Laser cutting platform for flexible panel

Abstract

The utility model relates to the field of flexible panel machining, in particular to a laser cutting platform for a flexible panel, the flexible panel to be chamfered is placed on a platform main body, a cutting track groove is formed in the platform main body, a light-transmitting plate is embedded in the bottom of the cutting track groove, and the light-transmitting plate penetrates through the whole platform main body; positioning devices used for grabbing flexible panel surface marks are installed on the upper portion and the lower portion of the platform body. The positioning device comprises a light source and a CCD camera, the light source is installed at the bottom of the platform body and vertically penetrates through the light-transmitting plate, and the CCD camera is installed at the top of the platform body; the waste collecting area comprises an outer adsorption area annularly distributed on the periphery of the platform body and an inner adsorption area formed in the cutting track groove, the outer adsorption area is annularly distributed on the periphery of the platform body, and the interior of the inner adsorption area communicates with the outer adsorption area through an inner adsorption pipeline. A backlight lighting recognition mode is adopted, the marked contour is clear and is not affected by materials and bubbles, and the laser cutting efficiency is effectively improved.

Description

Technical Field

[0001] This application relates to the field of flexible panel processing, and in particular to a laser cutting platform for flexible panels. Background Art

[0002] In traditional laser cutting equipment, before the CCD camera grabs the mark, the flexible panel is placed on the platform. After the camera and the light source grab and identify from top to bottom, laser cutting starts. A layer of support film material is attached to the bottom of the flexible panel. Due to material problems and micro-bubbles in the attachment of the support film, there are phenomena such as unclear display of the mark and abnormal grabbing by the CCD camera. The mark recognition alarm occurs frequently, seriously affecting the production output of the equipment and the equipment utilization rate; moreover, the platform is made of metal, and backlight transmission cannot be performed, and the main body of the laser platform cannot be replaced with acrylic. Utility Model Content

[0003] In order to overcome the problems existing in the prior art, this application provides a laser cutting platform for flexible panels.

[0004] The laser cutting platform for flexible panels provided by this application adopts the following technical solutions:

[0005] A laser cutting platform for flexible panels includes a platform main body, on which a flexible panel to be cut and chamfered is placed. A cutting track groove is opened on the platform main body, and a light-transmitting plate is inlaid at the bottom of the cutting track groove, and the light-transmitting plate penetrates through the entire platform main body. A positioning device for grabbing the mark on the surface of the flexible panel is installed above and below the platform main body; the positioning device includes a light source and a CCD camera. The light source is installed at the bottom of the platform main body and vertically penetrates through the light-transmitting plate, and the CCD camera is installed on the top of the platform main body; a waste collection area, which includes an outer adsorption area annularly distributed around the platform main body and an inner adsorption area opened in the cutting track groove. The outer adsorption area is annularly distributed around the platform main body, and the inner adsorption area is communicated with the outer adsorption area through an inner adsorption pipeline.

[0006] By adopting the above technical solutions, a cutting track groove adapted to the laser cutting equipment is opened on the platform main body, a light-transmitting plate is inlaid on the inner side of the grooved part, and the positioning device is set to backlight the platform main body with the light source from below. The light source passes through the light-transmitting plate, and the CCD camera identifies the mark on the flexible panel from the top, making the contour of the flexible panel clear and not affected by materials and bubbles. And a waste collection area is set on the platform main body. The outer adsorption area in the waste collection area adsorbs large-sized fragments cut from the edge of the flexible panel, and the inner adsorption area is set in the cutting track groove to adsorb the debris generated at the cutting part.

[0007] Preferably, the platform main body includes a base and a placement plate installed on the base. The base adopts an annular frame structure, and a number of vacuum adsorption holes for adsorbing the flexible panel are evenly distributed on the surface of the placement plate.

[0008] Preferably, there are two sets of placement trays, which are fixedly connected between the placement trays, and both sides of the placement trays are slidably connected to the base. A telescopic mechanism for driving the placement trays to slide on the base is installed at the end of the base.

[0009] By adopting the above technical solution, in the platform main body, the telescopic mechanism on the base drives the two fixedly connected placement trays to move on the base, so that when the flexible panel on a single placement tray is cut, the loading and unloading of the flexible panel can be carried out on the other placement tray, effectively improving the laser cutting efficiency.

