Circuit board pressing device

Abstract

The utility model provides a circuit board pressing device, which relates to the field of circuit board processing and comprises a pressing device body. A controller is installed in the press-fit device body, a cooling fan and a guide piece are installed on the side edge of the press-fit device body through an operation bin, the guide piece is of a rectangular frame structure with the narrow front end and the wide rear end, and partition plate assemblies which are evenly arranged are fixed in the guide piece. After the circuit board is pressed, the cooling fan can be controlled to operate, the cooling fan absorbs heat and waste heat through the air inlet, the guide piece and the partition plate assembly, airflow is controlled to circulate from the front end of the operation bin and the interior of the side piece, the airflow circulates through the circuit board, meanwhile, the residual waste heat is taken away, and the guide piece and the partition plate assembly can increase suction force. Therefore, the heat dissipation intensity is improved, and the problems that some residual heat is left after lamination of a common circuit board lamination device, the residual heat is reduced slowly, and the lamination efficiency is affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a circuit board pressing device. Background Art

[0002] Circuit board pressing is a key process in electronic manufacturing, mainly used to press the various components of a multi-layer printed circuit board into a whole according to a predetermined order and method. This process usually involves hot pressing under high temperature and high pressure conditions and subsequent cold pressing to ensure the flatness of the product and the stability between layers. The main purpose of circuit board pressing is to fuse and fix the inner core board and the semi-cured sheet (usually composed of resin and glass fiber) together under high temperature and high pressure conditions through a hot melt machine, ensure the alignment of patterns on different layers, and avoid interlayer slippage during subsequent processing. In PCB manufacturing, first, the copper foil, semi-cured sheet, and the core board with circuits are stacked in a certain order, and then hot pressed through a circuit board pressing device to integrate all layers under high temperature and high pressure conditions. Subsequently, cold pressing is carried out to release stress and ensure the flatness of the product. Due to the complexity of multi-layer PCBs, the pressing process is crucial for ensuring the performance and reliability of circuit boards. Circuit board pressing is an indispensable part of electronic manufacturing, and it ensures the performance and reliability of electronic products through complex processes. However, for common circuit board pressing devices on the market, after pressing, there will be some residual heat, and the cooling of this residual heat is relatively slow, affecting the pressing efficiency. When taking the circuit board, the hand needs to reach into the inside of the operation chamber, which poses a safety hazard, and the taking of the circuit board is not convenient enough. Summary of the Utility Model

[0003] An embodiment of the present disclosure relates to a circuit board pressing device. When placing the circuit board on the pressing device body, the pull plate structure can be pulled in advance to displace, so that the sliding rod structure slides inside the guide groove. Since the rear end of the guide groove is an inclined structure, the top plate structure moves forward and upward. Then, the circuit board to be pressed is placed above the contact plate, and the pull plate structure and the top plate structure are pushed back to their original positions, so that the top plate structure drives the contact plate into the inner groove, driving the circuit board to conveniently fall above the force-bearing structure for pressing, improving the pressing efficiency and the convenience of taking. Moreover, when taking, the hand will not reach into the inside of the operation chamber, improving safety.

[0004] In the first aspect of the present disclosure, a circuit board laminating device is provided, which specifically includes: a laminating device body; a controller is installed inside the laminating device body, and a heat dissipation fan and a guiding member are installed on the side of the laminating device body through an operation chamber. The guiding member is a rectangular frame structure with a narrow front end and a wide rear end, and a uniformly arranged partition assembly is fixed inside the guiding member; a stress structure; the stress structure is located on the side of the laminating device body, and there are two square holes at the front end of the stress structure. The stress structure is fixed to the inner bottom end of the operation chamber by bolts, and a top plate structure that can move up and down is installed in the stress structure through an inner groove. There are three top plate structures in total, and a contact plate made of flexible rubber material is adhesively fixed to the top end of each top plate structure, and an anti-slip groove is provided at the top end of the contact plate.

