Film-coated copper bar

Abstract

The utility model provides a film-coated copper bar which comprises a copper bar body, the surface of the copper bar body is plated with a nickel layer, the outer surface of the nickel layer is wrapped with an insulating film, and the hardness of the nickel layer ranges from HV300 to HV500. The hardness of the nickel layer ranges from HV300 to HV500, and the range not only ensures enough mechanical strength, but also gives consideration to the toughness of the material. The harder nickel layer can provide good support, so that the copper bar is prevented from being excessively deformed when being bent; and the proper toughness is beneficial to dispersing and absorbing stress generated in the processing process, so that the risk that the insulating film is broken due to stress concentration is reduced. In the bending process, different parts of the copper bar are subjected to stress effects of different degrees. The optimized nickel layer can disperse the stress more effectively, and a high-stress area is prevented from being formed at the junction of the insulating film and the copper bar or in the insulating film, so that the possibility of fracture is reduced.

Description

Technical Field

[0001] This application relates to the field of copper bars for new energy vehicles, and particularly to a copper bar with a film coating. Background Art

[0002] In the process of coating a film on a copper bar in the prior art, a series of specific technological steps are usually followed to ensure that while the copper bar has good electrical conductivity, it can also achieve insulation protection through the film coating. This process can generally be divided into the following key steps:

[0003] Pretreatment: First, the copper bar is cleaned and processed to remove dirt, grease, and other impurities on the surface, ensuring that the surface of the copper bar is clean and flat, providing a good foundation for subsequent processing steps.

[0004] Nickel plating layer: Next, a layer of nickel is plated on the surface of the cleaned copper bar. The purpose of this step is to utilize the high hardness and good corrosion resistance of the nickel layer to enhance the mechanical strength and durability of the copper bar, and at the same time, as an intermediate layer, improve the bonding force between the copper bar and the subsequent insulating film.

[0005] Film coating treatment: After the nickel plating is completed, the copper bar enters the film coating link. In this step, an insulating film is wrapped around the surface of the copper bar. The insulating film is usually made of materials with excellent electrical insulation performance and mechanical strength, such as polyimide, polyester, etc., aiming to protect the copper bar from the influence of the external environment and prevent the risks of short circuit and electric shock.

[0006] Bending processing: Finally, according to specific application requirements, the copper bar with the film coating is bent so that it can be installed into a specific electrical device or system. However, due to the relatively high hardness of the previously plated nickel layer, this characteristic may cause excessive stress on the insulating film during the bending process, thereby causing the insulating film to rupture, affecting the insulation effect and use safety.

[0007] In summary, although the prior art enhances the physical properties of the copper bar through nickel plating in the copper bar film coating process, it faces the challenge of easy rupture of the insulating film in the bending processing link, which becomes a problem that needs to be considered emphatically when further optimizing this process. Utility Model Content

[0008] The purpose of this application is to provide a copper bar with a film coating that can more effectively disperse and absorb stress during processing such as bending, reducing the risk of rupture of the insulating film due to stress concentration by optimizing the hardness range of the nickel layer.

[0009] To achieve the above purpose, this application provides the following technical solutions:

[0010] A copper-clad busbar includes a busbar body, a nickel layer is plated on the surface of the busbar body, an insulating film is wrapped on the outer surface of the nickel layer, and the hardness of the nickel layer is HV300 to HV500.

[0011] Further, the hardness of the nickel layer is HV350 to HV450.

[0012] Further, the hardness of the nickel layer is HV400.

[0013] Further, the insulating film includes a base layer, a toughening layer and an insulating layer. The toughening layer is disposed on the upper surface of the base layer, and the insulating layer is disposed on the upper surface of the toughening layer.

[0014] Further, a protective layer is further disposed on the upper surface of the insulating layer.

[0015] Further, the toughening layer is a fine grid structure.

[0016] Further, a buffer layer is disposed on the lower surface of the base layer.

[0017] Further, a first edge-sealing portion and a second edge-sealing portion are disposed on the side of the insulating film.

