Transport case
The transport box design addresses the need for improved cushioning and stability by using different material layers to absorb impacts and maintain structural integrity, effectively protecting crystal wafers during transportation.
Patent Information
- Application Number
- CN202421648779.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-07-12
AI Technical Summary
The existing transport boxes have shortcomings in buffering effect and structural stability, especially in terms of mitigating impact forces from the bottom of the box and maintaining the support of the transport boxes, it is difficult to take into account the protection of the wafer box and the stable pick-up of the robotic arm.
The transport box adopts a bottom wall and partition design. The bottom wall and partition are composed of a support layer and a buffer layer respectively. The support layer is made of Paulilong material and the buffer layer is made of foamed polyethylene material. The materials of the two are different to provide support and buffering effects.
It improves the buffering capacity of the transport box, ensures the protection of the wafer box during transportation, and maintains the structural stability of the transport box, and is suitable for the stable placement of multiple wafer boxes and the stable pick-up of the robot arms.
Smart Images
Figure CN223101383U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a transport box, in particular to a transport box for accommodating and transporting a wafer cassette. Background Art
[0002] Since a wafer is an item with high economic value and fragility, it must be handled with great care during transportation to avoid damage to the wafer caused by vibration or collision during transportation.
[0003] For wafer transportation, after the wafer is placed in a wafer cassette, the wafer cassette is then placed in a transport box, and the transport box plays a role in positioning and protecting the wafer cassette. The material of a general transport box is styrofoam. Although styrofoam helps with buffering, its protective effect for reducing the impact from the bottom of the box still needs to be enhanced. In addition, since the wafer cassette in the transport box is usually picked up by a robotic arm, the transport box must have sufficient support and not collapse downward so that the robotic arm can stably pick up the wafer cassette. Therefore, how to improve the buffering effect of the wafer cassette transport box and at the same time maintain the structural stability of the transport box has become an issue worthy of discussion. Summary of the Invention
[0004] The purpose of the utility model is to provide a transport box that can balance the buffering effect and structural stability.
[0005] The transport box of the utility model is applicable to a wafer cassette. The transport box includes a first box body. The first box body includes a bottom wall and a bottom outer wall extending upward around the periphery of the bottom wall. The bottom wall and the bottom outer wall together define a bottom chamber suitable for accommodating the wafer cassette therein. The bottom wall has a first support layer and a first buffer layer located below the first support layer. Among them, the material of the first buffer layer is an elastic material different from the material of the first support layer.
[0006] In some embodiments of the transport box of the utility model, the material of the first support layer is styrofoam, and the material of the first buffer layer is expanded polyethylene.
[0007] In some embodiments of the transport box of the utility model, the transport box is applicable to multiple wafer cassettes. The first box body further includes a first inner wall structure extending upward from the bottom wall and dividing the bottom chamber into multiple bottom grid-like spaces, and the bottom grid-like spaces are respectively suitable for accommodating the wafer cassettes therein.
[0008] In some embodiments of the transport box of the present utility model, the transport box further includes a second box body located above the first box body. Among them, the bottom chamber of the first box body is adapted to receive the bottom of the wafer cassette therein; the second box body includes a partition and a lower outer wall extending downward around the periphery of the partition. The partition and the lower outer wall jointly define a lower chamber adapted to receive the top of the wafer cassette therein. The partition has a second support layer and a second buffer layer located below the second support layer. The material of the second buffer layer is an elastic material different from the material of the second support layer.
[0009] In some embodiments of the transport box of the present utility model, the material of the second support layer is styrofoam, and the material of the second buffer layer is expanded polyethylene.
[0010] In some embodiments of the transport box of the present utility model, the transport box is adapted to at least two wafer cassettes. The bottom chamber and the lower chamber are respectively adapted to receive the bottom and the top of one of the wafer cassettes therein. The second box body further includes an upper outer wall extending upward around the periphery of the partition. The partition and the upper outer wall jointly define an upper chamber adapted to receive the bottom of another wafer cassette therein.
[0011] In some embodiments of the transport box of the present utility model, the partition of the second box body further has another second support layer, and the second buffer layer is located between the two second support layers.