[0010] Preferably, the vacuum adsorption holes on the placement tray are externally connected to a negative pressure pump, and a valve is provided in each single vacuum adsorption hole.

[0011] By adopting the above technical solution, the vacuum adsorption holes on the placement tray are each equipped with a separate valve, which can enable different numbers according to the size of the flexible panel, and close the valve when the vacuum adsorption holes are not in use, and can also effectively prevent the entry of impurities.

[0012] Preferably, the light-transmitting plate is made of transparent acrylic plate, and the light-transmitting plates are distributed in strips at the bottom of the cutting track groove.

[0013] By adopting the above technical solution, the strip-shaped transparent plates can allow the light source at the bottom to penetrate through the platform main body, and being arranged at the bottom of the cutting track groove can effectively avoid the influence of laser cutting on the transparent acrylic plate.

[0014] Preferably, the inner adsorption pipeline connected to the inner adsorption area is located outside the cutting track groove, and a plurality of adsorption holes communicating with the inner adsorption pipeline are installed at the bottom of the side surface of the cutting track groove.

[0015] By adopting the above technical solution, the inner adsorption area is connected to the outside of the cutting track groove through the inner adsorption pipeline, and the particles in the groove are sucked away through the adsorption holes outside the cutting track groove.

[0016] Preferably, the outer adsorption area is installed at the four peripheral edges of the placement tray, and the opening of the outer adsorption area faces the center of the placement tray. The outer adsorption area is connected to the collection chamber through an outer adsorption pipeline, and an adsorption pump is installed in the collection chamber.

[0017] By adopting the above technical solution, the outer adsorption area sucks away the fragments cut by the laser on the flexible panel from the adsorption tray through the adsorption ports around the placement tray, and collects them in the collection chamber at the bottom.

[0018] Preferably, the flexible panel adopts a rectangular structure, and the light-transmitting plate can transmit the light irradiated by the light source through the platform main body from the four sides of the flexible panel.

[0019] By adopting the above technical solutions, such a design changes the backlight mode of the CCD, and performs backlight illumination recognition on the flexible panel from bottom to top.

[0020] In summary, the present application includes at least one of the following beneficial technical effects:

[0021] 1. The present application designs a platform that can be used corresponding to a flexible laser cutting device. This platform design changes the backlight mode of the CCD camera, and performs backlight illumination recognition on the flexible panel from bottom to top. The contour marked by the backlight illumination recognition method under the CCD camera is clear, not affected by materials and bubbles, and effectively prevents problems such as abnormal mark recognition.

[0022] 2. By setting a waste collection area in the present application, large-sized fragments cut from the edge of the flexible panel are adsorbed through the outer adsorption area, and the inner adsorption area is arranged in the cutting track groove to adsorb the debris generated at the cutting position, reducing the cleaning time of the platform main body during the laser cutting process and improving the cutting efficiency. Description of the Drawings

[0023] Figure 1 is a schematic structural diagram of the platform main body in a laser cutting platform for a flexible panel;

[0024] Figure 2 is a schematic cross-sectional structural diagram of a laser cutting platform for a flexible panel;

[0025] Figure 3 is a schematic structural diagram of the light source passing through the light-transmitting plate in a laser cutting platform for a flexible panel.

[0026] Description of the reference numerals: 1. Platform main body; 11. Flexible panel; 12. Cutting track groove; 13. Light-transmitting plate; 14. Base; 141. Telescopic mechanism; 15. Placing plate; 151. Vacuum adsorption hole; 152. Negative pressure pump; 2. Positioning device; 21. Light source; 22. CCD camera; 3. Waste collection area; 31. Outer adsorption area; 311. Outer adsorption pipeline; 312. Collection cavity; 313. Adsorption pump; 32. Inner adsorption area; 321. Inner adsorption pipeline; 322. Adsorption hole. Detailed Description of the Embodiment

[0027] The following will further describe the present application in detail Figures 1-3 with reference to the attached

[0028] The embodiment of the present application discloses a laser cutting platform for a flexible panel.

