Tin removing device for integrated circuit element

Abstract

The utility model discloses a detinning device for an integrated circuit element, which comprises a device base, a supporting column fixedly connected to the top end of the device base, a rotating lantern ring sleeved outside the supporting column, a positioning disc fixedly connected to the top end of the supporting column, and a heating support and a suction support connected to two ends of the rotating lantern ring. A heating driving assembly is arranged at the lower end of the heating support, a heating pen is movably connected to the upper end of the heating support, and the heating driving assembly is connected with the heating pen through a cable. The upper end of the suction support is movably connected with a suction pipe, and a suction pump is fixedly arranged at the lower end of the suction support and connected with the suction pipe. Different integrated circuit elements can be fixed by adjusting the positioning disc, the heating pen and the suction pipe are adjusted to accurately position a tin removal point, heat tin removal and suck away soldering tin, the angles of the heating support and the suction support are adjusted by rotating the rotating lantern ring so as to adjust the positions of the tin removal point of the heating pen and the suction pipe on the integrated circuit elements, operation stability is achieved, and the tin removal efficiency is improved. And comprehensive and accurate tin removal is achieved, and element damage is reduced.

Description

Technical Field

[0001] The utility model relates to a tin removal device for integrated circuit components, belonging to the technical field of tin removal equipment. Background Art

[0002] In the field of integrated circuit manufacturing and maintenance, component soldering and tin removal on circuit boards are common operations. With the rapid development of electronic technology, the size of integrated circuit components is getting smaller and the density is getting higher, which puts forward higher requirements for the accuracy and efficiency of tin removal operations. Traditional tin removal devices for integrated circuit components mostly rely on manual operations, such as using hot air guns, desoldering pumps and other tools for tin removal. These methods have many deficiencies;

[0003] Firstly, the existing tin removal devices often lack flexibility and are difficult to adapt to circuit boards of different specifications and sizes; due to the diversity of integrated circuit components and the complexity of circuit board designs, the component layouts and solder joint positions on circuit boards are different, and traditional tin removal tools usually cannot accurately control the tin removal area, easily causing damage to adjacent components or the circuit board itself, affecting the overall performance and reliability of the product;

[0004] In addition, the existing tin removal devices are also unable to cope with circuit boards of different thicknesses. With the trend of thinner and lighter electronic products, the thickness of circuit boards is gradually decreasing, and traditional tin removal tools often cannot be flexibly adjusted according to the actual thickness of the circuit board, resulting in excessive pressure or uneven force during tin removal, which may damage the circuit board or components. Summary of the Utility Model

[0005] Utility Model Objective: In order to solve the problem that most of the existing tin removal devices for integrated circuit components use a motor to drive a clamping base to rotate to flexibly control the rotation angle of the integrated circuit component, so as to facilitate meeting the requirements of heating and melting tin at different angles and sucking out residual materials. However, in the actual tin removal process, the angle changes frequently. The clamping base driven by a motor requires a device with a certain precision and a relatively high cost. Not only does it affect the operation efficiency due to the reaction time required for starting and stopping, but also it is prone to equipment failures due to frequent starting and stopping, making it difficult to meet the actual use requirements. The objective of the present utility model is to provide a tin removal device for integrated circuit components.

[0006] Technical solution: The tin removal device for an integrated circuit component of the present utility model includes a device base. A support column is fixedly connected to the top end of the device base. A rotating collar is sleeved outside the support column. A positioning disk is fixedly connected to the top end of the support column. Heating brackets and suction brackets are symmetrically and fixedly connected to both ends of the rotating collar. A heating drive assembly is provided at the lower end of the heating bracket. A heating pen is movably connected to the upper end of the heating bracket. The upper end of the heating drive assembly is connected to the end of the heating pen through a cable. A suction pipe is movably connected to the upper end of the suction bracket. A suction pump is fixedly provided at the lower end of the suction bracket. The end of the input pipe of the suction pump is connected to the suction pipe in a penetrating manner. By adjusting the positioning disk, integrated circuit components of different specifications and different thicknesses can be flexibly fixed. By adjusting the angles and heights of the heating pen and the suction pipe, the tin removal points can be accurately positioned, and heating tin removal and sucking away the solder can be carried out. By rotating the rotating collar, the angles of the heating bracket and the suction bracket are adjusted to adjust the positions of the heating pen and the suction pipe at the tin removal points on the integrated circuit component, so as to achieve comprehensive tin removal.