[0012] In some embodiments of the transport box of the present utility model, the transport box is adapted to a plurality of wafer cassettes. The transport box includes a plurality of the second box bodies. Among them, the second box bodies are located above the first box body and arranged vertically. The lower chambers of the second box bodies are respectively adapted to receive the tops of the wafer cassettes therein. The upper chambers of the second box bodies and the bottom chambers of the first box body are respectively adapted to receive the bottoms of the wafer cassettes therein.
[0013] In some embodiments of the transport box of the present utility model, the transport box is adapted to a plurality of wafer cassettes. The first box body further includes a first inner wall structure extending upward from the bottom wall and dividing the bottom chamber into a plurality of bottom grid-like spaces. The bottom grid-like spaces and the upper chambers are respectively adapted to receive the bottoms of the wafer cassettes therein; each of the second box bodies further includes a lower inner wall structure extending downward from the partition and dividing the lower chamber into a plurality of lower grid-like spaces. The lower grid-like spaces of the lowermost second box body are respectively aligned with the bottom grid-like spaces and are respectively adapted to receive the tops of the corresponding wafer cassettes therein.
[0014] In some embodiments of the transport box of the present invention, each of the second boxes also includes an upper inner wall structure extending upward from the partition and dividing the upper chamber into a plurality of upper grid spaces. In two adjacent second boxes, the upper grid spaces of the second box located below and the lower grid spaces of the second box located above are respectively aligned with each other, and the upper grid spaces of the second box and the bottom grid spaces of the first box are respectively suitable for accommodating the bottom of the wafer box.
[0015] In some embodiments of the transport box of the present invention, a thickness ratio of the first buffer layer of the bottom wall to the bottom wall is between 15% and 80%.
[0016] In some embodiments of the transport box of the present invention, a thickness ratio of the second buffer layer of the partition relative to the partition is between 15% and 80%.
[0017] The beneficial effect of the utility model is that: by virtue of the bottom wall of the first box having the first buffer layer body disposed below the first support layer body, and the first buffer layer body being made of an elastic material different from the first support layer body, the impact force from the bottom of the first box body can be absorbed by the first buffer layer body, and the first support layer body provides the first buffer layer body with support force, thereby achieving the effect of taking into account both buffering and structural stability, thereby improving the protectiveness of the first box body to the wafer box contained therein. Furthermore, by the provision of the second box body, the transport box of the utility model can carry and protect more of the wafer boxes, and the partitions of each of the second boxes have the second support layer body, and the material of the second buffer layer body is an elastic material different from the material of the second support layer body, so the second buffer layer body can absorb the impact force, thereby improving the protectiveness of the second box body to the wafer box contained therein. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:
[0019] Figure 1 is a three-dimensional diagram illustrating an embodiment of the transport box of the utility model used to position a plurality of wafer boxes;
[0020] Figure 2 is a three-dimensional exploded view of the embodiment;
[0021] Figure 3 is a three-dimensional exploded view of the embodiment from an oblique downward perspective;
[0022] Figure 4 is a side cross-sectional view of the embodiment;
[0023] Figure 5 It is a side view cross-sectional view showing the implementation of a second box body in another implementation aspect of this embodiment. Specific implementation
[0024] Refer to Figure 1 、 Figure 2 and Figure 3 , which is an embodiment of the transport box of the present utility model. This transport box is suitable for positioning a plurality of wafer boxes 9. This transport box includes a first box body 1, a second box body 2, and an upper cover 3.
[0025] The first box body 1 includes a bottom wall 11, a bottom outer wall 12 extending upwardly around the periphery of the bottom wall 11, and a first inner wall structure 13 extending upwardly from the bottom wall 11. The bottom wall 11 and the bottom outer wall 12 together define a bottom chamber 14 suitable for receiving the bottom of the wafer box 9 therein, and the first inner wall structure 13 divides the bottom chamber 14 into a plurality of bottom grid spaces 141 respectively suitable for receiving several (six examples here) of the wafer boxes 9 therein. Specifically, the bottom grid spaces 141 are respectively suitable for receiving the bottom of the corresponding wafer box 9 therein.