[0018] The beneficial effects of this application are as follows:

[0019] The hardness of the nickel layer in this application is in the range of HV300 to HV500. This range not only ensures sufficient mechanical strength but also takes into account the toughness of the material. The relatively hard nickel layer can provide good support and prevent excessive deformation of the copper busbar during bending; while the appropriate toughness helps to disperse and absorb the stress generated during the processing, reducing the risk of the insulating film cracking due to stress concentration. During the bending process, different parts of the copper busbar will be subjected to different degrees of stress. The optimized nickel layer can more effectively disperse these stresses, avoiding the formation of high-stress areas at the junction of the insulating film and the copper busbar or inside the insulating film, thereby reducing the possibility of cracking. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of a copper-clad busbar provided by an embodiment of this application;

[0021] Figure 2 is a top view of a copper-clad busbar provided by an embodiment of this application;

[0022] Figure 3 is Figure 2 a cross-sectional view taken at A-A;

[0023] Figure 4 is a cross-sectional view of a copper-clad busbar provided by an embodiment of this application;

[0024] Figure 5Cross-sectional view of a copper busbar with a film provided by an embodiment of the present application;

[0025] Figure 6 Cross-sectional view of a copper busbar with a film provided by an embodiment of the present application;

[0026] Figure 7 Cross-sectional view of a copper busbar with a film provided by an embodiment of the present application;

[0027] Explanation of reference numerals:

[0028] 1. Copper busbar body; 2. Nickel layer; 3. Insulating film;

[0029] 31. Base layer; 32. Toughness-increasing layer; 33. Insulating layer; 34. Protective layer; 35. Buffer layer;

[0030] 36. First edge-sealing part; 37. Second edge-sealing part; Detailed implementation manners

[0031] The terms used in the implementation manners part of the present application are only used to explain the specific embodiments of the present application, rather than aiming to limit the present application. The implementation manners of the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0032] As Figure 1 and Figure 3 shown, a copper busbar with a film includes a copper busbar body 1, a nickel layer 2 is plated on the surface of the copper busbar body 1, and an insulating film 3 is wrapped on the outer surface of the nickel layer 2. The hardness of the nickel layer 2 is HV300 to HV500.

[0033] Copper busbar body 1: High-purity electrolytic copper is selected as the base material to ensure good electrical conductivity and workability.

[0034] Plating of nickel layer 2: Electroplating or electroless plating methods are used to evenly plate a layer of nickel on the surface of the copper busbar body 1. During the nickel plating process, process parameters such as plating solution composition, temperature, and current density are strictly controlled to ensure the uniformity of the nickel layer 2 and the required hardness range (HV300 to HV500).

[0035] Wrapping of insulating film 3: An insulating material with good insulating properties and temperature resistance (such as polyimide, polyester, etc.) is selected and tightly wrapped on the outer surface of the nickel layer 2 by hot pressing or pasting.

[0036] Hardness test and verification: A microhardness tester is used to test the hardness of the plated nickel layer 2. According to the standard test method (such as Vickers hardness test), multiple test points are selected on the surface of the nickel layer 2 for testing, and the average value is calculated to ensure the accuracy of the test results. The test results show that the hardness of the nickel layer 2 is within the range of HV300 to HV500, meeting the design requirements.

[0037] Conduct comparative tests with unplated copper bars or copper bars plated with nickel layers 2 in other hardness ranges. Under the same bending conditions (such as bending angle, speed, force, etc.), observe and record the fracture situation of the coated copper bars. Through comparison, it is found that the nickel layer 2 with a hardness in the range of HV300 to HV500 can significantly reduce the fracture phenomenon of the coated copper bars during the bending process.

[0038] Data comparison table for showing the comparison of the fracture situations of coated copper bars with nickel layers 2 of different hardnesses during the bending process.

[0039]

[0040]

[0041] Data comparison table: Fracture situations of coated copper bars with nickel layers 2 of different hardnesses during bending

[0042] Explanation:

[0043] The column of "Hardness range of nickel layer 2" represents different hardness ranges of nickel layer 2.

[0044] The column of "Number of test samples" represents the number of coated copper bar samples tested within each hardness range.

[0045] The column of "Bending conditions" represents that all test samples are tested under the same bending conditions.

[0046] The column of "Number of fractured samples" represents the number of samples that fractured during the bending process.

[0047] The column of "Fracture ratio" represents the ratio of the number of fractured samples to the number of test samples.

[0048] It can be seen from the above data comparison table that the coated copper bars with nickel layer 2 having a hardness in the range of HV300 - 500 have the lowest fracture ratio during the bending process, only 10%, while the coated copper bars without nickel plating or plated with nickel layers 2 in other hardness ranges show higher fracture ratios. This indicates that the nickel layer 2 with a hardness in the range of HV300 - 500 can effectively improve the fracture resistance of the coated copper bars.

[0049] In this embodiment, the hardness of the nickel layer 2 is HV350 to HV450.

[0050] In this embodiment, the hardness of the nickel layer 2 is HV400.

[0051]

[0052] As can be seen from the above data comparison table, when the hardness of the nickel layer 2 is in the range of HV350 - 450 and HV400, the coated copper busbar does not break during the bending process, showing excellent anti - fracture ability. While the nickel layer 2 with slightly lower or higher hardness shows a certain fracture ratio, indicating that these two preferred embodiments have significant advantages in preventing the coated copper busbar from breaking.