[0007] Further, a cross-shaped movable groove is opened on the top surface of the positioning disk. Limit U-shaped frames are fixedly connected in all four directions at the inner top end of the cross-shaped movable groove. A connecting groove is opened on the top surface of the limit U-shaped frame. A limit plate is movably clamped inside the cross-shaped movable groove. A connecting stud is fixedly connected to the top end of the limit plate (304). A connecting ring is screwed on the outside of the connecting stud. A rotating groove is opened on the bottom surface of the connecting ring. A rotating block is slidably connected inside the rotating groove. The bottom end of the rotating block is fixedly connected to a connecting block through a connecting column.

[0008] Furthermore, the connecting ring is slidably connected to the top of the limit U-shaped frame through the connecting groove and the connecting block. While the connecting ring is slidably connected to the limit U-shaped frame through the rotating groove and the rotating block with matching specifications, it rotates and is screwed around the connecting stud.

[0009] Furthermore, lifting studs are screwed inside the connecting studs. A pressing plate limiting column is fixedly connected to the top end of the lifting stud. A pressing plate is sleeved outside the pressing plate limiting column. A rubber pad is fixedly connected to the end of the bottom surface of the pressing plate.

[0010] Further, a heating moving groove is opened on the top surface of the heating bracket. A heating moving block is slidably connected inside the heating moving groove. Heating rotating grooves are opened on both sides inside the heating moving groove. A heating limiting column is fixedly connected to one end of the heating moving block. The heating limiting column passes through the heating rotating groove and is fixedly connected to one end of the heating moving block. A heating rotating stud is fixedly connected to the other end of the heating moving block. After the heating rotating stud passes through the heating rotating groove, a heating positioning nut is screwed on the outside. The heating pen is screwed inside the heating moving block.

[0011] Further, a suction moving groove is formed in the upper end surface of one side of the suction bracket facing the heating bracket. A suction moving block is slidably connected inside the suction moving groove. Suction rotating grooves are formed on both sides inside the suction moving groove. One end of the suction moving block is fixedly connected with a suction limiting column. The suction limiting column passes through the suction rotating groove and is fixedly connected with one end of the suction moving block. The other end of the suction moving block is fixedly connected with a suction rotating screw column. The outer side of the suction rotating screw column passing through the suction rotating groove is threadedly connected with a suction positioning nut. The end of the suction pump input pipe penetrates through the suction moving block and is connected with the suction pipe.

[0012] Furthermore, a telescopic threaded cylinder is threadedly connected inside the suction moving block. A suction pipe limiting groove is formed inside the telescopic threaded cylinder. A suction pipe limiting ring is fixedly connected to the outer side of the suction pipe. The suction pipe limiting ring is clamped with the suction pipe limiting groove.

[0013] Further, a suction machine box is fixedly connected to the bottom end of one side of the suction bracket. The suction pump is arranged on the top end of the suction machine box.

[0014] Furthermore, a collecting box is arranged on one side of the suction machine box.

[0015] Beneficial effects: Compared with the prior art, the utility model has the following remarkable advantages:

[0016] (1) In the utility model, a connecting ring for screwing and fixing is sleeved and screwed outside the limiting plate movably clamped inside the cross moving groove. The connecting ring is slidably connected with the limiting U-shaped frame through the connecting groove and the connecting block, so as to flexibly adjust the position of the limiting plate and its connecting structure to adapt to different specifications of circuit board sizes. And the purpose of rotation is realized through the rotation groove and the rotating block while maintaining the connection with the limiting U-shaped frame, so as to fix its position through the mutual pressing action between the limiting plate and the connecting ring after the position of the limiting plate is determined. The pressing plate block is rotatably connected to the top end of the lifting screw column by sleeving outside the pressing plate limiting column, and the thickness of different specifications of circuit boards is adjusted and adapted through the screwing state of the lifting screw column and the connecting screw column, driving the pressing plate block holding the rubber pad to stably press the circuit board.

