Wafer thinning and polishing device

Abstract

The utility model provides a wafer thinning and polishing device which comprises a rack and a wafer polishing device, the wafer polishing device comprises a polishing mechanism and a swing type wafer supporting mechanism, the polishing mechanism is arranged on the rack, and the swing type wafer supporting mechanism is rotatably connected with the rack and is connected with the polishing mechanism through a belt pulley mechanism; the swing type wafer supporting mechanism comprises a wafer swing type mechanism and a pre-tightening force adjusting mechanism, the wafer swing type mechanism is rotationally connected with the rack and connected with the polishing mechanism through a belt wheel mechanism, the pre-tightening force adjusting mechanism is arranged on the wafer swing type mechanism and attached to the upper end of the polishing mechanism in a pressing mode, and the polishing mechanism is driven by the pre-tightening force adjusting mechanism. And the wafer swing type beating drum is connected with the polishing mechanism through a belt wheel mechanism, so that the wafer swing type beating drum and the polishing mechanism are driven through a driving motor, and resources are saved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer thinning and grinding device. Background Art

[0002] A wafer is a silicon wafer used for manufacturing silicon semiconductor integrated circuits. The wafer is a cylindrical single crystal silicon and is a carrier for producing integrated circuits. During the processing of the wafer, a wafer thinning machine is required to grind and remove the excess substrate material on the back of the wafer to thin the thickness of the wafer.

[0003] In the existing wafer grinding device, the wafer is fixed by a wafer fixing head and then swing - type grinding is performed on a rotating grinding disk. The rotation of the existing grinding disk and the reciprocating swing of the grinding disk both use separate driving mechanisms, which easily causes waste of resources, and it is not easy to adjust the pre - tightening force on the wafer fixing head.

[0004] In view of the above problems, we propose a wafer thinning and grinding device.

[0005] In view of the above problems, we propose a wafer thinning and grinding device. Content of the Utility Model

[0006] In view of the problems in the existing technology that are prone to waste of resources during the wafer grinding process and it is not easy to adjust the pre - tightening force when the wafer is pressed against the grinding disk, the utility model proposes a wafer thinning and grinding device.

[0007] A wafer thinning and grinding device provided by the utility model includes a frame and a wafer grinding device. The wafer grinding device includes a grinding mechanism and a swing - type wafer support mechanism. The grinding mechanism is arranged on the frame, and the swing - type wafer support mechanism is rotatably connected to the frame and connected to the grinding mechanism through a pulley mechanism.

[0008] The swing - type wafer support mechanism includes a wafer swing mechanism and a pre - tightening force adjustment mechanism. The wafer swing mechanism is rotatably connected to the frame and connected to the grinding mechanism through a pulley mechanism. The pre - tightening force adjustment mechanism is arranged on the wafer swing mechanism and presses against the upper end of the grinding mechanism.

[0009] As a further improvement of the utility model, the grinding mechanism includes a driving motor and a grinding disk. The driving motor is fixedly connected to the frame through a support frame, and the grinding disk is arranged above the frame and coaxially fixedly connected to the output end of the driving motor.

[0010] As a further improvement of the utility model, the swing - type wafer support mechanism includes a support plate and a Z - shaped rod. The support plate is rotatably connected to the frame through a rotating rod. A moving groove is arranged on the support plate. One end of the Z - shaped rod is rotatably connected to the frame, and the other end moves in the moving groove.

[0011] As a further improvement of the present utility model, the pre-tightening force adjusting mechanism includes a support rod, a wafer fixing plate, an adjusting cross plate, a threaded rod, and a spring. The support rod is slidably connected to the support plate through a limiting member. The wafer fixing plate is pressed against the upper end of the grinding plate and connected to the support rod. The adjusting cross plate is movably sleeved on the surface of the support rod. The threaded rod is threadedly connected to the adjusting cross plate and rotatably connected to the support plate. The pressing plate is fixedly sleeved on the surface of the support rod and is disposed between the support plate and the adjusting cross plate. The spring is disposed between the pressing plate and the support plate and is sleeved on the surface of the support rod.

[0012] As a further improvement of the present utility model, the limiting member includes a chute and a sliding strip. The chute is disposed on the support rod, and the sliding strip is fixedly connected to the support plate and slidably disposed in the chute.

[0013] As a further improvement of the present utility model, the pulley mechanism includes pulleys and a connecting belt. There are two pulleys, which are respectively coaxially and fixedly sleeved on the output end of the driving motor and the surface of the Z-shaped rod. The diameter of the pulley on the Z-shaped rod is larger than the diameter of the pulley on the output end of the motor. The connecting belt is connected to the two pulleys.

