Infrared bijection inductive switch

Abstract

The utility model discloses an infrared correlation inductive switch, which mainly comprises a plastic shell, an infrared transmitting module and an infrared receiving module, the infrared transmitting module is integrated with a first substrate and a light emitting diode, the bottom end of the first substrate is provided with a first pin, and the bottom end of the first substrate is provided with a second pin. The infrared receiving module integrates a second substrate and a photoelectric receiving tube, and the bottom end of the second substrate is provided with a second pin. The plastic shell is of an integrated structure and is provided with a first mounting groove and a second mounting groove, buckle structures are arranged in the grooves, and the infrared transmitting module and the infrared receiving module are mounted in the grooves through the buckle structures. The plastic shell is provided with a first window, a clearance area and a second window which are communicated, so that the light of the transmitting end can irradiate the receiving end to realize a photoelectric switch function. According to the infrared correlation inductive switch provided by the utility model, main parts are modularized, the product structure is simple, the assembly is convenient, the production cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the field of photoelectric induction switches, and particularly relates to an infrared opposed induction switch. Background Art

[0002] The transmitting end of an infrared induction switch mainly includes a light-emitting diode (IR_LED), which is an important part of a photoelectric sensor and is mainly responsible for emitting light signals. The receiving end of the photoelectric sensor mainly includes a photoelectric receiving tube, a filter, and a signal processor. The photoelectric receiving tube is a special semiconductor device that can convert light signals into electrical signals. The working principle of the infrared induction switch is that when infrared light irradiates from the transmitting end to the receiving end, the receiving end converts the received light signal into an electrical signal to control the opening of the relevant circuit; when the light is blocked, the optical path is interrupted at this time, and the relevant circuit is controlled to disconnect, thereby realizing the switch function without physical contact.

[0003] For the existing infrared induction switches, due to the structural design, there are many and scattered components, resulting in a relatively complex product structure, and the production and assembly steps are cumbersome, which restricts the production efficiency of the infrared induction switch. Content of the Utility Model

[0004] The purpose of the utility model is to provide an infrared opposed induction switch, which has a simple structure, convenient production and assembly, and high production efficiency.

[0005] The utility model is realized as follows: an infrared opposed induction switch includes a plastic housing, an infrared emission module, and an infrared reception module; the infrared emission module includes a first substrate and a light-emitting diode for emitting infrared light, the light-emitting diode is welded on the first substrate, and a first pin is provided at the bottom end of the first substrate; the infrared reception module includes a second substrate and a photoelectric receiving tube, the photoelectric receiving tube is welded on the second substrate, and a second pin is provided at the bottom end of the second substrate;

[0006] The plastic housing is an integrated structure, and first and second installation grooves are provided on its opposite sides. The infrared emission module is installed in the first installation groove through a first snap structure, and the infrared reception module is installed in the second installation groove through a second snap structure;

[0007] An air avoidance area is provided at the middle position of the plastic housing. The first installation groove is communicated with the air avoidance area through a first window, and the position of the first window corresponds to the position of the light-emitting diode; the second installation groove is communicated with the air avoidance area through a second window, and the position of the second window corresponds to the position of the photoelectric receiving tube.

[0008] Further, the plastic housing is an integrated structure formed by injection molding.

[0009] Further, the first snap structure includes first elastic snaps protruding from two inner sidewalls of the first mounting groove, and two outer edges of the first substrate are snap-connected to the first elastic snaps.

[0010] Further, the second snap structure includes second elastic snaps protruding from two inner sidewalls of the second mounting groove, and two outer edges of the second substrate are snap-connected to the second elastic snaps.

[0011] Further, a first positioning post extends from a bottom wall of the first mounting groove, and a first positioning hole extending in a thickness direction of the first substrate is formed on the first substrate. After the infrared emission module is assembled with the plastic housing, the first positioning post is inserted into the first positioning hole.

[0012] Further, a second positioning post extends from a bottom wall of the second mounting groove, and a second positioning hole extending in a thickness direction of the second substrate is formed on the second substrate. After the infrared reception module is assembled with the plastic housing, the second positioning post is inserted into the second positioning hole.

[0013] Further, the light-emitting diode includes a light-emitting diode chip and a first hemispherical lens formed by epoxy resin. The first hemispherical lens is fixed on the first substrate and covers the light-emitting diode chip.

[0014] Further, the photoelectric receiving tube includes a photoelectric receiving tube chip and a second hemispherical lens formed by epoxy resin. The second hemispherical lens is fixed on the second substrate and covers the photoelectric receiving tube chip.