[0017] (2) In the present utility model, the heating pen is screwed and connected inside the heating moving block. The height spacing between the heating end of the heating pen and the positioning disc is accurately adjusted through the screwing connection relationship. The heating moving block can flexibly move horizontally at the top of the heating bracket through the heating moving groove and the heating rotating groove, that is, the horizontal spacing between the heating pen and the tin removal point is flexibly adjusted. The structure of the heating moving block through the heating limit post and the heating rotating screw column and the heating rotating groove can also flexibly adjust the rotation angle of the heating moving block to adapt to different requirements for the inclination angle of the heating pen during the heating process, and the angle is conveniently fixed through the heating positioning nut. The suction pipe is clamped inside the telescopic threaded cylinder through the suction pipe limit ring and the suction pipe limit groove. The connection structure of the telescopic threaded cylinder is similar to the connection structure of the heating pen, and the purpose of adjusting the horizontal spacing between the suction pipe and the tin removal point and the inclination angle of the suction pipe is also achieved. This structure where the heating bracket and the suction bracket can flexibly rotate around the positioning disc through the rotating collar replaces the general motor-driven positioning disc rotation structure. Without using a high-precision motor, it can meet the purpose of realizing the rotation angle with a stable mechanical structure, reducing the production cost, and also avoiding the problems of reduced operation efficiency and frequent equipment failures caused by the frequent start and stop when using the motor. Description of the Drawings

[0018] Figure 1 is the overall structural schematic diagram of the tin removal device for integrated circuit components of the present utility model;

[0019] Figure 2 is the structural schematic diagram of the rotating collar in the tin removal device for integrated circuit components of the present utility model;

[0020] Figure 3 is the structural schematic diagram of the positioning disc in the tin removal device for integrated circuit components of the present utility model;

[0021] Figure 4 is the structural schematic diagram of the pressure plate in the tin removal device for integrated circuit components of the present utility model;

[0022] Figure 5 is the structural schematic diagram of the heating bracket in the tin removal device for integrated circuit components of the present utility model;

[0023] Figure 6 is the structural schematic diagram of the suction bracket in the tin removal device for integrated circuit components of the present utility model;

[0024] Figure 7 is the structural schematic diagram of the telescopic threaded cylinder in the tin removal device for integrated circuit components of the present utility model;

[0025] Figure 8 is the structural schematic diagram of the suction chassis in the tin removal device for integrated circuit components of the present utility model;

[0026] In the figure: 1. Device base; 2. Support column; 3. Positioning disk; 301. Cross-shaped movable groove; 302. Limiting U-shaped frame; 303. Connecting groove; 304. Limiting plate; 305. Connecting stud; 306. Connecting ring; 307. Rotating groove; 308. Rotating block; 309. Connecting column; 310. Connecting block; 311. Lifting stud; 312. Pressing plate limiting column; 313. Pressing plate block; 314. Rubber pad; 4. Rotating collar; 5. Heating bracket; 501. Heating moving groove; 502. Heating moving block; 503. Heating limiting column; 504. Heating rotating stud; 505. Heating positioning nut; 506. Heating rotating groove; 507. Heating pen; 508. Heating drive assembly; 6. Suction bracket; 601. Suction moving groove; 602. Suction moving block; 603. Suction limiting column; 604. Suction rotating stud; 605. Suction positioning nut; 606. Suction rotating groove; 607. Telescopic threaded cylinder; 608. Suction machine box; 609. Suction pump; 610. Suction pipe; 611. Suction pipe limiting ring; 612. Suction pipe limiting groove; 613. Aggregate box. Detailed implementation mode

[0027] The technical solution of the present utility model will be further described below in conjunction with the accompanying drawings.

[0028] The technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0029] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected", "set" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The following describes the embodiments according to the overall structure of the present utility model.

