Y-direction moving body 2 slides along the two groups of Y-axis guide rails 5, it drives the grating scale 3 to move in the Y-axis direction, and the grating position sensor 4 reads the information of the grating scale 3, so as to obtain the position information of the bonding head mechanism.
[0024] In summary, the position detection device for the bonding head mechanism of the wire bonding machine of the present utility model has the following advantages:
[0025] 1. By setting the grating scale 3 in the middle of the Y-direction moving body 2 and the grating position sensor 4 in the middle of the X-direction moving plate 1, the problem of uneven weight distribution of the X-axis and Y-axis of the TABLE motion module is effectively improved. At the same time, the problem of slight displacement of the grating scale 3 and the grating position sensor 4 due to the coupling effect between X and Y during high-speed movement is improved. In the present utility model, since the grating scale 3 and the grating position sensor 4 are placed in the middle, the change in the center of gravity position will not affect the grating scale 3 and the grating position sensor 4, so there will be no displacement; the stability of the machine during high-speed movement is effectively improved, the welding effect is improved, and the product yield is increased.
[0026] 2. By setting the grating scale 3 in the middle of the Y-direction moving body 2 and the grating position sensor 4 in the middle of the X-direction moving plate 1, the grating scale 3 and the grating position sensor 4 are completely blocked by the Y-direction moving body 2 and the X-direction moving plate 1, effectively preventing the problem of abnormal signal transmission caused by dust and foreign objects soiling their surfaces, increasing the service life, being not easily worn, and having low maintenance costs.
[0027] As long as it does not violate the idea of the present utility model, any combination of various different embodiments of the present utility model shall be regarded as the content disclosed in the present utility model; within the scope of the technical concept of the present utility model, various simple modifications of the technical solution and any combination of different embodiments that do not violate the idea of the present utility model shall be within the protection scope of the present utility model.
Claims
1. A position detection device for a wire bonding head mechanism of a wire bonder, characterized in that Including: An X-direction moving plate (1), a Y-direction moving body (2), a grating scale (3), and a grating position sensor (4); the grating scale (3) is installed on the Y-direction moving body (2), the grating position sensor (4) is installed on the X-direction moving plate (1), the Y-direction moving body (2) and the X-direction moving plate (1) are installed in cooperation with each other, and the grating position sensor (4) faces the grating scale (3) directly; both the grating scale (3) and the grating position sensor (4) are clamped between the Y-direction moving body (2) and the X-direction moving plate (1), and both the grating scale (3) and the grating position sensor (4) are completely blocked by the Y-direction moving body (2) and the X-direction moving plate (1).
2. The position detection device of the wire bonding head mechanism according to claim 1, characterized in that: The Y-direction moving body (2) is provided with a first mounting surface (201), and four parallel Y-axis guide rails (5) are arranged along the Y direction on the first mounting surface (201); two Y-axis guide rails (5) form a group, and are divided into two groups, which are respectively arranged on both side edges of the first mounting surface (201).
3. The position detection device of the wire bonding head mechanism according to claim 2, characterized in that: A groove is arranged along the Y direction at the middle position of the first mounting surface (201); the grating scale (3) is installed in the groove, and the grating scale (3) is located between the two groups of Y-axis guide rails (5).
4. The position detection device of the wire bonding head mechanism according to claim 3, characterized in that: The X-direction moving plate (1) is provided with a second mounting surface (101), and a mounting hole (102) is arranged at the middle position of the second mounting surface (101), and the grating position sensor (4) is installed in the mounting hole (102).
5. The position detection device of the wire bonding head mechanism according to claim 4, characterized in that: The first mounting surface (201) and the second mounting surface (101) are installed in cooperation with each other.