[0014] The beneficial effects of the present utility model: A wafer thinning and grinding device provided by the present utility model is convenient for adjusting the extrusion force between the wafer and the grinding plate through the pre-tightening force adjusting mechanism. The wafer swing type is connected to the grinding mechanism through the pulley mechanism, which is convenient for driving the two through a driving motor, achieving resource saving. Description of the Drawings

[0015] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. They are used together with the embodiments of the present utility model to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0016] Figure 1 is the structure of a wafer thinning and grinding device of the present utility model Figure 1 。

[0017] Figure 2 is the structure of a wafer thinning and grinding device of the present utility model Figure 2 。

[0018] Figure 3 is the structure of a wafer thinning and grinding device of the present utility model Figure 3 。

[0019] Figure 4 is the structure of a wafer thinning and grinding device of the present utility model Figure 4 。

[0020] Figure 5 It is an enlarged view of the A position of a wafer thinning and grinding device of the present utility model.

[0021] Figure 6 It is an enlarged view of the B position of a wafer thinning and grinding device of the present utility model.

[0022] Figure 7 It is a structural diagram of a limiting member of a wafer thinning and grinding device of the present utility model.

[0023] Figure 8 It is a structural diagram of a pulley mechanism of a wafer thinning and grinding device of the present utility model.

[0024] In the attached drawings: 1. Frame; 2. Wafer grinding device; 3. Grinding mechanism; 4. Swing-type wafer support mechanism; 5. Pulley mechanism; 6. Wafer swing mechanism; 7. Pretightening force adjustment mechanism; 8. Driving motor; 9. Grinding disc; 10. Support frame; 11. Support plate; 12. Z-shaped rod; 13. Rotating rod; 14. Moving groove; 15. Support rod; 16. Wafer fixing plate; 17. Adjusting cross plate; 18. Threaded rod; 19. Spring; 20. Slide groove; 21. Slide bar; 22. Pulley; 23. Connecting belt; 24. Pressing plate. Detailed implementation manners

[0025] To facilitate the understanding of the present utility model, the present application will be described more comprehensively with reference to the relevant attached drawings; the attached drawings show the preferred embodiments of the present utility model. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, these embodiments are provided to make the disclosure of the present utility model more thorough and comprehensive. It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only embodiments. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs; the terms used in the description of the present utility model in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present utility model; the term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] According to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8A wafer thinning and polishing device is shown, which includes a frame 1 and a wafer polishing device 2. The wafer polishing device 2 includes a polishing mechanism 3 and a swing-type wafer support mechanism 4. The polishing mechanism 3 is arranged on the frame 1 and is convenient for polishing the wafer. The swing-type wafer support mechanism 4 is rotatably connected to the frame 1 and is connected to the polishing mechanism 3 through a pulley mechanism 5. The swing-type wafer support mechanism 4 is convenient for making the wafer swing back and forth, and the pulley mechanism 5 is convenient for starting the polishing mechanism 3 and the swing-type wafer support mechanism 4.

[0027] The swing-type wafer support mechanism 4 includes a wafer swing mechanism 6 and a pre-tightening force adjustment mechanism 7. The wafer swing mechanism 6 is rotatably connected to the frame 1 and is connected to the polishing mechanism 3 through a pulley mechanism 5. The wafer swing mechanism 6 is convenient for making the wafer swing back and forth. The pre-tightening force adjustment mechanism 7 is arranged on the wafer swing mechanism 6 and presses against the upper end of the polishing mechanism 3. The pre-tightening force adjustment mechanism 7 is convenient for adjusting the extrusion force between the wafer and the polishing mechanism 3.

[0028] The polishing mechanism 3 of the present utility model includes a driving motor 8 and a polishing disc 9. The driving motor 8 is fixedly connected to the frame 1 through a support frame 10. The polishing disc 9 is arranged above the frame 1 and is coaxially fixedly connected to the output end of the driving motor 8. The driving motor 8 drives the polishing disc 9 to rotate to polish the wafer.

[0029] The swing-type wafer support mechanism 4 of the present utility model includes a support plate 11 and a Z-shaped rod 12. The support plate 11 is rotatably connected to the frame 1 through a rotating rod 13. A moving groove 14 is arranged on the support plate 11. One end of the Z-shaped rod 12 is rotatably connected to the frame 1, and the other end moves in the moving groove 14. When the Z-shaped rod 12 rotates, one end of it moves in the moving groove 14, thereby driving the support plate 11 to swing back and forth.

[0030] The pre-tightening force adjustment mechanism 7 of the present utility model includes a support rod 15, a wafer fixing disc 16, an adjustment cross plate 17, a threaded rod 18, and a spring 19. The support rod 15 is slidably connected to the support plate 11 through a limiting member. The wafer fixing disc 16 presses against the upper end of the polishing disc 9 and is connected to the support rod 15. The adjustment cross plate 17 is movably sleeved on the surface of the support rod 15. The threaded rod 18 is threadedly connected to the adjustment cross plate 17 and is rotatably connected to the support plate 11. The pressing plate 24 is fixedly sleeved on the surface of the support rod and is arranged between the support plate 11 and the adjustment cross plate 17. The spring 19 is arranged between the pressing plate 24 and the support plate 11 and is sleeved on the surface of the support rod 15. When the threaded rod 18 rotates, it will drive the adjustment cross plate 17 to move up and down. The adjustment cross plate 17 squeezes the pressing plate 24, and the pressing plate 24 squeezes the spring 19 to adjust the extrusion force between the wafer and the polishing disc 9.