[0030] As Figure 1-2 shown, a tin removal device for an integrated circuit element according to the present utility model includes: a device base 1, a support column 2, a positioning disk 3, a rotating collar 4, a heating bracket 5, and a suction bracket 6. The support column 2 is located at the top of the device base 1 and is fixedly connected to the device base 1. The rotating collar 4 is sleeved outside the support column 2, and heating brackets 5 and suction brackets 6 are symmetrically and fixedly connected to both ends of the rotating collar 4. The positioning disk 3 is located at the top of the support column 2 and is fixedly connected to the support column 2.

[0031] Among them, as Figure 3-4 shown, the positioning disk 3 includes a cross-shaped movable groove 301, a limiting U-shaped frame 302, a connecting groove 303, a limiting plate 304, a connecting stud 305, a connecting ring 306, a rotating groove 307, a rotating block 308, a connecting column 309, a connecting block 310, a lifting stud 311, a pressing plate limiting column 312, a pressing plate block 313, and a rubber pad 314.

[0032] On the top surface of the positioning plate 3, a cross-shaped movable groove 301 is provided. At the inner top end of the cross-shaped movable groove 301, four-way limit U-shaped frames 302 are fixedly connected. On the top surfaces of the four limit U-shaped frames 302, connection grooves 303 are provided. Inside the four connection grooves 303, limit plates 304 are movably clamped. At the top ends of the four limit plates 304, connection studs 305 are fixedly connected. On the outer sides of the four connection studs 305, connection rings 306 are screwed. On the bottom surfaces of the four connection rings 306, rotation grooves 307 are provided. Inside the four rotation grooves 307, rotation blocks 308 are slidably connected. At the bottom ends of the four rotation blocks 308, connection blocks 310 are fixedly connected through connection columns 309. The connection ring 306 is slidably connected to the top of the limit U-shaped frame 302 through the connection groove 303 and the connection block 310. While the connection ring 306 is slidably connected to the limit U-shaped frame 302 through the rotation groove 307 and the rotation block 308 with matching specifications, it rotates and is screwed around the connection stud 305. Inside the four connection studs 305, lifting studs 311 are screwed. At the top ends of the four lifting studs 311, pressure plate limit columns 312 are fixedly connected. On the outer sides of the four pressure plate limit columns 312, pressure plates 313 are sleeved. At the end of the bottom surface of the four pressure plates 313, rubber pads 314 are fixedly connected.

[0033] Adopting the above positioning plate 3 solution: A connection ring 306 for screwing and fixing is sleeved and screwed outside the limit plate 304 movably clamped inside the cross-shaped movable groove 301. The connection ring 306 is slidably connected to the limit U-shaped frame 302 through the connection groove 303 and the connection block 310, so as to flexibly adjust the position of the limit plate 304 and its connection structure to adapt to different specifications of circuit board sizes. And through the rotation groove 307 and the rotation block 308, the purpose of rotation is achieved while maintaining the connection with the limit U-shaped frame 302, so that after determining the position of the limit plate 304, its position is fixed through the mutual pressing action with the connection ring 306. The pressure plate 313 is rotatably connected to the top end of the lifting stud 311 by sleeving outside the pressure plate limit column 312, and the thickness of different specifications of circuit boards is adjusted and adapted through the screwed state of the lifting stud 311 and the connection stud 305, driving the pressure plate 313 holding the rubber pad 314 to firmly press the circuit board.

[0034] Such as Figure 5As shown in the figure, the heating bracket 5 includes a heating moving groove 501, a heating moving block 502, a heating limiting column 503, a heating rotating stud 504, a heating positioning nut 505, a heating rotating groove 506, a heating pen 507, and a heating driving assembly 508. A heating moving groove 501 is formed on the top surface (in the up-down direction) of the heating bracket 5. A heating moving block 502 is slidably connected inside the heating moving groove 501. Heating rotating grooves 506 are formed on both sides (in the direction tangent to the heating moving groove 501) inside the heating moving groove 501. The heating limiting column 503 passes through the heating rotating groove 506 and is fixedly connected to one end of the heating moving block 502. The other end of the heating moving block 502 is fixedly connected to a heating rotating stud 504. The heating rotating stud 504 passes through the heating rotating groove 506 and is threadedly connected to a heating positioning nut 505 on the outside. A heating pen 507 is threadedly connected inside the heating moving block 502. A heating driving assembly 508 is fixedly connected to one side of the bottom of the heating bracket 5. The upper end of the heating driving assembly 508 is connected to the end of the heating pen 507 through a cable.