[0029] Refer to Figure 1 、 Figure 2 and Figure 3, a laser cutting platform for a flexible panel, comprising a platform main body 1, on which a flexible panel 11 to be cut and chamfered is placed. A cutting track groove 12 is provided on the platform main body 1, and a light-transmitting plate 13 is inlaid at the bottom of the cutting track groove 12, and the light-transmitting plate 13 penetrates through the entire platform main body 1. A positioning device 2 for grasping the marks on the surface of the flexible panel 11 is installed above and below the platform main body 1; the positioning device 2 includes a light source 21 and a CCD camera 22. The light source 21 is installed at the bottom of the platform main body 1 and vertically penetrates through the light-transmitting plate 13, and the CCD camera 22 is installed at the top of the platform main body 1; a waste collection area 3, the waste collection area 3 includes an outer adsorption area 31 annularly distributed around the platform main body 1 and an inner adsorption area 32 provided in the cutting track groove 12. The outer adsorption area 31 is annularly distributed around the platform main body 1, and the inner adsorption area 32 is communicated with the outer adsorption area 31 through an inner adsorption pipeline 321. A cutting track groove 12 adapted to a laser cutting device is provided on the platform main body 1, a light-transmitting plate 13 is inlaid on the inner side of the grooved part, and the set positioning device 2 backlights the platform main body 1 with the light source 21 from below. The light source 21 passes through the light-transmitting plate 13, and the CCD camera 22 identifies the marks on the flexible panel 11 from the top, so that the contour of the flexible panel 11 is clear and not affected by materials and bubbles. And a waste collection area 3 is provided on the platform main body 1. The outer adsorption area 31 in the waste collection area 3 adsorbs large-sized fragments cut from the edge of the flexible panel 11, and the inner adsorption area 32 is provided in the cutting track groove 12 for adsorbing debris generated at the cutting part.

[0030] Referring to Figure 1 , Figure 2 and Figure 3 , the platform main body 1 includes a base 14 and a placement plate 15 installed on the base 14. The base 14 adopts an annular frame structure, and a plurality of vacuum adsorption holes 151 for adsorbing the flexible panel 11 are evenly distributed on the surface of the placement plate 15. There are two groups of placement plates 15, and the placement plates 15 are fixedly connected between them, and both sides of the placement plates 15 are slidably connected to the base 14. A telescopic mechanism 141 for driving the placement plate 15 to slide on the base 14 is installed at the end of the base 14. In the platform main body 1, the telescopic mechanism 141 on the base 14 drives the two fixedly connected placement plates 15 to move on the base 14, so that when the flexible panel 11 on a single placement plate 15 is cut, the loading and unloading of the flexible panel 11 can be carried out on the other placement plate 15, effectively improving the laser cutting efficiency.

[0031] Referring to Figure 1 , Figure 2 and Figure 3, the vacuum adsorption holes 151 on the placement plate 15 are externally connected to a negative pressure pump 152, and a valve is provided in each single vacuum adsorption hole 151. The vacuum adsorption holes 151 on the placement plate 15 are each equipped with a separate valve, which can enable different numbers according to the size of the flexible panel 11, and close the valve when the vacuum adsorption holes 151 are not in use, which can also effectively prevent the entry of impurities. The light-transmitting plate 13 is made of transparent acrylic, and the light-transmitting plate 13 is distributed in strips at the bottom of the cutting track groove 12. The strip-shaped distributed transparent plate allows the light source 21 at the bottom to penetrate the platform main body 1, and being arranged at the bottom of the cutting track groove 12 can effectively avoid the influence of laser cutting on the transparent acrylic plate.

[0032] Refer to Figure 1 , Figure 2 and Figure 3 , the inner adsorption pipeline 321 connected to the inner adsorption area 32 is located outside the cutting track groove 12, and several adsorption holes 322 communicating with the inner adsorption pipeline 321 are installed at the bottom of the side surface of the cutting track groove 12. The inner adsorption area 32 is connected to the outside of the cutting track groove 12 through the inner adsorption pipeline 321, and the particles in the groove are sucked away through the adsorption holes 322 outside the cutting track groove 12. The outer adsorption area 31 is installed on the four peripheral edges of the placement plate 15, and the opening of the outer adsorption area 31 faces the center of the placement plate 15. The outer adsorption area 31 is connected to the collection chamber 312 through the outer adsorption pipeline 311, and an adsorption pump 313 is installed in the collection chamber 312. The outer adsorption area 31 sucks away the fragments cut by laser on the flexible panel 11 from the adsorption plate through the adsorption ports around the placement plate 15 and collects them in the collection chamber 312 at its bottom. The flexible panel 11 adopts a rectangular structure, and the light-transmitting plate 13 can transmit the light irradiated by the light source 21 from around the flexible panel 11 through the platform main body 1. Such a design changes the CCD backlight mode and performs backlight illumination recognition on the flexible panel 11 from bottom to top.