[0053] As Figure 4 shown in the figure, in this embodiment, the insulating film 3 includes a base layer 31, a toughening layer 32, and an insulating layer 33. The toughening layer 32 is disposed on the upper surface of the base layer 31, and the insulating layer 33 is disposed on the upper surface of the toughening layer 32. The base layer 31 is made of polyimide or polyester. As the basic layer of the insulating film 3, the base layer 31 provides necessary support and stability, ensuring that the entire insulating film 3 can be firmly attached to the nickel layer 2. The toughening layer 32 is disposed on the upper surface of the base layer 31. The toughening layer 32 is a thermoplastic resin, such as modified polystyrene (HIPS), polycarbonate (PC), or modified polypropylene (PP). Its main function is to enhance the toughness of the insulating film 3. The toughening layer 32 can absorb and disperse the stress generated during processing (such as bending), preventing the insulating film 3 from cracking due to stress concentration. This helps to improve the adaptability and durability of the coated copper busbar under complex processing conditions. The insulating layer 33: located on the upper surface of the toughening layer 32, the insulating layer 33 can be one or more of polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), nylon (PA), polyethylene terephthalate. The insulating layer 33 is the part of the insulating film 3 that directly plays the role of electrical insulation. The material of the insulating layer 33 usually has high insulation resistance and breakdown electric field strength, which can effectively isolate the copper busbar from the external environment and prevent current leakage and short - circuit phenomena.

[0054] As Figure 5 shown in the figure, in this embodiment, a protective layer 34 is further disposed on the upper surface of the insulating layer 33. The protective layer 34 can further improve the insulation grade of the copper busbar and ensure stable insulation performance even in harsh environments.

[0055] As Figure 6 shown in the figure, in this embodiment, the toughening layer 32 is a fine grid structure. The toughening layer 32 with a fine grid structure can absorb and disperse external impact energy, thereby slowing down the crack propagation speed and improving the overall toughness of the material. The material selection of the grid toughening layer 32 is diverse, and common ones include carbon fiber, glass fiber, metal fiber, basalt fiber, aramid fiber, silicon carbide fiber, carbon nanotube fiber, etc. These materials have good mechanical properties and stability, and can meet the requirements of different application scenarios.

[0056] As Figure 7As shown, in this embodiment, a buffer layer 35 is provided on the lower surface of the base layer 31. The buffer layer 35 can effectively reduce the direct impact or stress of the external on the base layer 31, preventing the base layer 31 from being damaged due to direct force. The buffer layer 35 can be one or more of polyimide (PI), polyethylene terephthalate (PET).

[0057] As Figure 3 As shown, in this embodiment, a first edge-sealing portion 36 and a second edge-sealing portion 37 are provided on the side of the insulating film 3. The edge-sealing portion can also be used as part of the structural support to enhance the bonding force between the insulating film 3 and the base layer 31 or other layers, improving the stability and reliability of the overall structure. By providing the edge-sealing portion, phenomena such as partial discharge and creepage caused by the edge breakage of the insulating film 3 can be reduced, thereby improving the insulation level and safety of the overall structure.

[0058] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection or an indirect connection through an intermediate medium. It can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0059] The device or element referred to in the embodiments of the present application or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically and precisely defined.

[0060] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described here, for example, can be implemented in an order other than those illustrated or described here. In addition, the terms "may include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and not to limit them. Although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. And these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A coated copper busbar, characterized in that: It includes a copper busbar body, a nickel layer is plated on the surface of the copper busbar body, an insulating film is wrapped on the outer surface of the nickel layer, and the hardness of the nickel layer is HV300 to HV500.

2. The laminated copper busbar according to claim 1, wherein: The hardness of the nickel layer is HV350 to HV450.

3. A coated copper busbar according to claim 2, characterized in that: The hardness of the nickel layer is HV400.

4. A coated copper busbar according to claim 1, characterized in that: The insulating film includes a base layer, a toughening layer and an insulating layer. The toughening layer is arranged on the upper surface of the base layer, and the insulating layer is arranged on the upper surface of the toughening layer.

5. The copper busbar with film according to claim 4, characterized in that: A protective layer is further arranged on the upper surface of the insulating layer.

6. A coated copper busbar according to claim 4, characterized in that: The toughening layer is a fine grid structure.

7. A copper-clad busbar according to claim 4, characterized in that: A buffer layer is arranged on the lower surface of the base layer.

8. A copper-clad busbar according to claim 1, characterized in that: First and second edge-sealing parts are arranged on the side of the insulating film.

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