[0035] Adopting the above heating bracket 5 solution: The heating pen 507 is threadedly connected inside the heating moving block 502, and the height distance between the heating end of the heating pen 507 and the positioning disc 3 is accurately adjusted through the screwing connection relationship. The heating moving block 502 flexibly moves horizontally at the top of the heating bracket 5 through the heating moving groove 501 and the heating rotating groove 506, that is, the horizontal distance between the heating pen 507 and the desoldering point is flexibly adjusted. The structure of the heating moving block 502 through the heating limiting column 503 and the heating rotating stud 504 and the heating rotating groove 506 can also flexibly adjust the rotation angle of the heating moving block 502 to adapt to different requirements for the inclination angle of the heating pen 507 during the heating process, and the angle is conveniently fixed through the heating positioning nut 505.

[0036] As Figure 6-8 shown in the figure, the suction bracket 6 further includes a suction moving groove 601, a suction moving block 602, a suction limiting column 603, a suction rotating stud 604, a suction positioning nut 605, a suction rotating groove 606, a telescopic threaded cylinder 607, a suction chassis 608, a suction pump 609, a suction pipe 610, a suction pipe limiting ring 611, a suction pipe limiting groove 612, and an aggregate box 613.

[0037] On one upper end face of the suction bracket 6, a suction movement groove 601 is formed in the direction towards the heating bracket 5. A suction movement block 602 is slidably connected inside the suction movement groove 601. On both sides inside the suction movement groove 601 (in the direction tangent to the suction movement groove 601), suction rotation grooves 606 are formed. A suction limit post 603 passes through the suction rotation groove 606 and is fixedly connected to one end of the suction movement block 602. The other end of the suction movement block 602 is fixedly connected to a suction rotation screw post 604. After passing through the suction rotation groove 606, a suction positioning nut 605 is threadedly connected to the outside of the suction rotation screw post 604. A telescopic threaded cylinder 607 is threadedly connected inside the suction movement block 602. One bottom end of the suction bracket 6 is fixedly connected to a suction machine case 608. A suction pump 609 is arranged at the top end of the suction machine case 608. The end of the input pipe of the suction pump 609 penetrates through the telescopic threaded cylinder 607 and is connected to a suction pipe 610. A suction pipe limit ring 611 is fixedly connected to the outside of the suction pipe 610. A suction pipe limit groove 612 is formed inside the telescopic threaded cylinder 607. The suction pipe limit ring 611 is clamped in the suction pipe limit groove 612. An aggregate box 613 is arranged on one side of the suction machine case 608.

[0038] Adopting the above suction bracket 6 solution: The suction pipe 610 is clamped inside the telescopic threaded cylinder 607 through the suction pipe limit ring 611 and the suction pipe limit groove 612. The connection structure of the telescopic threaded cylinder 607 is similar to the connection structure of the heating pen 507 (that is, the structural settings of 601 - 606 are similar to those of 501 - 507), and the purpose of adjusting the horizontal distance between the suction pipe 610 and the tin removal point and the inclination angle of the suction pipe 610 is also achieved.

[0039] In this utility model, the heating bracket 5 and the suction bracket 6 adopt a structure that can flexibly rotate around the positioning disk 3 through the rotating collar 4, replacing the general motor-driven positioning disk 3 rotation structure. Without using a high-precision motor, it can meet the requirement of a stable mechanical structure to achieve the purpose of the rotation angle, reducing the production cost and avoiding the problems of reduced operation efficiency and frequent equipment failures caused by the frequent start and stop when using the motor.