[0033] Working principle: Place the flexible panel 11 to be cut on the placement plate 15 of the platform main body 1, start the light source 21 to perform backlight illumination on the platform main body 1 from below, the light source 21 passes through the light-transmitting plate 13 at the bottom of the cutting track groove 12, the CCD camera 22 identifies the marks on the flexible panel 11 from the top, and start the laser cutting device to perform cutting on the platform. After cutting, the outer adsorption area 31 in the waste collection area 3 of the platform main body 1 adsorbs the large-sized fragments cut from the edge of the flexible panel 11, and the inner adsorption area 32 is arranged in the cutting track groove 12 to adsorb the debris generated at the cutting position. And after cutting is completed, the two groups of fixedly connected placement plates 15 on the platform main body 1 are driven to move on the base 14 by the telescopic mechanism 141 on the base 14, and the flexible panel 11 on the other placement plate 15 can be loaded and unloaded while the flexible panel 11 on a single placement plate 15 is being cut.

[0034] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A laser cutting platform for a flexible panel, characterized in that: Including A platform main body (1) on which a flexible panel (11) to be cut and chamfered is placed. A cutting track groove (12) is formed in the platform main body (1). A light-transmitting plate (13) is embedded at the bottom of the cutting track groove (12), and the light-transmitting plate (13) penetrates through the entire platform main body (1). A positioning device (2) for grasping the marks on the surface of the flexible panel (11) is installed above and below the platform main body (1). The positioning device (2) includes a light source (21) and a CCD camera (22). The light source (21) is installed at the bottom of the platform main body (1) and vertically penetrates through the light-transmitting plate (13). The CCD camera (22) is installed at the top of the platform main body (1). A waste collection area (3) includes an outer adsorption area (31) annularly distributed around the platform main body (1) and an inner adsorption area (32) formed in the cutting track groove (12). The outer adsorption area (31) is annularly distributed around the platform main body (1), and the inner adsorption area (32) is communicated with the outer adsorption area (31) through an inner adsorption pipeline (321).

2. The laser cutting platform for a flexible panel according to claim 1, wherein: The platform main body (1) includes a base (14) and a placement plate (15) installed on the base (14). The base (14) adopts an annular frame structure, and a plurality of vacuum adsorption holes (151) for adsorbing the flexible panel (11) are evenly distributed on the surface of the placement plate (15).

3. The laser cutting platform for a flexible panel according to claim 2, characterized in that: There are two groups of the placement plates (15), and the placement plates (15) are fixedly connected between them. The two sides of the placement plate (15) are slidably connected to the base (14). A telescopic mechanism (141) for driving the placement plate (15) to slide on the base (14) is installed at the end of the base (14).

4. The laser cutting platform for a flexible panel according to claim 3, wherein: The vacuum adsorption holes (151) on the placement plate (15) are externally connected to a negative pressure pump (152), and a valve is provided in each single vacuum adsorption hole (151).

5. The laser cutting platform for a flexible panel according to claim 1, characterized in that: The light-transmitting plate (13) is made of a transparent acrylic plate and is installed at the edge of the platform. The light-transmitting plate (13) is strip-shaped and distributed inside the cutting track groove (12).

6. The laser cutting platform for a flexible panel according to claim 5, characterized in that: The inner adsorption pipeline (321) connected to the inner adsorption area (32) is located outside the cutting track groove (12). A plurality of adsorption holes (322) communicated with the inner adsorption pipeline (321) are installed at the bottom of the side surface of the cutting track groove (12).

7. The laser cutting platform for a flexible panel according to claim 6, characterized in that: The outer adsorption area (31) is installed at the four peripheral edges of the placement plate (15), and the opening of the outer adsorption area (31) faces the center of the placement plate (15). The outer adsorption area (31) is connected to a collection chamber (312) through an outer adsorption pipeline (311), and an adsorption pump (313) is installed in the collection chamber (312).

8. The laser cutting platform for a flexible panel according to claim 1, characterized in that: The flexible panel (11) adopts a rectangular structure. The light-transmitting plate (13) can transmit the light irradiated by the light source (21) from the periphery of the flexible panel (11) through the platform main body (1).

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