[0005] In at least some embodiments, an operation chamber is installed on the side of the laminating device body. An operation button is provided at the front end of the operation chamber. On both sides of the bottom of the operation chamber, uniformly arranged side members are respectively fixed. The inclined side members are rectangular tubular structures and are communicated with the inside of the operation chamber; two guiding rod assemblies are respectively fixed on both sides of the operation chamber, and a hydraulic cylinder assembly is fixedly installed at the top end of the operation chamber; the telescopic end of the hydraulic cylinder assembly is connected to the laminating assembly and drives the laminating assembly to move up and down. The guiding rod assembly penetrates through the laminating assembly. An air inlet is provided at the rear end of the operation chamber, a heat dissipation fan is installed outside the air inlet, and a guiding member is fixedly installed inside the air inlet.

[0006] In at least some embodiments, three inner grooves are penetrated and opened at the top end of the stress structure. Two guiding grooves are respectively opened on both sides of the inside of each inner groove, and the rear end of the guiding groove is an inclined structure; a sliding rod structure that can slide freely is inserted into the guiding groove, and the sliding rod structure is fixed to both sides of the top plate structure. Through grooves are uniformly arranged and penetrated inside the contact plate; a connecting rod is fixed at the front end of each top plate structure, and the connecting rod with an external thread penetrates through the pulling plate structure. A nut is fixed on the external thread of the connecting rod and is fixedly connected to the pulling plate structure, and the pulling plate structure drives the three top plate structures to move together.

[0007] The utility model provides a circuit board laminating device, which has the following beneficial effects:

[0008] When the laminating device body places the circuit board, the pulling plate structure can be pulled to displace in advance, so that the sliding rod structure slides inside the guiding groove. Since the rear end of the guiding groove is an inclined structure, the top plate structure moves forward and upward. Then, the circuit board to be laminated is placed above the contact plate, and the pulling plate structure and the top plate structure are pushed to reset, so that the top plate structure drives the contact plate to enter the inside of the inner groove, driving the circuit board to conveniently fall above the stress structure for lamination, improving the lamination efficiency and the convenience of taking and placing. And when taking and placing, the hand will not reach into the inside of the operation chamber, improving safety.

[0009] After the circuit board lamination is completed, the operation of the cooling fan can be controlled. The cooling fan draws in heat and residual temperature through the air inlet, guide member, and partition assembly, controls the airflow to circulate from the front end of the operation chamber and the inside of the side member, enables the airflow to pass through the circuit board, and at the same time takes away the remaining residual temperature. The guide member and the partition assembly can increase the suction force, thereby enhancing the heat dissipation intensity. Brief Description of the Drawings

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings of the embodiments will be briefly introduced below.

[0011] The accompanying drawings in the following description only relate to some embodiments of the present utility model and do not limit the present utility model.

[0012] In the accompanying drawings:

[0013] Figure 1 A three-dimensional structure diagram of the present application is shown;

[0014] Figure 2 A disassembled three-dimensional structure diagram of the present application is shown;

[0015] Figure 3 A three-dimensional structure diagram showing the usage state of the force-bearing structure of the present application is shown;

[0016] Figure 4 A disassembled three-dimensional structure diagram of the lamination device body of the present application is shown;

[0017] Figure 5 A disassembled three-dimensional structure diagram of the force-bearing structure of the present application is shown;

[0018] Figure 6 A disassembled bottom view structure diagram of the force-bearing structure of the present application is shown;

[0019] List of Reference Numerals

[0020] 1. Lamination device body; 101. Operation chamber; 102. Side member; 103. Guide rod assembly; 104. Hydraulic cylinder assembly; 105. Lamination assembly; 106. Cooling fan; 107. Guide member; 108. Partition assembly;

[0021] 2. Force-bearing structure; 201. Inner groove; 202. Guide groove; 203. Slide rod structure; 204. Jacking plate structure; 205. Contact plate; 206. Through groove; 207. Connecting rod; 208. Pulling plate structure. Detailed Description of the Embodiment

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0023] Embodiment 1: Please refer to Figures 1 to 6 :