[0015] In some preferred embodiments, the above infrared opposed induction switch further includes a first sealing plate and a second sealing plate; the first sealing plate covers an opening of the first mounting groove for sealing the infrared emission module; the second sealing plate covers an opening of the second mounting groove for sealing the infrared reception module.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0017] The infrared opposed induction switch provided by the present utility model mainly includes three components: a plastic housing, an infrared emission module, and an infrared reception module. Among them, the infrared emission module integrates a first substrate and a light-emitting diode. A first pin is provided at the bottom end of the first substrate, and it can be attached to a circuit board through the SMT pasting process. The infrared reception module integrates a second substrate and a photoelectric receiving tube. A second pin is provided at the bottom end of the second substrate, and it can be attached to a circuit board through the SMT pasting process.

[0018] The plastic housing is an integrated structure, which is simple to manufacture. There are a first installation groove and a second installation groove on its opposite sides, and snap structures are provided in both grooves. The infrared emission module and the infrared reception module are respectively installed in the first installation groove and the second installation groove through the snap structures, and the assembly process is simple.

[0019] An empty area is provided in the middle position of the plastic housing. The first installation groove is communicated with the empty area through a first window, and the second installation groove is communicated with the empty area through a second window. For the assembled product, the light from the emission end can irradiate the reception end, thereby realizing the function of the photoelectric switch.

[0020] In summary, for the infrared opposed induction switch provided by the present utility model, the main components are modularized. Not only is the product structure simple, but also the assembly is convenient, which is beneficial to reducing the production cost and improving the production efficiency. Description of the Drawings

[0021] Figure 1 is an exploded structural schematic diagram of an infrared opposed induction switch provided by an embodiment of the present utility model;

[0022] Figure 2 is Figure 1 an exploded structural schematic diagram of the infrared opposed induction switch shown from another angle;

[0023] Figure 3 is an assembly schematic diagram of the infrared opposed induction switch provided by an embodiment of the present utility model and a circuit board;

[0024] Figure 4 is Figure 1 a longitudinal sectional schematic diagram of the infrared opposed induction switch shown. Detailed Embodiment

[0025] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0026] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model; the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance; in addition, unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] For the existing infrared induction switch, due to the reason of structural design, there are many and scattered components, resulting in a relatively complex product structure, cumbersome production and assembly steps, and restricting the production efficiency of the infrared induction switch.

[0028] In order to solve the above problems existing in the prior art, this embodiment provides an infrared opposed induction switch. Referring to Figure 1 and Figure 2 , the induction switch of this embodiment includes a plastic housing 1, an infrared emission module 2 and an infrared reception module 3; wherein, the infrared emission module 2 includes a first substrate 21 and a light emitting diode 22 for emitting infrared light. The light emitting diode 22 is welded on the first substrate 21. A first pin 211 is provided at the bottom end of the first substrate 21. The infrared reception module 3 includes a second substrate 31 and a photoelectric receiving tube 32. The photoelectric receiving tube 32 is welded on the second substrate 31. A second pin 311 is provided at the bottom end of the second substrate 31. Referring to Figure 3 , since pins are provided at the bottom end of the substrate, the assembled product can be attached to the circuit board 200 through the SMT pasting process.

[0029] The plastic housing 1 is an integrated structure. In practical applications, the plastic housing 1 is manufactured by an injection molding process. On opposite sides of the plastic housing 1, there are a first installation groove 11 and a second installation groove 12. The infrared emission module 2 is installed in the first installation groove 11 through a first snap structure 13, and the infrared reception module 3 is installed in the second installation groove 12 through a second snap structure 14. Preferably, the first snap structure 13 includes first elastic snaps protruding from the two inner sidewalls of the first installation groove 11, and the two outer edges of the first substrate 21 are snap-connected to the first elastic snaps. The second snap structure 14 includes second elastic snaps protruding from the two inner sidewalls of the second installation groove, and the two outer edges of the second substrate 31 are snap-connected to the second elastic snaps.

[0030] The plastic housing 1 is integrally U-shaped, and there is a clearance area 15 at its middle position. The first installation groove 11 communicates with the clearance area 15 through a first window 16, and moreover, the position of the first window 16 corresponds to the position of the light-emitting diode 22. The second installation groove 12 communicates with the clearance area 15 through a second window 17, and moreover, the position of the second window 17 corresponds to the position of the photoelectric receiving tube 32. Referring to Figure 4 , through the above layout design, after the product is assembled, the light emitted by the infrared emission module 2 can irradiate the infrared reception module 3, thereby realizing the function of the photoelectric switch.

[0031] In order to accelerate the assembly speed of the infrared emission module 2 and the infrared reception module 3 and avoid installation position deviation, a first positioning post 18 extends from the bottom wall of the first installation groove 11, and a first positioning hole 212 extending along the thickness direction of the first substrate 21 is provided on the first substrate 21. When the infrared emission module 2 is assembled with the plastic housing 1, first align the first positioning hole 212 with the first positioning post 18, and then press the infrared emission module 2 in. Similarly, a second positioning post 19 extends from the bottom wall of the second installation groove 12, and a second positioning hole 312 extending along the thickness direction of the second substrate 31 is provided on the second substrate 31. When the infrared reception module 3 is assembled with the plastic housing 1, first align the second positioning hole 312 with the second positioning post 19, and then press the infrared reception module 3 in.