[0026] Refer to Figure 4 , the bottom wall 11 has a first support layer 111 and a first buffer layer 112 located below the first support layer 111. Among them, the material of the first buffer layer 112 is an elastic material different from the material of the first support layer 111. The first support layer 111 can provide support force for the first buffer layer 112. The first buffer layer 112 is disposed below the first support layer 111, so that the impact force from the bottom of the first box body 1 can be absorbed by the first buffer layer 112. Preferably, the material of the first support layer 111 is styrofoam, and the material of the first buffer layer 112 is expanded polyethylene. Since the material of expanded polyethylene is softer and more elastic than styrofoam, the buffer capacity of the first box body 1 can be effectively increased by providing the first buffer layer 112, especially the impact force generated at the bottom of the first box body 1 due to external collision can be slowed down.
[0027] Refer to Figure 2, in this embodiment, the bottom wall 11 of the first box body 1 is rectangular. The first inner wall structure 13 is located in the bottom layer chamber 14 and has a first partition wall portion 131 extending along the long side direction of the bottom wall 11, and two second partition wall portions 132 extending along the short side direction of the bottom wall 11 and passing through the first partition wall portion 131. The second partition wall portions 132 are arranged and spaced apart in the long side direction of the bottom wall 11. The first partition wall portion 131 and the two second partition wall portions 132 divide the bottom layer chamber 14 into six bottom layer grid-like spaces 141, but the implementation manner of the first inner wall structure 13 is not limited thereto.
[0028] Refer to Figure 1 , Figure 2 and Figure 3 , the second box body 2 is located above the first box body 1 and includes a partition plate 21, a lower outer wall 22 extending downward around the periphery of the partition plate 21, an upper outer wall 23 extending upward around the periphery of the partition plate 21, a lower inner wall structure 24 extending downward from the partition plate 21, and an upper inner wall structure 25 extending upward from the partition plate 21. The partition plate 21 and the lower outer wall 22 jointly define a lower side chamber 26. The lower inner wall structure 24 divides the lower side chamber 26 into a plurality of lower side grid-like spaces 261. The lower side grid-like spaces 261 are respectively aligned with the bottom layer grid-like spaces 141 of the first box body 1. The lower side grid-like spaces 261 cooperate with the bottom layer grid-like spaces 141 of the first box body 1 and are respectively suitable for accommodating the tops of the corresponding wafer cassettes 9 therein. The partition plate 21 and the upper outer wall 23 jointly define an upper side chamber 27. The upper inner wall structure 25 divides the upper side chamber 27 into a plurality of upper side grid-like spaces 271. The upper side grid-like spaces 271 are respectively suitable for accommodating the bottoms of other wafer cassettes 9 therein.
[0029] Refer to Figure 4 , the partition plate 21 is placed above the corresponding wafer cassette 9 and has a second support layer 211 and a second buffer layer 212 located below the second support layer 211. The material of the second buffer layer 212 is an elastic material different from the material of the second support layer 211. The second support layer 211 can provide support force for the second buffer layer 212. The second buffer layer 212 is disposed below the second support layer 211 and can absorb the impact force from the outside. Preferably, the material of the second support layer 211 is styrofoam, and the material of the second buffer layer 212 is expanded polyethylene.
[0030] Refer to Figure 2 and Figure 3, in this embodiment, the partition 21 of the second box body 2 is rectangular. The lower inner wall structure 24 is located in the lower chamber 26 and has a third partition wall portion 241 extending along the long side direction of the partition 21, and two fourth partition wall portions 242 extending along the short side direction of the partition 21 and penetrating through the third partition wall portion 241. The fourth partition wall portions 242 are arranged and spaced apart in the long side direction of the partition 21. The upper inner wall structure 25 is located in the upper chamber 27 and has a fifth partition wall portion 251 extending along the long side direction of the partition 21, and two sixth partition wall portions 252 extending along the short side direction of the partition 21 and penetrating through the fifth partition wall portion 251. The sixth partition wall portions 252 are arranged and spaced apart in the long side direction of the partition 21. The third partition wall portion 241 and the two fourth partition wall portions 242 divide the lower chamber 26 into six lower grid-like spaces 261, and the fifth partition wall portion 251 and the two sixth partition wall portions 252 divide the upper chamber 27 into six upper grid-like spaces 271. However, the implementation manners of the lower inner wall structure 24 and the upper inner wall structure 25 are not limited thereto.