[0040] The working principle of this utility model:

[0041] In use, the positioning plate 3 is fixedly connected to the top end of the device base 1 through the support column 2. A connecting ring 306 for screwing and fixing is sleeved outside the limiting plate 304 that is movably clamped inside the cross-shaped movable groove 301. The connecting ring 306 is slidably connected to the limiting U-shaped frame 302 through the connecting groove 303 and the connecting block 310, so as to flexibly adjust the position of the limiting plate 304 to adapt to circuit boards of different specifications. And through the rotation groove 307 and the rotation block 308, the purpose of rotation is achieved while maintaining the connection with the limiting U-shaped frame 302, so as to fix its position through the pressing action between it and the connecting ring 306 after determining the position of the limiting plate 304. The pressing plate block 313 is rotatably connected to the top end of the lifting screw column 311 by sleeving outside the pressing plate limiting column 312, and the thickness of circuit boards of different specifications is adjusted and adapted through the screwing state of the lifting screw column 311 and the connecting screw column 305, driving the pressing plate block 313 holding the rubber pad 314 to firmly press the circuit board. When performing the operation of heating and desoldering the integrated circuit components on the circuit board, the rotation angle of the heating bracket 5 and the suction bracket 6 is flexibly controlled through the rotating collar 4, so that the two correspond to the desoldering position of the components. The heating pen 507 is screwed and connected inside the heating moving block 502, and the height distance between the heating end of the heating pen 507 and the positioning plate 3 is accurately adjusted through the screwing relationship. The heating moving block 502 flexibly moves horizontally at the top of the heating bracket 5 through the heating moving groove 501 and the heating rotation groove 506, that is, the horizontal distance between the heating pen 507 and the desoldering point is flexibly adjusted. The structure of the heating moving block 502 through the heating limiting column 503 and the heating rotating screw column 504 and the heating rotation groove 506 can also flexibly adjust the rotation angle of the heating moving block 502 to adapt to different requirements for the inclination angle of the heating pen 507 during the heating process, and the angle is conveniently fixed through the heating positioning nut 505. The suction pipe 610 is clamped inside the telescopic threaded cylinder 607 through the suction pipe limiting ring 611 and the suction pipe limiting groove 612. The connection structure of the telescopic threaded cylinder 607 is similar to the connection structure of the heating pen 507, and the purpose of adjusting the horizontal distance between the suction pipe 610 and the desoldering point and the inclination angle of the suction pipe 610 is also achieved. This structure in which the heating bracket 5 and the suction bracket 6 can flexibly rotate around the positioning plate 3 through the rotating collar 4 replaces the general structure of driving the positioning plate 3 to rotate by a motor. Without using a high-precision motor, it can meet the purpose of realizing the rotation angle with a stable mechanical structure, reducing the production cost, and also avoiding the problems of reduced operation efficiency and frequent equipment failures caused by the frequent start and stop when using the motor. The soldering tin sucked by the suction pump 609 is centrally collected through the collecting box 613.

[0042] The above-mentioned is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent replacements or changes, and should be covered within the protection scope of the present invention.

Claims

1. A device for removing solder from an integrated circuit component, characterized in that, It includes a device base (1). A support column (2) is fixedly connected to the top end of the device base (1). A rotating collar (4) is sleeved outside the support column (2). A positioning disk (3) is fixedly connected to the top end of the support column (2). Heating brackets (5) and suction brackets (6) are symmetrically and fixedly connected to both ends of the rotating collar (4). A heating drive assembly (508) is provided at the lower end of the heating bracket (5). A heating pen (507) is movably connected to the upper end of the heating bracket (5). The upper end of the heating drive assembly (508) is connected to the end of the heating pen (507) through a cable. A suction pipe (610) is movably connected to the upper end of the suction bracket (6). A suction pump (609) is fixedly provided at the lower end of the suction bracket (6). The end of the input pipe of the suction pump (609) is connected to the suction pipe (610) in a through manner. By adjusting the positioning disk (3), integrated circuit components of different specifications and different thicknesses can be flexibly fixed. By adjusting the angles and heights of the heating pen (507) and the suction pipe (610), the de-tinning points can be accurately positioned, and heating de-tinning and sucking away the solder can be carried out. By rotating the rotating collar (4) to adjust the angles of the heating bracket (5) and the suction bracket (6), the positions of the de-tinning points of the heating pen (507) and the suction pipe (610) on the integrated circuit component can be adjusted to achieve comprehensive de-tinning.