[0032] Furthermore, the light-emitting diode 22 includes a light-emitting diode chip and a first hemispherical lens formed by epoxy resin. The first hemispherical lens is fixed on the first substrate 21 and covers the light-emitting diode chip. The photoelectric receiving tube 32 includes a photoelectric receiving tube chip and a second hemispherical lens formed by epoxy resin. The second hemispherical lens is fixed on the second substrate 31 and covers the photoelectric receiving tube chip.

[0033] In some preferred embodiments, the above-mentioned inductive switch further includes a first sealing plate 4 and a second sealing plate 5; the first sealing plate 4 covers the notch of the first installation groove 11 for sealing the infrared emission module 2; the second sealing plate 5 covers the notch of the second installation groove 12 for sealing the infrared reception module 3.

[0034] The manufacturing method of the infrared opposed inductive switch of this embodiment includes the following steps:

[0035] Fix the light-emitting diode chip and the photoelectric receiving tube chip on a substrate respectively, and lead out two pins at the bottom end of the substrate;

[0036] Adopt the die-casting and potting process to form a hemispherical lens with epoxy resin directly above the light-emitting diode chip and the photoelectric receiving tube chip respectively, and manufacture the infrared emission module 2 and the infrared reception module 3;

[0037] Integrally form the plastic housing 1 through the injection molding process;

[0038] Press the infrared emission module 2 into the first installation groove 11 of the plastic housing 1, and make the two side edges thereof form a snap connection with the first snap structure 13;

[0039] In the same way, press the infrared reception module 3 into the second installation groove 12 of the plastic housing 1, and make the two side edges thereof form a snap connection with the second snap structure 14.

[0040] To sum up, the infrared opposed inductive switch provided by this embodiment modularizes the main components, not only has a simple product structure, but also is convenient for assembly, which is beneficial to reducing production costs and improving production efficiency.

[0041] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An infrared pair-beam induction switch, characterized in that, It includes a plastic housing, an infrared emission module, and an infrared reception module; the infrared emission module includes a first substrate and a light-emitting diode for emitting infrared light, the light-emitting diode is welded on the first substrate, a first pin is provided at the bottom end of the first substrate, the infrared reception module includes a second substrate and a photoelectric receiving tube, the photoelectric receiving tube is welded on the second substrate, and a second pin is provided at the bottom end of the second substrate; The plastic housing is an integrated structure, and first and second mounting grooves are provided on two opposite side edges thereof. The infrared emission module is mounted in the first mounting groove through a first snap structure, and the infrared reception module is mounted in the second mounting groove through a second snap structure; An air clearance area is provided at the middle position of the plastic housing. The first mounting groove communicates with the air clearance area through a first window, and moreover, the position of the first window corresponds to the position of the light-emitting diode; the second mounting groove communicates with the air clearance area through a second window, and moreover, the position of the second window corresponds to the position of the photoelectric receiving tube.

2. The infrared opposed induction switch according to claim 1, characterized in that, The plastic housing is an integrated structure formed by injection molding.

3. The infrared pair emission induction switch according to claim 1, characterized in that, The first snap structure includes first elastic snaps protruding from two inner side walls of the first mounting groove, and two outer side edges of the first substrate are snap-connected to the first elastic snaps.

4. The infrared pair-beam induction switch according to claim 1, characterized in that, The second snap structure includes second elastic snaps protruding from two inner side walls of the second mounting groove, and two outer side edges of the second substrate are snap-connected to the second elastic snaps.

5. The infrared pair-beam induction switch according to claim 1, wherein First positioning posts extend from the bottom wall of the first mounting groove, and first positioning holes extending along the thickness direction thereof are provided on the first substrate. After the infrared emission module is assembled with the plastic housing, the first positioning posts are inserted into the first positioning holes.

6. The infrared pair emission induction switch according to claim 1, characterized in that Second positioning posts extend from the bottom wall of the second mounting groove, and second positioning holes extending along the thickness direction thereof are provided on the second substrate. After the infrared reception module is assembled with the plastic housing, the second positioning posts are inserted into the second positioning holes.

7. The infrared pair-beam induction switch according to claim 1, characterized in that, The light-emitting diode includes a light-emitting diode chip and a first hemispherical lens formed by epoxy resin. The first hemispherical lens is fixed on the first substrate and covers the light-emitting diode chip.

8. The infrared opposed induction switch according to claim 1, characterized in that, The photoelectric receiving tube includes a photoelectric receiving tube chip and a second hemispherical lens formed by epoxy resin. The second hemispherical lens is fixed on the second substrate and covers the photoelectric receiving tube chip.

9. The infrared opposed induction switch according to claim 1, characterized in that, It further includes a first sealing plate and a second sealing plate; the first sealing plate covers the opening of the first mounting groove for sealing the infrared emission module; the second sealing plate covers the opening of the second mounting groove for sealing the infrared reception module.

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