[0031] The upper cover 3 includes a cover body 31 and an upper cover outer wall 32 extending downward around the periphery of the cover body 31. The upper cover 3 cooperates with the upper chamber 27 of the second box body 2 and is suitable for accommodating the top of the corresponding wafer cassette 9 therein to achieve a protection function for the top of the wafer cassette 9.
[0032] Refer to Figure 4 , preferably, the thickness ratio of the first buffer layer 112 of the bottom wall 11 to the bottom wall 11 is between 15% and 80%. In this embodiment, the thickness ratio of the first buffer layer 112 of the bottom wall 11 to the bottom wall 11 is 20%. In this way, when the first buffer layer 112 is provided to increase the buffering capacity of the first box body 1, the structural stability of the first box body 1 can still be maintained, avoiding the first box body 1 from collapsing downward, and there is no need to additionally adjust the parameters used when the robotic arm picks up and places the wafer cassette 9 accommodated therein.
[0033] The second buffer layer 212 of the second box body 2 can effectively increase the buffering capacity of the second box body 2. Preferably, the thickness ratio of the second buffer layer 212 of the partition 21 to the partition 21 is between 15% and 80%. And in this embodiment, the thickness ratio of the second buffer layer 212 of the partition 21 to the partition 21 is 20%. The reason is the same as that of the first buffer layer 112 of the first box body 1 mentioned above, so it will not be repeated here.
[0034] Refer to Figure 5, which is another embodiment of the transport box of the utility model. In this embodiment, the partition 21 of the second box body 2 also has another second support layer 211, and the second buffer layer 212 is located between the two second support layers 211. The second support layer 211 can provide support forces on the upper and lower sides of the second buffer layer 212.
[0035] In other embodiments not shown in the figures, the transport box of the utility model includes a plurality of the second boxes 2, wherein the second boxes 2 are located above the first box 1 and arranged up and down, the lower grid spaces 261 of the lower chamber 26 of the second box 2 are respectively suitable for accommodating the top of the wafer box 9, and the upper grid spaces 271 and the bottom grid spaces 141 of the upper chamber 27 of the second box 2 are respectively suitable for accommodating the bottom of the wafer box 9. In two adjacent second boxes 2, the upper grid spaces 271 of the second box 2 located at the bottom and the lower grid spaces 261 of the second box 2 located at the top are respectively aligned with each other.
[0036] It is supplemented that the outer surfaces of the bottom outer wall 12 of the first box body 1 and the upper outer wall 23 and the lower outer wall 22 of the second box body 2 are respectively provided with one or more protrusions or grooves (not shown) to strengthen the structure.
[0037] In summary, the bottom wall 11 of the first box body 1 has the first buffer layer body 112 arranged below the first support layer body 111, and the first buffer layer body 112 is made of an elastic material different from the first support layer body 111, so that the impact force from the bottom of the first box body 1 can be absorbed by the first buffer layer body 112, and the first support layer body 111 provides support force for the first buffer layer body 112, thereby achieving the effect of taking into account both buffering and structural stability, thereby enhancing the protection of the first box body 1 to the wafer box 9 accommodated therein. Furthermore, through the provision of the second box body 2, the transport box of the utility model can carry and protect more of the wafer boxes 9, and the partition 21 of each of the second box bodies 2 has the second support layer body 211, and the material of the second buffer layer body 212 is an elastic material different from the material of the second support layer body 211, so the second buffer layer body 212 can absorb the impact force, thereby enhancing the protection of the second box body 2 to the wafer box 9 accommodated therein, so that the purpose of the utility model can indeed be achieved.