2. The tin removal device for an integrated circuit component according to claim 1, wherein, A cross-shaped movable groove (301) is opened on the top surface of the positioning disk (3). Four-way inner top ends of the cross-shaped movable groove (301) are fixedly connected with limiting U-shaped frames (302). A connecting groove (303) is opened on the top surface of the limiting U-shaped frame (302). A limiting plate (304) is movably clamped inside the cross-shaped movable groove (301). A connecting stud (305) is fixedly connected to the top end of the limiting plate (304). A connecting ring (306) is screwed outside the connecting stud (305). A rotating groove (307) is opened on the bottom surface of the connecting ring (306). A rotating block (308) is slidably connected inside the rotating groove (307). The bottom end of the rotating block (308) is fixedly connected with a connecting block (310) through a connecting column (309).

3. The tin removal device for an integrated circuit component according to claim 2, wherein, The connecting ring (306) is slidably connected to the top of the limiting U-shaped frame (302) through the connecting groove (303) and the connecting block (310). While the connecting ring (306) is slidably connected to the limiting U-shaped frame (302) through the rotating groove (307) and the rotating block (308) with matching specifications, it rotates and is screwed around the connecting stud (305).

4. The desoldering device for the integrated circuit component according to claim 2 or 3, characterized in that, Lifting studs (311) are screwed inside the connecting studs (305). A pressing plate limiting column (312) is fixedly connected to the top end of the lifting stud (311). A pressing plate block (313) is sleeved outside the pressing plate limiting column (312). A rubber pad (314) is fixedly connected to the end of the bottom surface of the pressing plate block (313).

5. The tin removal device for an integrated circuit component according to claim 1, wherein, The top surface of the heating bracket (5) is provided with a heating moving groove (501). A heating moving block (502) is slidably connected inside the heating moving groove (501). Both sides inside the heating moving groove (501) are provided with heating rotating grooves (506). One end of the heating moving block (502) is fixedly connected with a heating limiting column (503). The heating limiting column (503) passes through the heating rotating groove (506) and is fixedly connected with one end of the heating moving block (502). The other end of the heating moving block (502) is fixedly connected with a heating rotating stud (504). The heating rotating stud (504) passes through the heating rotating groove (506) and is threadedly connected with a heating positioning nut (505) on the outside. The heating pen (507) is threadedly connected with the inside of the heating moving block (502).

6. The tin removal device for an integrated circuit component according to claim 1, characterized in that, On one side, the upper end surface of the suction bracket (6) is provided with a suction moving groove (601) facing the direction of the heating bracket (5). A suction moving block (602) is slidably connected inside the suction moving groove (601). Both sides inside the suction moving groove (601) are provided with suction rotating grooves (606). One end of the suction moving block (602) is fixedly connected with a suction limiting column (603). The suction limiting column (603) passes through the suction rotating groove (606) and is fixedly connected with one end of the suction moving block (602). The other end of the suction moving block (602) is fixedly connected with a suction rotating stud (604). The suction rotating stud (604) passes through the suction rotating groove (606) and is threadedly connected with a suction positioning nut (605) on the outside. The end of the input pipe of the suction pump (609) penetrates through the suction moving block (602) and is connected with the suction pipe (610).

7. The desoldering device for an integrated circuit component according to claim 6, characterized in that, A telescopic threaded cylinder (607) is threadedly connected with the inside of the suction moving block (602). A suction pipe limiting groove (612) is arranged inside the telescopic threaded cylinder (607). A suction pipe limiting ring (611) is fixedly connected with the outside of the suction pipe (610). The suction pipe limiting ring (611) is clamped with the suction pipe limiting groove (612).

8. The desoldering device for an integrated circuit component according to claim 1, characterized in that, One side of the bottom end of the suction bracket (6) is fixedly connected with a suction machine box (608). The suction pump (609) is arranged on the top end of the suction machine box (608).

9. The de-tinning device for an integrated circuit component according to claim 8, characterized in that, An aggregate box (613) is arranged on one side of the suction machine box (608).

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