[0024] The present utility model provides a circuit board pressing device, including: a pressing device body 1; a controller is installed inside the pressing device body 1, and a heat dissipation fan 106 and a guiding member 107 are installed on the side of the pressing device body 1 through an operation chamber 101. The guiding member 107 is a rectangular frame structure with a narrow front end and a wide rear end, which can improve the heat suction effect and strength. A partition assembly 108 arranged uniformly is fixed inside the guiding member 107, which can improve the heat dissipation efficiency and usage efficiency; a force-bearing structure 2; the force-bearing structure 2 is located on the side of the pressing device body 1. There are two square holes at the front end of the force-bearing structure 2, and an electric cylinder can be installed inside it. The top plate structure 204 is pushed to displace in a power-driven manner. The force-bearing structure 2 is fixed to the inner bottom end of the operation chamber 101 by bolts. The force-bearing structure 2 is provided with a top plate structure 204 that can move up and down through an inner groove 201, and can move freely upward and forward inside the inner groove 201, facilitating lifting the circuit board or controlling the placement and use of the circuit board. There are three top plate structures 204 in total. A contact plate 205 made of flexible rubber material is adhesively fixed to the top end of each top plate structure 204. Anti-slip grooves are provided at the top end of the contact plate 205 for anti-slip flexible contact with the bottom of the circuit board. While stably pushing the circuit board to displace, it will not cause scratches and wear on the bottom of the circuit board.

[0025] In the embodiments of the present disclosure, as Figure 4As shown in the figure, an operation chamber 101 is installed on the side of the pressing device body 1. An operation button is provided at the front end of the operation chamber 101. On both sides of the bottom of the operation chamber 101, side members 102 arranged uniformly are respectively fixed. The inclined side members 102 are rectangular tubular structures and are communicated with the inside of the operation chamber 101, and can suck air flow from the side to improve the heat dissipation effect and heat dissipation intensity; two guide rod assemblies 103 are respectively fixed on both sides of the operation chamber 101 to control the guiding movement of the pressing assembly 105. A hydraulic cylinder assembly 104 is fixedly installed at the top of the operation chamber 101; the telescopic end of the hydraulic cylinder assembly 104 is connected to the pressing assembly 105 and drives the pressing assembly 105 to move up and down to generate a pressing force. The guide rod assembly 103 penetrates through the pressing assembly 105. An air inlet is provided at the rear end of the operation chamber 101. A cooling fan 106 is installed outside the air inlet, and a guide member 107 is fixedly installed inside the air inlet to improve the heat dissipation efficiency and quickly cool down the circuit board after pressing.

[0026] In the embodiment of the present disclosure, as Figure 5 with Figure 6 shown in the figure, three inner grooves 201 are penetrated and opened at the top end of the force-bearing structure 2 to enable the top plate structure 204 to freely move up and down inside it. Two guide grooves 202 are respectively opened on both sides inside each inner groove 201. The rear end of the guide groove 202 is an inclined structure to enable the slide rod structure 203 to freely displace inside it, driving the top plate structure 204 to displace in a guided manner to control the convenient taking and placing of the circuit board; a slidable slide rod structure 203 is inserted into the guide groove 202. The slide rod structure 203 is fixed on both sides of the top plate structure 204 to drive the top plate structure 204 to displace. Through grooves 206 are uniformly penetrated and opened inside the contact plate 205 to improve the flexibility of the contact plate 205; a connecting rod 207 is fixed at the front end of each top plate structure 204. The connecting rod 207 with an external thread penetrates through the pull plate structure 208. A nut is fixed on the external part of the connecting rod 207 and is fixedly connected to the pull plate structure 208. The pull plate structure 208 drives the three top plate structures 204 to move together, and the free movement of the top plate structure 204 can be controlled through the pull plate structure 208.