[0038] The above description is only an embodiment of the present invention, and should not be used to limit the scope of the present invention. That is, any simple equivalent changes and modifications made according to the claims and the description of the present invention still fall within the scope of the present invention.
Claims
1. A transport box, applicable to a wafer cassette, characterized in that: The transport box includes: A first box body, including a bottom wall and a bottom outer wall extending upwardly around the periphery of the bottom wall. The bottom wall and the bottom outer wall jointly define a bottom chamber adapted to receive the wafer cassette therein. The bottom wall has a first support layer and a first buffer layer located below the first support layer. Among them, the material of the first buffer layer is an elastic material different from the material of the first support layer.
2. The transport box according to claim 1, characterized in that: The material of the first support layer is styrofoam, and the material of the first buffer layer is polyethylene foam.
3. The transport box according to claim 1, characterized in that: Suitable for a plurality of wafer cassettes, the first box body further includes a first inner wall structure extending upwardly from the bottom wall and dividing the bottom chamber into a plurality of bottom grid-like spaces, and each of the bottom grid-like spaces is adapted to receive the wafer cassette therein.
4. The transport box according to claim 1, characterized in that: The transport box further includes a second box body located above the first box body. Among them, the bottom chamber of the first box body is adapted to receive the bottom of the wafer cassette therein; the second box body includes a partition and a lower outer wall extending downwardly around the periphery of the partition. The partition and the lower outer wall jointly define a lower chamber adapted to receive the top of the wafer cassette therein. The partition has a second support layer and a second buffer layer located below the second support layer, and the material of the second buffer layer is an elastic material different from the material of the second support layer.
5. The transport box according to claim 4, characterized in that: The material of the second support layer is styrofoam, and the material of the second buffer layer is polyethylene foam.
6. The transport box according to claim 4, wherein: Suitable for at least two wafer cassettes, the bottom chamber and the lower chamber are respectively adapted to receive the bottom and the top of one of the wafer cassettes therein. The second box body further includes an upper outer wall extending upwardly around the periphery of the partition. The partition and the upper outer wall jointly define an upper chamber, and the upper chamber is adapted to receive the bottom of another wafer cassette therein.
7. The transport box according to any one of claims 4 to 6, characterized in that: The partition of the second box body further has another second support layer, and the second buffer layer is located between the two second support layers.
8. The transport box according to claim 6, characterized in that: Suitable for a plurality of wafer cassettes, the transport box includes several second box bodies. Among them, the second box bodies are located above the first box body and arranged vertically. The lower chambers of the second box bodies are respectively adapted to receive the tops of the wafer cassettes therein, and the upper chambers of the second box bodies and the bottom chambers of the first box body are respectively adapted to receive the bottoms of the wafer cassettes therein.
9. The shipping case according to claim 8, wherein: Suitable for a plurality of wafer cassettes, the first box body further includes a first inner wall structure extending upwardly from the bottom wall and dividing the bottom chamber into a plurality of bottom grid-like spaces, and the bottom grid-like spaces and the upper chamber are respectively adapted to receive the bottoms of the wafer cassettes therein; Each of the second box bodies further includes a lower inner wall structure extending downwardly from the partition and dividing the lower chamber into a plurality of lower grid-like spaces. The lower grid-like spaces of the lowermost second box body are respectively aligned with the bottom grid-like spaces and are respectively adapted to receive the tops of the corresponding wafer cassettes therein.
10. The shipping container according to claim 9, wherein: Each of the second boxes further includes an upper inner wall structure extending upward from the partition and dividing the upper chamber into a plurality of upper lattice spaces. In two adjacent second boxes, the upper lattice space of the lower second box and the lower lattice space of the upper second box are respectively aligned with each other. The upper lattice space of the second box and the bottom lattice space of the first box are respectively adapted to accommodate the bottom of the wafer cassette therein.
11. The transport box according to claim 1, 2 or 3, characterized in that: The thickness ratio of the first buffer layer of the bottom wall to the bottom wall is between 15% and 80%.
12. The transport box according to claim 4, 5 or 6, characterized in that: The thickness ratio of the second buffer layer of the partition to the partition is between 15% and 80%.