[0031] The limiting member of the present utility model includes a chute 20 and a sliding bar 21. The chute 20 is provided on the support rod 15, and the sliding bar 21 is fixedly connected to the support plate 11 and slidably arranged in the chute 20.

[0032] The pulley mechanism 5 of the present utility model includes a pulley 22 and a connecting belt 23. There are two pulleys 22, which are respectively coaxially and fixedly sleeved on the output end of the driving motor 8 and the surface of the Z-shaped rod 12, and the connecting belt 23 is connected to the two pulleys 22.

[0033] Principle of the present utility model: During use, the wafer is fixed by the wafer fixing plate 16. Rotate the threaded rod 18, driving the adjustment cross plate 17 to move up and down under the action of the threaded rod 18, thereby adjusting the force of the adjustment cross plate 17 pressing the pressing plate 24, so that the wafer fixed by the wafer fixing plate 16 fits on the grinding disc 9. By rotating the threaded rod 18, the extrusion force between the wafer and the grinding disc 9 can be adjusted.

[0034] The driving motor 8 is started, driving the grinding disc 9 to rotate, and grinding the wafer located above the grinding disc 9. When the driving motor 8 is started, the Z-shaped rod 12 is driven to rotate through the pulley mechanism 5, thereby driving the support plate 11 to swing back and forth, so that the wafer swings back and forth on the grinding disc 9 for grinding the wafer.

[0035] The above describes the present utility model and its implementation manners. This description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present utility model, and the actual structure is not limited thereto. Generally speaking, if those of ordinary skill in the art are inspired by it and, without departing from the gist of the creation of the present utility model, design similar structural forms and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the present utility model.

Claims

1. A wafer thinning and polishing device, comprising a frame (1) and a wafer polishing device (2), characterized in that: The described wafer grinding device (2) includes a grinding mechanism (3) and a swing-type wafer support mechanism (4). The grinding mechanism (3) is provided on a frame (1). The swing-type wafer support mechanism (4) is rotatably connected to the frame (1) and is connected to the grinding mechanism (3) through a pulley mechanism (5). The swing-type wafer support mechanism (4) includes a wafer swing mechanism (6) and a pre-tightening force adjustment mechanism (7). The wafer swing mechanism (6) is rotatably connected to the frame (1) and is connected to the grinding mechanism (3) through a pulley mechanism (5). The pre-tightening force adjustment mechanism (7) is provided on the wafer swing mechanism (6) and presses against the upper end of the grinding mechanism (3).

2. The wafer thinning and polishing device according to claim 1, characterized in that: The grinding mechanism (3) includes a driving motor (8) and a grinding disc (9). The driving motor (8) is fixedly connected to the frame (1) through a support frame (10). The grinding disc (9) is provided above the frame (1) and is coaxially fixedly connected to the output end of the driving motor (8).

3. The wafer thinning and polishing device according to claim 1, characterized in that: The swing-type wafer support mechanism (4) includes a support plate (11) and a Z-shaped rod (12). The support plate (11) is rotatably connected to the frame (1) through a rotating rod (13). A moving groove (14) is provided on the support plate (11). One end of the Z-shaped rod (12) is rotatably connected to the frame (1), and the other end passes through the moving groove (14) and moves within the moving groove (14).

4. A wafer thinning and polishing device according to claim 1, characterized in that: The pre-tightening force adjustment mechanism (7) includes a support rod (15), a wafer fixing disc (16), an adjustment cross plate (17), a threaded rod (18), a pressing plate (24), and a spring (19). The support rod (15) is slidably connected to the support plate (11) through a limiting member. The wafer fixing disc (16) presses against the upper end of the grinding disc (9) and is connected to the support rod (15). The adjustment cross plate (17) is movably sleeved on the surface of the support rod (15). The threaded rod (18) is threadedly connected to the adjustment cross plate (17) and is rotatably connected to the support plate (11). The pressing plate (24) is fixedly sleeved on the surface of the support rod and is provided between the support plate (11) and the adjustment cross plate (17). The spring (19) is provided between the pressing plate (24) and the support plate (11) and is sleeved on the surface of the support rod (15).

5. A wafer thinning and polishing device according to claim 1, characterized in that: The limiting member includes a sliding groove (20) and a sliding strip (21). The sliding groove (20) is provided on the support rod (15). The sliding strip (21) is fixedly connected to the support plate (11) and slidably arranged within the sliding groove (20).

6. The wafer thinning and polishing device according to claim 1, wherein: The pulley mechanism (5) includes pulleys (22) and a connecting belt (23). There are two pulleys (22), which are respectively coaxially fixedly sleeved on the output end of the driving motor (8) and the surface of the Z-shaped rod (12). The connecting belt (23) is connected between the two pulleys (22).

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