[0027] Working principle of this embodiment: When it is necessary to control the lamination of the circuit board, the pull plate structure 208 can be directly pulled to displace, so that the pull plate structure 208 drives the jacking plate structure 204 to move together through the connecting rod 207. The slide rod structure 203 of the jacking plate structure 204 freely slides and displaces inside the guide groove 202. Since the rear end of the guide groove 202 is an inclined structure, the jacking plate structure 204 moves upward and forward, so that the jacking plate structure 204 is pulled to use, and the circuit board to be laminated is controlled to be placed above the contact plate 205. Then, the pull plate structure 208 is pushed to reset, and the pull plate structure 208 drives the jacking plate structure 204 to reset, so that the circuit board is conveniently placed above the stress structure 2 for use. Then, the hydraulic cylinder assembly 104 is controlled to operate, so that it drives the lamination assembly 105 to move downward to laminate the circuit board. After the lamination is completed, the cooling fan 106 is controlled to operate. The cooling fan 106 sucks heat through the guide member 107 and the partition assembly 108, so that the air flow circulates quickly, and the laminated circuit board is quickly cooled. Then, the pull plate structure 208 is pulled again, so that the jacking plate structure 204 pushes the circuit board to rise and move forward for convenient removal.

[0028] In this article, the following points need to be noted:

[0029] 1. The attached drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure. Other structures can refer to the general design.

[0030] 2. Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0031] The above is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A circuit board laminating device, characterized in that, Including: A lamination device body (1); a controller is installed inside the lamination device body (1), a heat dissipation fan (106) and a guide member (107) are installed on the side of the lamination device body (1) through an operation chamber (101), the guide member (107) is a rectangular frame structure with a narrow front end and a wide rear end, and a partition assembly (108) arranged uniformly is fixed inside the guide member (107); a stress structure (2); the stress structure (2) is located on the side of the lamination device body (1), two square holes are provided at the front end of the stress structure (2), the stress structure (2) is fixed to the inner bottom end of the operation chamber (101) by bolts, and a top plate structure (204) that can move up and down is installed in the stress structure (2) through an inner groove (201). There are three top plate structures (204) in total, and a contact plate (205) made of flexible rubber is adhesively fixed to the top end of each top plate structure (204), and anti-slip grooves are provided at the top end of the contact plate (205).

2. The laminating device for circuit boards according to claim 1, characterized in that, An operation chamber (101) is installed on the side of the lamination device body (1), operation buttons are provided at the front end of the operation chamber (101), and side members (102) arranged uniformly are fixed to both sides of the bottom of the operation chamber (101). The inclined side members (102) are rectangular tubular structures and are communicated with the inside of the operation chamber (101).

3. The circuit board laminating device according to claim 2, characterized in that, Two guide rod assemblies (103) are fixed to both sides of the operation chamber (101) respectively, and a hydraulic cylinder assembly (104) is fixedly installed at the top end of the operation chamber (101).

4. A circuit board pressing device according to claim 3, characterized in that, The telescopic end of the hydraulic cylinder assembly (104) is connected to a lamination assembly (105) and drives the lamination assembly (105) to move up and down. The guide rod assemblies (103) penetrate through the lamination assembly (105). An air inlet is provided at the rear end of the operation chamber (101), a heat dissipation fan (106) is installed outside the air inlet, and a guide member (107) is fixedly installed inside the air inlet.

5. The laminating device for a circuit board according to claim 4, wherein, Three inner grooves (201) are formed through the top end of the stress structure (2), two guide grooves (202) are formed on both sides of the inside of each inner groove (201), and the rear end of the guide groove (202) is an inclined structure.

6. A circuit board pressing device according to claim 5, characterized in that, A sliding rod structure (203) that can slide freely is inserted into the guide groove (202), and the sliding rod structure (203) is fixed to both sides of the top plate structure (204). Through grooves (206) are arranged uniformly and penetrate through the contact plate (205).

7. A circuit board laminating device according to claim 6, wherein, A connecting rod (207) is fixed to the front end of each top plate structure (204). The connecting rod (207) with an external thread penetrates through a pull plate structure (208), a nut is fixed to the outside of the connecting rod (207), and is fixedly connected to the pull plate structure (208). The pull plate structure (208) drives the three top plate structures (204) to move together.

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